CP767V-2N3467 [CENTRAL]

Power Bipolar Transistor,;
CP767V-2N3467
型号: CP767V-2N3467
厂家: CENTRAL SEMICONDUCTOR CORP    CENTRAL SEMICONDUCTOR CORP
描述:

Power Bipolar Transistor,

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CP767V-2N3467  
PNP - General Purpose Transistor Die  
1.0 Amp, 40 Volt  
www.centralsemi.com  
The CP767V-2N3467 is a silicon PNP transistor designed for general purpose switching  
applications.  
MECHANICAL SPECIFICATIONS:  
Die Size  
29.9 x 29.9 MILS  
7.1 MILS  
Die Thickness  
B
Base Bonding Pad Size  
Emitter Bonding Pad Size  
Top Side Metalization  
Back Side Metalization  
Scribe Alley Width  
Wafer Diameter  
3.9 x 4.3 MILS  
7.9 x 3.9 MILS  
Al – 13,000Å  
Au – 9,000Å  
1.97 MILS  
E
5 INCHES  
Gross Die Per Wafer  
18,960  
BACKSIDE COLLECTOR  
R0  
MAXIMUM RATINGS: (T =25°C)  
Collector-Base Voltage  
SYMBOL  
UNITS  
V
A
V
V
V
40  
40  
CBO  
CEO  
EBO  
Collector-Emitter Voltage  
V
V
Emitter-Base Voltage  
5.0  
Continuous Collector Current  
Operating and Storage Junction Temperature  
I
1.0  
A
C
T , T  
-65 to +150  
°C  
J
stg  
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
MAX  
UNITS  
I
I
I
V
V
V
=30V  
100  
nA  
CBO  
CEV  
BEV  
CB  
CE  
CE  
=30V, V =3.0V  
BE  
=30V, V =3.0V  
100  
120  
nA  
nA  
V
BE  
BV  
BV  
BV  
I =10μA  
40  
40  
CBO  
CEO  
C
I =10mA  
V
C
I =10μA  
5.0  
V
EBO  
E
V
V
V
V
V
V
I =150mA, I =15mA  
0.3  
0.5  
1.0  
1.0  
1.2  
1.6  
V
CE(SAT)  
CE(SAT)  
CE(SAT)  
BE(SAT)  
BE(SAT)  
BE(SAT)  
FE  
C
B
I =500mA, I =50mA  
V
C
B
I =1.0A, I =100mA  
V
C
B
I =150mA, I =15mA  
V
C
B
I =500mA, I =50mA  
0.8  
V
C
B
I =1.0A, I =100mA  
V
C
B
h
h
h
V
=1.0V, I =150mA  
40  
40  
40  
CE  
CE  
CE  
C
V
V
=1.0V, I =500mA  
120  
FE  
C
=5.0V, I =1.0A  
FE  
C
R0 (11-September 2019)  
CP767V-2N3467  
PNP - General Purpose Transistor Die  
1.0 Amp, 40 Volt  
www.centralsemi.com  
ELECTRICAL CHARACTERISTICS - Continued: (T =25°C unless otherwise noted)  
A
SYMBOL TEST CONDITIONS  
MIN  
MAX  
UNITS  
f
V
V
V
V
V
V
=10V, I =50mA, f=100MHz  
175  
MHz  
T
CE  
CB  
EB  
CC  
CC  
CC  
C
C
=10V, I =0, f=100kHz  
25  
100  
40  
pF  
pF  
ns  
ns  
nC  
ob  
ib  
E
C
=0.5V, I =0, f=100kHz  
C
t
t
=30V, V =2.0V, I =500mA, I =50mA  
on  
BE B1  
C
=30V, I =500mA, I =I =50mA  
90  
off  
C
B1 B2  
Q
=30V, I =500mA, I =50mA  
6.0  
T
C
B
R0 (11-September 2019)  
CP767V-2N3467  
Typical Electrical Characteristics  
www.centralsemi.com  
R0 (11-September 2019)  
BARE DIE PACKING OPTIONS  
BARE DIE IN TRAY (WAFFLE) PACK  
CT: Singulated die in tray (waffle) pack.  
(example: CP211-PART NUMBER-CT)  
CM: Singulated die in tray (waffle) pack 100% visually inspected as  
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).  
(example: CP211-PART NUMBER-CM)  
UNSAWN WAFER  
WN: Full wafer, unsawn, 100% tested with reject die inked.  
(example: CP211-PART NUMBER-WN)  
SAWN WAFER ON PLASTIC RING  
WR: Full wafer, sawn and mounted on plastic ring,  
100% tested with reject die inked.  
(example: CP211-PART NUMBER-WR)  
Please note: Sawn Wafer on Metal Frame (WS)  
is possible as a special order. Please contact your  
Central Sales Representative at 631-435-1110.  
Visit the Central website for a complete listing of specifications:  
www.centralsemi.com/bdspecs  
R2 (3-April 2017)  
www.centralsemi.com  
OUTSTANDING SUPPORT AND SUPERIOR SERVICES  
PRODUCT SUPPORT  
Central’s operations team provides the highest level of support to insure product is delivered on-time.  
• Supply management (Customer portals)  
• Inventory bonding  
• Custom bar coding for shipments  
• Custom product packing  
• Consolidated shipping options  
DESIGNER SUPPORT/SERVICES  
Central’s applications engineering team is ready to discuss your design challenges. Just ask.  
• Free quick ship samples (2nd day air)  
• Online technical data and parametric search  
• SPICE models  
• Special wafer diffusions  
• PbSn plating options  
• Package details  
• Custom electrical curves  
• Application notes  
• Environmental regulation compliance  
• Customer specific screening  
• Up-screening capabilities  
• Application and design sample kits  
• Custom product and package development  
REQUESTING PRODUCT PLATING  
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when  
ordering (example: 2N2222A TIN/LEAD).  
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number  
when ordering (example: 2N2222A PBFREE).  
CONTACT US  
Corporate Headquarters & Customer Support Team  
Central Semiconductor Corp.  
145 Adams Avenue  
Worldwide Field Representatives:  
www.centralsemi.com/wwreps  
Hauppauge, NY 11788 USA  
Main Tel: (631) 435-1110  
Main Fax: (631) 435-1824  
Support Team Fax: (631) 435-3388  
www.centralsemi.com  
Worldwide Distributors:  
www.centralsemi.com/wwdistributors  
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,  
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms  
(001)  
www.centralsemi.com  

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