UPC3226TB [CEL]
BIPOLAR ANALOG INTEGRATED CIRCUIT; 双极模拟集成电路
| 型号： | UPC3226TB |
| 厂家： | 
CALIFORNIA EASTERN LABS |
| 描述： | BIPOLAR ANALOG INTEGRATED CIRCUIT |
| 文件： | 总13页 (文件大小：408K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BIPOLAR ANALOG INTEGRATED CIRCUIT
UPC3226TB
5 V, SILICON GERMANIUM MMIC
MEDIUM OUTPUT POWER AMPLIFIER
DESCRIPTION
The µPC3226TB is a silicon germanium (SiGe) monolithic integrated circuit designed as IF amplifier for DBS tuners.
This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.
FEATURES
•
•
Low current
: ICC = 15.5 mA TYP. @ VCC = 5.0 V
: PO (sat) = +13.0 dBm TYP. @ f = 1.0 GHz
: PO (sat) = +9.0 dBm TYP. @ f = 2.2 GHz
: PO (1dB) = +7.5 dBm TYP. @ f = 1.0 GHz
: PO (1dB) = +5.7 dBm TYP. @ f = 2.2 GHz
: GP = 25.0 dB TYP. @ f = 1.0 GHz
: GP = 26.0 dB TYP. @ f = 2.2 GHz
: NF = 5.3 dB TYP. @ f = 1.0 GHz
: NF = 4.9 dB TYP. @ f = 2.2 GHz
: VCC = 4.5 to 5.5 V
Medium output power
•
•
•
High linearity
Power gain
Noise Figure
•
•
Supply voltage
Port impedance
: input/output 50 Ω
APPLICATIONS
•
IF amplifiers in LNB for DBS converters etc.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
C3N
Supplying Form
Embossed tape 8 mm wide.
µPC3226TB-E3
µPC3226TB-E3-A 6-pin super minimold
(Pb-Free) Note
1, 2, 3 pins face the perforation side of the tape.
Qty 3 kpcs/reel.
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, please contact your nearby sales office
Part number for sample order: µPC3226TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PU10558EJ01V0DS (1st edition)
Date Published May 2005 CP(K)
UPC3226TB
PIN CONNECTIONS
Pin No.
Pin Name
INPUT
GND
(Top View)
(Top View)
(Bottom View)
1
2
3
4
5
6
3
2
1
4
5
6
3
2
1
4
5
6
4
5
6
3
2
1
GND
OUTPUT
GND
VCC
PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER
(TA = +25°C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω)
fu
PO (sat)
GP
NF
ICC
Part No.
Package
Marking
(GHz)
(dBm)
(dB)
(dB)
(mA)
µPC2708TB
µPC2709TB
µPC2710TB
µPC2776TB
µPC3223TB
µPC3225TB
µPC3226TB
2.9
2.3
1.0
2.7
3.2
2.8
3.2
+10.0
+11.5
15
23
6.5
5.0
26
25
6-pin super minimold
C1D
C1E
C1F
C2L
C3J
C3M
C3N
+13.5
33
3.5
22
+8.5
23
6.0
25
+12.0
23
4.5
19
+15.5 Note
32.5 Note
3.7 Note
24.5
15.5
+13.0
25
5.3
Note µPC3225TB is f = 0.95 GHz
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
2
Data Sheet PU10558EJ01V0DS
UPC3226TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Symbol
Conditions
Ratings
6.0
Unit
V
VCC
ICC
PD
TA = +25°C
TA = +25°C
TA = +85°C
Total Circuit Current
Power Dissipation
40
mA
mW
°C
Note
270
Operating Ambient Temperature
Storage Temperature
Input Power
TA
−40 to +85
−55 to +150
+10
Tstg
Pin
°C
TA = +25°C
dBm
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Supply Voltage
Operating Ambient Temperature
Symbol
VCC
Conditions
MIN.
4.5
TYP.
5.0
MAX.
Unit
V
5.5
TA
−40
+25
+85
°C
3
Data Sheet PU10558EJ01V0DS
UPC3226TB
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω)
Parameter
Circuit Current
Symbol
ICC
Test Conditions
No input signal
MIN.
12.5
22.0
23.0
23.0
23.0
22.5
22.0
+10.0
+6.0
+5.0
+3.0
−
TYP.
15.5
24.0
25.0
26.0
26.0
25.5
25.0
+13.0
+9.0
+7.5
+5.7
5.3
MAX.
19.5
26.0
27.5
29.0
29.0
29.0
28.5
−
Unit
mA
dB
Power Gain 1
GP1
GP2
GP3
GP4
GP5
GP6
f = 0.1 GHz, Pin = −30 dBm
f = 1.0 GHz, Pin = −30 dBm
f = 1.8 GHz, Pin = −30 dBm
f = 2.2 GHz, Pin = −30 dBm
f = 2.6 GHz, Pin = −30 dBm
f = 3.0 GHz, Pin = −30 dBm
Power Gain 2
Power Gain 3
Power Gain 4
Power Gain 5
Power Gain 6
Saturated Output Power 1
Saturated Output Power 2
PO (sat) 1 f = 1.0 GHz, Pin = −2 dBm
PO (sat) 2 f = 2.2 GHz, Pin = −8 dBm
dBm
dBm
dB
−
Gain 1 dB Compression Output Power 1 PO (1 dB) 1 f = 1.0 GHz
Gain 1 dB Compression Output Power 2 PO (1 dB) 2 f = 2.2 GHz
−
−
Noise Figure 1
NF1
NF2
f = 1.0 GHz
6.0
6.0
−
Noise Figure 2
f = 2.2 GHz
−
4.9
Isolation 1
ISL1
f = 1.0 GHz, Pin = −30 dBm
f = 2.2 GHz, Pin = −30 dBm
f = 1.0 GHz, Pin = −30 dBm
f = 2.2 GHz, Pin = −30 dBm
f = 1.0 GHz, Pin = −30 dBm
f = 2.2 GHz, Pin = −30 dBm
31
34
dB
Isolation 2
ISL2
33
36
−
Input Return Loss 1
Input Return Loss 2
Output Return Loss 1
Output Return Loss 2
Input 3rd Order Distortion Intercept Point 1
RLin1
RLin2
RLout1
RLout2
IIP31
10.0
9.0
14.0
13.0
13.0
13.0
−5.0
−
dB
−
10.0
10.0
−
−
dB
−
f1 = 1 000 MHz, f2 = 1 001 MHz,
−
dBm
Pin = −30 dBm
Input 3rd Order Distortion Intercept Point 2
IIP32
f1 = 2 200 MHz, f2 = 2 201 MHz,
−
−
−
−
−11.0
+20.0
+15.0
43.0
−
−
−
−
Pin = −30 dBm
Output 3rd Order Distortion Intercept Point 1 OIP31
Output 3rd Order Distortion Intercept Point 2 OIP32
f1 = 1 000 MHz, f2 = 1 001 MHz,
dBm
Pin = −30 dBm
f1 = 2 200 MHz, f2 = 2 201 MHz,
Pin = −30 dBm
2nd Order Intermodulation Distortion
IM2
f1 = 1 000 MHz, f2 = 1 001 MHz,
dBc
Pin = −30 dBm
K factor 1
K factor 2
K1
K2
f = 1.0 GHz
f = 2.2 GHz
−
−
1.4
1.6
−
−
−
−
4
Data Sheet PU10558EJ01V0DS
UPC3226TB
TEST CIRCUIT
V
CC
C4
1 000 pF
1 000 pF
C3
L
4
100 nH
6
50 Ω
IN
50 Ω
C1
C2
1
OUT
100 pF
100 pF
2, 3, 5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Type
Value
100 pF
C1, C2
C3
Chip Capacitor
Chip Capacitor
Feed-through Capacitor
Chip Inductor
1 000 pF
1 000 pF
100 nH
C4
L
INDUCTOR FOR THE OUTPUT PIN
The internal output transistor of this IC, to output medium power. To supply current for output transistor, connect
an inductor between the VCC pin (pin 6) and output pin (pin 4). Select inductance, as the value listed above.
The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum
voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get
enough gain. In this case, large inductance and Q is suitable.
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for
the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitances are therefore selected as lower impedance against a 50 Ω load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under
10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are
determined by equation, C = 1/(2 πRfc).
5
Data Sheet PU10558EJ01V0DS
UPC3226TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
IN
C1
C2
OUT
L
C3
C4
COMPONENT LIST
Notes
Value
1. 30 × 30 × 0.4 mm double sided copper clad polyimide board.
2. Back side: GND pattern
C1, C2
C3, C4
L1
100 pF
1 000 pF
100 nH
3. Solder plated on pattern
4.
: Through holes
6
Data Sheet PU10558EJ01V0DS
UPC3226TB
TYPICAL CHARACTERISTICS (T
A
= +25
°
C, VCC = Vout = 5.0 V, Z
S
= Z = 50 Ω, unless otherwise specified)
L
CURCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
25
18
No Input Signal
17
16
15
14
13
12
20
T
A
= +85°C
15
10
5
+25°C
–40°C
0
1
2
3
4
5
6
–50
–25
0
25
50
75
(°C)
100
Supply Voltage VCC (V)
Operating Ambient Temperature T
A
POWER GAIN vs. FREQUENCY
ISOLATION vs. FREQUENCY
30
25
20
15
10
5
0
–10
–20
–30
–40
–50
–60
V
CC = 5.5 V
5.0 V
V
CC = 4.5 V
4.5 V
5.0 V
5.5 V
0
0.1
0.3
0.5
1.0
2.0 3.0
0.1
0.3
0.5
1.0
2.0 3.0
Frequency f (GHz)
Frequency f (GHz)
INPUT RETURN LOSS vs. FREQUENCY
OUTPUT RETURN LOSS vs. FREQUENCY
0
0
–5
–5
V
CC = 4.5 V
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
V
CC = 4.5 V
5.0 V
1.0
5.5 V
5.0 V
5.5 V
2.0 3.0
0.1
0.3
0.5
1.0
0.1
0.3
0.5
2.0 3.0
Frequency f (GHz)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
7
Data Sheet PU10558EJ01V0DS
UPC3226TB
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+20
+15
+10
+5
+20
+15
+10
+5
f = 1.0 GHz
f = 2.2 GHz
CC = 5.5 V
V
V
CC = 5.5 V
5.0 V
0
0
5.0 V
4.5 V
–5
–5
4.5 V
–10
–15
–20
–10
–15
–20
–30
0
Input Power Pin (dBm)
–40
–20
–10
+10
+20
–30
–10
Input Power Pin (dBm)
–40
–20
0
+10
NOISE FIGURE vs. FREQUENCY
NOISE FIGURE vs. FREQUENCY
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
V
CC = 4.5 V
T
A
= +85°C
5.0 V
+25°C
5.5 V
–40°C
0
500
1 000
1 500
2 000
2 500
0
500
1 000
1 500
2 000
2 500
Frequency f (MHz)
Frequency f (MHz)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PU10558EJ01V0DS
UPC3226TB
OUTPUT POWER, IM
3
vs. INPUT POWER
OUTPUT POWER, IM vs. INPUT POWER
3
+20
+10
0
+20
+10
0
f
f
= 1 000 MHz
1 = 1 001 MHz
f
f
= 2 200 MHz
1 = 2 201 MHz
P
out
2
2
P
out
–10
–20
–30
–40
–50
–60
–70
–80
–90
IM
3
–10
–20
–30
–40
–50
–60
–70
IM3
–30
–10
–35
–20
–40
–20
0
–40
–30
Input Power Pin (dBm)
–25
–15
Input Power Pin (dBm)
OUTPUT POWER, IM
2
vs. INPUT POWER
IM vs. INPUT POWER
2
+20
+10
0
60
50
40
30
20
10
0
f
= 1 000 MHz
= 1 001 MHz
f1
2
P
out
V
CC = 5.5 V
–10
–20
–30
–40
–50
–60
–70
IM2
5.0 V
4.5 V
–10
–40
–10
–30
Input Power Pin (dBm)
–40
–30
–20
0
–20
–10
0
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
9
Data Sheet PU10558EJ01V0DS
UPC3226TB
S-PARAMETERS (TA = +25°C, VCC = Vout = 5.0 V, Pin = −30 dBm)
S11−FREQUENCY
START: 100.000 000 MHz
STOP : 5 100.000 000 MHz
1
2
1 : 1 000 MHz 73.191 Ω −12.578 Ω
2 : 2 200 MHz 61.383 Ω −32.15 Ω
S22−FREQUENCY
START: 100.000 000 MHz
STOP : 5 100.000 000 MHz
1
2
1 : 1 000 MHz 80.102 Ω −13.164 Ω
2 : 2 200 MHz 56.375 Ω −30.771 Ω
10
Data Sheet PU10558EJ01V0DS
UPC3226TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.ꢀ 0.ꢀ
ꢀ.25 0.ꢀ
0.ꢀ MIN.
11
Data Sheet PU10558EJ01V0DS
UPC3226TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC line.
(4) The inductor (L) must be attached between VCC and output pins. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
WS260
HS350
: 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution Do not use different soldering methods together (except for partial heating).
12
Data Sheet PU10558EJ01V0DS
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
-AZ
(*)
Lead (Pb)
Mercury
< 1000 PPM
< 1000 PPM
< 100 PPM
< 1000 PPM
< 1000 PPM
< 1000 PPM
Not Detected
Not Detected
Cadmium
Hexavalent Chromium
PBB
Not Detected
Not Detected
Not Detected
Not Detected
PBDE
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance
content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better
integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL
suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to
customer on an annual basis.
See CEL Terms and Conditions for additional clarification of warranties and liability.
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