ECG012B-PCB1900 [WJCI]
0.1 Watt, High Linearity InGaP HBT Amplifier; 0.1瓦，高线性度的InGaP HBT放大器
| 型号： | ECG012B-PCB1900 |
| 厂家： | 
WJ COMMUNICATION. INC. |
| 描述： | 0.1 Watt, High Linearity InGaP HBT Amplifier |
| 文件： | 总4页 (文件大小：204K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The Communications Edge TM
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
Product Features
Product Description
Functional Diagram
GND
The ECG012 is a high dynamic range driver amplifier in
a low-cost surface mount package. The InGaP/GaAs
HBT is able to achieve high performance across a broad
range with +36 dBm OIP3 and +20 dBm of compressed
1dB power. It is housed in a lead-free/green/RoHS-
compliant SOT-89 SMT package. All devices are 100%
RF and DC tested.
• 60 – 2500 MHz
4
• +20 dBm P1dB
• +36 dBm Output IP3
• 14 dB Gain @ 900 MHz
• 12.5 dB Gain @ 1900 MHz
• Single Positive Supply (+3V)
1
2
3
The ECG012 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity and medium
power is required. An internal active bias allows the
ECG012 to maintain high linearity over temperature and
operate directly off a single +3 V supply. This
combination makes the device an excellent candidate for
transceiver line cards in current and next generation
multi-carrier 3G base stations.
RF IN
GND
RF OUT
• Available in a lead-free / green
SOT-89 Package Style
Function
Pin No.
Input
1
3
Output/Bias
Ground
Applications
2, 4
• Final stage amplifiers for Repeaters
• Mobile Infrastructure
• CATV / DBS
• Defense / Homeland Security
Specifications (1)
Typical Performance (3)
Parameters
Operational Bandwidth
Test Frequency
Gain
Units Min Typ Max
Parameters
Frequency
Units
MHz
dB
Typical
1900
MHz
MHz
dB
60
2500
900
14
2140
11.5
-15
S21 - Gain
12.5
-15
-10
+20
+36
4.9
1900
12.5
15
S11 - Input R.L.
S22 - Output R.L.
Output P1dB
Output IP3
dB
-14
-10
+20
+35
4.7
11
dB
-10
Input Return Loss
Output Return Loss
Output P1dB
dB
dBm
dBm
dB
+20
+36
5.4
dB
10
dBm
dBm
+20
+36
Output IP3 (2)
Noise Figure
Supply Bias
+3 V @ 100 mA
IS-95A Channel Power
@ -45 dBc ACPR
dBm
+13
3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +3 V, I =
Noise Figure
dB
mA
V
4.9
100
+3
100 mA, +25 °C
Operating Current Range
Device Voltage
65
145
1. Test conditions unless otherwise noted: 25 ºC, Vsupply = +3 V, in a tuned application circuit.
2. 3OIP measured with two tones at an output power of +6 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Ordering Information
Parameter
Rating
-40 to +85 °C
-65 to +150 °C
+15 dBm
+6 V
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Junction Temperature
Part No.
Description
0.1 Watt, High Linearity InGaP HBT Amplifier
(lead-free/green/RoHS-compliant SOT-89 Pkg)
ECG012B-G
ECG012B-PCB900 900 MHz Evaluation Board
ECG012B-PCB1900 1900 MHz Evaluation Board
ECG012B-PCB2140 2140 MHz Evaluation Board
220 mA
+250 °C
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
Page 1 of 4 October 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
The Communications Edge TM
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
Typical Device Data
S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 °C, unmatched 50 ohm system)
S11
S22
Swp Max
3000MHz
Swp Max
3000MHz
Gain / Maximum Stable Gain
30
25
20
15
10
5
DB(|S(2,1)|)
DB(GMax())
0
0
1000
2000
3000
Frequency (MHz)
Swp Min
50MHz
Swp Min
50MHz
Notes:
The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency,
it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line.
The impedance plots are shown from 50 – 3000 MHz, with markers placed at 0.5 – 3.0 GHz in 0.5 GHz increments.
S-Parameters (Vcc = +3 V, Icc = 100 mA, T = 25 °C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-6.10
-3.49
-3.10
-2.96
-2.79
-2.64
-2.55
-2.44
-2.49
-2.39
-2.35
-2.28
-2.29
S11 (ang)
-155.37
-176.62
174.48
167.11
160.22
153.20
146.05
138.76
132.13
125.66
119.11
111.83
104.87
S21 (dB)
20.62
14.94
13.45
12.26
11.17
10.12
9.07
S21 (ang)
150.95
140.53
129.49
115.68
102.37
89.48
S12 (dB)
-25.48
-23.11
-22.77
-22.45
-22.24
-21.89
-21.32
-21.09
-20.45
-20.33
-19.88
-19.58
-18.98
S12 (ang)
18.56
6.69
S22 (dB)
-8.19
-5.84
-5.64
-5.43
-5.27
-5.06
-5.01
-4.84
-4.77
-4.69
-4.68
-4.70
-4.54
S22 (ang)
-109.32
-166.90
178.74
170.66
162.86
156.23
149.29
142.22
135.81
128.87
122.52
115.41
108.72
250
500
5.89
750
3.33
1000
1250
1500
1750
2000
2250
2500
2750
3000
1.71
-0.69
-2.91
-5.27
-7.61
-11.25
-16.63
-18.56
-24.51
78.22
8.18
67.48
7.30
57.62
6.45
48.01
5.69
39.53
4.98
30.50
4.30
21.43
Device S-parameters are available for download off of the website at: http://www.wj.com
Application Circuit PC Board Layout
Circuit Board Material: .014” Getek, 4 layers (other layers added for rigidity), .062” total thickness, 1 oz copper
Microstrip line details: width = .026”, spacing = .026”
Specifications and information are subject to change without notice
Page 2 of 4 October 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
The Communications Edge TM
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
900 MHz Application Circuit (ECG012B-PCB900)
CAP
ID=C1
C=100000 pF
Typical RF Performance
Vcc = +3 V
Frequency
900 MHz
14 dB
size 1206
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used asover-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
CAP
ID=C2
C=56 pF
S21 – Gain
DIODE1
ID=D1
S11 – Input Return Loss
S22 – Output Return Loss
-14 dB
-10 dB
CAP
ID=C3
C=1000 pF
L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
5.6 V
size 0805
IND
ID=L1
L=33 nH
RES
ID=R1
R=820 Ohm
Output IP3
(+6 dBm / tone, 1 MHz spacing)
CAP
ID=C4
C=56 pF
+35 dBm
CAP
PORT
P=2
C=56 pF Z=50 Ohm
PORT
P=1
Z=50 Ohm
RES
ID=L2
R=0 Ohm
ID=C5
size 0603
Output P1dB
Noise Figure
Supply Voltage
Supply Current
+20 dBm
4.7 dB
+3 V
RES
ID=L3
R=0 Ohm
SUBCKT
ID=U1
NET="ECG012"
CAP
ID=C7
C=5.6 pF
CAP
ID=C9
C=1 pF
C9 should be placed between
silk screen markers '8' and '9'
on the WJ evaluation board.
100 mA
C7 should be placed at the silk screen
marker 'F' on the WJ evaluation board.
Measured parameters were taken at 25 °C.
The capacitor should be placed
19°@ 0.9GHz from pin 3
of the ECG012.
The capacitor should be placed
13.7°@ 0.9GHz from pin 1 of the ECG012
1900 MHz Application Circuit (ECG012B-PCB1900)
CAP
ID=C1
C=100000 pF
Vcc = +3 V
Typical RF Performance
size 1206
Frequency
1900 MHz
12.5 dB
-15 dB
All passive components are of size 0603 unless otherwise noted.
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
CAP
ID=C2
C=56 pF
S21 – Gain
DIODE1
ID=D1
CAP
ID=C3
C=1000 pF
L2, L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
S11 – Input Return Loss
S22 – Output Return Loss
5.6 V
-10 dB
size 0805
IND
ID=L1
L=18 nH
RES
ID=R1
R=820 Ohm
CAP
ID=C4
C=56 pF
Output IP3
(+6 dBm / tone, 1 MHz spacing)
CAP
PORT
P=2
C=56 pF Z=50 Ohm
PORT
P=1
Z=50 Ohm
+36 dBm
RES
ID=L2
R=0 Ohm
RES
ID=L3
R=0 Ohm
ID=C5
Output P1dB
Noise Figure
Supply Voltage
Supply Current
+20 dBm
4.9 dB
+3 V
SUBCKT
ID=U1
NET="ECG012"
CAP
ID=C7
C=2.4 pF
CAP
ID=C9
C=1.2 pF
C9 should be placed at
silk screen marker '7'
on the WJ evaluation board.
C7 should be placed at the silk screen
marker 'A' on the WJ evaluation board.
100 mA
The capacitor should be placed
34°@ 1.9GHz from pin 3
of the ECG012.
Measured parameters were taken at 25 °C.
The capacitor should be placed
4.6°@ 1.9GHz from pin 1 of the ECG012
2140 MHz Application Circuit (ECG012B-PCB2140)
CAP
ID=C1
C=100000 pF
Typical RF Performance
Vcc = +3 V
Frequency
2140 MHz
11.5 dB
-15 dB
All passive components are of size 0603 unless otherwise noted.
size 1206
CAP
ID=C2
C=56 pF
The diode D1 is used as over-voltage protection on the evaluation
boards. It is not specifically required in the final circuit layout in
a system using a DC regulator.
S21 – Gain
DIODE1
ID=D1
CAP
ID=C3
C=1000 pF
S11 – Input Return Loss
S22 – Output Return Loss
Component R1 is shown in the silkscreen but is not used for this
configuration.
5.6 V
-10 dB
L3 - the 0 ohm resistor - can be removed (with a thru line) in the
final circuit layout.
size 0805
IND
ID=L1
L=18 nH
RES
ID=R1
R=820 Ohm
Output IP3
(+6 dBm / tone, 1 MHz spacing)
CAP
ID=C4
C=56 pF
CAP
PORT
P=2
C=56 pF Z=50 Ohm
PORT
P=1
Z=50 Ohm
+34 dBm
ID=C5
Output P1dB
Noise Figure
Supply Voltage
Supply Current
+20 dBm
5.4 dB
+3 V
RES
ID=L3
R=0 Ohm
CAP
ID=L2
C=2 pF
SUBCKT
ID=U1
NET="ECG012"
CAP
ID=C6
C=1.5 pF
CAP
ID=C9
C=.8 pF
C9 should be placed at
silk screen marker '3'
on the WJ evaluation board.
C6 should be placed between silk screen
markers 'E' & 'F' on the WJ evaluation board.
The capacitor should be placed
100 mA
The capacitor should be placed
14.2°@ 2.14GHz from pin 3
of the ECG012.
Measured parameters were taken at 25 °C.
28.9°@ 2.14GHz from pin 1 of the ECG012
Specifications and information are subject to change without notice
Page 3 of 4 October 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
The Communications Edge TM
ECG012
0.1 Watt, High Linearity InGaP HBT Amplifier
Product Information
ECG012B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“E012G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E012” designator
alphanumeric lot code.
followed
by an
Tape and reel specification for this part is
located on the website in the “Application
Notes” section.
ESD / MSL Information
Land Pattern
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Thermal Specifications
MTTF vs. GND Tab Temperature
10000
1000
100
10
Parameter
Operating Case Temperature
Thermal Resistance, Rth (1)
Rating
-40 to +85 °C
149 °C / W
130 °C
Junction Temperature, Tj (2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 °C.
2. This corresponds to the typical biasing condition of
1
60
70
80
90
100
110
120
Tab Temperature (°C)
+3V, 100 mA at an 85 °C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247 °C.
Specifications and information are subject to change without notice
Page 4 of 4 October 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
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