DEMO-ATF3X14-32 [ETC]

Single stage 2 GHz LNA demonstration board for ATF-3x143 series ultra low noise PHEMTs ; 单级2 GHz的低噪声放大器演示板ATF - 3x143系列超低噪声PHEMTs\n
DEMO-ATF3X14-32
型号: DEMO-ATF3X14-32
厂家: ETC    ETC
描述:

Single stage 2 GHz LNA demonstration board for ATF-3x143 series ultra low noise PHEMTs
单级2 GHz的低噪声放大器演示板ATF - 3x143系列超低噪声PHEMTs\n

放大器
文件: 总19页 (文件大小:473K)
中文:  中文翻译
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Low Noise Pseudomorphic HEMT  
in a Surface Mount Plastic Package  
Technical Data  
ATF-35143  
Features  
Surface Mount Package  
SOT-343  
Description  
• Low Noise Figure  
Agilent’s ATF-35143 is a high  
dynamic range, low noise,  
PHEMT housed in a 4-lead SC-70  
(SOT-343) surface mount plastic  
package.  
• Excellent Uniformity in  
Product Specifications  
• Low Cost Surface Mount  
Small Plastic Package  
SOT-343 (4 lead SC-70)  
Based on its featured perfor-  
mance, ATF-35143 is suitable for  
applications in cellular and PCS  
base stations, LEO systems,  
MMDS, and other systems requir-  
ing super low noise figure with  
good intercept in the 450 MHz to  
10 GHz frequency range.  
• Tape-and-Reel Packaging  
Option Available  
Pin Connections and  
Package Marking  
Specifications  
1.9 GHz; 2V, 15 mA (Typ.)  
DRAIN  
SOURCE  
• 0.4 dB Noise Figure  
SOURCE  
GATE  
• 18 dB Associated Gain  
Other PHEMT devices in this  
family are the ATF-34143 and the  
ATF-33143. The typical specifica-  
tions for these devices at 2 GHz  
are shown in the table below:  
• 11 dBm Output Power at  
1 dB Gain Compression  
• 21 dBm Output 3rd Order  
Intercept  
Note: Top View. Package marking  
provides orientation and identification.  
“5P” = Device code  
“x” = Date code character. A new  
character is assigned for each month, year.  
Applications  
• Low Noise Amplifier for  
Cellular/PCS Handsets  
Part No.  
ATF-33143  
ATF-34143  
ATF-35143  
Gate Width Bias Point NF (dB) Ga (dB) OIP3 (dBm)  
1600 µ  
800 µ  
400 µ  
4V, 80 mA  
4V, 60 mA  
2V, 15 mA  
0.5  
0.5  
0.4  
15.0  
17.5  
18.0  
33.5  
31.5  
21.0  
• LNA for WLAN, WLL/RLL,  
LEO, and MMDS  
Applications  
• General Purpose Discrete  
PHEMT for Other Ultra Low  
Noise Applications  
2
ATF-35143 Absolute Maximum Ratings[1]  
Notes:  
Absolute  
Maximum  
1. Operation of this device above any one  
of these parameters may cause  
permanent damage.  
2. Assumes DC quiesent conditions.  
3. VGS = 0V  
4. Source lead temperature is 25°C.  
Derate 3.2 mW/°C for TL > 67°C.  
5. Thermal resistance measured using  
150°C Liquid Crystal Measurement  
method.  
Symbol  
VDS  
Parameter  
Drain - Source Voltage[2]  
Gate - Source Voltage[2]  
Gate Drain Voltage[2]  
Drain Current[2]  
Units  
V
5.5  
-5  
VGS  
V
VGD  
V
-5  
[3]  
IDS  
mA  
mW  
dBm  
°C  
Idss  
Pdiss  
Pin max  
TCH  
Total Power Dissipation[4]  
300  
14  
RF Input Power  
Channel Temperature  
Storage Temperature  
Thermal Resistance[5]  
160  
TSTG  
θjc  
°C  
°C/W  
-65 to 160  
310  
Product Consistency Distribution Charts[7, 8]  
120  
120  
Cpk = 1.73  
Std = 0.35  
+0.6 V  
0 V  
100  
100  
80  
60  
40  
20  
0
80  
-3 Std  
+3 Std  
60  
40  
20  
0
–0.6 V  
19  
20  
21  
22  
23  
24  
0
2
4
6
8
OIP3 (dBm)  
V
(V)  
DS  
[6]  
Figure 2. OIP3 @ 2 GHz, 2 V, 15 mA.  
LSL=19.0, Nominal=20.9, USL=23.0  
Figure 1. Typical Pulsed I-V Curves  
(VGS = -0.2 V per step)  
.
200  
160  
120  
160  
120  
Cpk = 3.7  
Std = 0.03  
Cpk = 2.75  
Std = 0.17  
-3 Std  
+3 Std  
-3 Std  
+3 Std  
80  
40  
0
80  
40  
0
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
16  
17  
18  
GAIN (dB)  
19  
20  
NF (dB)  
Figure 3. NF @ 2 GHz, 2 V, 15 mA.  
LSL=0.2, Nominal=0.37, USL=0.7  
Figure 4. Gain @ 2 GHz, 2 V, 15 mA.  
LSL=16.5, Nominal=18.0, USL=19.5  
Notes:  
6. Under large signal conditions, VGS may  
7. Distribution data sample size is 450  
samples taken from 9 different wafers.  
Future wafers allocated to this product  
may have nominal values anywhere  
within the upper and lower spec limits.  
8. Measurements made on production test  
board. This circuit represents a trade-off  
between an optimal noise match and a  
realizeable match based on production test  
requirements. Circuit losses have been de-  
embedded from actual measurements.  
swing positive and the drain current may  
exceed Idss. These conditions are  
acceptable as long as the maximum Pdiss  
and Pin max ratings are not exceeded.  
3
ATF-35143 Electrical Specifications  
TA = 25°C, RF parameters measured in a test circuit for a typical device  
Symbol  
Parameters and Test Conditions  
Units Min. Typ.[2] Max.  
[1]  
Idss  
Saturated Drain Current  
VDS = 1.5 V, VGS = 0 V  
VDS = 1.5 V, IDS = 10% of Idss  
VGS = 0.45 V, VDS = 2 V  
mA  
V
40  
-0.65  
65  
-0.5  
15  
80  
-0.35  
[1]  
VP  
Pinchoff Voltage  
Id  
[1]  
Quiescent Bias Current  
Transconductance  
mA  
gm  
VDS = 1.5 V, gm = Idss /VP mmho  
90  
120  
IGDO  
Igss  
Gate to Drain Leakage Current  
Gate Leakage Current  
VGD = 5 V  
µA  
µA  
dB  
250  
150  
VGD = VGS = -4 V  
10  
f = 2 GHz VDS = 2 V, IDS = 15 mA  
VDS = 2 V, IDS = 5 mA  
0.4  
0.5  
0.7  
0.9  
NF  
Ga  
Noise Figure[3]  
f = 900 MHz VDS = 2 V, IDS = 15 mA  
VDS = 2 V, IDS = 5 mA  
dB  
dB  
0.3  
0.4  
f = 2 GHz VDS = 2 V, IDS = 15 mA  
VDS = 2 V, IDS = 5 mA  
16.5  
14  
18  
16  
19.5  
18  
Associated Gain[3]  
f = 900 MHz VDS = 2 V, IDS = 15 mA  
VDS = 2 V, IDS = 5 mA  
dB  
20  
18  
f = 2 GHz VDS = 2 V, IDS = 15 mA  
VDS = 2 V, IDS = 5 mA  
dBm  
dBm  
dBm  
dBm  
19  
21  
14  
Output 3rd Order  
OIP3  
P1dB  
Intercept Point[4, 5]  
f = 900 MHz VDS = 2 V, IDS = 15 mA  
VDS = 2 V, IDS = 5 mA  
19  
14  
f = 2 GHz VDS = 2 V, IDSQ = 15 mA  
VDS = 2 V, IDSQ = 5 mA  
10  
8
1 dB Compressed  
Intercept Point[4]  
f = 900 MHz VDS = 2 V, IDSQ = 15 mA  
VDS = 2 V, IDSQ = 5 mA  
9
9
Notes:  
1. Guaranteed at wafer probe level  
2. Typical value determined from a sample size of 450 parts from 9 wafers.  
3. 2V 5 mA min/max data guaranteed via the 2V 15 mA production test.  
4. Measurements obtained using production test board described in Figure 5.  
5.  
Pout = -10 dBm per tone  
50 Ohm  
Input  
50 Ohm  
Input  
Output  
Transmission  
Line Including  
Gate Bias T  
(0.5 dB loss)  
Matching Circuit  
Γ_mag = 0.66  
Γ_ang = 5°  
Transmission  
Line Including  
Drain Bias T  
(0.5 dB loss)  
DUT  
(0.4 dB loss)  
Figure 5. Block diagram of 2 GHz production test board used for Noise Figure, Associated Gain, P1dB, and OIP3 measure-  
ments. This circuit represents a trade-off between an optimal noise match and a realizable match based on production test  
requirements. Circuit losses have been de-embedded from actual measurements.  
4
ATF-35143 Typical Performance Curves  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
OIP3  
OIP3  
P
1dB  
P
1dB  
2 V  
3 V  
4 V  
2 V  
3 V  
4 V  
0
0
10  
20  
30  
(mA)  
40  
50  
60  
0
10  
20  
30  
(mA)  
40  
50  
60  
I
I
DSQ  
DSQ  
Figure 7. OIP3 and P1dB vs. Bias at  
900 MHz.[1,2]  
Figure 6. OIP3 and P1dB vs. Bias at  
2 GHz.[1,2]  
20  
2 V  
3 V  
4 V  
2.5  
2
24  
2 V  
3 V  
4 V  
2.5  
2
19  
G
a
22  
G
a
18  
17  
1.5  
1
20  
18  
1.5  
1
NF  
NF  
16  
0.5  
0
16  
0.5  
0
15  
14  
0
10  
20  
30  
(mA)  
40  
50  
60  
0
10  
20  
30  
(mA)  
40  
50  
60  
I
I
DSQ  
DSQ  
Figure 8. NF and Ga vs. Bias at 2 GHz.[1]  
Figure 9. NF and Ga vs. Bias at  
900 MHz.[1]  
25  
20  
15  
10  
20  
15  
10  
5
5
2 V  
2 V  
3 V  
4 V  
0
0
3 V  
4 V  
-5  
-5  
0
20  
40  
60  
80  
0
20  
40  
60  
80  
I
(mA)  
I
(mA)  
DS  
DS  
Figure 10. P1dB vs. Bias (Active Bias)  
Tuned for NF @ 2V, 15 mA at 2 GHz.[1]  
Figure 11. P1dB vs. Bias (Active Bias)  
Tuned for NF @ 2V, 15 mA at 900 MHz.[1]  
Notes:  
1. Measurements made on a fixed tuned production test board that was tuned for optimal gain match with reasonable noise figure at 2V  
15 mA bias. This circuit represents a trade-off between optimal noise match, maximum gain match and a realizable match based on  
production test board requirements. Circuit losses have been de-embedded from actual measurements.  
2. P1dB measurements are performed with passive biasing. Quiescent drain current, IDSQ, is set with zero RF drive applied. As P1dB is  
approached, the drain current may increase or decrease depending on frequency and dc bias point. At lower values of IDSQ the device  
is running closer to class B as power output approaches P1dB. This results in higher P1dB and higher PAE (power added efficiency)  
when compared to a device that is driven by a constant current source as is typically done with active biasing. As an example, at a VDS  
= 4 V and IDSQ = 5 mA, Id increases to 30 mA as a P1dB of +15 dBm is approached.  
5
ATF-35143 Typical Performance Curves, continued  
1.50  
1.25  
1.00  
0.75  
0.50  
0.25  
0
25  
20  
15  
10  
5
5 mA  
15 mA  
30 mA  
5 mA  
15 mA  
30 mA  
0
2
4
6
8
10  
0
2
4
6
8
10  
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 12. Fmin vs. Frequency and  
Current at 2V.  
Figure 13. Associated Gain vs.  
Frequency and Current at 2V.  
1.0  
0.8  
0.6  
0.4  
0.2  
0
22  
20  
25  
20  
15  
10  
5
18  
25°C  
-40°C  
85°C  
25°C  
-40°C  
85°C  
16  
14  
12  
0
2
4
6
8
0
2
4
6
8
FREQUENCY (GHz)  
FREQUENCY (GHz)  
Figure 14. Fmin and Ga vs. Frequency  
and Temperature, VDS=2V, IDS=15 mA.  
Figure 15. OIP3 and P1dB vs. Frequency  
and Temperature[1,2], VDS=2V, IDS=15 mA.  
2.5  
2
3
25  
20  
15  
10  
5
25  
20  
15  
10  
5
2.5  
2
1.5  
1
1.5  
1
P
P
1dB  
1dB  
0.5  
0
0.5  
0
OIP3  
Gain  
NF  
OIP3  
Gain  
NF  
0
-5  
0
0
20  
40  
60  
80  
0
20  
40  
60  
80  
I
(mA)  
I
(mA)  
DS  
DS  
Figure 16. OIP3, P1dB, NF and Gain vs.  
Bias[1] (Active Bias, 2V, 3.9 GHz).  
Figure 17. OIP3, P1dB, NF and Gain vs.  
Bias[1] (Active Bias, 2V, 5.8 GHz).  
Notes:  
1. Measurements made on a fixed tuned test fixture that was tuned for noise figure at 2V 15mA bias. This circuit represents a trade-off  
between optimal noise match, maximum gain match and a realizable match based on production test requirements. Circuit losses have  
been de-embedded from actual measurements.  
2. P1dB measurements are performed with passive biasing. Quiescent drain current, IDSQ, is set with zero RF drive applied. As P1dB is  
approached, the drain current may increase or decrease depending on frequency and dc bias point. At lower values of Idsq the device is  
running closer to class B as power output approaches P1dB. This results in higher P1dB and higher PAE (power added efficiency) when  
compared to a device that is driven by a constant current source as is typically done with active biasing. As an example, at a VDS = 4V  
and IDSQ = 5 mA, Id increases to 30 mA as a P1dB of +15 dBm is approached.  
6
ATF-35143 Typical Scattering Parameters, VDS = 2 V, IDS = 5 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
9.00  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
0.99  
0.98  
0.97  
0.94  
0.91  
0.90  
0.85  
0.81  
-16.90 13.34  
-26.37 13.29  
-34.76 13.16  
-50.59 12.83  
-58.26 12.66  
-65.74 12.44  
-80.62 12.04  
-95.48 11.61  
4.64  
4.62  
4.55  
4.38  
4.30  
4.19  
4.00  
3.81  
3.43  
3.09  
2.80  
2.53  
2.29  
2.06  
1.87  
1.69  
1.52  
1.34  
166.04 -31.70 0.026  
157.78 -28.18 0.039  
150.72 -25.85 0.051  
137.02 -22.73 0.073  
130.38 -21.62 0.083  
123.90 -20.72 0.092  
111.27 -19.33 0.108  
99.08 -18.27 0.122  
75.75 -17.08 0.140  
53.63 -16.48 0.150  
32.77 -16.14 0.156  
12.43 -16.08 0.157  
-7.12 -16.31 0.153  
-26.14 -16.59 0.148  
-44.14 -16.89 0.143  
-62.85 -17.14 0.139  
77.91  
71.12  
65.76  
54.85  
49.69  
44.45  
34.61  
25.21  
6.95  
0.73  
0.72  
0.71  
0.68  
0.67  
0.65  
0.62  
0.59  
0.52  
0.45 -102.71  
0.38 -120.16  
0.31 -138.01  
0.25 -157.10  
0.20 -178.27  
0.16  
0.14  
0.17  
0.22  
0.28  
0.34  
0.42  
0.49  
0.56  
-12.47  
-17.53  
-23.33  
-34.88  
-40.49  
-46.03  
-56.68  
-66.71  
-85.11  
22.52  
20.83  
19.50  
17.78  
17.13  
16.58  
15.69  
14.94  
13.89  
13.13  
12.53  
12.07  
11.75  
11.19  
9.63  
8.81  
7.87  
6.79  
5.86  
5.89  
4.84  
4.62  
0.72 -125.99 10.71  
0.66 -156.09  
9.79  
8.93  
8.06  
7.20  
6.26  
5.43  
4.58  
3.64  
2.56  
1.45  
0.43  
-9.83  
0.62  
0.60  
0.60  
0.62  
0.66  
0.70  
0.72  
0.74  
0.76  
0.82  
0.82  
0.84  
0.86  
174.97  
145.61  
118.39  
93.15  
71.31  
50.91  
31.04  
11.26  
-3.08  
-25.73  
-41.00  
-54.14  
-67.05  
-78.09  
-88.99  
157.62  
121.82  
82.33  
53.17  
27.32  
6.01  
-10.69  
-22.32  
-35.90  
-81.42 -17.52 0.133 -100.38  
-99.46 -18.13 0.124 -111.06  
1.18 -115.94 -18.79 0.115 -119.00  
1.05 -132.24 -19.25 0.109 -127.12  
0.92 -149.24 -19.58 0.105 -135.42  
0.81 -164.44 -19.74 0.103 -143.49  
-14.26  
-26.64 -0.72  
-38.94 -1.83  
-54.78 -3.02  
0.71  
179.28 -20.18 0.098 -152.36  
4.04  
ATF-35143 Typical Noise Parameters  
VDS = 2 V, IDS = 5 mA  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
MSG  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.10  
0.12  
0.14  
0.20  
0.23  
0.27  
0.33  
0.39  
0.52  
0.64  
0.77  
0.89  
1.02  
1.14  
1.27  
0.91  
0.87  
0.86  
0.81  
0.78  
0.76  
0.71  
0.66  
0.58  
0.52  
0.47  
0.43  
0.41  
0.40  
0.41  
6.4  
15.0  
17.2  
28.0  
33.4  
38.8  
50.0  
61.9  
87.2  
114.4  
143.2  
173.5  
-155.2  
-122.9  
-90.1  
0.22  
0.22  
0.22  
0.22  
0.21  
0.21  
0.19  
0.17  
0.13  
0.09  
0.06  
0.05  
0.07  
0.13  
0.24  
19.3  
17.9  
17.5  
16.3  
15.8  
15.4  
14.7  
14.0  
12.7  
11.5  
10.4  
9.5  
S
MAG  
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 18. MSG/MAG and |S21|2 vs.  
Frequency at 2 V, 5 mA.  
8.7  
8.0  
7.5  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at 16 different impedances using an ATN NP5 test system. From these measure-  
ments a true Fmin is calculated. Refer to the noise parameter application section for more information.  
2. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
7
ATF-35143 Typical Scattering Parameters, VDS = 2 V, IDS = 10 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
0.99  
0.97  
0.95  
0.91  
0.89  
0.86  
0.81  
-18.75 15.89  
-29.11 15.79  
-38.28 15.61  
-55.52 15.17  
-63.78 14.92  
-71.82 14.65  
-87.59 14.11  
6.23  
6.16  
6.03  
5.73  
5.57  
5.40  
5.08  
4.76  
4.17  
3.67  
3.26  
2.91  
2.61  
2.32  
2.10  
1.89  
1.69  
1.49  
164.76 -32.40 0.024  
155.98 -28.87 0.036  
148.42 -26.56 0.047  
133.92 -23.61 0.066  
127.01 -22.62 0.074  
120.27 -21.72 0.082  
107.36 -20.35 0.096  
95.04 -19.41 0.107  
71.95 -18.27 0.122  
50.43 -17.65 0.131  
30.28 -17.33 0.136  
10.68 -17.14 0.139  
-8.09 -17.14 0.139  
-26.38 -17.20 0.138  
-43.90 -17.20 0.138  
-61.97 -17.27 0.137  
-79.90 -17.39 0.135  
77.63  
70.58  
64.88  
54.16  
49.11  
44.08  
34.60  
25.71  
9.04  
0.63  
0.61  
0.60  
0.57  
0.56  
0.54  
0.51  
0.47  
0.41  
0.34 -110.05  
0.27 -129.24  
0.21 -150.49  
0.17 -174.77  
0.13  
0.11  
0.14  
0.19  
0.26  
0.33  
0.39  
0.45  
0.51  
0.57  
-14.09  
-19.69  
-26.10  
-38.73  
-44.79  
-50.70  
-61.95  
-72.47  
-91.47  
24.14  
22.30  
21.08  
19.39  
18.75  
18.19  
17.23  
16.48  
15.34  
14.47  
13.80  
13.21  
12.73  
10.69  
9.85  
9.16  
8.34  
7.35  
6.51  
6.51  
5.48  
5.24  
4.72  
0.76 -103.22 13.54  
0.66 -134.81 12.40  
0.61 -165.34 11.29  
-5.97  
0.58  
0.57  
0.58  
0.61  
0.65  
0.69  
0.72  
0.74  
0.77  
0.82  
0.82  
0.84  
0.86  
165.88 10.27  
-20.15  
-33.84  
-45.60  
-57.65  
-68.22  
-79.30  
-90.87  
137.00  
110.78  
86.75  
66.25  
46.88  
27.76  
8.62  
-5.28  
-16.03  
-28.32  
9.27  
8.33  
7.32  
6.44  
5.54  
4.56  
3.45  
2.33  
1.29  
0.19  
9.00  
154.01  
118.18  
78.36  
49.57  
29.95  
9.45  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
-97.18 -17.79 0.129 -102.19  
1.31 -112.92 -18.20 0.123 -110.80  
1.16 -128.66 -18.56 0.118 -120.09  
1.02 -144.87 -18.79 0.115 -129.92  
0.91 -159.49 -18.79 0.115 -139.60  
0.80 -175.19 -19.33 0.108 -149.17  
-7.98  
-22.30  
-32.23  
-44.43  
-40.43 -0.87  
-56.14 -1.99  
ATF-35143 Typical Noise Parameters  
VDS = 2 V, IDS = 10 mA  
30  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.10  
0.11  
0.12  
0.17  
0.20  
0.23  
0.29  
0.34  
0.46  
0.58  
0.69  
0.81  
0.92  
1.04  
1.16  
0.88  
0.84  
0.83  
0.77  
0.74  
0.71  
0.66  
0.60  
0.52  
0.45  
0.40  
0.37  
0.35  
0.35  
0.37  
5.0  
14.0  
16.0  
26.0  
31.9  
37.3  
48.6  
60.6  
86.8  
115.3  
145.8  
177.7  
-149.3  
-115.6  
-81.8  
0.15  
0.15  
0.15  
0.15  
0.15  
0.14  
0.14  
0.12  
0.12  
0.08  
0.05  
0.05  
0.07  
0.12  
0.22  
20.5  
19.0  
18.6  
17.5  
16.9  
16.4  
15.7  
15.0  
13.6  
12.4  
11.3  
10.3  
9.5  
MSG  
MAG  
S
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 19. MSG/MAG and |S21|2 vs.  
Frequency at 2 V, 10 mA.  
8.8  
8.3  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at sixteen different impedances using an ATN NP5 test system. From these  
measurements a true Fmin is calculated. Refer to the noise parameter application section for more information.  
2. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
8
ATF-35143 Typical Scattering Parameters, VDS = 2 V, IDS = 15 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
0.99  
0.97  
0.95  
0.90  
0.87  
0.84  
0.79  
-19.75 17.02  
-30.58 16.90  
-40.15 16.69  
-58.08 16.18  
-66.65 15.90  
-74.93 15.59  
-91.13 14.97  
7.10  
7.00  
6.83  
6.44  
6.23  
6.02  
5.61  
5.21  
4.51  
3.93  
3.47  
3.08  
2.75  
2.44  
2.20  
1.98  
1.76  
1.55  
164.04 -32.77 0.023  
154.98 -29.37 0.034  
147.18 -27.13 0.044  
132.28 -24.15 0.062  
125.22 -23.10 0.070  
118.41 -22.27 0.077  
105.38 -20.92 0.090  
93.08 -20.00 0.100  
70.17 -18.94 0.113  
49.03 -18.27 0.122  
29.27 -17.79 0.129  
10.04 -17.59 0.132  
-8.35 -17.46 0.134  
-26.29 -17.39 0.135  
-43.56 -17.33 0.136  
-61.33 -17.27 0.137  
-78.94 -17.27 0.137  
-95.93 -17.59 0.132  
77.60  
70.54  
64.80  
54.23  
49.25  
44.36  
35.36  
26.85  
11.15  
-2.96  
-16.43  
-29.47  
-40.80  
-52.63  
-63.33  
-74.77  
-86.46  
-98.11  
0.57  
0.55  
0.54  
0.51  
0.49  
0.48  
0.44  
0.41  
0.35  
-14.99  
-20.86  
-27.61  
-40.74  
-46.95  
-53.06  
-64.59  
-75.32  
-94.59  
24.89  
23.05  
21.91  
20.17  
19.53  
18.93  
17.95  
17.17  
16.01  
15.09  
14.30  
13.68  
12.29  
10.74  
9.99  
9.34  
8.57  
7.62  
6.79  
6.76  
5.81  
5.55  
5.06  
0.73 -107.08 14.34  
0.64 -139.07 13.09  
0.59 -169.70 11.90  
0.29 -113.89  
0.23 -134.46  
0.17 -158.65  
0.56  
0.56  
0.57  
0.60  
0.64  
0.68  
0.72  
0.74  
0.77  
0.82  
0.82  
0.84  
0.86  
161.74 10.81  
133.19  
107.56  
84.16  
64.19  
45.46  
26.66  
7.70  
-5.93  
-16.54  
-28.76  
9.77  
8.78  
7.75  
6.86  
5.93  
4.93  
3.80  
2.68  
1.63  
0.54  
0.14  
0.11  
0.12  
0.16  
0.22  
0.29  
0.36  
0.41  
0.47  
0.53  
0.58  
172.14  
134.01  
95.85  
63.20  
40.01  
23.11  
3.55  
-12.09  
-26.21  
-35.57  
-47.29  
9.00  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
1.36 -111.53 -17.92 0.127 -107.51  
1.21 -126.76 -18.20 0.123 -117.16  
1.06 -142.70 -18.49 0.119 -127.03  
0.95 -157.02 -18.49 0.119 -137.06  
0.83 -172.47 -18.94 0.113 -147.50  
-40.79 -0.49  
-56.40 -1.60  
ATF-35143 Typical Noise Parameters  
VDS = 2 V, IDS = 15 mA  
30  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.10  
0.13  
0.14  
0.19  
0.22  
0.23  
0.29  
0.34  
0.45  
0.56  
0.67  
0.79  
0.90  
1.01  
1.12  
0.88  
0.83  
0.82  
0.76  
0.72  
0.70  
0.64  
0.58  
0.49  
0.42  
0.37  
0.34  
0.33  
0.34  
0.36  
4.5  
13.1  
15.3  
26.1  
32.6  
36.9  
48.5  
60.9  
87.9  
117.4  
149.0  
-178.1  
-144.3  
-110.2  
-76.3  
0.19  
0.17  
0.16  
0.15  
0.15  
0.14  
0.12  
0.07  
0.13  
0.07  
0.05  
0.05  
0.07  
0.13  
0.23  
20.9  
19.4  
19.2  
17.9  
17.3  
17.0  
16.2  
15.4  
14.1  
12.8  
11.7  
10.8  
9.9  
MSG  
MAG  
S
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 20. MSG/MAG and |S21|2 vs.  
Frequency at 2 V, 15 mA.  
9.2  
8.6  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at 16 different impedances using an ATF NP5 test system. From these measure-  
ments a true Fmin is calculated. Refer to the noise parameter application section for more information.  
2. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
9
ATF-35143 Typical Scattering Parameters, VDS = 2 V, IDS = 30 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
0.99  
0.96  
0.94  
0.88  
0.85  
0.82  
0.76  
-20.95 18.17  
-32.34 18.02  
-42.36 17.77  
-61.09 17.18  
-69.98 16.85  
-78.53 16.50  
-95.14 15.81  
8.10  
7.96  
7.73  
7.22  
6.96  
6.69  
6.17  
5.69  
4.86  
4.20  
3.68  
3.24  
2.88  
2.56  
2.30  
2.06  
1.84  
1.61  
163.18 -33.56 0.021  
153.79 -30.17 0.031  
145.67 -27.96 0.040  
130.36 -25.04 0.056  
123.20 -24.01 0.063  
116.28 -23.22 0.069  
103.17 -21.94 0.080  
90.88 -21.01 0.089  
68.24 -19.83 0.102  
47.48 -19.02 0.112  
28.10 -18.49 0.119  
9.28 -18.13 0.124  
-8.75 -17.79 0.129  
-26.37 -17.59 0.132  
-43.37 -17.33 0.136  
-60.90 -17.20 0.138  
-78.22 -17.14 0.139  
-94.88 -17.33 0.136  
77.39  
70.55  
65.08  
54.79  
50.12  
45.58  
37.15  
29.29  
14.76  
1.63  
-10.98  
-23.67  
-34.72  
-46.33  
-57.43  
-68.78  
-81.32  
-93.11  
0.49  
0.47  
0.46  
0.43  
0.41  
0.39  
0.36  
0.34  
0.28  
-15.99  
-22.00  
-29.03  
-42.64  
-48.96  
-55.19  
-66.91  
-77.74  
-97.29  
25.87  
24.10  
22.86  
21.11  
20.42  
19.86  
18.87  
18.06  
16.78  
15.74  
14.90  
14.17  
11.98  
10.82  
10.15  
9.51  
0.70 -111.48 15.11  
0.61 -143.89 13.73  
0.56 -174.55 12.46  
0.23 -117.24  
0.17 -139.78  
0.13 -169.09  
0.55  
0.55  
0.56  
0.60  
0.64  
0.68  
0.72  
0.74  
0.77  
0.82  
0.83  
0.85  
0.87  
157.19 11.31  
129.18 10.22  
104.19  
81.48  
62.07  
43.83  
25.46  
6.81  
-6.74  
-17.21  
-29.31  
9.20  
8.15  
7.24  
6.29  
5.27  
4.14  
3.01  
1.94  
0.87  
0.11  
0.11  
0.13  
0.18  
0.24  
0.31  
0.38  
0.43  
0.49  
0.54  
0.60  
155.22  
112.23  
77.30  
51.74  
32.67  
17.81  
0.45  
-15.44  
-29.37  
-38.55  
-49.70  
9.00  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
8.77  
7.87  
7.08  
7.06  
6.13  
5.89  
5.39  
1.41 -110.07 -17.65 0.131 -103.06  
1.25 -125.15 -17.86 0.128 -112.88  
1.11 -140.80 -18.06 0.125 -123.55  
0.98 -154.83 -18.13 0.124 -134.43  
0.87 -170.03 -18.56 0.118 -144.88  
-41.30 -0.15  
-56.87 -1.24  
ATF-35143 Typical Noise Parameters  
VDS = 2 V, IDS = 30 mA  
30  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.11  
0.15  
0.16  
0.22  
0.25  
0.27  
0.33  
0.39  
0.52  
0.64  
0.77  
0.90  
1.02  
1.15  
1.28  
0.87  
0.81  
0.80  
0.73  
0.69  
0.66  
0.60  
0.54  
0.45  
0.39  
0.34  
0.33  
0.33  
0.36  
0.40  
2.7  
12.1  
14.5  
26.3  
33.4  
38.1  
50.6  
64.2  
94.0  
126.5  
160.6  
-164.7  
-130.3  
-97.5  
-67.0  
0.18  
0.17  
0.16  
0.15  
0.15  
0.14  
0.13  
0.12  
0.10  
0.07  
0.05  
0.06  
0.10  
0.18  
0.30  
21.6  
20.2  
19.9  
18.7  
18.0  
17.7  
17.0  
16.2  
14.8  
13.5  
12.4  
11.4  
10.5  
9.7  
MSG  
MAG  
S
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 21. MSG/MAG and |S21|2 vs.  
Frequency at 2 V, 30 mA.  
9.1  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at 16 different impedances using an ATF NP5 test system. From these measure-  
ments a true Fmin is calculated. Refer to the noise parameter application section for more information.  
2. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
10  
ATF-35143 Typical Scattering Parameters, VDS = 3 V, IDS = 10 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
0.99  
0.97  
0.95  
0.91  
0.88  
0.86  
0.81  
-18.76 16.07  
-29.12 15.97  
-38.28 15.79  
-55.52 15.34  
-63.78 15.09  
-71.79 14.82  
-87.55 14.27  
6.36  
6.29  
6.16  
5.85  
5.68  
5.51  
5.17  
4.85  
4.25  
3.74  
3.32  
2.97  
2.66  
2.38  
2.15  
1.94  
1.74  
1.53  
164.73 -32.77 0.023  
155.93 -29.37 0.034  
148.37 -27.13 0.044  
133.87 -24.01 0.063  
126.95 -22.97 0.071  
120.22 -22.05 0.079  
107.29 -20.82 0.091  
95.00 -19.83 0.102  
71.95 -18.71 0.116  
50.50 -18.13 0.124  
30.44 -17.79 0.129  
10.91 -17.65 0.131  
-7.80 -17.59 0.132  
-26.05 -17.65 0.131  
-43.52 -17.65 0.131  
-61.59 -17.65 0.131  
-79.58 -17.72 0.130  
-96.96 -17.99 0.126  
76.79  
70.22  
64.53  
54.04  
49.13  
44.06  
34.85  
25.98  
9.56  
0.65  
0.63  
0.62  
0.59  
0.57  
0.56  
0.52  
0.49  
0.42  
0.35 -105.14  
0.29 -122.61  
0.23 -141.22  
0.18 -162.07  
0.13  
0.10  
0.11  
0.16  
0.23  
0.29  
0.35  
0.42  
0.49  
0.55  
-13.67  
-19.08  
-25.28  
-37.48  
-43.28  
-49.01  
-59.84  
-69.88  
-87.88  
24.42  
22.70  
21.46  
19.68  
19.00  
18.43  
17.55  
16.77  
15.63  
14.79  
14.11  
13.55  
12.81  
10.75  
9.98  
9.32  
8.54  
7.59  
6.76  
6.79  
5.79  
5.54  
5.05  
0.75 -103.15 13.71  
0.66 -134.65 12.56  
0.60 -165.16 11.45  
-5.10  
0.58  
0.56  
0.57  
0.60  
0.64  
0.68  
0.71  
0.74  
0.77  
0.82  
0.82  
0.84  
0.86  
166.12 10.43  
-19.00  
-32.32  
-43.61  
-55.14  
-65.42  
-76.27  
-87.47  
-98.60  
137.25  
111.11  
87.10  
66.58  
47.31  
28.18  
9.02  
-4.82  
-15.65  
-28.00  
9.44  
8.51  
7.51  
6.64  
5.76  
4.81  
3.71  
2.61  
1.60  
0.51  
9.00  
172.01  
139.11  
93.44  
57.88  
35.32  
13.11  
-4.62  
-19.61  
-29.62  
-41.92  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
1.35 -112.95 -18.34 0.121 -107.41  
1.20 -128.77 -18.56 0.118 -116.63  
1.06 -145.23 -18.71 0.116 -126.02  
0.94 -160.01 -18.71 0.116 -136.14  
0.82 -176.05 -19.25 0.109 -146.13  
-40.11 -0.55  
-55.87 -1.68  
ATF-35143 Typical Noise Parameters  
VDS = 3 V, IDS = 10 mA  
30  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.12  
0.16  
0.17  
0.22  
0.26  
0.28  
0.33  
0.39  
0.49  
0.60  
0.71  
0.81  
0.92  
1.03  
1.13  
0.87  
0.82  
0.81  
0.75  
0.71  
0.68  
0.62  
0.57  
0.49  
0.43  
0.38  
0.36  
0.34  
0.34  
0.35  
4.7  
13.2  
15.3  
25.9  
32.3  
36.5  
47.7  
59.6  
85.4  
113.6  
143.7  
175.6  
-151.3  
-117.3  
-82.7  
0.21  
0.19  
0.19  
0.17  
0.16  
0.16  
0.14  
0.13  
0.10  
0.08  
0.05  
0.05  
0.07  
0.12  
0.21  
20.0  
19.0  
18.8  
17.8  
17.2  
16.7  
15.9  
15.1  
13.7  
12.5  
11.4  
10.4  
9.6  
MSG  
MAG  
S
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 22. MSG/MAG and |S21|2 vs.  
Frequency at 3 V, 10 mA.  
8.9  
8.4  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at 16 different impedances using an ATN NP5 test system. From these measure-  
ments a true Fmin is calculated. Refer to the noise parameter application section for more information.  
2. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
11  
ATF-35143 Typical Scattering Parameters, VDS = 3 V, IDS = 15 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
0.99  
0.96  
0.94  
0.90  
0.87  
0.84  
0.78  
-19.76 17.20  
-30.58 17.08  
-40.14 16.86  
-58.04 16.35  
-66.61 16.06  
-74.88 15.75  
-91.02 15.13  
7.24  
7.14  
6.97  
6.57  
6.35  
6.13  
5.71  
5.31  
4.59  
4.00  
3.53  
3.14  
2.81  
2.50  
2.26  
2.03  
1.82  
1.60  
164.03 -33.15 0.022  
154.94 -29.90 0.032  
147.12 -27.54 0.042  
132.22 -24.58 0.059  
125.16 -23.48 0.067  
118.36 -22.62 0.074  
105.32 -21.41 0.085  
93.02 -20.45 0.102  
70.17 -19.41 0.107  
49.09 -18.79 0.115  
29.39 -18.34 0.121  
10.23 -18.06 0.125  
-8.11 -17.92 0.127  
-26.04 -17.86 0.128  
-43.28 -17.72 0.130  
-61.06 -17.59 0.132  
-78.75 -17.59 0.132  
-95.88 -17.79 0.129  
76.95  
69.88  
64.59  
54.00  
49.23  
44.39  
35.29  
27.00  
11.47  
-2.18  
-15.36  
-27.97  
-38.89  
-50.41  
-60.57  
-71.45  
-83.32  
-94.36  
0.60  
0.58  
0.57  
0.54  
0.52  
0.50  
0.47  
0.44  
0.37  
0.31 -107.23  
0.24 -125.21  
0.19 -145.42  
0.14 -168.81  
0.11  
0.09  
0.12  
0.18  
0.25  
0.31  
0.37  
0.44  
0.50  
0.56  
-14.39  
-20.00  
-26.48  
-39.05  
-45.00  
-50.83  
-61.71  
-71.87  
-89.81  
25.17  
23.47  
22.20  
20.47  
19.78  
19.19  
18.27  
17.47  
16.32  
15.42  
14.66  
14.00  
12.23  
10.87  
10.16  
9.55  
8.80  
7.86  
7.09  
7.04  
6.09  
5.87  
5.41  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
0.73 -106.95 14.50  
0.63 -138.86 13.24  
0.58 -169.42 12.05  
0.56  
0.55  
0.56  
0.60  
0.64  
0.68  
0.71  
0.74  
0.77  
0.82  
0.82  
0.85  
0.86  
162.05 10.97  
7.00  
8.00  
9.00  
133.54  
107.88  
84.56  
64.57  
45.84  
27.11  
8.18  
-5.58  
-16.18  
-28.41  
9.93  
8.96  
7.95  
7.06  
6.16  
5.19  
4.09  
2.98  
1.96  
0.88  
158.79  
118.59  
75.36  
46.94  
27.91  
7.94  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
1.41 -111.57 -18.06 0.125 -103.78  
1.25 -127.09 -18.27 0.122 -113.43  
1.11 -143.31 -18.42 0.120 -123.35  
0.98 -157.87 -18.49 0.119 -134.06  
0.87 -173.65 -18.86 0.114 -144.46  
-8.87  
-23.42  
-32.96  
-44.64  
-40.49 -0.15  
-56.20 -1.25  
ATF-35143 Typical Noise Parameters  
VDS = 3 V, IDS = 15 mA  
30  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.11  
0.15  
0.16  
0.21  
0.24  
0.26  
0.31  
0.37  
0.47  
0.58  
0.68  
0.79  
0.89  
1.00  
1.10  
0.86  
0.81  
0.80  
0.73  
0.69  
0.66  
0.60  
0.55  
0.46  
0.40  
0.36  
0.33  
0.32  
0.32  
0.33  
3.5  
12.1  
14.3  
25.1  
31.6  
35.9  
47.2  
59.4  
86.0  
115.4  
146.8  
179.8  
-146.1  
-111.5  
-76.8  
0.17  
0.16  
0.16  
0.15  
0.14  
0.20  
0.17  
0.15  
0.11  
0.07  
0.05  
0.05  
0.07  
0.13  
0.22  
21.2  
19.9  
19.6  
18.2  
17.6  
17.2  
16.3  
15.6  
14.2  
12.9  
11.8  
10.8  
10.0  
9.3  
MSG  
MAG  
S
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 23. MSG/MAG and |S21|2 vs.  
Frequency at 3 V, 15 mA.  
8.8  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at 16 different impedances using an ATN NP5 test system. From these measure-  
ments a true Fmin is calculated. Refer to the noise parameter application section for more information.  
2. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
12  
ATF-35143 Typical Scattering Parameters, VDS = 3 V, IDS = 30 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
0.99  
0.96  
0.93  
0.88  
0.85  
0.82  
0.76  
-21.01 18.45  
-32.39 18.29  
-42.42 18.03  
-61.18 17.42  
-70.01 17.09  
-78.57 16.74  
-95.09 16.03  
8.36  
8.21  
7.97  
7.43  
7.15  
6.87  
6.33  
5.83  
4.97  
4.29  
3.76  
3.32  
2.96  
2.63  
2.37  
2.13  
1.90  
1.67  
163.08 -33.98 0.020  
153.62 -30.46 0.030  
145.49 -28.40 0.038  
130.11 -25.35 0.054  
122.91 -24.44 0.060  
116.00 -23.61 0.066  
102.87 -22.38 0.076  
90.60 -21.41 0.085  
68.04 -20.26 0.097  
47.37 -19.58 0.105  
28.09 -19.02 0.112  
9.32 -18.64 0.117  
-8.66 -18.34 0.121  
-26.26 -18.06 0.125  
-43.25 -17.79 0.129  
-60.82 -17.52 0.133  
-78.23 -17.46 0.134  
-95.07 -17.65 0.131  
76.89  
69.94  
64.80  
54.32  
49.77  
45.15  
36.87  
29.08  
14.96  
2.38  
-10.00  
-22.21  
-32.79  
-44.11  
-54.57  
-66.16  
-78.18  
-89.74  
-99.72  
0.53  
0.51  
0.50  
0.47  
0.45  
0.43  
0.40  
0.37  
0.31  
-15.23  
-21.01  
-27.72  
-40.61  
-46.56  
-52.43  
-63.37  
-73.44  
-91.21  
26.21  
24.36  
23.22  
21.39  
20.72  
20.17  
19.21  
18.36  
17.10  
16.11  
15.26  
13.78  
12.10  
11.00  
10.36  
9.76  
0.70 -111.30 15.32  
0.61 -143.48 13.93  
0.56 -174.00 12.65  
0.25 -108.94  
0.19 -128.04  
0.14 -151.53  
0.54  
0.54  
0.55  
0.59  
0.63  
0.67  
0.71  
0.74  
0.77  
0.82  
0.82  
0.85  
0.87  
157.98 11.50  
130.06 10.42  
105.20  
82.53  
63.18  
44.96  
26.64  
7.94  
9.42  
8.39  
7.49  
6.56  
5.58  
4.46  
3.36  
2.33  
1.25  
0.23  
0.11  
0.09  
0.09  
0.14  
0.20  
0.27  
0.34  
0.39  
0.46  
0.51  
0.57  
179.40  
138.30  
95.15  
62.17  
39.86  
23.41  
5.08  
-11.42  
-25.74  
-35.29  
-46.81  
9.00  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
9.05  
8.14  
7.40  
7.41  
6.44  
6.19  
5.71  
-5.53  
1.47 -110.42 -17.86 0.128  
-16.02  
-28.09  
-40.02  
1.31 -125.79 -17.99 0.126 -109.60  
1.16 -141.72 -18.06 0.125 -120.39  
1.03 -156.00 -18.06 0.125 -131.03  
0.91 -171.48 -18.49 0.119 -141.69  
-55.63 -0.85  
ATF-35143 Typical Noise Parameters  
VDS = 3 V, IDS = 30 mA  
30  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.11  
0.16  
0.17  
0.23  
0.27  
0.28  
0.35  
0.41  
0.53  
0.66  
0.79  
0.91  
1.04  
1.17  
1.29  
0.87  
0.81  
0.79  
0.72  
0.68  
0.65  
0.59  
0.53  
0.43  
0.37  
0.33  
0.31  
0.31  
0.33  
0.38  
3.5  
12.5  
14.7  
25.9  
32.6  
37.1  
49.3  
62.5  
91.6  
123.4  
157.1  
-168.3  
-133.7  
-100.0  
-68.1  
0.18  
0.17  
0.17  
0.16  
0.15  
0.15  
0.14  
0.12  
0.09  
0.07  
0.05  
0.06  
0.10  
0.17  
0.28  
21.6  
20.5  
20.2  
18.9  
18.3  
17.9  
17.0  
16.3  
14.9  
13.6  
12.4  
11.4  
10.6  
9.9  
MSG  
MAG  
S
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 24. MSG/MAG and |S21|2 vs.  
Frequency at 3 V, 30 mA.  
9.3  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at 16 different impedances using an ATN NP5 test system. From these measure-  
ments a true Fmin is calculated. Refer to the noise parameter application section for more information.  
2. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
13  
ATF-35143 Typical Scattering Parameters, VDS = 4 V, IDS = 30 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
0.99  
0.96  
0.94  
0.88  
0.85  
0.82  
0.76  
-21.11 18.54  
-32.57 18.38  
-42.70 18.13  
-61.55 17.53  
-70.46 17.20  
-79.07 16.84  
-95.78 16.14  
8.45  
8.30  
8.07  
7.53  
7.24  
6.95  
6.41  
5.91  
5.03  
4.34  
3.81  
3.37  
3.00  
2.67  
2.41  
2.17  
1.95  
1.72  
163.20 -33.98 0.020  
153.72 -30.75 0.029  
145.56 -28.64 0.037  
130.19 -25.68 0.052  
123.00 -24.58 0.059  
116.04 -23.88 0.064  
102.91 -22.62 0.074  
90.63 -21.72 0.082  
68.03 -20.72 0.092  
47.35 -20.00 0.100  
28.07 -19.49 0.106  
9.35 -19.25 0.109  
-8.62 -18.94 0.113  
-26.19 -18.79 0.115  
-43.13 -18.49 0.119  
-60.63 -18.27 0.122  
-78.09 -18.13 0.124  
-95.00 -18.27 0.122  
77.63  
70.15  
64.68  
53.94  
49.29  
44.64  
36.30  
28.32  
13.98  
1.12  
-11.07  
-23.07  
-33.33  
-44.34  
-54.44  
-65.68  
-77.35  
-88.59  
-98.13  
0.56  
0.54  
0.53  
0.50  
0.48  
0.46  
0.43  
0.40  
0.34  
0.28 -104.23  
0.22 -120.69  
0.17 -139.29  
0.13 -160.54  
0.09  
0.07  
0.09  
0.15  
0.22  
0.28  
0.34  
0.40  
0.46  
0.52  
-14.66  
-20.35  
-26.91  
-39.45  
-45.29  
-50.94  
-61.54  
-71.17  
-87.95  
26.26  
24.55  
23.38  
21.61  
20.90  
20.36  
19.38  
18.58  
17.38  
16.38  
15.55  
14.19  
12.47  
11.33  
10.70  
10.10  
9.40  
0.71 -112.14 15.43  
0.62 -144.46 14.04  
0.57 -174.93 12.76  
0.55  
0.55  
0.57  
0.60  
0.64  
0.68  
0.72  
0.74  
0.77  
0.82  
0.82  
0.85  
0.86  
157.13 11.61  
129.56 10.54  
104.96  
82.47  
63.23  
45.01  
26.69  
8.00  
9.55  
8.53  
7.64  
6.74  
5.79  
4.71  
3.64  
2.65  
1.62  
0.64  
9.00  
169.67  
128.74  
78.47  
47.96  
28.53  
8.38  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
8.47  
7.69  
7.76  
6.75  
6.53  
6.00  
-5.46  
1.52 -110.50 -18.42 0.120  
-16.18  
-28.39  
-40.51  
1.36 -126.04 -18.49 0.119 -108.03  
1.21 -142.14 -18.49 0.119 -118.41  
1.08 -156.61 -18.49 0.119 -129.54  
0.95 -172.55 -18.86 0.114 -140.19  
-8.46  
-22.93  
-32.29  
-43.97  
-56.36 -0.44  
ATF-35143 Typical Noise Parameters  
VDS = 4 V, IDS = 30 mA  
30  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
MSG  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.10  
0.14  
0.16  
0.21  
0.25  
0.28  
0.33  
0.38  
0.49  
0.62  
0.74  
0.87  
0.99  
1.11  
1.24  
0.90  
0.85  
0.83  
0.77  
0.73  
0.70  
0.64  
0.58  
0.48  
0.40  
0.35  
0.32  
0.31  
0.34  
0.39  
3.5  
12.5  
14.7  
25.9  
32.6  
37.1  
49.1  
62.0  
90.3  
121.2  
154.0  
-172.2  
-138.0  
-104.2  
-71.6  
0.22  
0.21  
0.20  
0.18  
0.17  
0.17  
0.15  
0.14  
0.10  
0.07  
0.05  
0.06  
0.09  
0.15  
0.26  
20.7  
19.7  
19.5  
18.4  
17.8  
17.5  
16.7  
16.0  
14.7  
13.5  
12.5  
11.5  
10.7  
10.0  
9.5  
MAG  
S
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 25. MSG/MAG and |S21|2 vs.  
Frequency at 4 V, 30 mA.  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at 16 different impedances using an ATN NP5 test system. From these measure-  
ments a true Fmin is calculated. Refer to the noise parameter application section for more information.  
2. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
14  
ATF-35143 Typical Scattering Parameters, VDS = 4 V, IDS = 60 mA  
Freq.  
GHz  
S11  
S21  
Mag.  
S12  
Mag.  
S22  
MSG/MAG  
dB  
Mag.  
Ang.  
dB  
Ang.  
dB  
Ang.  
Mag.  
Ang.  
0.50  
0.75  
1.00  
1.50  
1.75  
2.00  
2.50  
3.00  
4.00  
5.00  
6.00  
7.00  
8.00  
0.99  
0.96  
0.94  
0.88  
0.85  
0.82  
0.76  
-21.27 18.15  
-32.77 17.99  
-42.95 17.74  
-61.92 17.13  
-70.88 16.79  
-79.55 16.45  
-96.36 15.74  
8.09  
7.94  
7.71  
7.19  
6.91  
6.64  
6.12  
5.64  
4.81  
4.15  
3.64  
3.21  
2.87  
2.55  
2.30  
2.08  
1.87  
1.65  
163.09 -34.89 0.018  
153.59 -31.70 0.026  
145.40 -29.37 0.034  
129.98 -26.56 0.047  
122.76 -25.51 0.053  
115.80 -24.73 0.058  
102.60 -23.48 0.067  
90.26 -22.62 0.074  
67.52 -21.51 0.084  
46.76 -20.82 0.091  
27.45 -20.26 0.097  
8.68 -19.83 0.102  
-9.34 -19.41 0.107  
-27.02 -19.09 0.111  
-44.01 -18.71 0.116  
-61.57 -18.27 0.122  
-79.17 -17.92 0.127  
-96.36 -17.92 0.127  
77.28  
70.40  
65.05  
55.14  
50.40  
46.34  
38.10  
30.61  
17.18  
5.47  
0.54  
0.53  
0.51  
0.48  
0.47  
0.45  
0.42  
0.39  
0.34  
0.29  
0.24 -107.07  
0.19 -121.43  
0.15 -137.04  
0.11 -156.16  
0.07  
0.06  
0.10  
0.18  
0.25  
0.31  
0.39  
0.46  
0.52  
-13.50  
-18.54  
-24.50  
-35.90  
-41.17  
-46.33  
-55.86  
-64.53  
-79.32  
-93.48  
26.52  
24.83  
23.55  
21.84  
21.15  
20.59  
19.61  
18.82  
17.58  
16.59  
15.74  
13.17  
11.94  
10.99  
10.38  
9.88  
0.70 -112.86 15.03  
0.61 -145.47 13.64  
0.57 -176.15 12.35  
0.55  
0.55  
0.57  
0.60  
0.64  
0.69  
0.72  
0.75  
0.78  
0.83  
0.84  
0.87  
0.88  
155.85 11.21  
128.25 10.14  
-5.83  
-17.10  
-26.34  
-36.93  
-46.43  
-57.09  
-68.92  
-80.43  
-90.26  
103.61  
81.11  
62.01  
43.90  
25.78  
7.31  
9.16  
8.14  
7.25  
6.37  
5.43  
4.37  
3.30  
2.29  
1.25  
0.21  
9.00  
10.00  
11.00  
12.00  
13.00  
14.00  
15.00  
16.00  
17.00  
18.00  
178.65  
113.63  
60.75  
35.69  
13.24  
-4.12  
-19.12  
-28.89  
-40.92  
9.26  
8.35  
7.57  
7.78  
6.73  
6.65  
6.06  
-6.12  
1.46 -112.19 -17.92 0.127  
-16.62  
-28.78  
-40.91  
1.30 -127.94 -17.86 0.128 -100.79  
1.16 -144.27 -17.79 0.129 -112.14  
1.03 -159.19 -17.79 0.129 -123.71  
0.90 -175.28 -17.99 0.126 -134.88  
-56.66 -0.92  
ATF-35143 Typical Noise Parameters  
VDS = 4 V, IDS = 60 mA  
30  
25  
20  
15  
10  
5
Freq.  
GHz  
Fmin  
dB  
Γopt  
Rn/50  
-
Ga  
dB  
Mag.  
Ang.  
MSG  
0.5  
0.9  
1.0  
1.5  
1.8  
2.0  
2.5  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
9.0  
10.0  
0.22  
0.30  
0.32  
0.42  
0.48  
0.52  
0.63  
0.73  
0.94  
1.15  
1.35  
1.56  
1.77  
1.98  
2.18  
0.84  
0.78  
0.77  
0.70  
0.65  
0.63  
0.56  
0.51  
0.44  
0.40  
0.39  
0.40  
0.43  
0.47  
0.53  
4.4  
15.6  
18.4  
32.4  
40.8  
46.4  
61.0  
76.6  
109.9  
144.8  
-179.8  
-145.5  
-113.7  
-85.6  
-62.6  
0.29  
0.29  
0.28  
0.26  
0.25  
0.24  
0.21  
0.19  
0.13  
0.09  
0.08  
0.13  
0.26  
0.48  
0.79  
22.5  
21.3  
21.0  
19.8  
19.2  
18.8  
17.8  
17.0  
15.5  
14.1  
12.9  
11.9  
11.0  
10.3  
9.8  
MAG  
S
21  
0
-5  
0
5
10  
15  
20  
FREQUENCY (GHz)  
Figure 26. MSG/MAG and |S21|2 vs.  
Frequency at 4 V, 60 mA.  
Notes:  
1. Fmin values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are  
based on a set of 16 noise figure measurements made at 16 different impedances using an ATN NP5 test system. From these measure-  
ments a true Fmin is calculated. Refer to the noise parameter application section for more information.  
3. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the  
end of the gate lead. The output reference plane is at the end of the drain lead. The parameters include the effect of four plated  
through via holes connecting source landing pads on top of the test carrier to the microstrip ground plane on the bottom side of the  
carrier. Two 0.020 inch diameter via holes are placed within 0.010 inch from each source lead contact point, one via on each side of  
that point.  
15  
presented with Γo. If the reflec-  
tion coefficient of the matching  
network is other than Γo, then the  
noise figure of the device will be  
greater than Fmin based on the  
following equation.  
Typically for FETs, the higher Γo  
usually infers that an impedance  
much higher than 50is required  
for the device to produce Fmin. At  
VHF frequencies and even lower  
L Band frequencies, the required  
impedance can be in the vicinity  
of several thousand ohms.  
Matching to such a high imped-  
ance requires very hi-Q compo-  
nents in order to minimize circuit  
losses. As an example at 900 MHz,  
when airwwound coils (Q>100)  
are used for matching networks,  
the loss can still be up to 0.25 dB  
which will add directly to the  
Noise Parameter  
Applications Information  
Fmin values at 2 GHz and higher  
are based on measurements while  
the Fmins below 2 GHz have been  
extrapolated. The Fmin values are  
based on a set of 16 noise figure  
measurements made at 16  
different impedances using an  
ATN NP5 test system. From these  
measurements, a true Fmin is  
calculated. Fmin represents the  
true minimum noise figure of the  
device when the device is pre-  
sented with an impedance  
matching network that trans-  
forms the source impedance,  
typically 50, to an impedance  
represented by the reflection  
coefficient Γo. The designer must  
design a matching network that  
will present Γo to the device with  
minimal associated circuit losses.  
The noise figure of the completed  
amplifier is equal to the noise  
figure of the device plus the  
NF = Fmin + 4 Rn  
|Γs Γo | 2  
Zo (|1 + Γo|2)(1Γs|2)  
Where Rn/Zo is the normalized  
noise resistance, Γo is the opti-  
mum reflection coefficient  
required to produce Fmin and Γs is  
the reflection coefficient of the  
source impedance actually  
presented to the device. The  
losses of the matching networks  
are non-zero and they will also  
add to the noise figure of the  
device creating a higher amplifier  
noise figure. The losses of the  
matching networks are related to  
the Q of the components and  
associated printed circuit board  
loss. Γo is typically fairly low at  
higher frequencies and increases  
as frequency is lowered. Larger  
gate width devices will typically  
have a lower Γo as compared to  
narrower gate width devices.  
noise figure of the device. Using  
muiltilayer molded inductors with  
Qs in the 30 to 50 range results in  
additional loss over the airwound  
coil. Losses as high as 0.5 dB or  
greater add to the typical 0.15 dB  
F
min of the device creating an  
amplifier noise figure of nearly  
0.65 dB. A discussion concerning  
calculated and measured circuit  
losses and their effect on ampli-  
fier noise figure is covered in  
Agilent Application 1085.  
losses of the matching network  
preceding the device. The noise  
figure of the device is equal to  
Fmin only when the device is  
16  
ATF-35143 SC-70 4 Lead, High Frequency Model  
Optimized for 0.16.0 GHz  
R
EQUATION La=0.1 nH  
EQUATION Lb=0.1 nH  
EQUATION Lc=0.8 nH  
EQUATION Ld=0.6 nH  
EQUATION Rb=0.1 OH  
EQUATION Ca=0.15 pF  
EQUATION Cb=0.15 pF  
R=0.1 OH  
LOSSYL  
L=Lb  
R=Rb  
L
LOSSYL  
L
LOSSYL  
L=Lb  
SOURCE  
GATE_IN  
SOURCE  
L=Lb  
R=Rb  
L=La .5  
*
L=Lc  
R=Rb  
D
S
C=Cb  
C
C=Ca  
C
G
L
L
LOSSYL  
LOSSYL  
DRAIN_OUT  
L=Lb  
R=Rb  
L=Lb  
R=Rb  
L=Ld  
L=La  
This model can be used as a  
the measured data in this data  
sheet. For future improvements  
Agilent reserves the right to  
change these models without  
prior notice.  
design tool. It has been tested on  
MDS for various specifications.  
However, for more precise and  
accurate design, please refer to  
ATF-35143 Die Model  
STATZ MESFET MODEL  
*
*
MODEL = FET  
IDS model  
NFET=yes  
PFET=  
IDSMOD=3  
VTO=–0.95  
BETA= Beta  
LAMBDA=0.09  
ALPHA=4.0  
B=0.8  
Gate model  
DELTA=.2  
GSCAP=3  
CGS=cgs pF  
GDCAP=3  
GCD=Cgd pF  
Parasitics  
Breakdown  
GSFWD=1  
GSREV=0  
GDFWD=1  
GDREV=0  
VJR=1  
IS=1 nA  
IR=1 nA  
IMAX=.1  
XTI=  
Noise  
FNC=01e+6  
R=.17  
P=.65  
C=.2  
RG=1  
RD=Rd  
RS=Rs  
LG=Lg nH  
LD=Ld nH  
LS=Ls nH  
CDS=Cds pF  
CRF=.1  
TNOM=27  
IDSTC=  
VBI=.7  
RC=Rc  
N=  
EG=  
Model scal factors (W=FET width in microns)  
EQUATION Cds=0.01 W/200  
EQUATION Beta=0.06 W/200  
*
EQUATION Rd=200/W  
D
*
NFETMESFET  
EQUATION Rs=.5 200/W  
*
EQUATION Cgs=0.2 W/200  
*
G
MODEL=FET  
EQUATION Cgd=0.04 W/200  
*
EQUATION Lg=0.03 200/W  
*
S
S
EQUATION Ld=0.03 200/W  
*
EQUATION Ls=0.01 200/W  
*
W=400 µm  
EQUATION Rc=500 200/W  
*
17  
Part Number Ordering Information  
No. of  
Part Number  
ATF-35143-TR1  
ATF-35143-TR2  
ATF-35143-BLK  
Devices  
Container  
7" Reel  
3000  
10000  
100  
13" Reel  
antistatic bag  
Package Dimensions  
Outline 43 (SOT-343/SC-70 4 lead)  
1.30 (0.051)  
BSC  
1.30 (.051) REF  
2.60 (.102)  
E
1.30 (.051)  
E1  
0.85 (.033)  
0.55 (.021) TYP  
1.15 (.045) BSC  
e
1.15 (.045) REF  
D
h
A
A1  
b TYP  
C TYP  
L
θ
DIMENSIONS  
SYMBOL  
MIN.  
MAX.  
A
A1  
b
0.80 (0.031)  
0 (0)  
1.00 (0.039)  
0.10 (0.004)  
0.35 (0.014)  
0.20 (0.008)  
2.10 (0.083)  
2.20 (0.087)  
0.65 (0.025)  
0.25 (0.010)  
0.10 (0.004)  
1.90 (0.075)  
2.00 (0.079)  
0.55 (0.022)  
C
D
E
e
h
0.450 TYP (0.018)  
E1  
L
1.15 (0.045)  
0.10 (0.004)  
0
1.35 (0.053)  
0.35 (0.014)  
10  
θ
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
18  
Device Orientation  
REEL  
TOP VIEW  
4 mm  
END VIEW  
CARRIER  
TAPE  
8 mm  
5PX  
5PX  
5PX  
5PX  
USER  
FEED  
DIRECTION  
COVER TAPE  
Tape Dimensions  
For Outline 4T  
P
P
D
2
P
0
E
F
W
C
D
1
t
(CARRIER TAPE THICKNESS)  
T (COVER TAPE THICKNESS)  
t
1
K
8° MAX.  
5° MAX.  
0
A
B
0
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
D
2.24 0.10  
2.34 0.10  
1.22 0.10  
4.00 0.10  
1.00 + 0.25  
0.088 0.004  
0.092 0.004  
0.048 0.004  
0.157 0.004  
0.039 + 0.010  
0
0
0
BOTTOM HOLE DIAMETER  
1
0
PERFORATION  
DIAMETER  
PITCH  
POSITION  
D
P
E
1.55 0.05  
4.00 0.10  
1.75 0.10  
0.061 0.002  
0.157 0.004  
0.069 0.004  
CARRIER TAPE WIDTH  
THICKNESS  
W
8.00 0.30  
0.315 0.012  
t
0.255 0.013 0.010 0.0005  
5.4 0.10 0.205 0.004  
0.062 0.001 0.0025 0.00004  
1
COVER TAPE  
WIDTH  
C
TAPE THICKNESS  
T
t
DISTANCE  
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2
2.00 0.05  
0.079 0.002  
www.agilent.com/semiconductors  
For product information and a complete list of  
distributors, please go to our web site.  
For technical assistance call:  
Americas/Canada: +1 (800) 235-0312 or  
(408) 654-8675  
Europe: +49 (0) 6441 92460  
China: 10800 650 0017  
Hong Kong: (+65) 6271 2451  
India, Australia, New Zealand: (+65) 6271 2394  
Japan: (+81 3) 3335-8152(Domestic/International), or  
0120-61-1280(Domestic Only)  
Korea: (+65) 6271 2194  
Malaysia, Singapore: (+65) 6271 2054  
Taiwan: (+65) 6271 2654  
Data subject to change.  
Copyright © 2002 Agilent Technologies, Inc.  
Obsoletes 5968-7826EN  
September 20, 2002  
5988-7943EN  

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