HFBR-53D3EM [ETC]
1 x 9 5V Fiber Optic Transceiver for Fibre Channel/Storage - Extended Shield. Metalized Housing ; 1 ×9 5V光纤收发器光纤通道/存储 - 扩展盾。金属化外壳\n
| 型号： | HFBR-53D3EM |
| 厂家： | 
ETC |
| 描述： | 1 x 9 5V Fiber Optic Transceiver for Fibre Channel/Storage - Extended Shield. Metalized Housing
|
| 文件： | 总16页 (文件大小：446K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 x 9 Fiber Optic Transceivers
for Fibre Channel
Technical Data
HFBR-53D3 Family,
850 nm VCSEL
HFCT-53D3 Family,
1300 nm FP Laser
Features
Applications:
• HFBR-53D3 is Compliant
with ANSI X3.297-1996
Fibre Channel Physical
Interface FC-PH-2 Revision
7.4 Proposed Specifications
for 100-M5-SN-I and
100-M6-SN-I signal interfaces
• HFCT-53D3 is Compliant
with ANSI 100-SM-LC-L
Revision 2 enhancement to
ANSI X3.297-1996 FC-PH-2
Revision 7.4
• Mass Storage Systems I/O
• Computer Systems I/O
• High-speed Peripheral
Interface
• High-speed Switching
Systems
• Host Adapter I/O
• RAID Cabinets
Related Products
Transmitter Section
The transmitter section of the
HFBR-53D3 consists of an 850 nm
Vertical Cavity Surface Emitting
Laser (VCSEL) in an optical
subassembly (OSA), which mates
to the fiber cable. The HFCT-53D3
incorporates a 1300 nm Fabry-
Perot (FP) Laser designed to
meet the Fibre Channel
specification. The OSA is driven
by a custom, silicon bipolar IC
which converts differential PECL
logic signals (ECL referenced to a
+5 V supply) into an analog laser
diode drive current.
• Physical Layer ICs
Available for optical or
Copper Interface (HDMP-
1536A/46A)
• Industry Standard
Mezzanine Height 1 x 9
Package Style with Integral
Duplex SC Connector
• Performance:
• Versions of this Transceiver
Module also available for
Gigabit Ethernet
HFBR-53D3:
300 m over 62.5/125 µm
MMF
500 m over 50/125 µm MMF
HFCT-53D3:
500 m with 50/125 µm MMF
500 m with 62.5/125 µm
MMF
(HFBR/HFCT-53D5 Family)
• Gigabit Interface
Converters (GBIC) for
Fibre Channel (CX, SX, LX)
Description
The HFBR/HFCT-53D3
transceiver from Agilent allows
the system designer to implement
a range of solutions for
multimode and single mode Fibre
Channel applications.
10 km with 9/125 µm SMF
• IEC 60825-1 Class 1/CDRH
Class I Laser Eye Safe
• Single +5 V Power Supply
Operation with PECL Logic
Interfaces
• Wave Solderable and
Aqueous Wash Process
Compatible
Receiver Section
The receiver of the HFBR-53D3
includes a silicon PIN photodiode
mounted together with a custom,
silicon bipolar transimpedance
preamplifier IC in an OSA. This
OSA is mated to a custom silicon
bipolar circuit that provides post-
amplification and quantization.
The HFCT-53D3 utilizes an InP
PIN photodiode in the same
configuration.
The overall Agilent transceiver
product consists of three sections:
the transmitter and receiver
optical subassemblies, an
electrical subassembly, and the
package housing which
incorporates a duplex SC
connector receptacle.
2
The post-amplifier also includes a
Signal Detect circuit which
Recommended Cleaning/
Degreasing Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane.
Other: soap solution, naphtha.
to the outside of the equipment
chassis it may be subject to
whatever system-level ESD test
criteria that the equipment is
intended to meet. The transceiver
performance is more robust than
typical industry equipment
provides a PECL logic-high output
upon detection of a usable input
optical signal level. This single-
ended PECL output is designed to
drive a standard PECL input
through a 50 PECL load.
Do not use partially halogenated
hydrocarbons such as 1,1.1
requirements of today.
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also, Agilent
does not recommend the use of
cleaners that use halogenated
hydrocarbons because of their
potential environmental harm.
Electromagnetic Interference
(EMI)
Package and Handling
Instructions
Flammability
The HFBR/HFCT-53D3
transceiver housing is made of
high strength, heat resistant,
chemically resistant, and UL 94V-0
flame retardant plastic.
Most equipment designs utilizing
these high-speed transceivers from
Agilent will be required to meet
the requirements of FCC in the
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 5) for more details.
Recommended Solder and
Wash Process
The HFBR/HFCT-53D3 is
compatible with industry-standard
wave or hand solder processes.
Regulatory Compliance
(See the Regulatory Compliance
Table for transceiver performance)
The overall equipment design will
determine the certification level.
The transceiver performance is
offered as a figure of merit to
assist the designer in considering
their use in equipment designs.
Immunity
Equipment utilizing these
transceivers will be subject to
radio-frequency electromagnetic
fields in some environments.
These transceivers have good
immunity to such fields due to
their shielded design.
Process plug
This transceiver is supplied with a
process plug (HFBR-5000) for
protection of the optical ports
within the duplex SC connector
receptacle. This process plug
prevents contamination during
wave solder and aqueous rinse as
well as during handling, shipping
and storage. It is made of a high-
temperature, molded sealing
material that can withstand +80°C
and a rinse pressure of 110 lbs
per square inch.
Eye Safety
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
These laser-based transceivers
are classified as AEL Class I (U.S.
21 CFR(J) and AEL Class 1 per
EN 60825-1 (+A11). They are eye
safe when used within the data
sheet limits per CDRH. They are
also eye safe under normal
operating conditions and under
all reasonably foreseeable single
fault conditions per EN60825-1.
Agilent has tested the transceiver
design for compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to these
transceivers for laser eye safety
and use in EN 60950 and
The first case is during handling of
the transceiver prior to mounting it
on the circuit board. It is important
to use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas. The
transceiver performance has been
shown to provide adequate
Recommended Solder fluxes
Solder fluxes used with the
HFBR/HFCT-53D3 should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-Metals of Jersey City, NJ.
performance in typical industry
production environments.
The second case to consider is
static discharges to the exterior
of the equipment chassis
containing the transceiver parts.
To the extent that the duplex SC
connector receptacle is exposed
EN 60825-2 applications. Their
performance enables the
transceivers to be used without
concern for eye safety up to 7 V
transmitter V
.
CC
3
Connection of the
CAUTION:
HFBR/HFCT-53D3 to a non-
approved optical source, operating
above the recommended absolute
maximum conditions or operating
the HFBR/HFCT-53D3 in a
manner inconsistent with its
design and function may result in
hazardous radiation exposure and
may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
There are no user serviceable
parts nor any maintenance
required for the
HFBR/HFCT-53D3. All
adjustments are made at the
factory before shipment to our
customers. Tampering with or
modifying the performance of the
HFBR/HFCT-53D3 will result in
voided product warranty. It may
also result in improper operation
of the HFBR/HFCT-53D3 circuitry,
and possible overstress of the
laser source. Device degradation
or product failure may result.
required by law to recertify and
reidentify the laser product under
the provisions of U.S. 21 CFR
(Subchapter J).
Regulatory Compliance
Feature
Electrostatic Discharge MIL-STD-883C
Test Method
Performance
Class 1 (>2000 V).
(ESD) to the
Method 3015.4
Electrical Pins
Electrostatic Discharge Variation of IEC 801-2
(ESD) to the
Duplex SC Receptacle
Typically withstand at least 15 kV without damage
when the duplex SC connector receptacle is
contacted by a Human Body Model probe.
Margins are dependent on customer board and
chassis designs.
Electromagnetic
FCC Class B
Interference (EMI)
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class I
Immunity
Variation of IEC 801-3
Typically show no measurable effect from a 3 V/m
field swept from 27 to 1000 MHz applied to the
transceiver without a chassis enclosure.
AEL Class I, FDA/CDRH
Laser Eye Safety
and Equipment Type
Testing
US 21 CFR, Subchapter J
per Paragraphs 1002.10
and 1002.12
HFBR-53D3 Accession #9720151-03
HFCT-53D3 Accession #9521220-16
EN 60825-1: 1994 +A11
EN 60825-2: 1994
AEL Class 1, TUV Rheinland of North America
HFBR-53D3:
EN 60950: 1992+A1+A2+A3
Certificate #E9771047.09
Protection Class III
HFCT-53D3
Certificate #933/510803
Component
Recognition
Underwriters Laboratories and UL File #E173874
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
4
As for the receiver section, it is
internally ac-coupled between the
preamplifier and the post-
In the HFBR-53D3 there are three
key elements to the laser driver
safety circuitry: a monitor diode,
a window detector circuit and
direct control of the laser bias.
The window detection circuit
monitors the average optical
power using the monitor diode. If
a fault occurs such that the
transmitter dc regulation circuit
cannot maintain the preset bias
conditions for the laser emitter
within 20ꢀ, the transmitter will
automatically be disabled. Once
this has occurred, only an
APPLICATION SUPPORT
Optical Power Budget
and Link Penalties
amplifier stages. The actual Data
and Data-bar outputs of the post-
amplifier are dc-coupled to their
respective output pins (pins 2, 3).
Signal Detect is a single-ended,
+5 V PECL output signal that is
dc-coupled to pin 4 of the module.
Signal Detect should not be ac-
coupled externally to the
The worst-case Optical Power
Budget (OPB) in dB for a fiber-
optic link is determined by the
difference between the minimum
transmitter output optical power
(dBm avg.) and the lowest receiver
sensitivity (dBm avg.). This OPB
provides the necessary optical
signal range to establish a working
fiber-optic link. The OPB is
allocated for the fiber-optic cable
length and the corresponding link
penalties. For proper link
performance, all penalties that
affect the link performance must
be accounted for within the link
optical power budget.
follow-on circuits because of its
infrequent state changes.
Caution should be taken to account
for the proper interconnection
between the supporting Physical
Layer integrated circuits and this
HFBR/HFCT-53D3 transceiver.
Figure 3 illustrates a
recommended interface circuit
for interconnecting to a +5 V dc
PECL fiber-optic transceiver.
electrical power reset will allow
an attempted turn-on of the
transmitter.
The HFCT-53D3 utilizes an
integral fiber stub along with a
current limiting circuit to
guarantee eye-safety. It is
intrinsically eye safe and does not
require shut down circuitry.
Data Line
Interconnections
Agilent’s HFBR/HFCT-53D3 fiber-
optic transceiver is designed to
directly couple to +5 V PECL
signals. The transmitter inputs
are internally dc-coupled to the
laser driver circuit from the
transmitter input pins (pins 7, 8).
There is no internal, capacitively-
coupled 50 Ohm termination
resistance within the transmitter
input section. The transmitter
driver circuit for the laser light
source is a dc-coupled circuit.
This circuit regulates the output
optical power. The regulated light
output will maintain a constant
output optical power provided the
data pattern is reasonably
balanced in duty factor. If the
data duty factor has long,
continuous state times (low or
high data duty factor), then the
output optical power will
gradually change its average
output optical power level to its
preset value.
Some fiber-optic transceiver
suppliers’ modules include
internal capacitors, with or
Signal Detect
The Signal Detect circuit provides
a deasserted output signal that
implies the link is open or the
transmitter is OFF. The Signal
Detect threshold is set to
without 50 Ohm termination, to
couple their Data and Data-bar
lines to the I/O pins of their
module. When designing to use
these type of transceivers along
with Agilent transceivers, it is
important that the interface
circuit can accommodate either
internal or external capacitive
coupling with 50 Ohm termination
components for proper operation
of both transceiver designs. The
internal dc-coupled design of the
HFBR/HFCT-53D3 I/O
transition from a high to low state
between the minimum receiver
input optional power and -30 dBm
avg. input optical power
indicating a definite optical fault
(e.g. unplugged connector for the
receiver or transmitter, broken
fiber, or failed far-end transmitter
or data source). A Signal Detect
indicating a working link is
functional when receiving
encoded 8B/l0B characters. The
Signal Detect does not detect
receiver data error or error-rate.
Data errors are determined by
Signal processing following the
transceiver.
connections was done to provide
the designer with the most
flexibility for interfacing to
various types of circuits.
Eye Safety Circuit
For an optical transmitter device
to be eye-safe in the event of a
single fault failure, the transmitter
must either maintain normal, eye-
safe operation or be disabled.
5
contacts the panel or enclosure
on the inside of the aperture on
all but the bottom side of the
shield and provides a good RF
connection to the panel. This
option can accommodate various
panel or enclosure thickness, i.e.,
.04 in. min. to 0.10 in. max. The
reference plane for this panel
thickness variation is from the
front surface of the panel or
enclosure. The recommended
length for protruding the
equipment closure. The front
panel aperture dimensions are
recommended in Figures 7 and 9.
When layout of the printed circuit
board is done to incorporate
these metal-shielded transceivers,
keep the area on the printed
circuit board directly under the
metal shield free of any
Electromagnetic
Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard; and
more importantly, it reduces the
possibility of interference to
neighboring equipment. There are
three options available for the
HFBR-53D3 and two for the
HFCT-53D3 with regard to EMI
shielding which provide the
designer with a means to achieve
good EMI performance. The EMI
performance of an enclosure
using these transceivers is
components and circuit board
traces. For additional EMI
performance advantage, use
duplex SC fiber-optic connectors
that have low metal content
inside them. This lowers the
ability of the metal fiber-optic
connectors to couple EMI out
through the aperture of the panel
or enclosure.
HFBR/HFCT-53D3 EM
transceiver beyond the front
surface of the panel or enclosure
is 0.25 in. With this option, there
is flexibility of positioning the
module to fit the specific need of
the enclosure design. (See
Figure 6 for the mechanical
drawing dimensions of this
shield.)
dependent on the chassis design.
Agilent encourages using
standard RF suppression
practices and avoiding poorly
EMI-sealed enclosures.
The third configuration, option
FM, is for applications that are
designed to have a flush mounting
of the module with respect to the
front of the panel or enclosure.
The flush-mount design
accommodates a large variety of
panel thickness, i.e., 0.04 in. min.
to 0.10 in. max. Note the
reference plane for the flush-
mount design is the interior side
of the panel or enclosure. The
recommended distance from the
centerline of the transceiver front
solder posts to the inside wall of
the panel is 0.55 in. This option
contacts the inside panel or
enclosure wall on all four sides of
this metal shield. See Figure 8 for
the mechanical drawing
The first configuration is a
standard HFBR-53D3 fiber optic
transceiver that has no external
EMI shield. This unit is for
applications where EMI is either
not an issue for the designer, the
unit resides completely inside a
shielded enclosure, or the module
is used in a low density,
extremely quiet application. The
HFCT-53D3 is not available for
use without an external shield.
The second configuration, option
EM, is for EMI shielding
applications where the position of
the transceiver module will
extend outside the equipment
enclosure. The metallized plastic
package and integral external
metal shield of the transceiver
helps locally to terminate EM
fields to the chassis to prevent
their emissions outside the
dimensions of this shield.
The two metallized designs are
comparable in their shielding
effectiveness. Both design
options connect only to the
equipment chassis and not to the
signal or logic ground of the
circuit board within the
enclosure. This metal shield
6
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation,
all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one
parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect
device reliability.
Parameter
Storage Temperature
Symbol
TS
Min.
-40
Typ.
Max.
+100
7.0
Unit
°C
V
Reference
Supply Voltage
VCC
VI
-0.5
-0.5
1
2
Data Input Voltage
VCC
1.6
V
Transmitter Differential Input Voltage
Output Current
VD
V
ID
50
mA
ꢀ
Relative Humidity
RH
5
95
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Case Temperature
Symbol
Min.
Typ.
Max.
+70
Unit
°C
°C
V
Reference
TA
TC
0
3
4
+90
Supply Voltage
VCC
4.75
5.25
Power Supply Rejection
PSR
VIL-VCC
VIH-VCC
VD
50
mVP-P
V
5
6
6
Transmitter Data Input Voltage - Low
Transmitter Data Input Voltage - High
Transmitter Differential Input Voltage
Data Output Load
-1.810
-1.165
0.3
-1.475
-0.880
1.6
V
V
RDL
50
7
7
Signal Detect Output Load
RSDL
50
Process Compatibility
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Hand Lead Soldering Temperature/Time
Wave Soldering and Aqueous Wash
T
SOLD/tSOLD
+260/10 °C/sec.
+260/10 °C/sec.
T
SOLD/tSOLD
8
Notes:
1. The transceiver is class 1 eye safe up to V = 7 V.
CC
2. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs without damaging the input
circuit.
3. 2 m/s air flow required.
4. Case temperature measurement referenced to the center-top of the internal metal transmitter shield.
5. Tested with a 50 mV
sinusoidal signal in the frequency range from 500 Hz to 1500 kHz on the V supply with the
CC
P-P
recommended power supply filter in place. Typically less than a 0.25 dB change in sensitivity is experienced.
6. Compatible with 10 K, 10 KH, and 100 K ECL and PECL input signals.
7. The outputs are terminated to V -2 V.
CC
8. Aqueous wash pressure <110 psi.
7
HFBR-53D3 Family, 850 nm VCSEL
Transmitter Electrical Characteristics
(TA = 0°C to +70°C, V = 4.75 V to 5.25 V)
CC
Parameter
Supply Current
Symbol
ICCT
Min.
Typ.
85
Max.
120
Unit
mA
W
Reference
Power Dissipation
PDIST
IIL
0.45
0
0.63
Data Input Current - Low
Data Input Current - High
Laser Reset Voltage
-350
µA
µA
V
IIH
16
350
2.5
VCCT-reset
2.7
1
Receiver Electrical Characteristics
(TA = 0°C to +70°C, V = 4.75 V to 5.25 V)
CC
Parameter
Supply Current
Symbol
ICCR
Min.
Typ.
105
Max.
130
Unit
mA
W
Reference
2
2
3
3
4
4
3
3
Power Dissipation
PDISR
0.53
0.68
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
VOL - VCC
-1.950
-1.045
-1.620
-0.740
0.40
V
V
OH - VCC
V
tr
tf
ns
ns
V
0.40
VOL - VCC
OH - VCC
-1.950
-1.045
-1.620
-0.740
Signal Detect Output Voltage - High
V
V
Notes:
1. The Laser Reset Voltage is the voltage level below which the V
voltage must be lowered to cause the laser driver circuit to
CCT
reset from an electrical/optical shutdown condition to a proper electrical/optical operating condition. The maximum value
corresponds to the worst-case highest V voltage necessary to cause a reset condition to occur. The laser safety shutdown
CC
circuit will operate properly with transmitter V levels of 3.5 V dc < V < 7.0 V dc.
CC
CC
2. Receiver Supply Current and Power Dissipation do not include current and power in external 270 ohm terminating resistors.
3. These outputs are compatible with 10 K, 10 KH, and 100 K ECL and PECL inputs.
4. These are 20-80ꢀ values.
HFBR-53D3 Family, 850 nm VCSEL
Transmitter Optical Characteristics
(TA = 0°C to +70°C, V = 4.75 V to 5.25 V)
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Output Optical Power
POUT
-10
-4
dBm avg.
50/125 µm, NA = 0.20 Fiber
Output Optical Power
POUT
-10
-4
dBm avg.
62.5/125 µm, NA = 0.275 Fiber
Optical Extinction Ratio
9
dB
nm
1
Center Wavelength
Spectral Width - rms
Optical Rise/Fall Time
RIN12
830
850
860
0.85
0.45
-116
188
C
nm rms
ns
tr/tf
2, 3 Figure 1
dB/Hz
ps
Deterministic Transmitter Jitter
See notes on following page.
8
Receiver Optical Characteristics
(TA = 0°C to +70°C, V = 4.75 V to 5.25 V)
CC
Parameter
Input Optical Power
Operating Center Wavelength
Return Loss
Symbol
Min.
-16
Typ.
Max.
0
Unit
dBm avg.
nm
Reference
PIN
4
770
12
860
C
dB
5
Signal Detect – Asserted
Signal Detect – Deasserted
Signal Detect – Hysteresis
Notes:
P
-18
dBm avg.
dBm avg.
dB
PD
-30
1.5
PA - PD
1. Optical Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the
low (“0”) state. This Optical Extinction Ratio is expressed in decibels (dB) by the relationship 10log(P
/P
).
high avg low avg
2. These are 20-80ꢀ values and include the effect of a fourth order filter.
3. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 1). The characteristics include rise time,
fall time, pulse overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the
receiver sensitivity.
4. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.
5. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.
HFCT-53D3 Family, 1300 nm FP/Laser
Transmitter Electrical Characteristics
(TA = 0°C to +70°C, V = 4.75 V to 5.25 V)
CC
Parameter
Supply Current
Symbol
ICCT
Min.
Typ.
65
Max.
130
Unit
mA
W
Reference
Power Dissipation
PDIST
IIL
0.35
0
0.68
Data Input Current - Low
Data Input Current - High
-350
µA
IIH
16
350
µA
Receiver Electrical Characteristics
(TA = 0°C to +70°C, V = 4.75 V to 5.25 V)
CC
Parameter
Supply Current
Symbol
ICCR
Min.
Typ.
120
Max.
140
Unit
mA
W
Reference
1
1
2
2
3
3
2
2
Power Dissipation
PDISR
0.53
0.74
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
VOL - VCC
-1.950
-1.045
-1.620
-0.740
0.40
V
V
OH - VCC
V
tr
tf
ns
ns
V
Data Output Fall Time
0.40
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
VOL - VCC
OH - VCC
-1.950
-1.045
-1.620
-0.740
V
V
Notes:
1. Receiver Supply Current and Power Dissipation do not include current and power in external 270 ohm terminating resistors.
2. These outputs are compatible with 10 K, 10 KH, and 100 K ECL and PECL inputs.
3. These are 20-80ꢀ values.
9
HFCT-53D3 Family, 1300 nm FP-Laser
Transmitter Optical Characteristics
(TA = 0°C to +70°C, V = 4.75 V to 5.25 V)
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Output Optical Power 9 mm SMF
Output Optical Power 62.5 mm MMF
Output Optical Power 50 mm MMF
Optical Extinction Ratio
POUT
-9.5
-11.5
-11.5
9
-3
-3
-3
dBm
dBm
dBm
dB
1
1
2
Center Wavelength
Spectral Width - rms
Optical Rise/Fall Time
RIN12
1285
1343
2.8
nm
nm rms
ns
C
tr/tf
0.32
-116
188
3, 4 Figure 1
dB/Hz
ps
Deterministic Transmitter Jitter
Receiver Optical Characteristics
(TA = 0°C to +70°C, V = 4.75 V to 5.25 V)
CC
Parameter
Input Optical Power
Symbol
Min.
-20
Typ.
Max.
-3
Unit
dBm avg.
nm
Reference
PIN
5
Operating Center Wavelength
Return Loss
1270
12
1355
C
dB
6
Signal Detect – Asserted
Signal Detect – Deasserted
Signal Detect – Hysteresis
P
-20
dBm avg.
dBm avg.
dB
PD
-30
1.5
PA - PD
Notes:
1. Specifications for 1300 nm transceivers with multimode fiber are modeled after IEEE.802.3z standard for Gigabit Ethernet.
2. Optical Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the
low (“0”) state. This Optical Extinction Ratio is expressed in decibels (dB) by the relationship 10log(P
/P
).
high avg low avg
3. These are 20-80ꢀ values and are corrected to remove the effects of the fourth order filter used during measurement.
4. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 1). The characteristics include rise time,
fall time, pulse overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the
receiver sensitivity.
5. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.
6. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.
1.3
1.0
0.8
0.5
0.2
0
-0.2
0
0.375
NORMALIZED TIME
Figure 1. Transmitter Optical Eye Diagram Mask
0.625
0.85
1.0
0.15
10
Table 1. Pinout Table
Pin Symbol
Functional Description
Mounting Pins The mounting pins are provided for transceiver mechanical attachment to the circuit board.
They are embedded in the nonconductive plastic housing and are not connected to the
transceiver internal circuit, nor is there a guaranteed connection to the metallized housing
in the EM and FM versions. They should be soldered into plated-through hole on the
printed circuit board.
1
VEER
Receiver Signal Ground
Directly connect this pin to receiver signal ground plane. (For HFBR-53D3, VEER = VEET
)
2
RD+ Receiver Data Out
RD+ is an open-emitter output circuit. Terminate this high-speed differential PECL output
with standard PECL techniques at the follow-on device input pin.
3
4
RD– Receiver Data Out Bar
RD– is an open-emitter output circuit. Terminate this high-speed differential PECL output
with standard PECL techniques at the follow-on device input pin.
Signal Detect
SD
Normal optical input levels to the receiver result in a logic “1” output, VOH, asserted.
Low input optical levels to the receiver result in a fault condition indicated by a logic “0”
output VOL, deasserted.
Signal Detect is a single-ended PECL output. SD can be terminated with standard PECL
techniques via 50 to VCCR - 2 V. Alternatively, SD can be loaded with a 270 resistor to
VEER to conserve electrical power with small compromise to signal quality. If Signal Detect
output is not used, leave it open-circuited.
This Signal Detect output can be used to drive a PECL input on an upstream circuit, such
as, Signal Detect input or Loss of Signal-bar.
5
6
7
8
9
VCCR
VCCT
TD–
Receiver Power Supply
Provide +5 V dc via the recommended receiver power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCR pin.
Transmitter Power Supply
Provide +5 Vdc via the recommended transmitter power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCT pin.
Transmitter Data In-Bar
Terminate this high-speed differential PECL input with standard PECL techniques at the
transmitter input pin.
TD+ Transmitter Data In
Terminate this high-speed differential PECL input with standard PECL techniques at the
transmitter input pin.
Transmitter Signal Ground
VEET
Directly connect this pin to the transmitter signal ground plane.
1 = VEER
NIC
RX
2 = RD+
3 = RD–
4 = SD
5 = VCCR
6 = VCCT
7 = TD–
8 = TD+
9 = VEET
TX
NIC
TOP VIEW
NIC = NO INTERNAL CONNECTION (MOUNTING PINS)
Figure 2. Pin-Out
11
3.3 V dc
GND
+
C5
5 V dc
0.1 µF
9
8
R3
68
R2
68
V
TD+
CC2
VEE2
V
EET
50
50
CLOCK
SYNTHESIS
CIRCUIT
TD+
TD-
C9 0.01 µF
LASER
DRIVER
CIRCUIT
PECL
INPUT
OUTPUT
DRIVER
PARALLEL
TO SERIAL
CIRCUIT
TD-
7
C10 0.01 µF
R4
191
R1
191
R13
150
R12
150
L2
6
5
V
CCT
HFBR/HFCT-53D3
FIBER-OPTIC
TRANSCEIVER
5 V dc
C4
HDMP-1536A/-1546A
SERIAL/DE-SERIALIZER
(SERDES - 10 BIT
C2
1 µH
0.1 µF
C3
+
L1
TRANSCEIVER)
VCCR
0.1
µF
10
µF
C1
C8*
1 µH
+
0.1
µF
10 µF*
SIGNAL
DETECT
CIRCUIT
SD
TO SIGNAL DETECT (SD)
4
3
INPUT AT UPPER-LEVEL-IC
R9
270
CLOCK
RD-
50
RD-
RECOVERY
C12 0.01 µF
PRE-
AMPLIFIER
POST-
AMPLIFIER
R14
CIRCUIT
INPUT
BUFFER
SERIAL TO
100
50
RD+
RD+
2
1
PARALLEL
CIRCUIT
C11 0.01 µF
VEER
R11
270
R10
270
SEE HDMP-1536A/-1546A DATA SHEET FOR
DETAILS ABOUT THIS TRANSCEIVER IC.
NOTES:
*C8 IS AN OPTIONAL BYPASS CAPACITOR FOR ADDITIONAL LOW-FREQUENCY NOISE FILTERING.
USE SURFACE-MOUNT COMPONENTS FOR OPTIMUM HIGH-FREQUENCY PERFORMANCE.
USE 50 MICROSTRIP OR STRIPLINE FOR SIGNAL PATHS.
LOCATE 50 TERMINATIONS AT THE INPUTS OF RECEIVING UNITS.
Figure 3. Recommended Gigabit/sec Ethernet HFBR/HFCT-53D3 Fiber-Optic Transceiver and HDMP-1536A/1546A
SERDES Integrated Circuit Transceiver Interface and Power Supply Filter Circuits.
12
1.9 0.1
0.075 0.004
ø
(2X)
–A–
20.32
0.800
Ø0.000
M
A
0.8 0.1
ø
(9X)
20.32
0.800
0.032 0.004
Ø0.000
M
A
2.54
0.100
(8X)
TOP VIEW
Figure 4. Recommended Board Layout Hole Pattern.
XXXX-XXXX
KEY:
Agilent
ZZZZZ LASER PROD
21CFR(J) CLASS 1
YYWW = DATE CODE
FOR MULTIMODE MODULE:
XXXX-XXXX = HFBR-53xx
ZZZZ = 850 nꢀ
COUNTRY OF ORIGIN YYWW
RX
TX
39.6
(1.56)
12.7
(0.50)
MAX.
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4
(1.00)
12.7
(0.50)
MAX.
2.0 0.1
(0.079 0.004)
2.5
(0.10)
SLOT WIDTH
SLOT DEPTH
+0.1
0.25
-0.05
+0.004
-0.002
(
0.010
)
9.8
MAX.
(0.386)
0.51
(0.020)
3.3 0.38
(0.130 0.015)
20.32
(0.800)
15.8 0.15
(0.622 0.006)
+0.25
0.46
-0.05
+0.25
-0.05
9X Ø
1.27
+0.010
(
0.018
)
2X Ø
-0.002
+0.010
(
0.050
)
-0.002
2.54
(0.100)
8X
20.32
(0.800)
23.8
(0.937)
20.32
(0.800)
1.3
(0.051)
2X Ø
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE 0.025 ꢀꢀ UNLESS OTHERWISE SPECIFIED.
Figure 5. Package Outline Drawing for HFBR/HFCT-53D3.
13
KEY:
XXXX-XXXX
YYWW = DATE CODE
FOR MULTIMODE MODULE:
XXXX-XXXX = HFBR-53xx
ZZZZ = 850 nꢀ
Agilent
TX
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
FOR SINGLEMODE MODULES:
XXXX-XXXX = HFCT-53xx
ZZZZ = 1300 nꢀ
29.6
(1.16)
UNCOMPRESSED
39.6
(1.56)
12.7
(0.50)
4.7
(0.185)
MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
25.4
12.7
(0.50)
MAX.
(1.00)
2.0 0.1
(0.079 0.004)
SLOT WIDTH
+0.1
0.25
2.09
(0.08)
10.2
(0.40)
UNCOMPRESSED
-0.05
MAX.
+0.004
(
0.010
)
-0.002
9.8
MAX.
(0.386)
1.3
(0.05)
3.3 0.38
(0.130 0.015)
20.32
(0.80)
15.8 0.15
(0.622 0.006)
+0.25
0.46
-0.05
+0.010
-0.002
+0.25
1.27
9X Ø
-0.05
(
0.018
)
2X Ø
+0.010
(
0.050
)
-0.002
2.54
(0.100)
8X
20.32
(0.800)
23.8
(0.937)
20.32
(0.800)
1.3
(0.051)
2X Ø
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE 0.025 ꢀꢀ UNLESS OTHERWISE SPECIFIED.
Figure 6. Package Outline for HFBR/HFCT-53D3EM.
14
0.8
(0.032)
2X
0.8
(0.032)
2X
+0.5
10.9
-0.25
+0.02
)
(0.43
-0.01
9.4
(0.37)
27.4 0.50
(1.08 0.02)
6.35
(0.25)
MODULE
PROTRUSION
PCB BOTTOM VIEW
Figure 7. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-53D3EM.
15
KEY:
XXXX-XXXX
Agilent
TX
YYWW = DATE CODE
FOR MULTIMODE MODULE:
XXXX-XXXX = HFBR-5208
ZZZZ = 1300 nꢀ
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
FOR SINGLEMODE MODULES:
XXXX-XXXX = HFCT-5208
ZZZZ = 1300 nꢀ
39.6
(1.56)
12.7
(0.50)
MAX.
1.01
4.7
(0.185)
(0.40)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4
(1.00)
MAX.
12.7
(0.50)
29.7
(1.17)
2.0 0.1
(0.079 0.004)
SLOT WIDTH
25.8
(1.02)
MAX.
2.2
(0.09)
SLOT DEPTH
+0.1
10.2
0.25
MAX.
-0.05
(0.40)
+0.004
(
0.010
)
-0.002
14.4
(0.57)
22.0
(0.87)
9.8
MAX.
3.3 0.38
(0.386)
(0.130 0.015)
20.32
(0.800)
15.8 0.15
+0.25
0.46
(0.622 0.006)
-0.05
+0.25
9X Ø
1.27
+0.010
-0.05
+0.010
-0.002
(
0.018
)
2X Ø
-0.002
(
0.050
)
AREA
RESERVED
FOR
PROCESS
PLUG
2.54
(0.100)
8X
20.32
(0.800)
23.8
(0.937)
20.32
(0.800)
1.3
(0.051)
2X Ø
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE 0.025 ꢀꢀ UNLESS OTHERWISE SPECIFIED.
Figure 8. Package Outline for HFBR/HFCT-53D3FM.
DIMENSION SHOWN FOR MOUNTING
MODULE
FLUSH TO PANEL. THICKER PANEL WILL
RECESS MODULE. THINNER PANEL WILL
PROTRUDE MODULE.
1.98
(0.078)
1.27
(0.05)
OPTIONAL SEPTUM
30.2
KEEP OUT ZONE
(1.19)
0.36
(0.014)
10.82
(0.426)
14.73
(0.58)
1.82
(0.072)
26.4
(1.04)
13.82
(0.544)
BOTTOM SIDE OF PCB
12.0
(0.47)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE 0.025 ꢀꢀ UNLESS OTHERWISE SPECIFIED.
Figure 9. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-53D3FM.
Ordering Information
850 nm VCSEL (Short Wavelength Laser)
HFBR-53D3 No shield, plastic housing.
HFBR-53D3EM Extended/protruding shield, metallized housing.
HFBR-53D3FM Flush shield, metallized housing.
1300 nm FP Laser (Long Wavelength Laser)
HFCT-53D3EM Extended/protruding shield, metallized housing.
HFCT-53D3FM Flush shield, metallized housing.
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2000 Agilent Technologies, Inc.
5968-5302E (11/99)
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