HFBR-53D5FM [AGILENT]

1 x 9 Fiber Optic Transceivers for Gigabit Ethernet; 1 ×9光纤收发器千兆以太网
HFBR-53D5FM
型号: HFBR-53D5FM
厂家: AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述:

1 x 9 Fiber Optic Transceivers for Gigabit Ethernet
1 ×9光纤收发器千兆以太网

光纤 电信集成电路 电信电路 以太网
文件: 总16页 (文件大小:281K)
中文:  中文翻译
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1 x 9 Fiber Optic Transceivers  
for Gigabit Ethernet  
Technical Data  
HFBR-53D5 Family,  
850 nm VCSEL  
HFCT-53D5 Family,  
1300 nm FP Laser  
Features  
Applications  
• Compliant with  
Specifications for  
IEEE- 802.3z Gigabit  
Ethernet  
• Switch to Switch Interface  
• Switched Backbone  
Applications  
• High Speed Interface for  
File Servers  
• High Performance Desktops  
• Industry Standard  
Mezzanine Height 1 x 9  
Package Style with Integral  
Duplex SC Connector  
• Performance  
HFBR-53D5:  
220 m with 62.5/125 µm MMF  
500 m with 50/125 µm MMF  
HFCT-53D5:  
550 m with 62.5/125 µm MMF  
550 m with 50/125 µm MMF  
10 km with 9/125 SMF  
• IEC 60825-1 Class 1/CDRH  
Class I Laser Eye Safe  
• Single +5 V Power Supply  
Operation with PECL Logic  
Interfaces  
Related Products  
• Physical Layer ICs Available  
for Optical or Copper  
Interface (HDMP-1636A/  
1646A)  
• Versions of this Transceiver  
Module Also Available for  
Fibre Channel  
an electrical subassembly, and  
the package housing which  
incorporates a duplex SC  
connector receptacle.  
Transmitter Section  
(HFBR/HFCT-53D3)  
The transmitter section of the  
HFBR-53D5 consists of an  
850 nm Vertical Cavity Surface  
Emitting Laser (VCSEL) in an  
optical subassembly (OSA),  
which mates to the fiber cable.  
The HFCT-53D5 incorporates a  
1300 nm Fabry-Perot (FP) Laser  
designed to meet the Gigabit  
Ethernet LX specification. The  
OSA is driven by a custom,  
silicon bipolar IC which converts  
differential PECL logic signals  
(ECL referenced to a +5 Volt  
supply) into an analog laser diode  
drive current.  
• Gigabit Interface Converters  
(GBIC) for Gigabit Ethernet  
(CX, SX, LX)  
Description  
The HFBR/HFCT-53D5  
• Wave Solder and Aqueous  
Wash Process Compatible  
transceiver from Agilent  
Technologies allows the system  
designer to implement a range of  
solutions for multimode and  
single mode Gigabit Ethernet  
applications.  
The overall Agilent transceiver  
product consists of three  
sections: the transmitter and  
receiver optical subassemblies,  
2
Receiver Section  
Recommended Solder fluxes  
Solder fluxes used with the  
wrist straps, work benches, and  
floor mats in ESD controlled  
areas. The transceiver perform-  
ance has been shown to provide  
adequate performance in typical  
industry production  
The receiver of the HFBR-53D5  
includes a silicon PIN photo-  
diode mounted together with a  
custom, silicon bipolar  
transimpedance preamplifier IC  
in an OSA. This OSA is mated to a  
custom silicon bipolar circuit that  
provides post-amplification and  
quantization. The HFCT-53D5  
utilizes an InP PIN photodiode in  
the same configuration.  
HFBR/HFCT-53D5 should be  
water-soluble, organic fluxes.  
Recommended solder fluxes  
include Lonco 3355-11 from  
London Chemical West, Inc. of  
Burbank, CA, and 100 Flux from  
Alpha-Metals of Jersey City, NJ.  
environments.  
The second case to consider is  
static discharges to the exterior  
of the equipment chassis  
Recommended Cleaning/  
Degreasing Chemicals  
Alcohols: methyl, isopropyl,  
isobutyl.  
Aliphatics: hexane, heptane  
Other: soap solution, naphtha.  
containing the transceiver parts.  
To the extent that the duplex SC  
connector receptacle is exposed  
to the outside of the equipment  
chassis it may be subject to  
whatever system-level ESD test  
criteria that the equipment is  
intended to meet. The transceiver  
performance is more robust than  
typical industry equipment  
The post-amplifier also includes a  
Signal Detect circuit which pro-  
vides a PECL logic-high output  
upon detection of a usable input  
optical signal level. This single-  
ended PECL output is designed to  
drive a standard PECL input  
Do not use partially halogenated  
hydrocarbons such as 1,1.1  
trichloroethane, ketones such as  
MEK, acetone, chloroform, ethyl  
acetate, methylene dichloride,  
phenol, methylene chloride, or  
N-methylpyrolldone. Also, HP  
does not recommend the use of  
cleaners that use halogenated  
hydrocarbons because of their  
potential environmental harm.  
through a 50 PECL load.  
requirements of today.  
Package and Handling  
Instructions  
Flammability  
Electromagnetic Interference  
(EMI)  
Most equipment designs utilizing  
these high-speed transceivers  
from Agilent will be required to  
meet the requirements of FCC in  
the United States, CENELEC  
EN55022 (CISPR 22) in Europe  
and VCCI in Japan. Refer to EMI  
section (page 5) for more details.  
The HFBR/HFCT-53D5  
transceiver housing is made of  
high strength, heat resistant,  
chemically resistant, and UL  
94V-0 flame retardant plastic.  
Regulatory Compliance  
(See the Regulatory Compliance  
Table for transceiver  
performance)  
Recommended Solder and  
Wash Process  
The HFBR/HFCT-53D5 is  
compatible with industry-  
standard wave or hand solder  
processes.  
The overall equipment design will  
determine the certification level.  
The transceiver performance is  
offered as a figure of merit to  
assist the designer in considering  
their use in equipment designs.  
Immunity  
Equipment utilizing these  
transceivers will be subject to  
radio-frequency electromagnetic  
fields in some environments.  
These transceivers have good  
immunity to such fields due to  
their shielded design.  
Process plug  
This transceiver is supplied with  
a process plug (HFBR-5000) for  
protection of the optical ports  
within the duplex SC connector  
receptacle. This process plug  
prevents contamination during  
wave solder and aqueous rinse as  
well as during handling, shipping  
and storage. It is made of a high-  
temperature, molded sealing  
material that can withstand 80°C  
and a rinse pressure of 110 lbs  
per square inch.  
Electrostatic Discharge (ESD)  
There are two design cases in  
which immunity to ESD damage  
is important.  
Eye Safety  
These laser-based transceivers  
are classified as AEL Class I (U.S.  
21 CFR(J) and AEL Class 1 per  
EN 60825-1 (+A11). They are  
eye safe when used within the  
data sheet limits per CDRH. They  
are also eye safe under normal  
operating conditions and under  
all reasonably forseeable single  
The first case is during handling  
of the transceiver prior to  
mounting it on the circuit board.  
It is important to use normal ESD  
handling precautions for ESD  
sensitive devices. These pre-  
cautions include using grounded  
3
fault conditions per EN60825-1.  
Agilent has tested the transceiver  
design for compliance with the  
requirements listed below under  
normal operating conditions and  
under single fault conditions  
where applicable. TUV Rheinland  
has granted certi-fication to these  
transceivers for laser eye safety  
and use in EN 60950 and EN  
60825-2 applications. Their  
CAUTION:  
Connection of the HFBR/HFCT-  
53D5 to a nonapproved optical  
source, operating above the  
recommended absolute maximum  
conditions or operating the  
HFBR/HFCT-53D5 in a manner  
inconsistent with its design and  
function may result in hazardous  
radiation exposure and may be  
considered an act of modifying or  
manufacturing a laser product.  
The person(s) performing such  
an act is required by law to  
There are no user serviceable  
parts nor any maintenance  
required for the  
HFBR/HFCT-53D5. All  
adjustments are made at the  
factory before shipment to our  
customers. Tampering with or  
modifying the performance of the  
HFBR/HFCT-53D5 will result in  
voided product warranty. It may  
also result in improper operation  
of the HFBR/HFCT-53D5  
circuitry, and possible overstress  
of the laser source. Device  
degradation or product failure  
may result.  
performance enables the  
transceivers to be used without  
concern for eye safety up to 7  
recertify and reidentify the laser  
product under the provisions of  
U.S. 21 CFR (Subchapter J).  
volts transmitter V  
.
CC  
Regulatory Compliance  
Feature  
Test Method  
Performance  
Electrostatic Discharge MIL-STD-883C  
Class 1 (>2000 V).  
(ESD) to the  
Method 3015.4  
Electrical Pins  
Electrostatic Discharge Variation of IEC 801-2  
(ESD) to the  
Duplex SC Receptacle  
Typically withstand at least 15 kV without  
damage when the duplex SC connector  
receptacle is contacted by a Human Body  
Model probe.  
Electromagnetic  
Interference (EMI)  
FCC Class B  
CENELEC EN55022 Class B  
(CISPR 22A)  
Margins are dependent on customer board and  
chassis designs.  
VCCI Class I  
Immunity  
Variation of IEC 801-3  
Typically show no measurable effect from a  
10 V/m field swept from 27 to 1000 MHz applied  
to the transceiver without a chassis enclosure.  
Laser Eye Safety  
and Equipment Type  
Testing  
US 21 CFR, Subchapter J  
per Paragraphs 1002.10  
and 1002.12  
AEL Class I, FDA/CDRH  
HFBR-53D5 Accession #9720151-03  
HFCT-53D5 Accession #9521220-16  
EN 60825-1: 1994 +A11  
EN 60825-2: 1994  
AEL Class 1, TUV Rheinland of North America  
HFBR-53D5:  
EN 60950: 1992+A1+A2+A3  
Certificate #R9771018.5  
Protection Class III  
HFCT-53D5:  
Certificate 933/51083  
Component  
Recognition  
Underwriters Laboratories and UL File E173874 (Pending)  
Canadian Standards Association  
Joint Component Recognition  
for Information Technology  
Equipment Including Electrical  
Business Equipment.  
4
APPLICATION SUPPORT  
Optical Power Budget  
and Link Penalties  
Some fiber-optic transceiver sup-  
pliers’ modules include internal  
capacitors, with or without 50 Ohm  
termination, to couple their Data  
and Data-bar lines to the I/O pins  
of their module. When designing  
to use these type of transceivers  
along with Agilent transceivers, it  
is important that the interface  
circuit can accommodate either  
internal or external capacitive  
coupling with 50 Ohm termina-  
tion components for proper  
operation of both transceiver  
designs. The internal dc-coupled  
design of the  
Data Line  
Interconnections  
Agilent Technologies’ HFBR/  
HFCT-53D5 fiber-optic  
The worst-case Optical Power  
Budget (OPB) in dB for a fiber-  
optic link is determined by the  
difference between the minimum  
transmitter output optical power  
(dBm avg) and the lowest  
receiver sensitivity (dBm avg).  
This OPB provides the necessary  
optical signal range to establish a  
working fiber-optic link. The OPB  
is allocated for the fiber-optic  
cable length and the corre-  
sponding link penalties. For  
proper link performance, all  
penalties that affect the link  
performance must be accounted  
for within the link optical power  
budget. The Gigabit Ethernet  
IEEE 802.3z standard identifies,  
and has modeled, the  
transceiver is designed to directly  
couple to +5 V PECL signals. The  
transmitter inputs are internally  
dc-coupled to the laser driver  
circuit from the transmitter input  
pins (pins 7, 8). There is no  
internal, capacitively-coupled 50  
Ohm termination resistance  
within the transmitter input  
section. The transmitter driver  
circuit for the laser light source  
is a dc-coupled circuit. This  
circuit regulates the output  
optical power. The regulated light  
output will maintain a constant  
output optical power provided  
the data pattern is reasonably  
balanced in duty factor. If the  
data duty factor has long, con-  
tinuous state times (low or high  
data duty factor), then the output  
optical power will gradually  
change its average output optical  
power level to its pre-set value.  
HFBR/HFCT-53D5 I/O  
connections was done to provide  
the designer with the most  
flexibility for interfacing to  
various types of circuits.  
Eye Safety Circuit  
For an optical transmitter device  
to be eye-safe in the event of a  
single fault failure, the transmit-  
ter must either maintain normal,  
eye-safe operation or be disabled.  
contributions of these OPB  
penalties to establish the link  
length requirements for 62.5/125 µm  
and 50/125 µm multimode fiber  
usage. In addition, single-mode  
fiber with standard 1300 nm  
Fabry-Perot lasers have been  
modeled and specified. Refer to  
the IEEE 802.3z standard and its  
supplemental documents that  
develop the model, empirical  
results and final specifications.  
In the HFBR-53D5 there are  
three key elements to the laser  
driver safety circuitry: a monitor  
diode, a window detector circuit,  
and direct control of the laser  
bias. The window detection  
circuit monitors the average  
optical power using the monitor  
diode. If a fault occurs such that  
the transmitter DC regulation  
circuit cannot maintain the preset  
bias conditions for the laser  
emitter within ± 20%, the  
As for the receiver section, it is  
internally ac-coupled between the  
pre-amplifier and the post-  
amplifier stages. The actual Data  
and Data-bar outputs of the post-  
amplifier are dc-coupled to their  
respective output pins (pins 2, 3).  
Signal Detect is a single-ended,  
+5 V PECL output signal that is  
dc-coupled to pin 4 of the  
10 km Link Support  
As well as complying with the LX  
5 km standard, the HFCT-53D5  
specification provides additional  
margin allowing for a 10 km  
Gigabit Ethernet link on single  
mode fiber. This is accomplished  
by limiting the spectral width and  
center wavelength range of the  
transmitter while increasing the  
output optical power and  
module. Signal Detect should not  
be ac-coupled externally to the  
follow-on circuits because of its  
infrequent state changes.  
transmitter will automatically be  
disabled. Once this has occurred,  
only an electrical power reset will  
allow an attempted turn-on of the  
transmitter.  
Caution should be taken to  
account for the proper intercon-  
nection between the supporting  
Physical Layer integrated circuits  
and this HFBR/HFCT-53D5  
transceiver. Figure 3 illustrates a  
recommended interface circuit  
for interconnecting to a +5 Vdc  
PECL fiber-optic transceiver.  
improving sensitivity. All other  
LX cable plant recommendations  
should be followed.  
The HFCT-53D5 utilizes an  
integral fiber stub along with a  
current limiting circuit to  
guarantee eye-safety. It is  
5
intrinsically eye safe and does not  
require shut down circuitry.  
standard RF suppression  
practices and avoiding poorly  
EMI-sealed enclosures.  
The third configuration, option  
FM, is for applications that are  
designed to have a flush  
Signal Detect  
mounting of the module with  
respect to the front of the panel  
or enclosure. The flush-mount  
design accommodates a large  
variety of panel thickness, i.e.,  
0.04 in. min. to 0.10 in. max.  
Note the reference plane for the  
flush-mount design is the interior  
side of the panel or enclosure.  
The recommended distance from  
the centerline of the transceiver  
front solder posts to the inside  
wall of the panel is 0.55 in. This  
option contacts the inside panel  
or enclosure wall on all four sides  
of this metal shield. See Figure 8  
for the mechanical drawing  
The Signal Detect circuit provides  
a deasserted output signal that  
implies the link is open or the  
transmitter is OFF as defined by  
the Gigabit Ethernet specification  
IEEE 802.3z, Table 38.1. The  
Signal Detect threshold is set to  
The first configuration is a  
standard HFBR-53D5 fiber-optic  
transceiver that has no external  
EMI shield. This unit is for  
applications where EMI is either  
not an issue for the designer, or  
the unit resides completely inside  
transition from a high to low state a shielded enclosure, or the  
between the minimum receiver  
input optional power and –30 dBm  
avg. input optical power  
indicating a definite optical fault  
(e.g. unplugged connector for the  
receiver or transmitter, broken  
fiber, or failed far-end transmitter  
or data source). A Signal Detect  
indicating a working link is  
functional when receiving  
encoded 8B/10B characters. The  
Signal Detect does not detect  
receiver data error or error-rate.  
Data errors are determined by  
Signal processing following the  
transceiver.  
module is used in low density,  
extremely quiet applications. The  
HFCT-53D5 is not available for  
use without an external shield.  
The second configuration, option  
EM, is for EMI shielding  
applications where the position of  
the transceiver module will  
dimensions of this shield.  
extend outside the equipment  
enclosure. The metallized plastic  
package and integral external  
metal shield of the transceiver  
helps locally to terminate EM  
fields to the chassis to prevent  
their emissions outside the  
enclosure. This metal shield  
contacts the panel or enclosure  
on the inside of the aperture on  
all but the bottom side of the  
shield and provides a good RF  
connection to the panel. This  
option can accommodate various  
panel or enclosure thickness, i.e.,  
.04 in. min. to 0.10 in. max. The  
reference plane for this panel  
thickness variation is from the  
front surface of the panel or  
enclosure. The recommended  
length for protruding the  
HFBR/HFCT-53D5EM transceiver  
beyond the front surface of the  
panel or enclosure is 0.25 in.  
With this option, there is  
flexibility of positioning the  
module to fit the specific need of  
the enclosure design. (See Figure  
6 for the mechanical drawing  
dimensions of this shield.)  
The two metallized designs are  
comparable in their shielding  
effectiveness. Both design  
options connect only to the  
equipment chassis and not to the  
signal or logic ground of the  
circuit board within the  
equipment closure. The front  
panel aperture dimensions are  
recommended in Figures 7 and 9.  
When layout of the printed circuit  
board is done to incorporate  
these metal-shielded transceivers,  
keep the area on the printed  
circuit board directly under the  
metal shield free of any  
Electromagnetic  
Interference (EMI)  
One of a circuit board designer’s  
foremost concerns is the control  
of electromagnetic emissions  
from electronic equipment.  
Success in controlling generated  
Electromagnetic Interference  
(EMI) enables the designer to  
pass a governmental agency’s  
EMI regulatory standard; and  
more importantly, it reduces the  
possibility of interference to  
neighboring equipment. There  
are three options available for the  
HFBR-53D5 and two options for  
the HFCT-53D5 with regard to  
EMI shielding which provide the  
designer with a means to achieve  
good EMI performance. The EMI  
performance of an enclosure  
using these transceivers is  
components and circuit board  
traces. For additional EMI  
performance advantage, use  
duplex SC fiber-optic connectors  
that have low metal content  
inside them. This lowers the  
ability of the metal fiber-optic  
connectors to couple EMI out  
through the aperture of the panel  
or enclosure.  
Evaluation Kit  
To help you in your preliminary  
transceiver evaluation, Agilent  
offers a 1250 MBd Gigabit  
dependent on the chassis design.  
Agilent encourages using  
6
Ethernet evaluation board (Part  
# HFBR-0535). This board  
allows testing of the fiber-optic  
VCSEL transceiver. It includes  
the HFBR-53D5 transceiver, test  
board, and application  
transceiver evaluation the  
deserializer (SERDES) IC. (Part #  
HDMP-163k) Please contact your  
local Field Sales representative  
for ordering details.  
HFCT-53D5 can be substituted  
on this evaluation board. In addi-  
tion, a complementary evaluation  
board is available for the  
HDMP-1636A 1250 MBd  
instructions. For single mode  
Gigabit Ethernet serializer/  
Absolute Maximum Ratings  
Parameter  
Symbol  
Min.  
–40  
Typ.  
Max.  
100  
7.0  
Unit  
˚C  
V
Reference  
Storage Temperature  
Supply Voltage  
T
S
V
–0.5  
–0.5  
1
2
CC  
Data Input Voltage  
V
V
V
I
CC  
Transmitter Differential Input Voltage  
Output Current  
V
1.6  
50  
95  
V
D
I
mA  
%
D
Relative Humidity  
RH  
5
Recommended Operating Conditions  
Parameter  
Ambient Operating Temperature  
Case Temperature  
Symbol  
Min.  
Typ.  
Max.  
70  
Unit  
˚C  
˚C  
V
Reference  
T
0
A
C
T
90  
3
Supply Voltage  
V
4.75  
5.25  
CC  
Power Supply Rejection  
Transmitter Data Input Voltage – Low  
PSR  
V –V  
50  
mV  
4
5
5
P–P  
–1.810  
–1.165  
0.3  
–1.475  
–0.880  
1.6  
V
IL CC  
Transmitter Data Input Voltage – High V –V  
V
V
IH CC  
Transmitter Differential Input Voltage  
Data Output Load  
V
D
R
50  
6
DL  
Signal Detect Output Load  
R
50  
6
SDL  
Process Compatibility  
Parameter  
Symbol  
/t  
Min. Typ.  
Max.  
Unit  
Reference  
Hand Lead Soldering Temperature/Time  
Wave Soldering and Aqueous Wash  
T
T
260/10 ˚C/sec.  
260/10 ˚C/sec.  
SOLD SOLD  
/t  
7
SOLD SOLD  
Notes:  
1. The transceiver is class 1 eye-safe up to V = 7 V.  
CC  
2. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs without damaging the input  
circuit.  
3. Case temperature measurement referenced to the center-top of the internal metal transmitter shield.  
4. Tested with a 50 mV  
sinusoidal signal in the frequency range from 500 Hz to 1500 kHz on the V supply with the  
P–P  
CC  
recommended power supply filter in place. Typically less than a 0.25 dB change in sensitivity is experienced.  
5. Compatible with 10 K, 10 KH, and 100 K ECL and PECL input signals.  
6. The outputs are terminated to V –2 V.  
CC  
7. Aqueous wash pressure < 110 psi.  
7
HFBR-53D5 Family, 850 nm VCSEL  
Transmitter Electrical Characteristics  
(T = 0˚C to +70˚C, V = 4.75 V to 5.25 V)  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
85  
Max.  
120  
Unit  
mA  
W
Reference  
Supply Current  
I
CCT  
Power Dissipation  
P
0.45  
0
0.63  
DIST  
Data Input Current – Low  
Data Input Current – High  
Laser Reset Voltage  
I
–350  
µA  
µA  
V
IL  
I
16  
350  
2.5  
IH  
V
2.7  
1
CCT–reset  
Receiver Electrical Characteristics  
(T = 0˚C to +70˚C, V = 4.75 V to 5.25 V)  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
105  
Max.  
130  
Unit  
mA  
W
V
Reference  
Supply Current  
I
CCR  
Power Dissipation  
P
DISR  
0.53  
0.63  
2
3
3
4
4
3
3
Data Output Voltage – Low  
Data Output Voltage – High  
Data Output Rise Time  
V
OL  
– V  
–1.950  
–1.045  
–1.620  
–0.740  
0.40  
CC  
V
– V  
V
OH  
CC  
t
r
ns  
ns  
V
Data Output Fall Time  
t
0.40  
f
Signal Detect Output Voltage – Low  
Signal Detect Output Voltage – High  
V
OL  
– V  
–1.950  
–1.045  
–1.620  
–0.740  
CC  
V
– V  
V
OH  
CC  
Notes:  
1. The Laser Reset Voltage is the voltage level below which the V  
voltage must be lowered to cause the laser driver circuit to reset  
CCT  
from an electrical/optical shutdown condition to a proper electrical/optical operating condition. The maximum value corresponds  
to the worst-case highest V voltage necessary to cause a reset condition to occur. The laser safety shutdown circuit will operate  
CC  
properly with transmitter V levels of 3.5 Vdc V 7.0 Vdc.  
CC  
CC  
2. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of V and I  
CC  
CC  
minus the sum of the products of the output voltages and currents.  
3. These outputs are compatible with 10 K, 10 KH, and 100 K ECL and PECL inputs.  
4. These are 20-80% values.  
HFBR-53D5 Family, 850 nm VCSEL  
Transmitter Optical Characteristics  
(T = 0°C to +70°C, V = 4.75 V to 5.25 V)  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Reference  
Output Optical Power  
50/125 µm, NA = 0.20 Fiber  
Output Optical Power  
62.5/125 µm, NA = 0.275 Fiber  
Optical Extinction Ratio  
Center Wavelength  
Spectral Width – rms  
Optical Rise/Fall Time  
P
–9.5  
–4  
dBm avg.  
1
OUT  
OUT  
P
–9.5  
–4  
dBm avg.  
1
2
9
830  
dB  
nm  
nm rms  
ns  
dB/Hz  
dB  
ps  
λ
850  
860  
0.85  
0.26  
–117  
C
σ
t /t  
3, 4, Fig. 1  
r
f
RIN  
12  
Coupled Power Ratio  
Total Transmitter Jitter  
Added at TP2  
CPR  
9
5
6
227  
See notes on following page.  
8
Receiver Optical Characteristics  
(T = 0°C to +70°C, V = 4.75 V to 5.25 V)  
A
CC  
Parameter  
Input Optical Power  
Symbol  
Min.  
–17  
Typ.  
Max.  
0
Unit  
dBm avg.  
Reference  
P
IN  
7
Stressed Receiver Sensitivity  
62.5 µm  
50 µm  
–12.5  
–13.5  
dBm avg.  
dBm avg.  
8
8
Stressed Receiver Eye  
Opening at TP4  
201  
ps  
6, 9  
Receive Electrical 3 dB  
Upper Cutoff Frequency  
Operating Center Wavelength  
Return Loss  
1500  
860  
MHz  
10  
λ
770  
12  
nm  
dB  
C
11  
Signal Detect – Asserted  
Signal Detect – Deasserted  
Signal Detect – Hysteresis  
P
–18  
dBm avg.  
dBm avg.  
dB  
A
P
–30  
1.5  
D
P – P  
A
D
Notes:  
1. The maximum Optical Output Power complies with the IEEE 802.3z specification, and is class 1 laser eye safe.  
2. Optical Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the low (“0”) state.  
The transmitter is driven with a Gigabit Ethernet 1250 MBd 8B/10B encoded serial data pattern. This Optical Extinction Ratio is expressed in  
decibels (dB) by the relationship 10log(Phigh avg/Plow avg).  
3. These are unfiltered 20-80% values.  
4. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 1). The characteristics include rise time, fall time, pulse  
overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the receiver sensitivity. These parameters  
are specified by the referenced Gigabit Ethernet eye diagram using the required filter. The output optical waveform complies with the requirements  
of the eye mask discussed in section 38.6.5 and Fig. 38-2 of IEEE 802.3z.  
5. CPR is measured in accordance with EIA/TIA-526-14A as referenced in 802.3z, section 38.6.10.  
6. TP refers to the compliance point specified in 802.3z, section 38.2.1.  
7. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.  
8. The stressed receiver sensitivity is measured using the conformance test signal defined in 802.3z, section 38.6.11. The conformance test signal is  
conditioned by applying deterministic jitter and intersymbol interference.  
9. The stressed receiver jitter is measured using the conformance test signal defined in 802.3z, section 38.6.11 and set to an average optical power 0.5  
dB greater than the specified stressed receiver sensitivity.  
10. The 3 dB electrical bandwidth of the receiver is measured using the technique outlined in 802.3z, section 38.6.12.  
11. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.  
HFCT-53D5 Family, 1300 nm FP/Laser, Transmitter Electrical Characteristics  
(T = 0˚C to +70˚C, V = 4.75 V to 5.25 V)  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
65  
Max.  
130  
Unit  
mA  
W
Reference  
Supply Current  
I
CCT  
Power Dissipation  
P
DIST  
0.35  
0
0.68  
Data Input Current – Low  
Data Input Current – High  
I
–350  
µA  
IL  
I
16  
350  
µA  
IH  
Receiver Electrical Characteristics (T = 0˚C to +70˚C, V = 4.75 V to 5.25 V)  
A
CC  
Typ.  
120  
Parameter  
Supply Current  
Symbol  
Min.  
Max.  
140  
Unit  
mA  
W
V
Reference  
I
CCR  
Power Dissipation  
P
0.53  
0.68  
1
2
2
3
3
2
2
DISR  
Data Output Voltage – Low  
Data Output Voltage – High  
Data Output Rise Time  
V
– V  
–1.950  
–1.045  
–1.620  
–0.740  
0.40  
OL  
OH  
CC  
V
– V  
V
CC  
t
ns  
ns  
V
r
f
Data Output Fall Time  
t
0.40  
Signal Detect Output Voltage – Low  
Data Output Voltage – High  
V
– V  
–1.950  
–1.045  
–1.620  
–0.740  
OL  
CC  
V
– V  
V
OH  
CC  
Notes:  
1. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC minus the sum of the  
products of the output voltages and currents.  
2. These outputs are compatible with 10 K, 10 KH, and 100 K ECL and PECL inputs.  
3. These are 20-80% values.  
9
HFCT-53D5 Family, 1300 nm FP-Laser  
Transmitter Optical Characteristics  
(T = 0°C to +70°C, V = 4.75 V to 5.25 V)  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Reference  
Output Optical Power 9 µm SMF  
62.5 µm MMF  
P
OUT  
–9.5  
–11.5  
–11.5  
–3  
–3  
–3  
dBm  
dBm  
dBm  
1
1
50 µm MMF  
Optical Extinction Ratio  
Center Wavelength  
Spectral Width – rms  
Optical Rise/Fall Time  
9
dB  
nm  
nm rms  
ns  
dB/Hz  
ps  
2
λ
1285  
1343  
2.8  
0.26  
–120  
227  
C
σ
t /t  
r
3, 4, Fig. 1  
5
f
RIN  
12  
Total Transmitter Jitter  
Added at TP2  
Receiver Optical Characteristics  
(T = 0°C to +70°C, V = 4.75 V to 5.25 V)  
A
CC  
Parameter  
Input Optical Power  
Stressed Receiver Sensitivity  
Stressed Receiver Eye  
Opening at TP4  
Symbol  
Min.  
–20  
Typ.  
Max.  
–3  
–14.4  
Unit  
dBm avg.  
dBm avg.  
ps  
Reference  
P
IN  
6
7
5, 8  
201  
Receive Electrical 3 dB  
Upper Cutoff Frequency  
Operating Center Wavelength  
Return Loss  
1500  
1355  
MHz  
9
λ
1270  
12  
nm  
dB  
C
10  
Signal Detect – Asserted  
Signal Detect – Deasserted  
Signal Detect – Hysteresis  
P
–20  
dBm avg.  
dBm avg.  
dB  
A
P
–30  
1.5  
D
P – P  
A
D
Notes:  
1. The maximum Optical Output Power complies with the IEEE 802.3z specification, and is class 1 laser eye safe.  
2. Optical Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the  
low (“0”) state. The transmitter is driven with a Gigabit Ethernet 1250 MBd 8B/10B encoded serial data pattern. This Optical  
Extinction Ratio is expressed in decibels (dB) by the relationship 10log(P  
/P  
).  
high avg low avg  
3. These are unfiltered 20-80% values.  
4. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 2). The characteristics include rise time,  
fall time, pulse overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the  
receiver sensitivity. These parameters are specified by the referenced Gigabit Ethernet eye diagram using the required filter. The  
output optical waveform complies with the requirements of the eye mask discussed in section 38.6.5 and Fig. 38-2 of  
IEEE 802.3z.  
5. TP refers to the compliance point specified in 802.3z, section 38.2.1.  
6. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.  
7. The stressed receiver sensitivity is measured using the conformance test signal defined in 802.3z, section 38.6.11. The  
conformance test signal is conditioned by applying deterministic jitter and intersymbol interference.  
8. The stressed receiver jitter is measured using the conformance test signal defined in 802.3z, section 38.6.11 and set to an average  
optical power 0.5 dB greater than the specified stressed receive sensitivity.  
9. The 3 dB electrical bandwidth of the receiver is measured using the technique outlined in 802.3z, section 38.6.12.  
10. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.  
10  
Table 1. Pinout Table  
Pin Symbol  
Functional Description  
Mounting Pins The mounting pins are provided for transceiver mechanical attachment to the circuit  
board. They are embedded in the nonconductive plastic housing and are not connected  
to the transceiver internal circuit, nor is there a guaranteed connection to the metallized  
housing in the EM and FM versions. They should be soldered into plated-through holes  
on the printed circuit board.  
1
V
EER  
Receiver Signal Ground  
Directly connect this pin to receiver signal ground plane. (For HFBR-53D5, VEER = VEET  
)
2
RD+  
RD–  
SD  
Receiver Data Out  
RD+ is an open-emitter output circuit. Terminate this high-speed differential PECL  
output with standard PECL techniques at the follow-on device input pin.  
Receiver Data Out Bar  
RD– is an open-emitter output circuit. Terminate this high-speed differential PECL  
output with standard PECL techniques at the follow-on device input pin.  
Signal Detect  
3
4
Normal optical input levels to the receiver result in a logic “1” output, V , asserted.  
OH  
Low input optical levels to the receiver result in a fault condition indicated by  
a logic “0” output V , deasserted.  
OL  
Signal Detect is a single-ended PECL output. SD can be terminated with standard PECL  
techniques via 50 to V  
- 2 V. Alternatively, SD can be loaded with a 270 resistor  
CCR  
to V  
to conserve electrical power with small compromise to signal quality. If Signal  
EER  
Detect output is not used, leave it open-circuited.  
This Signal Detect output can be used to drive a PECL input on an upstream circuit,  
such as, Signal Detect input or Loss of Signal-bar.  
5
6
7
8
9
V
Receiver Power Supply  
Provide +5 Vdc via the recommended receiver power supply filter circuit.  
Locate the power supply filter circuit as close as possible to the V  
Transmitter Power Supply  
Provide +5 Vdc via the recommended transmitter power supply filter circuit.  
Locate the power supply filter circuit as close as possible to the V pin.  
Transmitter Data In-Bar  
Terminate this high-speed differential PECL input with standard PECL techniques at the  
transmitter input pin.  
CCR  
pin.  
CCR  
V
CCT  
CCT  
TD–  
TD+  
Transmitter Data In  
Terminate this high-speed differential PECL input with standard PECL techniques at the  
transmitter input pin.  
Transmitter Signal Ground  
V
EET  
Directly connect this pin to the transmitter signal ground plane.  
1 = V  
EER  
NIC  
2 = RD+  
3 = RD-  
4 = SD  
1.3  
RX  
TX  
1.0  
0.8  
5 = V  
6 = V  
CCR  
CCT  
0.5  
7 = TD-  
8 = TD+  
0.2  
0
NIC  
9 = V  
EET  
-0.2  
TOP VIEW  
0
0.22 0.375  
0.625 0.78 1.0  
NORMALIZED TIME  
NIC = NO INTERNAL CONNECTION (MOUNTING PINS)  
Figure 1. Transmitter Optical Eye Diagram Mask.  
Figure 2. Pin-Out.  
11  
3.3 Vdc  
GND  
+
C5  
5 Vdc  
0.1 µF  
R3  
68  
R2  
68  
9
V
TD+  
V
V
CC2 EE2  
EET  
8
7
50  
50 Ω  
CLOCK  
SYNTHESIS  
CIRCUIT  
TD+  
C9 0.01 µF  
LASER  
DRIVER  
CIRCUIT  
PECL  
INPUT  
OUTPUT  
DRIVER  
PARALLEL  
TO SERIAL  
CIRCUIT  
TD-  
TD-  
C10 0.01 µF  
R4  
191  
R1  
191  
R13 R12  
150  
150  
L2  
6
5
V
CCT  
5 Vdc  
HFBR/HFCT-53D5  
FIBER-OPTIC  
TRANSCEIVER  
HDMP-1636A/-1646A  
C2  
1 µH  
SERIAL/DE-SERIALIZER  
(SERDES - 10 BIT  
TRANSCEIVER)  
0.1 µF  
C3  
C4  
+
L1  
V
CCR  
0.1  
µF  
10  
µF  
C1  
C8*  
1 µH  
+
0.1  
µF  
10 µF*  
SIGNAL  
DETECT  
CIRCUIT  
SD  
TO SIGNAL DETECT (SD)  
INPUT AT UPPER-LEVEL-IC  
4
3
R9  
270  
CLOCK  
RD-  
50 Ω  
RD-  
RECOVERY  
C12 0.01 µF  
C11 0.01 µF  
PRE-  
AMPLIFIER  
POST-  
AMPLIFIER  
R14  
CIRCUIT  
INPUT  
BUFFER  
SERIAL TO  
100  
RD+  
RD+  
2
1
PARALLEL  
CIRCUIT  
50 Ω  
V
EER  
R11 R10  
270 270  
SEE HDMP-1636A/-1646A DATA SHEET FOR  
DETAILS ABOUT THIS TRANSCEIVER IC.  
NOTES:  
*C8 IS AN OPTIONAL BYPASS CAPACITOR FOR ADDITIONAL LOW-FREQUENCY NOISE FILTERING.  
USE SURFACE-MOUNT COMPONENTS FOR OPTIMUM HIGH-FREQUENCY PERFORMANCE.  
USE 50 MICROSTRIP OR STRIPLINE FOR SIGNAL PATHS.  
LOCATE 50 TERMINATIONS AT THE INPUTS OF RECEIVING UNITS.  
Figure 3. Recommended Gigabit/sec Ethernet HFBR/HFCT-53D5 Fiber-Optic Transceiver and HDMP-1636A/1646A  
SERDES Integrated Circuit Transceiver Interface and Power Supply Filter Circuits.  
12  
1.9 ± 0.1  
0.075 ± 0.004  
ø
(2X)  
–A–  
20.32  
0.800  
Ø0.000  
M A  
0.8 ± 0.1  
0.032 ± 0.004  
ø
(9X)  
20.32  
0.800  
Ø0.000  
M
A
2.54  
0.100  
(8X)  
TOP VIEW  
Figure 4. Recommended Board Layout Hole Pattern.  
XXXX-XXXX  
KEY:  
A
ZZZZZ LASER PROD  
21CFR(J) CLASS 1  
YYWW = DATE CODE  
FOR MULTIMODE MODULE:  
XXXX-XXXX = HFBR-53xx  
ZZZZ = 850 nm  
COUNTRY OF ORIGIN YYWW  
TX  
RX  
39.6  
(1.56)  
12.7  
(0.50)  
MAX.  
4.7  
(0.185)  
AREA  
25.4  
MAX.  
(1.00)  
RESERVED  
FOR  
PROCESS  
PLUG  
12.7  
(0.50)  
2.0 ± 0.1  
(0.079 ± 0.004)  
2.5  
(0.10)  
SLOT WIDTH  
SLOT DEPTH  
+0.1  
-0.05  
0.25  
+0.004  
-0.002  
(
0.010  
)
9.8  
MAX.  
(0.386)  
0.51  
(0.020)  
3.3 ± 0.38  
(0.130 ± 0.015)  
20.32  
(0.800)  
15.8 ± 0.15  
(0.622 ± 0.006)  
+0.25  
-0.05  
0.46  
+0.25  
9X  
1.27  
+0.010  
-0.002  
-0.05  
2X  
(0.018  
)
+0.010  
-0.002  
(
0.050  
)
2.54  
(0.100)  
8X  
20.32  
(0.800)  
23.8  
(0.937)  
20.32  
(0.800)  
1.3  
(0.051)  
2X  
DIMENSIONS ARE IN MILLIMETERS (INCHES).  
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.  
Figure 5. Package Outline Drawing for HFBR-53D5.  
13  
KEY:  
XXXX-XXXX  
YYWW = DATE CODE  
FOR MULTIMODE MODULE:  
XXXX-XXXX = HFBR-53xx  
ZZZZ = 850 nm  
A
ZZZZZ LASER PROD  
21CFR(J) CLASS 1  
COUNTRY OF ORIGIN YYWW  
TX  
RX  
FOR SINGLEMODE MODULES:  
XXXX-XXXX = HFCT-53xx  
ZZZZ = 1300 nm  
29.6  
(1.16)  
UNCOMPRESSED  
39.6  
(1.56)  
12.7  
(0.50)  
4.7  
(0.185)  
MAX.  
AREA  
RESERVED  
FOR  
PROCESS  
PLUG  
25.4  
MAX.  
(1.00)  
12.7  
(0.50)  
2.0 ± 0.1  
(0.079 ± 0.004)  
SLOT WIDTH  
+0.1  
0.25  
2.09  
(0.08)  
10.2  
(0.40)  
UNCOMPRESSED  
-0.05  
MAX.  
+0.004  
(
0.010  
)
-0.002  
9.8  
(0.386)  
MAX.  
1.3  
(0.05)  
3.3 ± 0.38  
(0.130 ± 0.015)  
20.32  
(0.80)  
15.8 ± 0.15  
(0.622 ± 0.006)  
+0.25  
-0.05  
0.46  
+0.25  
1.27  
9X  
+0.010  
-0.002  
-0.05  
2X  
(0.018  
)
+0.010  
(
0.050  
)
-0.002  
2.54  
(0.100)  
8X  
20.32  
(0.800)  
23.8  
(0.937)  
20.32  
(0.800)  
1.3  
(0.051)  
2X  
DIMENSIONS ARE IN MILLIMETERS (INCHES).  
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.  
Figure 6. Package Outline for HFBR/HFCT-53D5EM.  
14  
0.8  
(0.032)  
2X  
0.8  
(0.032)  
2X  
+0.5  
-0.25  
10.9  
+0.02  
-0.01  
(0.43  
)
9.4  
(0.37)  
27.4 ± 0.50  
(1.08 ± 0.02)  
6.35  
(0.25)  
MODULE  
PROTRUSION  
PCB BOTTOM VIEW  
Figure 7. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-53D5EM.  
15  
KEY:  
XXXX-XXXX  
YYWW = DATE CODE  
FOR MULTIMODE MODULE:  
XXXX-XXXX = HFBR-53xx  
ZZZZ = 850 nm  
FOR SINGLEMODE MODULES:  
XXXX-XXXX = HFCT-53xx  
ZZZZ = 1300 nm  
A
ZZZZZ LASER PROD  
21CFR(J) CLASS 1  
COUNTRY OF ORIGIN YYWW  
TX  
RX  
39.6  
(1.56)  
12.7  
(0.50)  
MAX.  
1.01  
(0.40)  
4.7  
(0.185)  
AREA  
RESERVED  
FOR  
PROCESS  
PLUG  
25.4  
MAX.  
(1.00)  
12.7  
(0.50)  
29.7  
(1.17)  
2.0 ± 0.1  
(0.079 ± 0.004)  
SLOT WIDTH  
25.8  
(1.02)  
MAX.  
2.2  
(0.09)  
SLOT DEPTH  
+0.1  
10.2  
0.25  
MAX.  
(0.40)  
-0.05  
+0.004  
-0.002  
(
0.010  
)
14.4  
(0.57)  
22.0  
(0.87)  
9.8  
MAX.  
(0.386)  
3.3 ± 0.38  
(0.130 ± 0.015)  
20.32  
(0.800)  
15.8 ± 0.15  
(0.622 ± 0.006)  
+0.25  
0.46  
-0.05  
+0.25  
9X  
1.27  
+0.010  
-0.05  
2X  
(
0.018  
)
-0.002  
+0.010  
-0.002  
(
0.050  
)
AREA  
RESERVED  
FOR  
PROCESS  
PLUG  
2.54  
8X  
(0.100)  
20.32  
(0.800)  
23.8  
(0.937)  
20.32  
(0.800)  
1.3  
(0.051)  
2X  
DIMENSIONS ARE IN MILLIMETERS (INCHES).  
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.  
Figure 8. Package Outline for HFBR/HFCT-53D5FM.  
DIMENSION SHOWN FOR MOUNTING MODULE  
1.98 FLUSH TO PANEL. THICKER PANEL WILL  
(0.078) RECESS MODULE. THINNER PANEL WILL  
PROTRUDE MODULE.  
1.27  
(0.05)  
OPTIONAL SEPTUM  
30.2  
(1.19)  
KEEP OUT ZONE  
0.36  
(0.014)  
10.82  
14.73  
(0.426) (0.58)  
13.82  
(0.544)  
26.4  
(1.04)  
BOTTOM SIDE OF PCB  
12.0  
(0.47)  
DIMENSIONS ARE IN MILLIMETERS (INCHES).  
ALL DIMENSIONS ARE ± 0.025 mm UNLESS OTHERWISE SPECIFIED.  
Figure 9. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-53D5FM.  
Ordering Information  
850 nm VCSEL  
HFBR-53D5  
(SX – Short Wavelength Laser)  
No shield, plastic housing.  
HFBR-53D5EM  
HFBR-53D5FM  
Extended/protruding shield, metallized housing.  
Flush shield, metallized housing.  
www.semiconductor.agilent.com  
1300 nm FP Laser (LX – Long Wavelength Laser)  
Data subject to change.  
Copyright © 1999 Agilent Technologies, Inc.  
HFCT-53D5EM  
HFCT-53D5FM  
Extended/protruding shield, metallized housing.  
Flush shield, metallized housing.  
5968-3183E (11/99)  

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