BU2527AF/B [ETC]
TRANSISTOR ISOLATED SOT199 ; 晶体管绝缘SOT199\n
| 型号： | BU2527AF/B |
| 厂家： | 
ETC |
| 描述： | TRANSISTOR ISOLATED SOT199
|
| 文件： | 总7页 (文件大小：57K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2527AF
GENERAL DESCRIPTION
New generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in
horizontal deflection circuits of high resolution monitors. Features improved RBSOA performance and is suitable for
operation up to 64 kHz.
QUICK REFERENCE DATA
SYMBOL PARAMETER
CONDITIONS
TYP. MAX. UNIT
VCESM
VCEO
IC
Collector-emitter voltage peak value
VBE = 0 V
-
1500
800
12
V
V
Collector-emitter voltage (open base)
Collector current (DC)
-
-
-
A
ICM
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
Collector saturation current
Storage time
30
A
Ptot
T
hs ≤ 25 ˚C
-
45
W
V
VCEsat
ICsat
ts
IC = 6.0 A; IB = 1.2 A
-
5.0
-
6.0
1.7
A
ICsat = 6.0 A; IB(end) = 0.55 A
2.0
µs
PINNING - SOT199
PIN CONFIGURATION
SYMBOL
PIN
1
DESCRIPTION
c
case
base
2
collector
emitter
b
3
case isolated
1
2
3
e
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN. MAX. UNIT
VCESM
VCEO
IC
Collector-emitter voltage peak value
VBE = 0 V
-
1500
800
12
V
V
Collector-emitter voltage (open base)
Collector current (DC)
-
-
A
ICM
Collector current peak value
Base current (DC)
-
30
A
IB
IBM
-IB(AV)
-IBM
Ptot
Tstg
Tj
-
8
12
A
Base current peak value
Reverse base current
-
A
average over any 20 ms period
-
200
7
mA
A
Reverse base current peak value 1
Total power dissipation
Storage temperature
-
-
Ths ≤ 25 ˚C
45
W
˚C
˚C
-65
-
150
150
Junction temperature
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
TYP. MAX. UNIT
Rth j-hs
Rth j-hs
Rth j-a
Junction to heatsink
Junction to heatsink
Junction to ambient
without heatsink compound
with heatsink compound
in free air
-
-
3.7
2.8
-
K/W
K/W
K/W
35
1 Turn-off current.
September 1997
1
Rev 1.200
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2527AF
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Visol
Cisol
Repetitive peak voltage from all R.H. ≤ 65 % ; clean and dustfree
-
2500
V
three terminals to external
heatsink
Capacitance from T2 to external f = 1 MHz
heatsink
-
22
-
pF
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
ICES
ICES
Collector cut-off current 2
VBE = 0 V; VCE = VCESMmax
VBE = 0 V; VCE = VCESMmax
Tj = 125 ˚C
-
-
-
-
0.25
2.0
mA
mA
;
IEBO
BVEBO
VCEOsust
Emitter cut-off current
Emitter-base breakdown voltage
VEB = 7.5 V; IC = 0 A
IB = 1 mA
-
-
13.5
-
0.25
-
-
mA
V
V
7.5
800
Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA;
L = 25 mH
VCEsat
VBEsat
hFE
Collector-emitter saturation voltage IC = 6.0 A; IB = 1.2 A
-
-
-
-
10
7
5.0
1.3
-
V
V
Base-emitter saturation voltage
DC current gain
IC = 6.0 A; IB = 1.2 A
IC = 1 A; VCE = 5 V
IC = 6 A; VCE = 5 V
-
hFE
5
9
DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
TYP. MAX. UNIT
Cc
Collector capacitance
IE = 0 A; VCB = 10 V; f = 1 MHz
145
-
pF
Switching times (64 kHz line
deflection circuit)
ICsat = 6.0 A; LC = 170 µH;
Cfb = 5.4 nF; IB(end) = 0.55 A;
LB = 0.6 µH; -VBB = 2 V;
(-dIB/dt = 3.33 A/µs)
ts
tf
Turn-off storage time
Turn-off fall time
1.7
0.1
2.0
0.2
µs
µs
2 Measured with half sine-wave voltage (curve tracer).
September 1997
2
Rev 1.200
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2527AF
ICsat
90 %
+ 50v
100-200R
IC
IB
10 %
Horizontal
tf
t
Oscilloscope
ts
IBend
Vertical
1R
t
100R
6V
30-60 Hz
- IBM
Fig.1. Test circuit for VCEOsust
.
Fig.4. Switching times definitions.
IC / mA
+ 150 v nominal
adjust for ICsat
Lc
250
200
LB
T.U.T.
IBend
-VBB
100
0
Cfb
min
VCE / V
VCEOsust
Fig.2. Oscilloscope display for VCEOsust
.
Fig.5. Switching times test circuit.
ICsat
VCC
TRANSISTOR
I
C
B
DIODE
t
t
LC
I
I
end
B
VCL
IBend
-VBB
LB
5 us
6.5 us
16 us
CFB
T.U.T.
V
CE
t
Fig.6. Test Circuit RBSOA. VCC = 140 V; -VBB = 4 V;
LC = 100 - 200 µH; VCL ≤ 1500 V; LB = 3 µH;
CFB = 1 - 2.2 nF; IB(end) = 1 - 2 A
Fig.3. Switching times waveforms.
September 1997
3
Rev 1.200
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2527AF
hFE
VBESAT / V
100
1.2
1.1
1
Tj = 85 C
Tj = 85 C
Tj = 25 C
Tj = -40 C
Tj = 25 C
10
0.9
0.8
0.7
0.6
IC =
7A
6A
5A
1
0.01
0.1
1
10
100
0
0.2 0.4 0.6 0.8
1
IB / A
1.2 1.4 1.6 1.8
2
IC / A
Fig.7. Typical DC current gain. hFE = f (IC)
VCE = 5 V
Fig.10. Typical base-emitter saturation voltage.
VBEsat = f (IB); parameter IC
Poff / W
VBESAT / V
100
10
1
1.2
1.1
1
Tj = 85 C
Tj = 25 C
IC =
0.9
0.8
0.7
0.6
0.5
0.4
6A
5A
IC/IB =
3
5
0.1
1
IC / A
10
0
0.2 0.4 0.6 0.8
1
IB / A
1.2 1.4 1.6 1.8
2
Fig.8. Typical base-emitter saturation voltage.
VBEsat = f (IC); parameter IC/IB
Fig.11. Typical turn-off losses. Tj = 85˚C
Poff = f (IB); parameter IC; f = 64 kHz
ts, tf / us
VCESAT / V
4
3.5
3
10
1
Tj = 85 C
Tj = 25 C
2.5
2
IC/IB = 5
IC =
6A
3
1.5
1
0.1
0.01
5A
0.5
0
0.1
1
10
100
0
0.2 0.4 0.6 0.8
1
IB / A
1.2 1.4 1.6 1.8
2
IC / A
Fig.9. Typical collector-emitter saturation voltage.
VCEsat = f (IC); parameter IC/IB
Fig.12. Typical collector storage and fall time.
ts = f (IB); tf = f (IB); parameter IC; Tj = 85˚C; f = 64 kHz
September 1997
4
Rev 1.200
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2527AF
Normalised Power Derating
PD%
120
IC / A
with heatsink compound
110
100
100
90
80
70
60
50
40
30
20
10
0
tp =
= 0.01
ICM
40 us
ICDC
10
100 us
0
20
40
60
80
Ths /
100
120
140
C
Ptot
Fig.13. Normalised power dissipation.
PD% = 100 PD/PD 25˚C = f (Ths)
1
1 ms
Zth / (K/W)
0.5
10
1
0.1
0.2
0.1
0.05
10 ms
DC
0.1
0.02
t
T
p
t
p
P
D =
D
0.01
0.001
0.01
t
D = 0
VCE / V
1000
T
1
10
100
1E-06
1E-04
1E-02
t / s
1E+00
Fig.15. Forward bias safe operating area. Ths = 25 ˚C
ICDC & ICM = f(VCE); ICM single pulse; parameter tp
Second-breakdown limits independant of temperature.
Mounted with heatsink compound.
Fig.14. Transient thermal impedance.
Zth j-hs = f(t); parameter D = tp/T
IC / A
30
20
10
0
0
500
1000
1500
VCE / V
Fig.16. Reverse bias safe operating area. Tj ≤ Tjmax
September 1997
5
Rev 1.200
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2527AF
MECHANICAL DATA
Dimensions in mm
15.3 max
5.2 max
Net Mass: 5.5 g
3.1
3.3
0.7
7.3
3.2
o
45
6.2
5.8
21.5
max
seating
plane
3.5 max
not tinned
3.5
15.7
min
1
2
3
1.2
1.0
0.7 max
2.0
2.1 max
M
0.4
5.45
5.45
Fig.17. SOT199; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
September 1997
6
Rev 1.200
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU2527AF
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1997
7
Rev 1.200
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