CP327V-CZTA27 [CENTRAL]
Small Signal Bipolar Transistor,;
| 型号： | CP327V-CZTA27 |
| 厂家： | 
CENTRAL SEMICONDUCTOR CORP |
| 描述： | Small Signal Bipolar Transistor, |
| 文件： | 总4页 (文件大小：456K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CP327V-CZTA27
NPN - Darlington Transistor Die
0.5 Amp, 60 Volt
www.centralsemi.com
The CP327V-CZTA27 die is a silicon NPN Darlington power transistor designed for high gain
amplifier applications.
MECHANICAL SPECIFICATIONS:
Die Size
22.8 x 22.8 MILS
7.1 MILS
Die Thickness
Base Bonding Pad Size
Emitter Bonding Pad Size
Top Side Metalization
Back Side Metalization
Scribe Alley Width
Wafer Diameter
4.7 x 4.7 MILS
4.7 x 4.7 MILS
Al-Si – 17,000Å
Au – 9,000Å
1.8 MILS
5 INCHES
Gross Die Per Wafer
33,085
BACKSIDE COLLECTOR
R0
MAXIMUM RATINGS: (T =25°C)
Collector-Emitter Voltage
SYMBOL
UNITS
V
A
V
60
10
CES
Emitter-Base Voltage
V
V
A
EBO
Continuous Collector Current
Operating and Storage Junction Temperature
I
0.5
C
T
T
-65 to +150
°C
J, stg
ELECTRICAL CHARACTERISTICS: (T =25°C unless otherwise noted)
A
SYMBOL
TEST CONDITIONS
MIN
MAX
UNITS
I
I
I
V
V
V
=50V
=50V
=10V
100
nA
CBO
CES
EBO
CB
CE
EB
500
100
nA
nA
V
BV
I =100µA
60
60
CBO
CES
C
BV
I =100µA
V
C
V
V
I =100mA, I =0.1mA
1.5
2.0
V
CE(SAT)
BE(ON)
FE
C
B
V
=5.0V, I =100mA
V
CE
CE
CE
CE
C
h
h
V
V
V
=5.0V, I =10mA
10K
10K
125
C
=5.0V, I =100mA
FE
C
f
=5.0V, I =10mA, f=100MHz
MHz
T
C
R0 (17-January 2020)
CP327V-CZTA27
Typical Electrical Characteristics
www.centralsemi.com
R0 (17-January 2020)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
www.centralsemi.com
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Inventory bonding
• Custom bar coding for shipments
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Online technical data and parametric search
• SPICE models
• Special wafer diffusions
• PbSn plating options
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Customer specific screening
• Up-screening capabilities
• Application and design sample kits
• Custom product and package development
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
(001)
www.centralsemi.com
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