ECG008B [ETC]
InGaP HBT Gain Block; 的InGaP HBT增益模块
| 型号： | ECG008B |
| 厂家： | 
ETC |
| 描述： | InGaP HBT Gain Block |
| 文件： | 总5页 (文件大小：250K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
ECG008
InGaP HBT Gain Block
Product Information
Product Features
xꢀ DC – 4 GHz
Product Description
The ECG008 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG008 typically provides 15
dB of gain, +40 dBm Output IP3, and +24 dBm P1dB.
Functional Diagram
GND
4
xꢀ +24 dBm P1dB at 1 GHz
xꢀ +40 dBm OIP3 at 1 GHz
xꢀ 15 dB Gain at 1 GHz
xꢀ 4.6 dB Noise Figure at 2 GHz
The ECG008 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in a low
cost, surface-mountable SOT-89 package. The ECG008 is
also available in a lead-free/green/RoHS-compliant SOT-
89 package. All devices are 100% RF and DC tested.
1
2
3
xꢀ SOT-89 and lead-free / green
SOT-89 Package Styles
RF IN
GND
RF OUT
ECG008B / ECG008B-G
xꢀ Internally matched to 50 :
Applications
xꢀ Mobile Infrastructure
xꢀ CATV / DBS
xꢀ W-LAN / ISM
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG008 will work for other various applications within
the DC to 4 GHz frequency range such as CATV and fixed
wireless.
xꢀ RFID
xꢀ Defense / Homeland Security
xꢀ Fixed Wireless
Specifications (1)
Typical Performance (3)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3 (3)
Noise Figure
Units Min Typ Max
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
MHz
MHz
dB
DC
4000
500
14.7
-26
-19.4
+24.3
+41
900
14.6
-28.5
-17.4
+24
1900
14.3
-28
2140
14.3
-19.5
-15
1000
15
-13.4
+23.3 +19.0
dBm
dBm
dB
+24
+40
4.6
+40
4.6
+37
4.7
+30.5
4.8
4.7
Test Frequency
Gain
MHz
dB
dB
2000
14.3
25
13
3. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = +7.3V, Rbias = 14 , 50 System.
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
dB
14
dBm
dBm
dB
+23
+37
4.8
+34
6.8
Device Voltage
Device Current
Output mismatch w/o spurs VSWR
V
7.3
7.8
mA
120
10:1
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +9 V, Rbias = 14 , 50 System.
2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Ordering Information
Parameter
Rating
Part No.
ECG008B
Description
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Current
-40 to +85 qC
-65 to +150 qC
+15 dBm
InGaP HBT Gain Block
(leaded SOT-89 Pkg)
InGaP HBT Gain Block
ECG008B-G
(lead-free/green/RoHS-compliant SOT-89 Pkg)
160 mA
ECG008B-PCB
700 –2400 MHz Fully Assembled Eval. Board
Junction Temperature
+250 qC
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
December 2004
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
Web site: www.wj.com
TM
ECG008
InGaP HBT Gain Block
Product Information
Typical Device RF Performance
Supply Bias = +9 V, Rbias = 14 :, Icc = 120 mA
Frequency
S21
MHz
dB
100
14.8
-25
500
14.7
-26
900
14.6
-28.5
-17
1900
14.3
-28
2140
14.3
-25
2400
14.2
-23.2
-12
3500
14.5
-15.4
-7.9
5800
12.4
-6
S11
dB
S22
dB
-20
-19
-13
-13
-2.7
Output P1dB
Output IP3
Noise Figure
dBm
dBm
dB
+24.5 +24.3
+24
+40
4.6
+23.2 +22.8 +21.8 +17.3
+41.6
4.9
+41
4.7
+37
4.7
+36
4.9
+34
5.2
1. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = 7.3 V, Rbias = 14 , Icc = 120 mA typical, 50 System.
2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not
account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3.
Gainvs. Frequency
S11, S22vs. Frequency
S22
Vdevs. Icc
0
-5
140
120
100
80
20
18
16
14
12
10
-10
-15
-20
-25
-30
-35
-40
S11
+25°C
60
40
20
+25°C -40°C +85°C
0
0
1
2
3
4
5
6
0.0
2.0
4.0
Vde(V)
6.0
8.0
10.0
500
1000
1500
Frequency(MHz)
2000
2500
3000
Frequency(GHz)
OIP3vs. Frequency
NoiseFigurevs. Frequency
P1dBvs. Frequency
45
30
25
20
15
10
5
4.5
4
40
35
30
25
3.5
3
2.5
2
+25°C -40°C +85°C
+25°C -40°C +85°C
500
1000
1500
2000
2500
3000
500
1000
1500
2000
500
1000
1500
2000
2500
3000
Frequency(MHz)
Frequency(MHz)
Frequency(MHz)
S-Parameters (Vdevice = +7.3 V, ICC = 120 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-24.87
-26.14
-28.46
-30.86
-28.14
-23.15
-18.78
-15.39
-12.91
-10.59
-8.44
S11 (ang)
176.05
167.68
166.94
-178.22
-144.76
-137.68
-150.37
-171.26
161.38
132.87
105.27
80.71
S21 (dB)
14.88
14.71
14.60
14.39
14.30
14.20
14.30
14.48
14.65
14.51
14.04
13.17
12.10
S21 (ang)
177.77
161.26
142.99
125.46
108.38
91.08
74.41
56.29
35.57
13.60
S12 (dB)
-18.94
-18.94
-19.02
-18.94
-18.86
-18.64
-18.20
-17.52
-16.85
-16.36
-16.20
-16.26
-16.59
S12 (ang)
-1.51
-5.99
S22 (dB)
S22 (ang)
-20.41
-19.43
-17.47
-15.40
-13.40
-11.63
-9.65
-7.83
-6.06
-4.68
-3.62
-4.20
-39.76
-72.27
-95.62
-116.18
-133.34
-151.20
-171.17
165.56
141.33
117.07
94.30
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-11.44
-16.56
-21.00
-25.54
-29.98
-36.74
-45.50
-56.53
-68.74
-81.52
-93.75
-8.75
-31.25
-50.89
-6.76
-5.43
-2.87
-2.41
61.63
73.89
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
Web site: www.wj.com December 2004
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
TM
ECG008
InGaP HBT Gain Block
Product Information
Recommended Application Circuit
Vcc
Icc = 120 mA
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
R2
R3
RF Choke
RF IN
RF OUT
ECG008B
R2
18
R3
4.7
C2
Blocking
Capacitor
C1
Blocking
Capacitor
Recommended Component Values
Recommended Bias Resistor Values
Reference
Designator
L1
Frequency (MHz)
Supply
Voltage
9 V
10 V
12 V
R1 value
Size
50
820 nH
.018 µF
500
220 nH
1000 pF
900
1900
27 nH
68 pF
2200
22 nH
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
68 nH
100 pF
14 ohms
23 ohms
39 ohms
2010
2512
2512
C1, C2, C4
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The component values in the table below are contained on the evaluation board to achieve optimal broadband
performance.
3. R2 and R3 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures
of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to
degrade about only 0.5 dB, while overall gain will be about 2 dB less than the performance shown in page 1 and 2 of
this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz.
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +9 V.
1% tolerance resistor is recommended.
A
Ref. Desig.
Value / Type
Size
L1
39 nH wirewound inductor
56 pF chip capacitor
0.018 PF chip capacitor
Do Not Place
0603
0603
0603
C1, C2
C3
C4
R2
R3
R4
0603
0603
2010
18 : chip resistor
4.7 : chip resistor
14 : 1% tolerance
ECG008B-PCB Performance Data
(WJ’s evaluation board uses the circuit shown above.)
Gain
Return Loss
14
12
10
8
0
-10
-20
-30
S11
S22
6
4
0
1
2
3
4
0
1
2
3
4
Frequency (GHz)
Frequency (GHz)
Specifications and information are subject to change without notice
Web site: www.wj.com December 2004
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
TM
ECG008
InGaP HBT Gain Block
Product Information
ECG008B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Product Marking
Outline Drawing
The component will be marked with an
“E008” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground
/ thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
Land Pattern
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
Web site: www.wj.com December 2004
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
TM
ECG008
InGaP HBT Gain Block
Product Information
ECG008B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“ E008G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow
Standard: JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground
/ thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
Web site: www.wj.com December 2004
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
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