ECG006C [ETC]
InGaP HBT Gain Block; 的InGaP HBT增益模块
| 型号： | ECG006C |
| 厂家： | 
ETC |
| 描述： | InGaP HBT Gain Block |
| 文件： | 总8页 (文件大小：374K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
ECG006
InGaP HBT Gain Block
Product Information
Product Features
xꢀ DC – 5.5 GHz
xꢀ +15.5 dBm P1dB at 1 GHz
xꢀ +32 dBm OIP3 at 1 GHz
xꢀ 15 dB Gain at 1 GHz
Product Description
The ECG006 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG006 typically provides 15
dB of gain, +32 dBm Output IP3, and +15.5 dBm P1dB.
Functional Diagram
GND
4
1
2
3
RF IN
GND
RF OUT
The ECG006 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in low-cost,
surface-mountable plastic SOT-86, SOT-363, and SOT-89
packages. The ECG006 is also available in a lead-
free/green/RoHS-compliant SOT-89 package. All devices
are 100% RF and DC tested.
xꢀ 4.0 dB Noise Figure at 2 GHz
ECG006B / ECG006B-G
xꢀ Available in SOT-363, SOT-86,
and lead-free / green SOT-89
Package Styles
GND
4
1
3
RF Out
RF In
xꢀ Internally matched to 50 :
2
GND
Applications
xꢀ Mobile Infrastructure
xꢀ CATV / DBS
xꢀ W-LAN / ISM
ECG006C
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG006 will work for other various applications within
the DC to 5.5 GHz frequency range such as CATV and
fixed wireless.
GND
1
2
3
6
RFOUT
GND
GND
5
RFIN
4
GND
xꢀ RFID
ECG006F
xꢀ Defense / Homeland Security
xꢀ Fixed Wireless
Specifications (1)
Typical Performance (4)
Parameter
Operational Bandwidth
Test Frequency
Gain
Units Min Typ Max
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3 (2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
MHz
MHz
dB
DC
5500
500
15.5
-20
900
15
1900
14.2
2140
14
1000
15
-14
-13
-17.4
-14.5
+15
+30
3.7
-18
-15
+15
+30
3.7
-16
Output P1dB
dBm
dBm
MHz
dB
+15.4
+32
2000
14
Output IP3 (2)
Test Frequency
Gain
+15.8 +15.4
+32
3.7
+32
3.7
Large-signal Gain (3)
Input Return Loss
Output Return Loss
Output P1dB
dB
dB
dB
dBm
dBm
dB
11.5
3.5
13
18
14
15.0
32
4.0
3.9
45
4. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9V, Rbias = 24.3 , 50 System.
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
V
mA
4.3
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, Rbias = 24.3 , 50 System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Large-signal gain is tested with an input power level of +2 dBm.
Ordering Information
Part No.
ECG006B
Description
Absolute Maximum Rating
InGaP HBT Gain Block
(leaded SOT-89 Pkg)
InGaP HBT Gain Block
ECG006B-G
Parameter
Rating
(lead-free/green/RoHS-compliant SOT-89 Pkg)
Operating Case Temperature
Storage Temperature
Device Current
-40 to +85 qC
-55 to +150 qC
150 mA
ECG006C
ECG006F
ECG006B-PCB
ECG006C-PCB
ECG006F-PCB
InGaP HBT Gain Block (SOT-86 Pkg)
InGaP HBT Gain Block (SOT-363 Pkg)
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
RF Input Power (continuous)
Junction Temperature
+12 dBm
+250 qC
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
December 2004 Rev 1
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
Web site: www.wj.com
TM
ECG006
InGaP HBT Gain Block
Product Information
Typical Device RF Performance
Supply Bias = +5 V, Rbias = 24.3 :, Icc = 45 mA
Frequency
S21
MHz
dB
100
15.3
-20
500
15.2
-18
900
15.1
-14
1900
14.5
-17
2140
14.3
-18
2400
14.1
-20
3500
13.9
-17
5800
10.2
-12.5
-9.5
S11
dB
S22
dB
-29
-16
-13
-14
-14
-15
-15
Output P1dB
Output IP3
Noise Figure
dBm
dBm
dB
+15.8 +15.4 +15.2 +15.0 +14.9 +14.6
+14
+31
3.8
+31.5
3.7
+32
3.6
+30
3.6
+30
3.6
+29.6
3.6
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24.3 , Icc = 45 mA typical, 50 System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gainvs. Frequency
S11, S22vs. Frequency
Vdevs. Icc
18
16
14
12
10
8
90
80
70
60
50
40
30
20
10
0
0
-5
-10
-15
-20
-25
S22
S11
+25°C
+25C -40C +85C
0.0
1.0
2.0
3.0
4.0
5.0
500
1000
1500
2000
2500
3000
0
1
2
3
4
5
6
Frequency(MHz)
Vde(V)
Frequency(GHz)
OIP3vs. Frequency
NoiseFigurevs. Frequency
P1dBvs. Frequency
35
30
25
20
15
18
16
14
12
10
8
4
3.5
3
2.5
2
+25°C -40°C +85°C
+25°C -40°C +85°C
500
1000
1500
2000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
Frequency(MHz)
Frequency(MHz)
Frequency(MHz)
Specifications and information are subject to change without notice
Web site: www.wj.com December 2004 Rev 1
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
TM
ECG006
InGaP HBT Gain Block
Product Information
Recommended Application Circuit
ECG006C-PCB
Vcc
Icc = 45 mA
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
RF OUT
ECG006
C2
C1
Blocking
Capacitor
Blocking
Capacitor
ECG006F-PCB
ECG006B-PCB
Recommended Component Values
Recommended Bias Resistor Values
Reference
Designator
L1
Frequency (MHz)
Supply
Voltage
5 V
6 V
8 V
9 V
10 V
12 V
R1 value
Size
50
820 nH
.018 µF
500
220 nH
1000 pF
900
1900
27 nH
68 pF
2200
22 nH
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
68 nH
100 pF
24.4 ohms
46.7 ohms
91 ohms
113 ohms
136 ohms
180 ohms
0805
0805
1210
1210
2010
2010
C1, C2, C4
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
Value / Type
Size
L1
39 nH wirewound inductor
56 pF chip capacitor
0.018 PF chip capacitor
Do Not Place
0603
0603
0603
C1, C2
C3
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V.
1% tolerance resistor is recommended.
C4
R4
A
0805
24.3: 1% tolerance
Specifications and information are subject to change without notice
Web site: www.wj.com December 2004 Rev 1
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
TM
ECG006
InGaP HBT Gain Block
Product Information
ECG006B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an
“E006” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground
/ thermal vias are critical for the proper
Land Pattern
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
Web site: www.wj.com
December 2004 Rev 1
TM
ECG006
InGaP HBT Gain Block
Product Information
ECG006B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“ E006G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground
/ thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
Web site: www.wj.com
December 2004 Rev 1
TM
ECG006
InGaP HBT Gain Block
Product Information
ECG006C (SOT-86 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with a two-
digit numeric lot code followed by an “ N”
designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 1 at +235 C convection reflow
Standard: JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device.
Vias should use
a .35mm (#80 / .0135”) diameter drill and have a
final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles
are in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
Web site: www.wj.com
December 2004 Rev 1
TM
ECG006
InGaP HBT Gain Block
Product Information
ECG006F (SOT-363 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “ XX”)
followed with a “ 3” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground
/ thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
Land Pattern
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
Web site: www.wj.com
December 2004 Rev 1
TM
ECG006
InGaP HBT Gain Block
Product Information
Typical Device S-Parameters – ECG006B / ECG006B-G
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-16.18
-16.13
-15.97
-15.79
-15.34
-14.99
-14.73
-14.29
-13.38
-11.80
-9.66
S11 (ang)
-2.18
S21 (dB)
15.76
15.57
15.21
14.80
14.57
14.34
14.02
13.65
13.22
12.66
12.00
11.20
10.36
S21 (ang)
178.02
160.12
141.76
124.56
108.50
91.11
74.20
56.77
39.56
22.19
S12 (dB)
-18.89
-18.77
-18.46
-17.94
-17.29
-16.69
-16.16
-15.76
-15.49
-15.29
-15.28
-15.43
-15.69
S12 (ang)
-0.38
-2.87
-5.33
-9.45
-14.37
-21.48
-29.16
-38.37
-47.75
-57.59
-68.56
-79.10
-89.87
S22 (dB)
-14.36
-14.40
-14.15
-13.78
-13.23
-12.79
-12.22
-11.63
-10.44
-9.04
S22 (ang)
-2.29
500
-22.13
-44.58
-68.38
-96.24
-124.42
-153.90
174.59
141.41
110.87
85.53
-26.41
-51.57
-77.30
-104.15
-131.75
-160.58
170.65
143.61
117.68
96.34
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
5.48
-10.89
-26.75
-7.50
-6.12
-4.95
-7.85
-6.37
63.77
47.01
76.71
59.58
Typical Device S-Parameters – ECG006C
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-13.66
-13.64
-14.11
-15.20
-17.86
-20.46
-18.86
-17.20
-16.45
-17.31
-16.22
-13.68
-11.01
S11 (ang)
-1.22
S21 (dB)
15.30
15.23
15.01
14.72
14.44
14.06
13.53
12.99
12.38
11.76
11.25
10.56
9.95
S21 (ang)
178.47
164.32
149.00
134.06
119.89
105.18
91.27
77.75
65.03
52.68
40.65
S12 (dB)
-18.67
-18.59
-18.38
-17.99
-17.52
-17.12
-16.59
-16.21
-15.93
-15.73
-15.52
-15.42
-15.43
S12 (ang)
-0.33
0.29
0.78
0.29
-0.93
-3.33
-6.24
-10.91
-15.16
-19.74
-24.35
-29.98
-34.96
S22 (dB)
-12.25
-12.33
-12.52
-13.08
-14.31
-15.20
-15.01
-14.89
-14.50
-13.75
-12.08
-10.21
-8.73
S22 (ang)
-1.92
500
-13.39
-23.99
-35.45
-52.47
-93.43
-135.97
-158.47
-171.80
166.84
136.42
110.91
97.79
-20.62
-41.41
-62.51
-82.78
-99.71
-124.98
-157.99
170.24
147.52
133.59
119.31
106.39
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
28.09
17.28
Typical Device S-Parameters – ECG006F
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-16.22
-14.87
-16.45
-16.41
-14.08
-12.50
-12.18
-11.70
-10.97
-10.24
-9.06
S11 (ang)
-0.52
-18.97
-51.46
-95.69
-118.65
-114.48
-126.96
-139.53
-158.51
178.62
161.58
150.77
140.56
S21 (dB)
15.76
15.63
15.51
15.22
14.79
14.48
14.14
13.94
13.57
13.03
12.33
11.60
10.95
S21 (ang)
178.32
165.77
151.31
137.15
123.39
112.93
100.74
88.52
75.28
62.14
51.12
42.08
S12 (dB)
-18.82
-18.87
-18.40
-18.07
-17.74
-17.16
-16.80
-16.16
-15.72
-15.50
-15.19
-15.22
-15.14
S12 (ang)
-0.82
1.49
1.44
0.35
-1.31
-2.57
-4.49
-8.66
-12.48
-19.07
-24.71
-28.00
-30.97
S22 (dB)
-14.16
-12.83
-14.19
-14.59
-13.52
-13.05
-12.19
-11.93
-11.00
-9.10
S22 (ang)
-2.06
-24.91
-55.98
-93.37
-120.99
-122.53
-138.80
-159.41
174.63
151.63
139.14
136.14
137.51
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-7.50
-6.87
-6.78
-8.32
-7.84
33.72
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
Web site: www.wj.com December 2004 Rev 1
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
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