DMN3051L [DIODES]

N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR; N沟道增强型网络场效晶体管
DMN3051L
型号: DMN3051L
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总4页 (文件大小:198K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DMN3051L  
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR  
Please click here to visit our online spice models database.  
Features  
Mechanical Data  
Low On-Resistance:  
RDS(ON) < 38m@ VGS = 10V, ID = 5.8A  
DS(ON) < 64m@ VGS = 4.5V, ID = 5.0A  
Case: SOT-23  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
R
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminals: Finish – Matte Tin annealed over Copper  
leadframe. Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Marking Information: See Page 3  
Ordering Information: See Page 3  
Weight: 0.008 grams (approximate)  
Low Gate Threshold Voltage  
Low Input Capacitance  
Fast Switching Speed  
Low Input/Output Leakage  
Lead Free By Design/RoHS Compliant (Note 2)  
"Green" Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Drain  
SOT-23  
D
Gate  
S
G
Source  
TOP VIEW  
TOP VIEW  
Equivalent Circuit  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Drain Source Voltage  
Symbol  
VDSS  
Value  
30  
Unit  
V
Gate-Source Voltage  
V
VGSS  
±20  
Drain Current (Note 1)  
TA = 25°C  
TA = 70°C  
Pulsed  
5.8  
4.9  
A
ID  
Drain Current (Note 1)  
Body-Diode Continuous Current (Note 1)  
20  
2.0  
A
A
IDM  
IS  
Thermal Characteristics  
Characteristic  
Symbol  
Value  
1.4  
Unit  
W
Total Power Dissipation (Note 1)  
PD  
90  
°C/W  
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 1)  
Operating and Storage Temperature Range  
Rθ  
JA  
-55 to +150  
°C  
T
J, TSTG  
Electrical Characteristics @TA = 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 4)  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
30  
V
BVDSS  
IDSS  
800  
VGS = 0V, ID = 250μA  
VDS = 28V, VGS = 0V  
nA  
±80  
±800  
VGS = ±12V, VDS = 0V  
VGS = ±20V, VDS = 0V  
Gate-Body Leakage  
nA  
IGSS  
ON CHARACTERISTICS (Note 4)  
Gate Threshold Voltage  
1.3  
1.9  
2.2  
V
VGS(th)  
VDS = VGS, ID = 250μA  
33  
54  
V
V
GS = 10V, ID = 5.8A  
GS = 4.5V, ID = 5.0A  
38  
64  
Static Drain-Source On-Resistance  
RDS (ON)  
mΩ  
Forward Transconductance  
Source-Drain Diode Forward Voltage  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
5
S
V
|Yfs|  
VSD  
1.16  
VDS = 5V, ID = 3.1A  
VGS = 0V, IS = 2.0A  
0.78  
424  
115  
81  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
V
DS = 5V, VGS = 0V  
Output Capacitance  
f = 1.0MHz  
Reverse Transfer Capacitance  
Notes:  
1. Device mounted on FR-4 PCB. t 5 sec.  
2. No purposefully added lead.  
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.  
4. Short duration pulse test used to minimize self-heating effect.  
1 of 4  
www.diodes.com  
June 2008  
© Diodes Incorporated  
DMN3051L  
Document number: DS31347 Rev. 3 - 2  
DMN3051L  
9.0  
8.0  
6
5
V
= 10V  
GS  
V
= 4.5V  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
GS  
V
= 5V  
DS  
4
3
2
T
= 150°C  
A
T
= 125°C  
A
T
= 85°C  
A
1
0
V
= 3.0V  
GS  
T
= 25°C  
V
= 2.5V  
= 1.8V  
A
GS  
1.0  
0
T
= -55°C  
V
A
GS  
0
0.5  
1
1.5  
2
2.5  
3
1.5  
2.5  
3.5  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 1 Typical Output Characteristics  
VGS, GATE SOURCE VOLTAGE (V)  
Fig. 2 Typical Transfer Characteristics  
0.1  
0.10  
0.09  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
T
= 150°C  
= 125°C  
A
0.08  
0.07  
0.06  
0.05  
T
A
T
= 85°C  
= 25°C  
A
V
= 4.5V  
= 10V  
GS  
T
A
V
GS  
0.02  
0.01  
0
T
= -55°C  
A
0.04  
0.03  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
ID, DRAIN CURRENT (A)  
ID, DRAIN CURRENT (A)  
Fig. 4 Typical Drain-Source On-Resistance  
vs. Drain Current and Temperature  
Fig. 3 Typical On-Resistance  
vs. Drain Current and Gate Voltage  
1.6  
1.5  
1.4  
V
I
= 10V  
GS  
C
iss  
= 5.8A  
D
1.3  
1.2  
V
= 4.5V  
= 5A  
GS  
I
D
1.1  
1.0  
0.9  
C
oss  
C
rss  
0.8  
0.7  
0.6  
-50 -25  
0
25  
50  
75 100 125 150  
0
5
10  
15  
20  
25  
30  
TJ, JUNCTION TEMPERATURE (°C)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Fig. 6 Typical Capacitance  
Fig. 5 On-Resistance Variation with Temperature  
2 of 4  
www.diodes.com  
June 2008  
© Diodes Incorporated  
DMN3051L  
Document number: DS31347 Rev. 3 - 2  
DMN3051L  
10  
1
3
I
= 250µA  
2.5  
D
T
= 150°C  
A
2
1.5  
1
T
= 125°C  
A
0.1  
T
= 85°C  
A
T
= 25°C  
A
0.01  
T
= -55°C  
A
0.001  
0.5  
0
0.0001  
0.1  
0.3  
0.5  
0.7  
0.9  
1.1  
-50 -25  
0
25  
50  
75 100 125 150  
TA, AMBIENT TEMPERATURE (°C)  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Fig. 7 Gate Threshold Variation vs. Ambient Temperature  
Fig. 8 Diode Forward Voltage vs. Current  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
D = 0.02  
R
(t) = r(t) * R  
θJA  
θJA  
R
= 105°C/W  
θJA  
0.01  
P(pk)  
T
D = 0.01  
t
1
t
D = 0.005  
2
- T = P * R (t)  
J
A
θJA  
Duty Cycle, D = t /t  
1
2
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t1, PULSE DURATION TIME (s)  
Fig. 9 Transient Thermal Response  
Ordering Information (Note 5)  
Part Number  
Case  
Packaging  
DMN3051L-7  
SOT-23  
3000/Tape & Reel  
Notes:  
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.  
Marking Information  
3N5 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year ex: U = 2007  
3N5  
M = Month ex: 9 = September  
Date Code Key  
Year  
2007  
2008  
2009  
2010  
2011  
2012  
2013  
2014  
2015  
Code  
U
V
W
X
Y
Z
A
B
C
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
3 of 4  
www.diodes.com  
June 2008  
© Diodes Incorporated  
DMN3051L  
Document number: DS31347 Rev. 3 - 2  
DMN3051L  
Package Outline Dimensions  
A
SOT-23  
Min  
Dim  
A
B
C
D
F
G
H
J
Max  
0.51  
1.40  
2.50  
1.03  
0.60  
2.05  
3.00  
0.10  
1.10  
0.61  
0.180  
8°  
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
0.013  
0.903  
0.45  
0.085  
0°  
C
B
G
H
K
J
M
K
L
M
L
F
D
α
All Dimensions in mm  
Suggested Pad Layout  
Y
Dimensions Value (in mm)  
Z
X
Y
C
E
2.9  
0.8  
0.9  
2.0  
1.35  
Z
C
E
X
IMPORTANT NOTICE  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product  
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall  
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,  
harmless against all damages.  
LIFE SUPPORT  
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written  
approval of the President of Diodes Incorporated.  
4 of 4  
www.diodes.com  
June 2008  
© Diodes Incorporated  
DMN3051L  
Document number: DS31347 Rev. 3 - 2  

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