ECG006C-G [WJCI]
InGaP HBT Gain Block; 的InGaP HBT增益模块
| 型号： | ECG006C-G |
| 厂家： | 
WJ COMMUNICATION. INC. |
| 描述： | InGaP HBT Gain Block |
| 文件： | 总7页 (文件大小：324K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ECG006
InGaP HBT Gain Block
Product Features
Product Description
Functional Diagram
GND
4
The ECG006 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG006 typically provides 15
dB of gain, +32 dBm Output IP3, and +15.5 dBm P1dB.
• DC – 5.5 GHz
• +15.5 dBm P1dB at 1 GHz
• +32 dBm OIP3 at 1 GHz
• 15 dB Gain at 1 GHz
• 3.7 dB Noise Figure
1
2
3
RF IN
GND
RF OUT
The ECG006 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in low-cost,
surface-mountable plastic lead-free/green/RoHS-compliant
SOT-363, SOT-86 and SOT-89 packages. All devices are
100% RF and DC tested.
ECG006B-G
• Available in lead-free/green SOT-86,
SOT-363, & SOT-89 package styles
GND
4
• Internally matched to 50 Ω
RF In
1
RF Out
3
2
Applications
GND
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG006 will work for other various applications within
the DC to 5.5 GHz frequency range such as CATV and
mobile wireless.
• Mobile Infrastructure
• CATV / FTTX
• W-LAN / ISM
• RFID
ECG006C-G
GND
GND
1
2
3
6
RF OUT
5
GND
RF IN
4
GND
• WiMAX / WiBro
ECG006F-G
Specifications (1)
Typical Performance (1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Units Min Typ Max
Parameter
Frequency
S21
Units
MHz
dB
Typical
MHz
MHz
dB
DC
5500
500
15.5
-20
900
15
1900
14.2
-17.4
-14.5
+15
2140
14
1000
15
S11
dB
-14
-13
-18
-15
+15
+30
3.7
S22
dB
-16
Output P1dB
Output IP3 (2)
Test Frequency
Gain
dBm
dBm
MHz
dB
+15.4
+32
2000
14
Output P1dB
Output IP3 (2)
Noise Figure
dBm
dBm
dB
+15.8 +15.4
+32
3.7
+32
3.7
+30
3.7
12
+12
3.5
18
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
dB
18
dB
14
dBm
dBm
dB
+15
+32
4.0
V
3.9
4.3
mA
45
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, Rbias = 24.3 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Ordering Information
Part No.
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
Absolute Maximum Rating
ECG006B-G
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 package)
Parameter
Rating
ECG006C-G
ECG006F-G
Operating Case Temperature
Storage Temperature
Device Current
RF Input Power (continuous)
Junction Temperature
-40 to +85 °C
-55 to +150 °C
150 mA
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-363 package)
ECG006B-PCB
ECG006C-PCB
ECG006F-PCB
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
+12 dBm
+250 °C
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
Page 1 of 7 April 2007
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
ECG006
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +5 V, Rbias = 24.3 Ω, Icc = 45 mA
Frequency
S21
MHz
dB
100
15.3
-20
500
15.2
-18
900
15.1
-14
1900
14.5
-17
2140
14.3
-18
2400
14.1
-20
3500
13.9
-17
5800
10.2
-12.5
-9.5
S11
dB
S22
dB
-29
-16
-13
-14
-14
-15
-15
Output P1dB
Output IP3
Noise Figure
dBm
dBm
dB
+15.8 +15.4 +15.2 +15.0 +14.9 +14.6
+14
+31
3.8
+31.5
3.7
+32
3.6
+30
3.6
+30
3.6
+29.6
3.6
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24.3 Ω, Icc = 45 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
S11, S22 vs. Frequency
Vde vs. Icc
90
80
70
60
50
40
30
20
10
0
18
16
14
12
10
8
0
-5
-10
-15
-20
-25
S22
S11
+25C
+25C -40C +85C
3.00 3.20 3.40 3.60 3.80 4.00 4.20 4.40
500
1000
1500
2000
2500
3000
0
1
2
3
4
5
6
Frequency (MHz)
Frequency (GHz)
Vde (V)
OIP3 vs. Frequency
Noise Figure vs. Frequency
P1dB vs. Frequency
35
18
16
14
12
10
8
4
30
25
20
15
3.5
3
2.5
2
+25°C -40°C +85°C
+25°C -40°C +85°C
500
1000
1500
2000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Frequency (MHz)
Specifications and information are subject to change without notice
Page 2 of 7 April 2007
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
ECG006
InGaP HBT Gain Block
Recommended Application Circuit
Vcc
Icc = 45 mA
ECG006C-PCB
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
RF OUT
ECG006
C2
Blocking
Capacitor
C1
Blocking
Capacitor
ECG006F-PCB
ECG006B-PCB
Recommended Component Values
Frequency (MHz)
Recommended Bias Resistor Values
Reference
Designator
L1
Supply
Voltage
5 V
R1 value
Size
50
500
900
1900
27 nH
68 pF
2200
22 nH
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
820 nH
.018 µF
220 nH
1000 pF
68 nH
100 pF
24.4 ohms
46.7 ohms
91 ohms
0805
0805
1210
1210
2010
2010
C1, C2, C4
6 V
8 V
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
9 V
113 ohms
136 ohms
180 ohms
10 V
12 V
Ref. Desig.
L1
Value / Type
Size
39 nH wirewound inductor
56 pF chip capacitor
0.018 µF chip capacitor
Do Not Place
0603
0603
0603
C1, C2
C3
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V.
1% tolerance resistor is recommended.
A
C4
R4
0805
24.3Ω 1% tolerance
Specifications and information are subject to change without notice
Page 3 of 7 April 2007
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
ECG006
InGaP HBT Gain Block
ECG006B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“E006G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E006”
designator
followed
by
an
alphanumeric lot code; it may also have been
marked with a “E” designator followed by a 3-
digit numeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Rating
-40 to +85 °C
Thermal Resistance, Rth
131 °C/W
Specifications and information are subject to change without notice
Page 4 of 7 April 2007
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
ECG006
InGaP HBT Gain Block
ECG006C-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a two-digit
numeric lot code (shown as “XX”) followed
with an “I” designator on the top surface of the
package. The obsolete tin-lead package is
marked with a two-digit numeric lot code
followed with a “N” designator; it may also
have been marked with a “N” designator
followed by a two-digit lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Rating
-40 to +85 °C
Thermal Resistance, Rth
233 °C/W
Specifications and information are subject to change without notice
Page 5 of 7 April 2007
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
ECG006
InGaP HBT Gain Block
ECG006F-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a two-
digit numeric lot code (shown as “XX”)
followed with a “7” designator on the top
surface of the package. The obsolete tin-
lead package is marked with a two-digit
numeric lot code followed with a “3”
designator; it may also have been marked
with a “30” designator followed by a letter
lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Rating
-40 to +85 °C
Thermal Resistance, Rth
131 °C/W
Specifications and information are subject to change without notice
Page 6 of 7 April 2007
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
ECG006
InGaP HBT Gain Block
Typical Device S-Parameters – ECG006B-G
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25°C, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-16.18
-16.13
-15.97
-15.79
-15.34
-14.99
-14.73
-14.29
-13.38
-11.80
-9.66
S11 (ang)
-2.18
S21 (dB)
15.76
15.57
15.21
14.80
14.57
14.34
14.02
13.65
13.22
12.66
12.00
11.20
10.36
S21 (ang)
178.02
160.12
141.76
124.56
108.50
91.11
S12 (dB)
-18.89
-18.77
-18.46
-17.94
-17.29
-16.69
-16.16
-15.76
-15.49
-15.29
-15.28
-15.43
-15.69
S12 (ang)
-0.38
S22 (dB)
-14.36
-14.40
-14.15
-13.78
-13.23
-12.79
-12.22
-11.63
-10.44
-9.04
S22 (ang)
-2.29
500
-22.13
-44.58
-68.38
-96.24
-124.42
-153.90
174.59
141.41
110.87
85.53
-2.87
-26.41
-51.57
-77.30
-104.15
-131.75
-160.58
170.65
143.61
117.68
96.34
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-5.33
-9.45
-14.37
-21.48
-29.16
-38.37
-47.75
-57.59
-68.56
-79.10
-89.87
74.20
56.77
39.56
22.19
5.48
-7.50
-7.85
63.77
-10.89
-26.75
-6.12
76.71
-6.37
47.01
-4.95
59.58
Typical Device S-Parameters – ECG006C-F
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25°C, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-13.66
-13.64
-14.11
-15.20
-17.86
-20.46
-18.86
-17.20
-16.45
-17.31
-16.22
-13.68
-11.01
S11 (ang)
-1.22
S21 (dB)
15.30
15.23
15.01
14.72
14.44
14.06
13.53
12.99
12.38
11.76
11.25
10.56
9.95
S21 (ang)
178.47
164.32
149.00
134.06
119.89
105.18
91.27
S12 (dB)
-18.67
-18.59
-18.38
-17.99
-17.52
-17.12
-16.59
-16.21
-15.93
-15.73
-15.52
-15.42
-15.43
S12 (ang)
-0.33
S22 (dB)
-12.25
-12.33
-12.52
-13.08
-14.31
-15.20
-15.01
-14.89
-14.50
-13.75
-12.08
-10.21
-8.73
S22 (ang)
-1.92
500
-13.39
-23.99
-35.45
-52.47
-93.43
-135.97
-158.47
-171.80
166.84
136.42
110.91
97.79
0.29
-20.62
-41.41
-62.51
-82.78
-99.71
-124.98
-157.99
170.24
147.52
133.59
119.31
106.39
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
0.78
0.29
-0.93
-3.33
-6.24
77.75
-10.91
-15.16
-19.74
-24.35
-29.98
-34.96
65.03
52.68
40.65
28.09
17.28
Typical Device S-Parameters – ECG006F-G
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25°C, calibrated to device leads)
Freq (MHz)
50
S11 (dB)
-16.22
-14.87
-16.45
-16.41
-14.08
-12.50
-12.18
-11.70
-10.97
-10.24
-9.06
S11 (ang)
-0.52
S21 (dB)
15.76
15.63
15.51
15.22
14.79
14.48
14.14
13.94
13.57
13.03
12.33
11.60
10.95
S21 (ang)
178.32
165.77
151.31
137.15
123.39
112.93
100.74
88.52
S12 (dB)
-18.82
-18.87
-18.40
-18.07
-17.74
-17.16
-16.80
-16.16
-15.72
-15.50
-15.19
-15.22
-15.14
S12 (ang)
-0.82
S22 (dB)
-14.16
-12.83
-14.19
-14.59
-13.52
-13.05
-12.19
-11.93
-11.00
-9.10
S22 (ang)
-2.06
500
-18.97
1.49
-24.91
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-51.46
1.44
-55.98
-95.69
0.35
-93.37
-118.65
-114.48
-126.96
-139.53
-158.51
178.62
161.58
150.77
140.56
-1.31
-120.99
-122.53
-138.80
-159.41
174.63
151.63
139.14
136.14
137.51
-2.57
-4.49
-8.66
75.28
-12.48
-19.07
-24.71
-28.00
-30.97
62.14
51.12
-7.50
-8.32
42.08
-6.87
-7.84
33.72
-6.78
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
Page 7 of 7 April 2007
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
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