DMP1096UCB4-7 [DIODES]

Small Signal Field-Effect Transistor, 2.4A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, WL-CSP1010H6-4, 4 PIN;
DMP1096UCB4-7
型号: DMP1096UCB4-7
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Small Signal Field-Effect Transistor, 2.4A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, WL-CSP1010H6-4, 4 PIN

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DMP1096UCB4  
P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary (Typ. @ VGS = -4.5V, TA = +25°C)  
Features  
LD-MOS Technology with the Lowest Figure of Merit:  
RDS(on) = 85mto Minimize On-State Losses  
Qg = 3.7nC for Ultra-Fast Switching  
VDSS  
RDS(on)  
Qg  
Qgd  
ID  
-12V  
85mΩ  
3.7nC  
0.6nC  
-2.6A  
Vgs(th) = -0.6V typ. for a Low Turn-On Potential  
CSP with Footprint 1.0mm × 1.0mm  
Description  
Height = 0.62mm for Low Profile  
This new generation MOSFET is designed to minimize the on-state  
resistance (RDS(on)) and yet maintain superior switching performance,  
making it ideal for high efficiency power management applications.  
ESD = 3kV HBM Protection of Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Applications  
Mechanical Data  
Battery Management  
Load Switch  
Case: U-WLB1010-4  
Battery Protection  
Terminal Connections: See Diagram Below  
Weight: 0.005 grams (Approximate)  
U-WLB1010-4  
D
G
D
S
ESD PROTECTED TO 3kV  
Top View  
Equivalent Circuit  
Ordering Information (Note 3)  
Part Number  
Case  
Packaging  
DMP1096UCB4-7  
U-WLB1010-4  
3000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
1W = Product Type Marking Code  
YM = Date Code Marking  
BW = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: X = 2010)  
Y = Year (ex: X = 2010)  
M = Month (ex: 9 = September)  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2010  
2011  
2012  
2013  
2014  
2015  
2016  
2017  
2018  
Code  
X
Y
Z
A
B
C
D
E
F
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
www.diodes.com  
May 2015  
© Diodes Incorporated  
DMP1096UCB4  
Document number: DS31954 Rev. 8 - 2  
DMP1096UCB4  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-12  
-5  
Unit  
V
Gate-Source Voltage  
V
VGSS  
Steady  
Continuous Drain Current (Note 5) VGS = -4.5V  
State  
TA = +25°C  
TA = +70°C  
TA = +25°C  
TA = +70°C  
-2.6  
-2.1  
A
ID  
Steady  
Continuous Drain Current (Note 5) VGS = -2.5V  
State  
-2.4  
-1.9  
A
A
ID  
Pulsed Drain Current (Note 6)  
-10  
IDM  
Thermal Characteristics  
Characteristic  
Power Dissipation (Note 5)  
Symbol  
PD  
Value  
0.82  
Unit  
W
150  
°C/W  
°C  
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5)  
Operating and Storage Temperature Range  
RθJA  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-12  
-
-
-
-
-
-
V
V
BVDSS  
BVGSS  
IDSS  
VGS = 0V, ID = -250μA  
VDS = 0V, IG = -250μA  
VDS = -9.6V, VGS = 0V  
VGS = -5V, VDS = 0V  
Gate-Source Breakdown Voltage  
Zero Gate Voltage Drain Current TJ = +25°C  
Gate-Source Leakage  
-6.0  
-
-
-1  
A  
nA  
-500  
IGSS  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
-0.4  
-0.6  
85  
-1.0  
102  
116  
152  
-
V
VGS(th)  
VDS = VGS, ID = -250μA  
VGS = -4.5V, ID = -500mA  
VGS = -2.5V, ID = -500mA  
VGS = -1.5V, ID = -500mA  
VDS = -6V, ID = -500mA  
VGS = 0V, IS = -500mA  
-
-
-
-
mΩ  
Static Drain-Source On-Resistance  
97  
RDS (ON)  
127  
4
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
S
V
|Yfs|  
VSD  
-0.6  
-1.0  
-
-
-
-
-
-
-
-
-
-
-
251  
359  
70  
-
-
-
-
-
-
-
-
-
-
-
Ciss  
Coss  
Crss  
Qg  
VDS = -6V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
nC  
Reverse Transfer Capacitance  
Total Gate Charge  
3.7  
0.4  
Gate-Source Charge  
Gate-Drain Charge  
Qgs  
Qgd  
Qg(th)  
tD(on)  
tr  
VGS = -4.5V, VDS = -6V,  
ID = -500mA  
0.6  
0.2  
Gate Charge at Vth  
17.6  
26.9  
37.5  
32.3  
Turn-On Delay Time  
Turn-On Rise Time  
VDS = -6V, VGS = -2.5V,  
RG = 20Ω, ID = -500mA  
ns  
Turn-Off Delay Time  
tD(off)  
tf  
Turn-Off Fall Time  
Notes:  
5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.  
6. Repetitive rating, pulse width limited by junction temperature.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to production testing.  
2 of 6  
www.diodes.com  
May 2015  
© Diodes Incorporated  
DMP1096UCB4  
Document number: DS31954 Rev. 8 - 2  
DMP1096UCB4  
5
4
5.0  
4.0  
V
= -4.5V  
GS  
V
= -5V  
DS  
V
= -3.0V  
GS  
V
= -2.5V  
GS  
V
= -2.0V  
3
2
3.0  
2.0  
GS  
V
= -1.5V  
GS  
T
= 150°C  
1
0
A
1.0  
0
T
A
= 85°C  
T
= 125°C  
A
A
T
= 25°C  
V
= -1.2V  
GS  
T
= -55°C  
A
0
0.3  
0.6  
0.9  
1.2  
1.5  
0
0.5  
1.0  
1.5  
2.0  
2.5  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
-VGS, GATE-SOURCE VOLTAGE (V)  
Fig. 2 Typical Transfer Characteristic  
Fig. 1 Typical Output Characteristic  
0.20  
0.18  
0.14  
0.12  
0.10  
V
= -4.5V  
GS  
0.16  
0.14  
0.12  
T
T
= 150°C  
A
V
= -2.5V  
= -4.5V  
= 125°C  
= 85°C  
GS  
A
0.10  
0.08  
T
A
V
GS  
T
= 25°C  
A
0.06  
0.04  
0.08  
0.06  
T
= -55°C  
A
0.02  
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
-ID, DRAIN CURRENT (A)  
Fig. 4 Typical On-Resistance  
vs. Drain Current and Temperature  
-ID, DRAIN-SOURCE CURRENT (A)  
Fig. 3 Typical On-Resistance  
vs. Drain Current and Gate Voltage  
1.6  
1.4  
0.16  
0.14  
0.12  
0.10  
0.08  
V
= -2.5V  
GS  
V
= -2.5V  
GS  
1.2  
1.0  
I
= -0.5A  
D
I
= -0.5A  
D
V
= -4.5V  
= -1.0A  
GS  
I
D
V
= -4.5V  
GS  
= -1.0A  
I
D
0.8  
0.6  
0.06  
0.04  
-50 -25  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 5 On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 6 On-Resistance Variation with Temperature  
3 of 6  
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May 2015  
© Diodes Incorporated  
DMP1096UCB4  
Document number: DS31954 Rev. 8 - 2  
DMP1096UCB4  
1.2  
1.0  
5
4
0.8  
0.6  
T
= 25°C  
3
2
A
I
= -1mA  
D
I
= -250µA  
D
0.4  
0.2  
0
1
0
-50 -25  
TA, AMBIENT TEMPERATURE (°C)  
Fig. 7 Gate Threshold Variation vs. Ambient Temperature  
0
25  
50  
75 100 125 150  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2 1.4  
-VSD, SOURCE-DRAIN VOLTAGE (V)  
Fig. 8 Diode Forward Voltage vs. Current  
10,000  
1,000  
100  
f = 1MHz  
T
= 150°C  
= 125°C  
A
1,000  
T
A
10  
1
C
iss  
T
= 85°C  
= 25°C  
A
C
oss  
100  
10  
C
T
rss  
A
0.1  
0.01  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
-VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 9 Typical Total Capacitance  
Fig. 10 Typical Leakage Current vs. Drain-Source Voltage  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
D = 0.02  
R
(t) = r(t) * R  
JA  
JA  
R
= 150°C/W  
JA  
0.01  
P(pk)  
T
D = 0.01  
t
1
t
2
D = 0.005  
- T = P * R (t)  
J
A
JA  
Duty Cycle, D = t /t  
1
2
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t1, PULSE DURATION TIME (s)  
Fig. 11 Transient Thermal Response  
4 of 6  
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May 2015  
© Diodes Incorporated  
DMP1096UCB4  
Document number: DS31954 Rev. 8 - 2  
DMP1096UCB4  
Package Outline Dimensions  
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.  
E
U-WLB1010-4  
Dim  
D
E
A
A2  
b
e
SD  
SE  
Min  
0.95  
0.95  
  
0.25  
Max  
1.05  
1.05  
0.62  
0.35  
Typ  
1.00  
1.00  
0.38  
0.30  
0.50  
0.25  
0.25  
D
A2  
A
e
4X-Ø b  
SD  
All Dimensions in mm  
SE  
e
Suggested Pad Layout  
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.  
ØD  
Dimensions  
Value (in mm)  
0.50  
C
C
D
0.25  
C
5 of 6  
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May 2015  
© Diodes Incorporated  
DMP1096UCB4  
Document number: DS31954 Rev. 8 - 2  
DMP1096UCB4  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
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all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
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Copyright © 2015, Diodes Incorporated  
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May 2015  
© Diodes Incorporated  
DMP1096UCB4  
Document number: DS31954 Rev. 8 - 2  

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