1SS400C2 [CYSTEKEC]
High Speed Switching diode; 高速开关二极管
| 型号： | 1SS400C2 |
| 厂家： | 
CYSTECH ELECTONICS CORP. |
| 描述： | High Speed Switching diode |
| 文件： | 总3页 (文件大小：163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : C303C2
Issued Date : 2004.02.11
Revised Date :
CYStech Electronics Corp.
Page No. : 1/3
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Features
•Extremely small surface mounting type.(SC-79/SOD523)
•High speed switching applications
•Low reverse current
Symbol
Outline
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature Tstg .................................................................................................... -55~+150°C
Junction Temperature Tj .............................................................................................................. +150°C
• Maximum Voltages and Currents (Ta=25°C)
DC Reverse Voltage VR .................................................................................................................... 100 V
Mean Rectifying Current IF ........................................................................................……….. 200mA
Peak Forward Surge Current IFSM………………………………….. ………………………………………. 500mA
• Thermal Characteristics
Total Device Dissipation @ TA=25°C (Note) PD……………………………………………….200mW
Thermal Resistance, Junction to Ambient
RθJA……………………………………………625°C/W
Note: FR-5 board minimum pad.
1SS400C2
CYStek Product Specification
Spec. No. : C303C2
Issued Date : 2004.02.11
Revised Date :
CYStech Electronics Corp.
Page No. : 2/3
Characteristics (Ta=25°C)
Characteristic
Forward Voltage
Reverse Leakage Current
Diode Capacitance
Reverse Recovery Time
Symbol
VF
Condition
IF=100mA
VR=80V
VR=0.5V, f=1MHz
IF=IR=10mA
Min.
Max.
1.2
0.1
3
Unit
-
-
-
-
V
µA
pF
ns
IR
CD
trr
4
Characteristic Curves
Forward Current vs Forward Voltage
Forward Current Derating Curve
100
10
1
120
100
80
60
40
20
0
Mounting on glass
epoxy PCBs
8
5℃
25℃
- 40℃
0.1
0.2
0
25
50
75
100 125 150 175 200
0.4
0.6
0.8
1
1.2
Forward Voltage---VF(V)
(℃)
Ambient Temperature---TA
Reverse Leakage Current vs Reverse Voltage
Capacitance vs Reverse Voltage
0.68
0.64
0.6
10
f=1MHz
Ta=25℃
Ta=
125℃
1
0.1
Ta= 8
5℃
0.56
0.01
0.001
Ta=
25℃
0.52
0
2
4
6
8
0
10
20
30
40
50
Reverse Voltage---VR(V)
Reverse Voltage---V (V)
R
1SS400C2
CYStek Product Specification
Spec. No. : C303C2
Issued Date : 2004.02.11
Revised Date :
CYStech Electronics Corp.
Page No. : 3/3
SOD-523 Dimension
Marking Code :
1
2
A
Style : Pin 1. Cathode 2. Anode
1
2
2-lead SOD-523 Plastic Package
CYStek Package Code : C2
*: Typical
Millimeters
Millimeters
DIM
DIM
Min
0.5
.Max.
0.7
Min.
0.7
Max.
0.9
A
bp
c
E
HE
V
0.25
0.1
0.35
0.2
1.5
1.7
0.15(typ)
D
1.1
1.3
Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
2.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
1SS400C2
CYStek Product Specification
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