FODM611R2 [ONSEMI]
高抗噪能力、5V、10Mbit/sec逻辑门输出(开路集电极)光电耦合器;型号: | FODM611R2 |
厂家: | ONSEMI |
描述: | 高抗噪能力、5V、10Mbit/sec逻辑门输出(开路集电极)光电耦合器 局域网 输出元件 光电 |
文件: | 总14页 (文件大小:541K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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May 2010
FODM611
High Noise Immunity, 5V, 10Mbit/sec Logic Gate Output
(Open Collector) Optocoupler
Features
Description
■ High Noise Immunity characterized by common mode
The FODM611 is a 5V high-speed logic gate output
(open collector) optocoupler, which supports isolated
communications allowing digital signals to communicate
between systems without conducting ground loops or
hazardous voltages. It utilizes Fairchild’s proprietary
transient immunity (CMTi)
– 20kV/µs Minimum CMTi
■ High Speed
– 10Mbit/sec Date Rate (NRZ)
– 100ns max. Propagation Delay
– 35ns max. Pulse Width Distortion
– 40ns max. Propagation Delay Skew
■ -40 to +85°C temperature range
■ Safety and regulatory approvals
®
coplanar packaging technology, Optoplanar , and
optimized IC design to achieve high noise immunity,
characterized by high common mode transient immunity
specifications.
This optocoupler consists of an AlGaAS LED at the
input, optically coupled to a high speed integrated photo-
detector logic gate. The output of the detector IC is an
open collector schottky-clamped transistor. The coupled
parameters are guaranteed over the wide temperature
range of -40°C to +85°C. A maximum input signal of
5mA will provide a minimum output sink current of 13mA
(fan out of 8).
– UL1577, 3750 VAC
for 1 min.
RMS
– IEC60747-5-2 (pending approval)
Applications
■ Microprocessor system interface
2
– SPI, I C
Related Resources
■ www.fairchildsemi.com/products/opto/
■ Industrial fieldbus communications
– DeviceNet, CAN, RS485
■ Programmable logic control
■ Isolated data acquisition system
■ Voltage level translator
■ www.fairchildsemi.com/pf/FO/FODM8061.html
■ www.fairchildsemi.com/pf/FO/FODM8071.html
■ Isolating MOSFET/IGBT gate drivers
Functional Schematic
Truth Table
V
V
ANODE 1
6
5
CC
O
LED
Off
Output
High
On
Low
CATHODE
GND
3
4
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
Pin Definitions
Number
Name
ANODE
CATHODE
GND
Function Description
1
3
4
5
6
Anode
Cathode
Output Ground
Output Voltage
Output Supply Voltage
V
O
V
CC
Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin)
As per IEC60747-5-2 (Pending Certification). This optocoupler is suitable for “safe electrical insulation” only within the
safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Installation Classifications per DIN VDE 0110/1.89 Table 1
For rated main voltage < 150Vrms
For rated main voltage < 300Vrms
Climatic Classification
Min.
Typ.
Max.
Unit
I-IV
I-III
40/85/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
CTI
175
V
Input to Output Test Voltage, Method b,
1060
PR
VIORM x 1.875 = V , 100% Production Test with
PR
t
= 1 sec, Partial Discharge < 5 pC
m
V
Input to Output Test Voltage, Method a,
VIORM x 1.5 = V , Type and Sample Test with
848
PR
PR
t
= 60 sec, Partial Discharge < 5 pC
m
V
Max Working Insulation Voltage
Highest Allowable Over Voltage
External Creepage
565
4000
5.0
V
V
IORM
peak
V
IOTM
peak
mm
mm
mm
°C
External Clearance
5.0
Insulation thickness
0.5
T
Safety Limit Values, Maximum Values allowed in the event
of a failure, Case Temperature
150
Case
9
R
Insulation Resistance at T , V = 500V
10
Ω
IO
S
IO
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
2
Absolute Maximum Ratings (T =25ºC unless otherwise specified)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Value
Units
T
Storage Temperature
-40 to +125
-40 to +85
ºC
ºC
ºC
ºC
STG
T
Operating Temperature
Junction Temperature
OPR
T
-40 to +125
260 for 10sec
J
T
Lead Solder Temperature
SOL
(Refer to Reflow Temperature Profile)
I
Forward Current
Reverse Voltage
Supply Voltage
50
5.0
mA
V
F
V
R
V
0 to 7.0
V
CC
V
Output Voltage
-0.5 to V +0.5
V
O
CC
I
Average Output Current
50
100
85
mA
mW
mW
O
(1)(2)
PD
Input Power Dissipation
I
(1)(2)
PD
Output Power Dissipation
O
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Ambient Operating Temperature
Min.
-40
4.5
0
Max.
+85
5.5
0.8
15
Unit
ºC
T
A
(3)
V
Supply Voltages
V
CC
V
Logic Low Input Voltage
Logic High Input Current
Logic Low Input Current
V
FL
I
6.3
mA
µA
FH
I
250
5
FL
N
Fan Out (at R = 1kΩ)
TTL Loads
Ω
L
R
Output Pull-up Resistor
330
4k
L
Isolation Characteristics (T =25ºC)
A
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
V
Input-Output Isolation Voltage
freq= 60Hz, t = 1.0min,
3750
Vac
RMS
ISO
(4)(5)
I
≤ 10µA
I-O
(4)
12
R
C
Isolation Resistance
Isolation Capacitance
V
V
= 500V
10
Ω
ISO
I-O
I-O
(4)
= 0V, freq=1.0MHz
0.6
pF
ISO
Notes:
1. No derate required to 85ºC.
2. Functional operation under these conditions is not implied. Permanent damage may occur if the device is subjected
to conditions outside these ratings.
3. 0.1µF bypass capacitor must be connected between pins 4 and 6.
4. Device is considered a two terminal device: Pins 1 and 3 are shorted, and Pins 4, 5, and 6 are shorted together.
5. 3,750 VAC
for 1 minute duration is equivalent to 4,500 VAC
for 1 second duration.
RMS
RMS
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
3
Electrical Characteristics (Apply over all recommended conditions)
(T = -40ºC to +85ºC, 4.5V ≤ V ≤ 5.5V), unless otherwise specified.
A
CC
Typical value is measured at T = 25ºC and V = 5.0V.
A
CC
Symbol
Parameter
Test Conditions
Min. Typ. Max. Units
INPUT CHARACTERISTICS
V
Forward Voltage
I = 10mA, Fig. 1
1.05
5.0
1.45
3.4
1.8
5.0
V
V
F
F
BV
Input Reverse Breakdown Voltage
Threshold Input Current
I = 10µA
R
R
I
V = 0.6V, I (sinking) = 13mA,
mA
FHL
O
OL
T < 85ºC, Fig. 2
A
OUTPUT CHARACTERISTICS
V
Logic LOW Output Voltage
I = rated I ,
FHL
0.4
0.6
V
OL
F
I
(sinking) = 13mA, Fig. 3
OL
I
Logic HIGH Output Current
I = 250µA, V = 5.0V, Fig. 4
2.1
7.5
30.0
10.0
µA
OH
F
O
I
Logic LOW Output Supply Current I = 10mA, V = 5.0V, Fig. 5, 7
mA
CCL
CCH
F
CC
I
Logic HIGH Output Supply Current I = 0mA, V = 5.0V, Fig. 6, 7
6.0
9.0
mA
F
CC
Switching Characteristics (Apply over all recommended conditions)
(T = -40ºC to +85ºC, 4.5V ≤ V ≤ 5.5V, I = 7.5mA), unless otherwise specified.
A
CC
F
Typical value is measured at T = 25ºC and V = 5.0V
A
CC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
Mbps
ns
Date Rate
R = 350Ω
10
L
t
Propagation Delay Time to Logic R = 350Ω, C = 15pF,
Low Output
43
50
7
100
PHL
PLH
L
L
Fig. 8 and 11
t
Propagation Delay Time to Logic R = 350Ω, C = 15pF,
High Output
100
35
ns
ns
L
L
Fig. 8 and 11
PWD
Pulse Width Distortion,
R = 350Ω, C = 15pF,
L
L
| t
– t
|
Fig. 9
PHL
PLH
(6)
t
Propagation Delay Skew
R = 350Ω, C = 15pF
40
ns
ns
PSK
L
L
t
Output Rise Time, (10% to 90%) R = 350Ω, C = 15pF,
20
10
40
40
R
L
L
Fig. 10 and 11
t
Output Fall Time, (90% to 10%) R = 350Ω, C = 15pF,
ns
F
L
L
Fig. 10 and 11
|CM |
Common Mode Transient
Immunity at Output High
V = 5.0V, V > 0.8 x V
,
20
20
kV/µs
kV/µs
H
I
O
CC
(7)
V
= 1000V , Fig. 12
CM
|CM |
Common Mode Transient
Immunity at Output Low
V = 0V, V < 0.8V,
L
I
O
(7)
V
= 1000V , Fig. 12
CM
Notes
6. t
is equal to the magnitude of the worst case difference in t
and/or t
that will be seen between any two units
PSK
PHL
PLH
from the same manufacturing date code that are operated at same case temperature ( 5°C), at same operating
conditions, with equal loads (R = 350Ω and C = 15pF), and with an input rise time less than 5ns.
L
L
7. Common mode transient immunity at output high is the maximum tolerable positive dVcm/dt on the leading edge of
the common mode impulse signal, Vcm, to assure that the output will remain high. Common mode transient immunity
at output low is the maximum tolerable negative dVcm/dt on the trailing edge of the common pulse signal, Vcm, to
assure that the output will remain low.
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
4
Typical Performance Curves
Fig. 2 Threshold Input Current vs Ambient Temperature
Fig. 1 Input LED Current vs Forward Voltage
6
5
4
3
2
1
100
V
= 5.0V
CC
I
= 13mA
OL
10
T
= 85°C
A
1
0.1
T
A
= -40°C
T
A
= 25°C
0.01
0.001
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-40
-20
0
20
40
60
80
V
F
– FORWARD VOLTAGE (V)
T
A
– AMBIENT TEMPERATURE (°C)
Fig. 3 Low Level Output Voltage vs. Ambient Temperature
Fig. 4 Logic High Output Current vs Ambient Temperature
0.60
2.0
I
V
I
= 5mA
= 5.0V
I
= 250µA
= 5.0V
CC
O
F
F
CC
V
V
= 13mA
= 3.3V
OL
1.8
1.6
1.4
1.2
1.0
0.8
0.55
0.50
0.45
0.40
0.35
-20
0
20
40
60
80
-20
0
20
T – AMBIENT TEMPERATURE (°C)
A
40
60
80
-40
-40
T
A
– AMBIENT TEMPERATURE (°C)
Fig. 5 Typical Logic Low Output Supply Current
vs. Ambient Temperature
Fig. 6 Typical Logic High Output Supply Current
vs. Ambient Temperature
10
9
10
8
I
V
= 10mA
= 5.0V
I
V
= 0mA
= 5.0V
F
F
CC
CC
8
6
7
4
6
2
5
4
-40
0
-40
-20
0
20
40
60
80
-20
0
20
T – AMBIENT TEMPERATURE (°C)
A
40
60
80
T
A
– AMBIENT TEMPERATURE (°C)
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
5
Typical Performance Curves (Continued)
Fig. 7 Typical Logic Output Supply Current
Fig. 8 Typical Propagation Delay vs. Ambient Temperature
vs. Output Supply Voltage
10
55
I
T
= 0mA (for I
CCH
), 10mA (for I
)
Frequency = 5MHz
Duty Cycle = 50%
F
A
CCL
= 25°C
I
V
R
= 7.5mA
= 5.0V
F
CC
8
6
4
2
0
50
45
40
35
30
= 350Ω
L
I
I
CCL
CCH
t
PHL
t
PLH
3.0
3.5
4.0
4.5
5.0
5.5
-40
-20
0
20
T – AMBIENT TEMPERATURE (°C)
A
40
60
80
V
CC
– OUTPUT SUPPLY VOLTAGE (V)
Fig. 9 Pulse Width Distortion vs. Ambient Temperature
Fig. 10 Rise and Fall Time vs. Ambient Temperature
8
40
35
30
25
20
15
10
5
Frequency = 5MHz
Duty Cycle = 50%
Frequency = 5MHz
Duty Cycle = 50%
I
F
= 7.5mA
I = 7.5mA
F
V
CC
= 5V
V
CC
= 5V
R
= 350Ω
R
= 350Ω
L
6
4
2
0
L
t
R
t
F
0
-40
-20
0
20
40
60
80
-20
0
20
40
60
80
-40
T
A
– AMBIENT TEMPERATURE (°C)
T – AMBIENT TEMPERATURE (°C)
A
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
6
Schematics
I
F
Pulse Gen.
5MHz
t = tr = 5ns
f
DC = 50%
0.1µF
Bypass
350Ω
V
Monitoring
O
Node
C
L
Input
Monitoring
Mode
R
M
(I = 7.5mA)
F
Input
50%
t
f
t
r
90%
1.5V
10%
Output
V
OL
t
t
PLH
PHL
Figure 11.Test Circuit for Propagation Delay Time, Rise Time and Fall Time
I
F
V
V
CC
0.1µF
Bypass
350Ω
Monitoring
O
Node
SW
C
L
R
M
V
CM
Pulse Gen
1kV
0V
V
CM
90%
10%
t
r
t
f
V
OH
V
V
(I = 0mA)
F
O
O
0.8 V
CC
0.8V
(I = 7.5mA)
F
V
OL
Figure 12.Test Circuit for Instantaneous Common Mode Rejection Voltage
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
7
Package Dimensions
LAND PATTERN RECOMMENDATION
Notes:
1. No standard applies to this package.
2. All dimensions are in millimeters.
3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion.
4. Drawings filesname and revision: MKT-MFP05A.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
8
Ordering Information
Order Entry Identifier
Option
No Suffix
R2
(Example)
Description
FODM611
Mini-Flat 5-pin, shipped in tubes (100 units per tube)
Mini-Flat 5-pin, tape and reel (2,500 units per reel)
FODM611R2
All packages are lead free per JEDEC: J-STD-020B standard.
Marking Information
1
2
6
M611
V X YY M
5
3
4
Definitions
1
2
3
4
5
6
Fairchild logo
Device number
IEC60747-5-2 (VDE marking)
One digit year code, e.g., ‘9’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
9
Tape and Reel Dimensions
P
2
D0
P
0
t
K0
E
A0
W
W1
B0
F
d
D1
P
2.54 Pitch
Description
Symbol
Dimensions (mm)
12.00 +0.30/-0.10
0.30 ±0.05
Tape Width
W
t
Tape Thickness
Sprocket Hole Pitch
Sprocket Hole Diameter
Sprocket Hole Location
Pocket Location
P0
D0
E
4.00 ±0.10
1.50 +0.10/-0.0
1.75 ±0.10
F
5.50 ±0.10
P2
P
2.00 ±0.10
Pocket Pitch
8.00 ±0.10
Pocket Dimension
A0
B0
K0
D1
W1
d
4.40 ±0.10
7.30 ±0.10
2.30 ±0.10
Pocket Hole Diameter
Cover Tape Width
1.50 Min.
9.20
Cover Tape Thickness
0.065 ±0.010
Max. Component Rotation or Tilt
Devices Per Reel
10° Max.
2500
Reel Diameter
330mm (13")
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
10
Reflow Profile
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
T
P
260
240
220
200
180
160
140
120
100
80
t
P
T
L
Tsmax
t
L
Preheat Area
Tsmin
t
s
60
40
20
0
120
Time 25°C to Peak
240
360
Time (seconds)
Profile Feature
Pb-Free Assembly Profile
150°C
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
200°C
Time (t ) from (Tsmin to Tsmax)
60–120 seconds
3°C/second max.
217°C
S
Ramp-up Rate (t to t )
L
P
Liquidous Temperature (T )
L
Time (t ) Maintained Above (T )
60–150 seconds
260°C +0°C / –5°C
30 seconds
L
L
Peak Body Package Temperature
Time (t ) within 5°C of 260°C
P
Ramp-down Rate (T to T )
6°C/second max.
8 minutes max.
P
L
Time 25°C to Peak Temperature
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
11
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
OPTOPLANAR®
AccuPower
AttitudeEngine™
Awinda®
F-PFS
®*
FRFET®
Global Power ResourceSM
GreenBridge
Green FPS
Green FPS e-Series
Gmax
TinyBoost®
TinyBuck®
TinyCalc
TinyLogic®
TINYOPTO
TinyPower
TinyPWM
TinyWire
TranSiC
®
AX-CAP®*
Power Supply WebDesigner
PowerTrench®
PowerXS™
BitSiC
Build it Now
CorePLUS
CorePOWER
CROSSVOLT
CTL
Current Transfer Logic
DEUXPEED®
Dual Cool™
EcoSPARK®
EfficientMax
Programmable Active Droop
GTO
IntelliMAX
QFET®
QS
ISOPLANAR
Making Small Speakers Sound Louder
and Better™
MegaBuck
MICROCOUPLER
MicroFET
Quiet Series
RapidConfigure
TriFault Detect
TRUECURRENT®*
μSerDes
Saving our world, 1mW/W/kW at a time™
SignalWise
SmartMax
SMART START
Solutions for Your Success
SPM®
ESBC
MicroPak
®
UHC®
MicroPak2
MillerDrive
MotionMax
MotionGrid®
Ultra FRFET
UniFET
VCX
VisualMax
VoltagePlus
XS™
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series
FACT®
STEALTH
SuperFET®
MTi®
SuperSOT-3
MTx®
FastvCore
FETBench
FPS
SuperSOT-6
SuperSOT-8
SupreMOS®
SyncFET
Sync-Lock™
MVN®
mWSaver®
Xsens™
OptoHiT
仙童
™
OPTOLOGIC®
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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Definition of Terms
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Definition
Datasheet contains the design specifications for product development. Specifications may change
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First Production
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Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I76
©2009 Fairchild Semiconductor Corporation
FODM611 Rev. 1.0.3
www.fairchildsemi.com
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