FODM453_10 [FAIRCHILD]
5-Pin Mini Flat Package High Speed Transistor Optocoupler; 5引脚微型扁平封装高速晶体管光耦型号: | FODM453_10 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | 5-Pin Mini Flat Package High Speed Transistor Optocoupler |
文件: | 总14页 (文件大小:366K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
July 2010
FODM452, FODM453
5-Pin Mini Flat Package High Speed Transistor
Optocoupler
Features
Description
■ Compact 5-pin mini flat package
■ High speed-1 MBit/s
The FODM452 and FODM453 optocouplers consist of
an AlGaAs LED optically coupled to a high speed photo-
detector transistor. The devices are housed in a compact
5-pin mini flat package for optimum mounting density.
The FODM453 features a high CMR rating for optimum
■ Superior CMR-15kV/µs at V
= 1500V (FODM453)
CM
■ Performance guaranteed over temperature (0–70°C)
■ U.L. recognized (File # E90700)
common mode transient immunity.
■ VDE0884 recognized (File # 136480)
– Ordering option V, e.g., FODM452V
Related Resources
■ 260°C reflow capability for Pb-free assembly
■ www.fairchildsemi.com/products/opto/
Applications
■ Line receivers
■ www.fairchildsemi.com/pf/FO/FODM611.html
■ www.fairchildsemi.com/pf/FO/FODM8061.html
■ www.fairchildsemi.com/pf/FO/FODM8071.html
■ Pulse transformer replacement
■ Output interface to CMOS-LSTTL-TTL
■ Wide bandwidth analog coupling
Functional Schematic
Truth Table
VCC
ANODE
1
6
5
LED
Off
Output
High
VO
On
Low
CATHODE
GND
3
4
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
Pin Definitions
Number
Name
ANODE
CATHODE
GND
Function Description
1
3
4
5
6
Anode
Cathode
Output Ground
Output Voltage
Output Supply Voltage
V
O
V
CC
Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin)
As per IEC60747-5-2 (Pending Certification). This optocoupler is suitable for “safe electrical insulation” only within the
safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Installation Classifications per DIN VDE 0110/1.89 Table 1
For rated main voltage < 150Vrms
For rated main voltage < 300Vrms
Climatic Classification
Min.
Typ.
Max.
Unit
I-IV
I-III
40/85/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
CTI
175
V
Input to Output Test Voltage, Method b,
1060
PR
VIORM x 1.875 = V , 100% Production Test with
PR
t
= 1 sec, Partial Discharge < 5 pC
m
V
Input to Output Test Voltage, Method a,
VIORM x 1.5 = V , Type and Sample Test with
848
PR
PR
t
= 60 sec, Partial Discharge < 5 pC
m
V
Max Working Insulation Voltage
Highest Allowable Over Voltage
External Creepage
565
4000
5.0
V
V
IORM
peak
V
IOTM
peak
mm
mm
mm
°C
External Clearance
5.0
Insulation thickness
0.5
T
Safety Limit Values, Maximum Values allowed in the event
of a failure, Case Temperature
150
Case
9
R
Insulation Resistance at T , V = 500V
10
Ω
IO
S
IO
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
2
Absolute Maximum Ratings (T = 25°C unless otherwise noted)
A
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Value
Units
°C
T
Storage Temperature
Operating Temperature
-40 to +125
-40 to +85
STG
T
°C
OPR
EMITTER
I (avg)
DC/Average Forward Input Current
25
50
1.0
5
mA
mA
A
F
I (pk)
Peak Forward Input Current (50% duty cycle, 1ms P.W.)
Peak Transient Input Current (≤1µs P.W., 300pps)
Reverse Input Voltage
F
I (trans)
F
V
P
V
R
D
Input Power Dissipation
45
mW
(No derating required over specified operating temp range)
DETECTOR
I
(avg)
(pk)
Average Output Current
Peak Output Current
Supply Voltage
8
mA
mA
V
O
I
16
O
V
-0.5 to 30
-0.5 to 20
100
CC
V
Output Voltage
V
O
P
Output Power Dissipation
mW
D
(No derating required over specified operating temp range)
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
3
Electrical Characteristics (T = 0 to 70°C unless otherwise specified)
A
Individual Component Characteristics
Symbol
EMITTER
Parameter
Test Conditions
Min. Typ.* Max. Unit
V
Input Forward Voltage
I = 16mA, T = 25°C
1.60
1.7
1.8
V
F
F
A
I = 16mA
F
B
Input Reverse Breakdown Voltage
I
= 10µA
5.0
V
VR
R
∆V /∆T
Temperature Coefficient of
Forward Voltage
I = 16mA
-1.8
mV/°C
F
A
F
DETECTOR
I
Logic High Output Current
I = 0mA, V = V = 5.5V, T =25°C
.001
.001
0.5
1
µA
OH
F
O
CC
A
I = 0 mA, V = V = 15V, T =25°C
F
O
CC
A
I = 0mA, V = V = 15V
50
200
1
F
O
CC
I
Logic Low Supply Current
Logic high supply current
I = 16mA, V = Open, V = 15V
100
µA
µA
CCL
F
O
CC
I
I = 0 mA, V = Open, V = 15V,
0.05
CCH
F
O
CC
T = 25°C
A
I = 0mA, V = Open, V = 15V
2
F
O
CC
Transfer Characteristics
Symbol
COUPLED
CTR
Parameter
Test Conditions
Min. Typ.* Max Unit
(1)
Current Transfer Ratio
I = 16mA, V = 4.5V
T = 25°C V =0.4V
20
15
50
%
V
F
CC
A
OL
V
=0.5V
OL
V
Logic LOW Output
Voltage
I = 16mA, I = 3mA, V = 4.5V, T =2 5°C
0.4
0.5
OL
F
O
CC
A
I = 16mA, I = 2.4mA, V = 4.5 V
F
O
CC
Switching Characteristics (V = 5V)
CC
Symbol
Parameter
Test Conditions
Device Min. Typ.* Max. Unit
(2)
T
T
Propagation Delay
Time to Logic LOW
R = 1.9kΩ, I = 16mA, T = 25°C (Fig. 9)
0.40
0.8
1.0
0.8
1.0
µs
µs
PHL
PLH
L
F
A
(2)
R = 1.9kΩ, I = 16mA (Fig. 9)
L
F
(2)
Propagation Delay
Time to Logic HIGH
R = 1.9kΩ, I = 16mA, T = 25°C (Fig. 9)
0.35
µs
L
F
A
(2)
R = 1.9kΩ, I = 16mA (Fig. 9)
µs
L
F
|CM |
Common Mode
Transient Immunity
at Logic HIGH
I = 0mA, V
= 10V , R = 1.9kΩ,
FODM452
FODM453
5
15
40
KV/µs
H
F
CM
P-P
L
(3)
T = 25°C (Fig. 10)
A
I = 0mA, V
= 1500V , R = 1.9kΩ
15
KV/µs
KV/µs
KV/µs
MHz
F
CM
(3)
P-P
L
T = 25°C (Fig. 10)
A
|CM |
Common Mode
Transient Immunity
at Logic LOW
I = 16mA, V
= 10V , R = 1.9kΩ,
FODM452
FODM453
5
15
40
3
L
F
CM
P-P
L
(3)
T = 25°C (Fig. 10)
A
I = 16mA, V
= 1500V , R = 1.9kΩ,
15
F
CM
P-P
L
(3)
T = 25°C (Fig. 10)
A
BW
Bandwidth
R = 100Ω
L
Isolation Characteristics
Symbol Characteristics
Test Conditions
Min. Typ.* Max. Unit
(4)
V
Withstand Insulation Test Voltage
Capacitance (Input to Output)
RH ≤ 50%, T = 25°C, t = 1 min.
3750
V
RMS
ISO
A
(4)
C
f = 1MHz
0.2
pF
I-O
*All Typicals at T = 25°C
A
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
4
Notes:
1. Current Transfer Ratio is defined as a ratio of output collector current, I , to the forward LED input current, I ,
O
F
times 100%.
2. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor.
3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the
cm
leading edge of the common mode pulse signal V , to assure that the output will remain in a logic high state
CM
(i.e., V > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dV /dt
O
cm
on the trailing edge of the common mode pulse signal, V , to assure that the output will remain in a logic low
CM
state (i.e., V < 0.8V).
O
4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted
together.
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
5
Typical Performance Curves
Fig. 1 Input Forward Current vs Forward Voltage
Fig. 2 Normalized Current Transfer Ratio vs. Input Current
100
10
1.20
1.15
1.10
1.05
1.00
0.95
0.90
V
V
= 0.4V
O
T
= 25°C
A
= 5V
CC
T
= 25°C
A
Normalized to IF = 16mA
1
0.1
0.01
0.001
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1
10
VF – FORWARD CURRENT (mA)
I
– INPUT CURRENT (mA)
F
Fig. 3 Normalized Current Transfer Ratio
vs. Ambient Temperature
Fig. 4 Logic High Output Current
vs. Ambient Temperature
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
IF = 16mA
V
I
= V = 5V
CC
= 0V
O
F
V
V
= 0.4V
O
= 5V
CC
Normalized to T = 25°C
A
10
1
0.1
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
T
– TEMPERATURE (°C)
T
A
– AMBIENT TEMPERATURE
A
Fig. 5 DC and Pulsed Transfer Characteristics
Fig. 6 Propagation Delay vs. Load Resistance
10
14
12
T
V
= 25°C
A
T
V
= 25°C
= 5V
A
CC
= 5V
CC
I
F
I
F
= 16mA
= 10mA
I
F
= 40mA
10
8
35mA
30mA
t
PLH
25mA
20mA
1
6
4
15mA
t
PHL
10mA
5mA
2
0
0.1
0
2
4
6
8
10
12
14
16
1
2
3
4
5
6
7
8
9 10
V
O
– OUTPUT VOLTAGE (V)
R
– LOAD RESISTANCE (kΩ)
L
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
6
Typical Performance Curves (Continued)
Fig. 8 Frequency Response
Fig. 7 Propagation Delay vs. Ambient Temperature
1400
5
0
I
V
T
= 16mA
= 5V
I
V
R
= 16mA
= 5V
F
CC
F
CC
= 25°C
= 1.9kΩ
1200
1000
800
A
L
R
= 220Ω
L
R
= 100Ω
L
-5
600
R
= 470Ω
L
t
PHL
400
-10
-15
t
PLH
R
= 1kΩ
L
200
0
-40
-20
0
20
40
60
80
100
0.01
0.1
1
10
T
– AMBIENT TEMPERATURE (°C)
f – FREQUENCY (MHz)
A
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
7
Pulse
Generator
tr = 5ns
ZO= 50
10% D.C.
I/f< 100µs
Noise
Shield
IF
+
VCC
+5 V
VO
1
3
Ω
6
5
4
RL
VO
0.1 µF
C
L = 1.5 µF
IF Monitor
GND
Rm
IF
0
5 V
VO
1.5 V
1.5 V
VOL
TPHL
TPLH
Fig. 9 Switching Time Test Circuit
IF
Noise
Shield
+
VCC
+5 V
1
3
6
5
4
RL
A
VO
VO
0.1 µF
B
VFF
GND
-
VCM
-
+
Pulse Gen
VCM 10 V
0 V
90% 90%
10%
tr
10%
tf
VO
5 V
Switch at A : IF = 0 mA
VO
VOL
Switch at A : IF = 16 mA
Fig. 10 Common Mode Immunity Test Circuit
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
8
Package Dimensions
Notes:
1. No standard applies to this package.
2. All dimensions are in millimeters.
3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion.
4. Drawings filesname and revision: MKT-MFP05A.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
9
Footprint Drawing for PCB Layout
0.61
1.27 1.27 1.27
Device
‘A’
Device
5.05
7.95
’
‘B
Pin1
Pin1
1.45
2.54
End Stacking Configuration
Unutilized Solder Pad
Dimensions in millimeters
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
10
Tape and Reel Dimensions
P
2
D0
P
0
t
K0
E
A0
W
W1
B0
F
d
D1
P
2.54 Pitch
Description
Symbol
Dimensions (mm)
12.00 +0.30/-0.10
0.30 ±0.05
Tape Width
W
t
Tape Thickness
Sprocket Hole Pitch
Sprocket Hole Diameter
Sprocket Hole Location
Pocket Location
P0
D0
E
4.00 ±0.10
1.50 +0.10/-0.0
1.75 ±0.10
F
5.50 ±0.10
P2
P
2.00 ±0.10
Pocket Pitch
8.00 ±0.10
Pocket Dimension
A0
B0
K0
D1
W1
d
4.40 ±0.10
7.30 ±0.10
2.30 ±0.10
Pocket Hole Diameter
Cover Tape Width
1.50 Min.
9.20
Cover Tape Thickness
0.065 ±0.010
Max. Component Rotation or Tilt
Devices Per Reel
10° Max.
2500
Reel Diameter
330mm (13")
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
11
Ordering Information
Order Entry Identifier
(example)
Option
R2
Description
FODM452R2
FODM452V
Tape and Reel (2500 per reel)
V
IEC60747-5-2
R2V
FODM452R2V
IEC60747-5-2, Tape and Reel (2500 per reel)
Marking Information
1
2
M452
6
V X YY M
5
3
4
Definitions
1
Fairchild logo
Device number
2
IEC60747-5-2 mark (Note: Only appears on parts ordered
with VDE option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘7’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
12
Reflow Profile
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
T
P
260
240
220
200
180
160
140
120
100
80
t
P
T
L
Tsmax
t
L
Preheat Area
Tsmin
t
s
60
40
20
0
120
Time 25°C to Peak
240
360
Time (seconds)
Profile Freature
Pb-Free Assembly Profile
150°C
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
200°C
Time (t ) from (Tsmin to Tsmax)
60–120 seconds
3°C/second max.
217°C
S
Ramp-up Rate (t to t )
L
P
Liquidous Temperature (T )
L
Time (t ) Maintained Above (T )
60–150 seconds
260°C +0°C / –5°C
30 seconds
L
L
Peak Body Package Temperature
Time (t ) within 5°C of 260°C
P
Ramp-down Rate (T to T )
6°C/second max.
8 minutes max.
P
L
Time 25°C to Peak Temperature
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
13
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
®
*
AccuPower™
Auto-SPM™
F-PFS™
Power-SPM™
PowerTrench®
PowerXS™
FRFET®
The Power Franchise®
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
Programmable Active Droop™
QFET®
QS™
TinyBoost™
TinyBuck™
Quiet Series™
RapidConfigure™
™
TinyCalc™
Current Transfer Logic™
DEUXPEED®
Dual Cool™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
" SerDes™
Saving our world, 1mW/W/kW at a time™
SignalWise™
SmartMax™
EcoSPARK®
n
EfficientMax™
ESBC™
MicroPak™
SMART START™
®
SPM®
MicroPak2™
MillerDrive™
MotionMax™
Motion-SPM™
OptoHiT™
Fairchild®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
OPTOLOGIC®
UHC®
FAST®
OPTOPLANAR®
Ultra FRFET™
UniFET™
VCX™
FastvCore™
®
SyncFET™
Sync-Lock™
FETBench™
FlashWriter®
*
PDP SPM™
VisualMax™
XS™
FPS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANYLIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a)
are intended for surgical implant into the body or (b) support or
sustain life, and (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on ourexternal website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors
are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical
and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise.
Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet
Product Status
Definition
Identification
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Advance Information
Preliminary
Formative / In Design
First Production
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
No Identification Needed Full Production
Obsolete Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I49
©2003 Fairchild Semiconductor Corporation
FODM452, FODM453 Rev. 1.0.5
www.fairchildsemi.com
14
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FODM8061
High Noise Immunity, 3.3V/5V, 10Mbit/sec Logic Gate Output (Open Collector) Optocoupler
FAIRCHILD
FODM8061R2
High Noise Immunity, 3.3V/5V, 10Mbit/sec Logic Gate Output (Open Collector) Optocoupler
FAIRCHILD
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