RF2412 [ETC]

RF Modulator ; RF调制器\n
RF2412
型号: RF2412
厂家: ETC    ETC
描述:

RF Modulator
RF调制器\n

文件: 总11页 (文件大小:198K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
RF2412  
BROADBAND DUAL-CONVERSION  
QUADRATURE MODULATOR  
5
Typical Applications  
• Digital and Spread-Spectrum Systems  
• Analog Communication Systems  
• UHF Digital and Analog Transmitters  
• GMSK, QPSK, DQPSK, QAM  
• Portable Battery-Powered Equipment  
• Commercial and Consumer Systems  
Product Description  
.299  
.292  
.009  
.005  
The RF2412 is a monolithic integrated transmitter univer-  
sal modulation IC capable of generating modulated AM,  
PM, or compound carriers in the VHF/UHF frequency  
range. The modulation is performed at VHF, then the  
resulting spectrum is upconverted to a frequency range  
between 100MHz to 1000MHz. The IC contains all of the  
required components to implement the modulation func-  
tion including differential amplifiers for the baseband  
inputs, a LO 90° hybrid phase splitter, limiting LO amplifi-  
ers, two balanced mixers, a combining differential ampli-  
fier, a second upconvert balanced mixer, and an output  
RF amplifier which will drive a 50load. Since the modu-  
lation is performed at a low frequency, excellent ampli-  
tude balance and phase accuracy are obtained.  
1
.018  
.014  
5
.493  
.486  
.050  
.413  
.398  
.092  
8 °MAX  
0°MIN  
.010  
.008  
.050  
.016  
Optimum Technology Matching® Applied  
Package Style: SOP-20  
Si BJT  
GaAs HBT  
üGaAs MESFET  
Si CMOS  
Si Bi-CMOS  
SiGe HBT  
Features  
• Single 3V to 6V Power Supply  
• Digitally-Controlled Power Down Mode  
• Dual Conversion  
VDD2  
VDD1  
PD  
1
2
3
4
5
6
7
8
9
20 RF OUT  
19 GND  
POWER  
CONTROL  
18 GND  
• DC to 50MHz Modulation Frequency  
• 50MHz to 150MHz IF Frequency  
• 100MHz to 1000MHz RF Frequency  
I SIG  
I REF  
Q REF  
Q SIG  
GND  
17 LO2  
16 GND  
Σ
15 MIX IN+  
14 MIX IN-  
13 GND  
Ordering Information  
GND  
12 MOD OUT-  
11 MOD OUT+  
-45°  
RF2412  
RF2412 PCBA  
Broadband Dual-Conversion Quadrature Modulator  
Fully Assembled Evaluation Board  
+45°  
LO1 10  
RF Micro Devices, Inc.  
7625 Thorndike Road  
Greensboro, NC 27409, USA  
Tel (336) 664 1233  
Fax (336) 664 0454  
http://www.rfmd.com  
Functional Block Diagram  
Rev B1 010329  
5-7  
RF2412  
Absolute Maximum Ratings  
Parameter  
Supply Voltage  
Rating  
-0.5 to 7.5  
Unit  
V
DC  
Caution! ESD sensitive device.  
PD Voltage  
V
+0.4  
DD  
V
DC  
Input LO and RF Levels  
Ambient Operating Temperature  
Storage Temperature  
+6  
dBm  
°C  
°C  
RF Micro Devices believes the furnished information is correct and accurate  
at the time of this printing. However, RF Micro Devices reserves the right to  
make changes to its products without notice. RF Micro Devices does not  
assume responsibility for the use of the described product(s).  
-40 to +85  
-40 to +150  
Specification  
Typ.  
Parameter  
Unit  
Condition  
Min.  
Max.  
T = 25°C, V =5V, V  
=2.5V,  
REF  
DD  
BB=100kHz, LO1=70MHz, LO2=700MHz,  
=3.0V , SSB, unless indicated other-  
Modulation Signals (I&Q)  
V
MOD  
PP  
wise.  
5
Frequency Range  
Signal Level  
DC to 50  
2.2  
MHz  
V
For 1dB compression  
PP  
Reference Voltage (V  
)
2.0 to 3.0  
V
REF  
Input Impedance to GND  
Amplitude Balance  
Quadrature Phase Error  
First LO Input  
3
0.1  
1
k  
dB  
°
Frequency Range  
50 to 150  
30 to 225  
-5 to +6  
MHz  
MHz  
dBm  
For 30dB sideband suppression  
For 20dB sideband suppression  
Power Level  
Input Impedance  
Second LO Input  
Frequency Range  
Power Level  
750-j400  
Without external 50termination  
100 to 1000  
-5 to +6  
600-j700  
MHz  
dBm  
Input Impedance  
Without external 50termination  
RF Output  
Output Power  
V
=5V, LO1,2 level=0dBm, SSB  
DD  
+4  
0
-4  
dBm  
dBm  
dBm  
Freq=200MHz to 500MHz  
Freq=500MHz to 800MHz  
Freq=800MHz to 1000MHz  
Output Power  
V
=6V, LO1,2 power=0dBm, SSB  
DD  
+6  
+3  
-1  
dBm  
dBm  
dBm  
Freq=200MHz to 500MHz  
Freq=500MHz to 800MHz  
Freq=800MHz to 1000MHz  
Nominal Output Impedance  
Output VSWR  
50  
1.5:1  
3:1  
-155  
Freq<600MHz  
600MHz<Freq<1000MHz  
Output Broadband Noise Power  
Spurious  
dBm/Hz  
Single sideband modulation  
Sideband Suppression  
Carrier Suppression  
35  
25  
dBc  
dBc  
Unadjusted. Modulation DC offset may be  
externally adjusted for maximum suppres-  
sion. See Pin Descriptions.  
Odd unfiltered IF  
First LO Harmonics  
-20  
-30  
dBc  
dBc  
Even unfiltered IF  
Power Supply  
Voltage  
Current Consumption  
3 to 6.5  
31  
V
mA  
Operating limits  
35  
V
=5.0V  
CC  
5-8  
Rev B1 010329  
RF2412  
Specification  
Typ.  
Parameter  
Unit  
Condition  
Min.  
Max.  
Power Down  
Turn On/Off Time  
PD Input Resistance  
Power Down “ON”  
<100  
>50  
ns  
kΩ  
V
V
Threshold voltage  
Threshold voltage  
CC  
Power Down “OFF”  
0
V
5
Rev B1 010329  
5-9  
RF2412  
Pin  
1
Function Description  
Interface Schematic  
Supply Voltage for the RF Output Stage only. A 33pF external bypass  
capacitor is required, and an optional 0.1µF will be required if no other  
low frequency bypass capacitors are nearby. The trace length between  
the pin and the bypass capacitors should be minimized. The ground  
side of the bypass capacitors should connect immediately to ground  
plane. Though the part is designed to run from a 5V supply, it will also  
work at 4V. Gain and available output power will be reduced by 5dB to  
10dB. Pins 1 and 2 may share a common bypass capacitor.  
VDD2  
Supply Voltage for all circuits but the RF Output Stage. The same com-  
ments as for VDD2 apply to this pin. Pins 1 and 2 may share a common  
bypass capacitor.  
2
3
VDD1  
PD  
Power Down control. When this pin is 0V all circuits are turned off, and  
VDD1  
VDD2  
when connected to V , all circuits are operational. This is a high  
DD  
impedance input, internally connected to the parallel gates of two  
switching FETs. To minimize current consumption in power down  
mode, this pin should be as close to 0V as possible. Turn-on voltage of  
some parts of the circuit may be as low as 0.1V. In order to maximize  
5
PD  
output power, the voltage on this pin should be as close to V as pos-  
DD  
sible during normal operation. A 33pF capacitor is recommended for  
bypassing. If this pin is not used for power down control, it may be tied  
to pins 1 and 2, and all three pins may share one 33pF capacitor, pro-  
vided that the associated trace lengths are minimized.  
Baseband input to the I mixer. This pin is DC coupled. Maximum output  
power is obtained when the input signal has a peak to peak amplitude  
4
5
I SIG  
I SIG  
of 5V. A DC reference of approximately V /2 must be supplied to this  
DD  
pin. The input impedance of this pin is about 3k. The SIG and REF  
inputs are inputs of a differential amplifier. Therefore, the REF and SIG  
inputs are interchangeable. If swapping the I SIG and I REF pins, the  
Q SIG and Q REF pins also need to be swapped to maintain the correct  
phase. The SIG and REF pins may be driven differentially to increase  
conversion gain.  
Reference voltage for the I mixer. This voltage should be the same as  
the DC voltage supplied to the I SIG pin. To obtain a carrier suppres-  
sion of better than 25dB it may be tuned ± 0.15V (relative to the I SIG  
DC voltage). Without tuning, the carrier suppression will typically be  
better than 25dB. The input impedance of this pin is about 3k.  
I REF  
I REF  
Reference voltage for the Q mixer. This voltage should be the same as Same as pin 5.  
the DC voltage supplied to the Q SIG pin. To obtain a carrier suppres-  
sion of better than 25dB it may be tuned ±0.15V (relative to the Q SIG  
DC voltage). Without tuning, the carrier suppression will typically be  
better than 25dB. The input impedance of this pin is about 3 k.  
6
7
Q REF  
Q SIG  
Baseband input to the Q mixer. This pin is DC coupled. Maximum out- Same as pin 4.  
put power is obtained when the input signal has a peak to peak ampli-  
tude of 5V. A DC reference of approximately V /2 must be supplied to  
DD  
this pin. The input impedance of this pin is about 3 k. Therefore, the  
REF and SIG inputs are interchangeable. If swapping the I SIG and I  
REF pins, the Q SIG and Q REF also need to be swapped to maintain  
the correct phase. The SIG and REF pins may be driven differentially to  
increase conversion gain.  
Ground connection. Keep traces physically short and connect immedi-  
ately to ground plane for best performance.  
8
9
GND  
GND  
Same as pin 8.  
5-10  
Rev B1 010329  
RF2412  
Pin  
10  
Function Description  
Interface Schematic  
High impedance modulator LO input. If approximately 0dBm of LO  
LO1  
LO1  
power is available, a shunt 56resistor may be used for matching. If  
the available LO power is approximately -6dBm, then a reactive match  
may be required. There is an internal blocking capacitor between this  
pin and the LO circuitry, but not between the pin and an internal resistor  
to ground (see the functional block diagram). An external blocking  
capacitor should be provided if the pin is connected to a device with DC  
present. A DC path to ground (an inductor or resistor to ground) is,  
however, acceptable at this pin. If a blocking capacitor is required, a  
value of 1nF is recommended.  
Balanced IF output port. If no filtering is required this pin can be con-  
nected directly to the MIX IN+ pin. This pin is NOT DC blocked and car-  
ries DC. A blocking capacitor of 1nF is needed when this pin is  
connected to a DC path. An appropriate matching network may be  
needed if an IF filter is used.  
11  
MOD OUT+  
MOD OUT+  
MOD OUT-  
Same as pin 11, except complementary output.  
Same as pin 8.  
See pin 11.  
12  
13  
14  
MOD OUT-  
GND  
MIX IN-  
5
High impedance balanced input to the IF stage. This pin has an internal  
DC blocking capacitor. If no IF filter is needed this pin may be con-  
nected directly to MOD OUT-. If an IF filter is used, an external shunt  
resistor to ground may be needed to provide correct matching for the  
filter.  
MIX IN+  
MIX IN-  
BIAS  
BIAS  
Same as pin 14, except complementary input.  
Same as pin 8.  
See pin 14.  
15  
16  
17  
MIX IN+  
GND  
LO2  
Mixer LO Input port. A shunt 56resistor can be used for matching.  
This pin has internal DC blocking,  
LO2  
BIAS  
BIAS  
Same as pin 8.  
Same as pin 8.  
18  
19  
20  
GND  
GND  
RF OUT  
50output. This pin is not internally DC blocked, and an external  
blocking capacitor of 33pF is required.  
RF OUT  
Rev B1 010329  
5-11  
RF2412  
Application Schematic  
915 MHz Operation, DC Coupled I and Q Inputs  
VDD  
100 nF  
33 pF  
33 pF  
RF OUT  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
POWER  
CONTROL  
3
33 pF  
I SIG  
4
33 pF  
VREF  
56  
5
5
Σ
6
100 nF  
Q SIG  
7
8
9
-45°  
+45°  
1 nF  
LO1 IN  
10  
56  
Application Schematic  
915 MHz Operation, AC Coupled I and Q Inputs  
VDD  
100 nH  
33 pF  
33 pF  
RF OUT  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
POWER  
CONTROL  
100 nF  
33 pF  
3
I SIG  
33 pF  
100  
LO2 IN  
4
VREF  
56  
5
100  
100  
Σ
100 nF  
100 nF  
6
100  
7
Q SIG  
8
9
-45°  
+45°  
1 nF  
LO1 IN  
10  
56  
5-12  
Rev B1 010329  
RF2412  
Evaluation Board Schematic  
(Download Bill of Materials from www.rfmd.com.)  
C5  
100 pF  
50 Ω µstrip  
RF OUT  
J5  
P1-1  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
C1  
33 pF  
POWER  
CONTROL  
3
C4  
100 pF  
50 Ω µstrip  
50 Ω µstrip  
ISIG  
J1  
LO2 IN  
J4  
4
P1-3  
5
C2  
33 pF  
R2  
56  
Σ
6
50 Ω µstrip  
QSIG  
J2  
5
FOR 50  
MATCH  
7
8
9
-45°  
C3  
1 nF  
+45°  
50 Ω µstrip  
LO1 IN  
J3  
10  
P1  
1
2412400 Rev -  
P1-1  
P1-3  
VCC  
R1  
56  
2
GND  
REF  
3
FOR 50  
MATCH  
Rev B1 010329  
5-13  
RF2412  
Evaluation Board Layout  
1.52” x 1.52”  
5
5-14  
Rev B1 010329  
RF2412  
Pout vs. Baseband Modulation Frequency  
Pout vs. Baseband Modulation Voltage  
20  
10  
5
0
Upper Side Band  
BB: 54.5dBmV  
+25C  
-40C  
+85C  
+25C  
-40C  
+85C  
LO1: 70 MHz, 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Vdd: 5.0V, Vref=2.5V  
0
-5  
-10  
-20  
-30  
-10  
-15  
Upper Side Band  
BB: 100 kHz  
LO1: 70 MHz, 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Vdd: 5.0V, Vref=2.5V  
5
0
10  
20  
30  
40  
50  
60  
45  
50  
55  
60  
65  
Modulation Frequency (MHz)  
Modulation Voltage (dBmV)  
Pout vs. LO1 Frequency  
Pout vs. LO1 Power  
20  
10  
20  
10  
Upper Side Band  
BB: 100 kHz, 54.5 dBmV  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
+25C  
-40C  
+85C  
+25C  
-40C  
+85C  
LO1: 70 MHz, 56 Res. Term.  
LO1: 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Vdd: 5.0V, Vref=2.5V  
Vdd: 5.0V, Vref=2.5V  
0
0
-10  
-20  
-30  
-10  
-20  
-30  
0
50  
100  
150  
200  
250  
300  
-10  
-8  
-6  
-4  
-2  
0
2
4
6
LO1 Frequency (MHz)  
LO1 Power (dBm)  
Pout vs. LO2 Frequency  
Pout vs. LO2 Power  
20  
10  
20  
10  
Upper Side Band  
BB: 100 kHz, 54.5 dBmV  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
+25C  
-40C  
+85C  
+25C  
-40C  
+85C  
LO1: 70 MHz, 0 dBm, 56 Res. Term.  
LO1: 70 MHz, 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 56 Res. Term.  
LO2: 0 dBm, 56 Res. Term.  
Vdd: 5.0V, Vref=2.5V  
Vdd: 5.0V, Vref=2.5V  
0
0
-10  
-20  
-30  
-10  
-20  
-30  
100  
400  
700  
1000  
1300  
1600  
1900  
-10  
-8  
-6  
-4  
-2  
0
2
4
6
LO2 Frequency (MHz)  
LO2 Power (dBm)  
Rev B1 010329  
5-15  
RF2412  
Phase Error vs. LO1 Frequency  
Suppression Levels vs. LO1 Frequency  
(+25C)  
10.0  
0
-20  
-IMD3  
CARR  
-IMD2  
+IMD2  
S.B.  
+IMD3  
5.0  
-40  
0.0  
-60  
-5.0  
-10.0  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
+25C  
-40C  
+85C  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
-80  
LO1: 0 dBm, 56 Res. Term.  
LO1: 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Vdd: 5.0V, Vref=2.5V  
Vdd: 5.0V, Vref=2.5V  
5
-100  
0
50  
100  
150  
200  
250  
300  
0
0
0
50  
100  
150  
200  
250  
300  
300  
300  
LO1 Frequency (MHz)  
LO1 Frequency (MHz)  
Amplitude Error vs. LO1 Frequency  
Suppression Levels vs. LO1 Frequency  
(-40C)  
2.0  
1.5  
0
-20  
-IMD3  
CARR  
-IMD2  
+IMD2  
S.B.  
+25C  
-40C  
+85C  
+IMD3  
1.0  
0.5  
-40  
0.0  
-60  
-0.5  
-1.0  
-1.5  
-2.0  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
-80  
LO1: 0 dBm, 56 Res. Term.  
LO1: 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Vdd: 5.0V, Vref=2.5V  
Vdd: 5.0V, Vref=2.5V  
-100  
0
50  
100  
150  
200  
250  
300  
50  
100  
150  
200  
250  
LO1 Frequency (MHz)  
LO1 Frequency (MHz)  
Pout and Idd vs. Vdd  
Suppression Levels vs. LO1 Frequency  
(+85C)  
20  
10  
100  
80  
60  
40  
20  
0
0
-20  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
LO1: 70 MHz, 0 dBm, 56 Res. Term.  
-IMD3  
CARR  
-IMD2  
+IMD2  
S.B.  
+IMD3  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Vref=2.5V  
0
-40  
-10  
-20  
-30  
-60  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
-80  
LO1: 0 dBm, 56 Res. Term.  
Pout, +25C  
Idd, +25C  
Pout, -40C  
Idd, -40C  
Pout, +85C  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Idd, +85C  
Vdd: 5.0V, Vref=2.5V  
-100  
4.0  
4.5  
5.0  
5.5  
6.0  
6.5  
50  
100  
150  
200  
250  
Vdd (Volts)  
LO1 Frequency (MHz)  
5-16  
Rev B1 010329  
RF2412  
Optimized Carrier Suppression vs. LO1 Frequency  
(optimized at +25C and LO1=70 MHz)  
0
-20  
-40  
-60  
-80  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
LO1: 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Vdd: 5.0V, Vref=2.5V  
+25C  
-40C  
+85C  
5
0
50  
100  
150  
200  
250  
300  
LO1 Frequency (MHz)  
Optimized Sideband Suppression vs. LO1 Frequency  
(optimized at +25C and LO1=70 MHz)  
0
-20  
-40  
-60  
-80  
Upper Side Band  
BB: 100 kHz, 54.5dBmV  
LO1: 0 dBm, 56 Res. Term.  
LO2: 845 MHz, 0 dBm, 56 Res. Term.  
Vdd: 5.0V, Vref=2.5V  
+25C  
-40C  
+85C  
0
50  
100  
150  
200  
250  
300  
LO1 Frequency (MHz)  
Rev B1 010329  
5-17  

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