UPC3227TB [CEL]
BIPOLAR ANALOG INTEGRATED CIRCUIT; 双极模拟集成电路
| 型号： | UPC3227TB |
| 厂家： | 
CALIFORNIA EASTERN LABS |
| 描述： | BIPOLAR ANALOG INTEGRATED CIRCUIT |
| 文件： | 总13页 (文件大小：177K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BIPOLAR ANALOG INTEGRATED CIRCUIT
UPC3227TB
5 V, SILICON GERMANIUM MMIC
WIDEBAND AMPLIFIER
DESCRIPTION
The PC3227TB is a silicon germanium (SiGe) monolithic integrated circuit designed as IF amplifier for DBS tuners.
This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process.
FEATURES
•
•
Low current
: ICC = 4.8 mA TYP. @ VCC = 5.0 V
: PO (sat) = 1.0 dBm TYP. @ f = 1.0 GHz
: PO (sat) = 3.5 dBm TYP. @ f = 2.2 GHz
: PO (1dB) = 6.5 dBm TYP. @ f = 1.0 GHz
: PO (1dB) = 8.0 dBm TYP. @ f = 2.2 GHz
: GP = 22.0 dB TYP. @ f = 1.0 GHz
: GP = 22.0 dB TYP. @ f = 2.2 GHz
: NF = 4.7 dB TYP. @ f = 1.0 GHz
: NF = 4.6 dB TYP. @ f = 2.2 GHz
: VCC = 4.5 to 5.5 V
Output power
•
•
•
High linearity
Power gain
Noise Figure
•
•
Supply voltage
Port impedance
: input/output 50
APPLICATIONS
IF amplifiers in LNB for DBS converters etc.
•
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
C3P
Supplying Form
Embossed tape 8 mm wide.
PC3227TB-E3
PC3227TB-E3-A 6-pin super minimold
(Pb-Free)Note
1, 2, 3 pins face the perforation side of the tape.
Qty 3 kpcs/reel.
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: PC3227TB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PU10557EJ02V0DS (2nd edition)
Date Published July 2005 CP(K)
UPC3227TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View) (Top View) (Bottom View)
Pin No.
Pin Name
INPUT
GND
1
2
3
4
5
6
3
2
1
4
5
6
3
2
1
4
5
6
4
5
6
3
2
1
GND
OUTPUT
GND
VCC
PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC WIDEBAND AMPLIFIER
(TA = +25°C, f = 1 GHz, VCC = 5.0 V, ZS = ZL = 50
)
fu
PO (sat)
GP
NF
ICC
Part No.
Package
Marking
(GHz)
(dBm)
(dB)
(dB)
(mA)
PC2711TB
PC2712TB
PC3215TB Note
PC3224TB
PC3227TB
2.9
2.6
2.9
3.2
3.2
+1.0
+3.0
+3.5
+4.0
1.0
13
20
5.0
4.5
2.3
4.3
4.7
12
12
6-pin super minimold
C1G
C1H
C3H
C3K
C3P
20.5
21.5
22
14
9.0
4.8
Note PC3215TB is f = 1.5 GHz
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
2
Data Sheet PU10557EJ02V0DS
UPC3227TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Symbol
Conditions
Ratings
6.0
Unit
V
VCC
ICC
PD
TA = +25°C
TA = +25°C
TA = +85 C
Total Circuit Current
Power Dissipation
15
mA
mW
°C
Note
270
Operating Ambient Temperature
Storage Temperature
Input Power
TA
40 to +85
55 to +150
+10
Tstg
Pin
°C
TA = +25°C
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Conditions
MIN.
4.5
TYP.
5.0
MAX.
Unit
V
Supply Voltage
Operating Ambient Temperature
VCC
TA
5.5
40
+25
+85
°C
3
Data Sheet PU10557EJ02V0DS
UPC3227TB
ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50
)
Parameter
Circuit Current
Symbol
Test Conditions
No input signal
MIN.
4.0
TYP.
4.8
MAX.
6.0
Unit
mA
dB
ICC
Power Gain 1
GP1
GP2
GP3
GP4
GP5
GP6
f = 0.1 GHz, Pin = 40 dBm
f = 1.0 GHz, Pin = 40 dBm
f = 1.8 GHz, Pin = 40 dBm
f = 2.2 GHz, Pin = 40 dBm
f = 2.6 GHz, Pin = 40 dBm
f = 3.0 GHz, Pin = 40 dBm
20.5
19.5
19.0
19.0
19.0
18.0
3.5
22.5
22.0
22.0
22.0
22.0
21.0
1.0
24.5
24.5
25.0
25.0
25.0
24.5
Power Gain 2
Power Gain 3
Power Gain 4
Power Gain 5
Power Gain 6
Saturated Output Power 1
Saturated Output Power 2
PO (sat) 1 f = 1.0 GHz, Pin = 12 dBm
PO (sat) 2 f = 2.2 GHz, Pin = 12 dBm
dBm
dBm
dB
6.0
3.5
Gain 1 dB Compression Output Power 1 PO (1 dB) 1 f = 1.0 GHz
Gain 1 dB Compression Output Power 2 PO (1 dB) 2 f = 2.2 GHz
9.0
6.5
11.0
8.0
Noise Figure 1
NF1
NF2
f = 1.0 GHz
4.7
5.5
5.5
Noise Figure 2
f = 2.2 GHz
4.6
Isolation 1
ISL1
f = 1.0 GHz, Pin = 40 dBm
f = 2.2 GHz, Pin = 40 dBm
f = 1.0 GHz, Pin = 40 dBm
f = 2.2 GHz, Pin = 40 dBm
f = 1.0 GHz, Pin = 40 dBm
f = 2.2 GHz, Pin = 40 dBm
35
35
40
dB
Isolation 2
ISL2
43
Input Return Loss 1
Input Return Loss 2
Output Return Loss 1
Output Return Loss 2
RLin1
RLin2
RLout1
RLout2
IIP31
7.5
7.5
10.0
7.5
10.5
10.5
13.5
9.5
dB
dB
Input 3rd Order Distortion
Intercept Point 1
f1 = 1 000 MHz, f2 = 1 001 MHz,
Pin = 40 dBm
18.0
dBm
Input 3rd Order Distortion
Intercept Point 2
IIP32
OIP31
OIP32
IM2
f1 = 2 200 MHz, f2 = 2 201 MHz,
Pin = 40 dBm
20.5
+4.0
+1.5
30.5
Output 3rd Order Distortion
Intercept Point 1
f1 = 1 000 MHz, f2 = 1 001 MHz,
Pin = 40 dBm
dBm
dBc
Output 3rd Order Distortion
Intercept Point 2
f1 = 2 200 MHz, f2 = 2 201 MHz,
Pin = 40 dBm
2nd Order Intermodulation Distortion
f1 = 1 000 MHz, f2 = 1 001 MHz,
Pin = 40 dBm
K factor 1
K factor 2
K1
K2
f = 1.0 GHz
f = 2.2 GHz
3.8
3.9
4
Data Sheet PU10557EJ02V0DS
UPC3227TB
TEST CIRCUIT
VCC
C4
1 000 pF
1 000 pF
C3
6
50
IN
50
C1
C2
4
1
OUT
100 pF
100 pF
2, 3, 5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
COMPONENTS OF TEST CIRCUIT FOR MEASURING
ELECTRICAL CHARACTERISTICS
Type
Value
100 pF
C1, C2
C3
Chip Capacitor
Chip Capacitor
1 000 pF
1 000 pF
C4
Feed-through Capacitor
CAPACITORS FOR VCC AND INPUT PINS
Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be
supplied against VCC fluctuation.
Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.
5
Data Sheet PU10557EJ02V0DS
UPC3227TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
IN
OUT
C1
C2
C3
VCC
C4
COMPONENT LIST
Notes
Value
1. 30 30 0.4 mm double sided copper clad polyimide board.
2. Back side: GND pattern
C1, C2
C3, C4
100 pF
1 000 pF
3. Solder plated on pattern
4.
: Through holes
6
Data Sheet PU10557EJ02V0DS
UPC3227TB
TYPICAL CHARACTERISTICS (TA = +25 C, VCC = 5.0 V, ZS = ZL = 50 , unless otherwise specified)
CIRCUIT CURRENT vs.
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
OPERATING AMBIENT TEMPERATURE
6
6.0
No Input Signal
No Input Signal
5
4
5.5
5.0
4.5
4.0
3.5
3.0
3
TA = +85 C
2
+25 C
1
–40 C
0
1
2
3
4
5
6
–60 –40 –20
0
20
40
60
80 100
Supply Voltage VCC (V)
Operating Ambient Temperature TA ( C)
POWER GAIN vs. FREQUENCY
ISOLATION vs. FREQUENCY
30
25
20
15
10
5
0
–10
–20
–30
–40
–50
–60
VCC = 5.5 V
VCC = 4.5 V
5.0 V
4.5 V
5.0 V
5.5 V
0
0.1
0.3 0.5
2.0
4.0
0.1
0.3 0.5
2.0
4.0
1.0
1.0
Frequency f (GHz)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT RETURN LOSS vs. FREQUENCY
0
0
VCC = 4.5 V
–5
–5
VCC = 4.5 V
–10
–15
–20
–25
–30
–10
–15
5.0 V
5.5 V
5.0 V
–20
5.5 V
–25
–30
0.1
0.3 0.5
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
1.0
2.0
4.0
0.1
0.3 0.5
1.0
2.0
4.0
Frequency f (GHz)
7
Data Sheet PU10557EJ02V0DS
UPC3227TB
OUTPUT POWER vs. INPUT POWER
OUTPUT POWER vs. INPUT POWER
+5
0
+5
0
f = 1.0 GHz
f = 2.2 GHz
VCC = 5.5 V
VCC = 5.5 V
–5
–5
5.0 V
4.5 V
5.0 V
–10
–15
–20
–10
–15
–20
4.5 V
–35
–20
Input Power Pin (dBm)
–40
–30
–25
–15
–10
–40
–35
–30
–25
–20
–15
–10
Input Power Pin (dBm)
NOISE FIGURE vs. FREQUENCY
NOISE FIGURE vs. FREQUENCY
6.0
5.5
5.0
4.5
4.0
3.5
3.0
6.0
5.5
5.0
4.5
4.0
3.5
3.0
TA = +85 C
VCC = 4.5 V
+25 C
5.0 V
5.5 V
–40 C
0
500
1 000
1 500
2 000
2 500
3 000
0
500
1 000
1 500
2 000
2 500
3 000
Frequency f (MHz)
Frequency f (MHz)
Remark The graphs indicate nominal characteristics.
8
Data Sheet PU10557EJ02V0DS
UPC3227TB
OUTPUT POWER, IM3 vs. INPUT POWER
OUTPUT POWER, IM3 vs. INPUT POWER
+10
+10
f1 = 1 000 MHz
f2 = 1 001 MHz
f1 = 2 200 MHz
f2 = 2 201 MHz
0
–10
–20
–30
–40
–50
–60
–70
–80
0
–10
–20
–30
–40
–50
–60
–70
–80
Pout
IM3
Pout
IM3
–40
–10
–50
–30
–20
0
–40
–10
–50
–30
–20
0
Input Power Pin (dBm)
Input Power Pin (dBm)
OUTPUT POWER, IM2 vs. INPUT POWER
IM2 vs. INPUT POWER
+10
50
40
30
20
10
0
0
–10
–20
–30
–40
–50
–60
–70
–80
Pout
IM2
–50
–40
Input Power Pin (dBm)
–10
–50
–40
Input Power Pin (dBm)
–60
–30
–20
0
–60
–30
–20
–10
Remark The graphs indicate nominal characteristics.
9
Data Sheet PU10557EJ02V0DS
UPC3227TB
S-PARAMETERS (TA = +25 C, VCC = 5.0 V, Pin = 40 dBm)
S11 FREQUENCY
START : 100.000 000 MHz
STOP : 5 100.000 000 MHz
1
2
1 : 1 000 MHz 91.02
2 : 2 200 MHz 82.914
2.3789
26.738
S22 FREQUENCY
START: 100.000 000 MHz
STOP : 5 100.000 000 MHz
1
2
1 : 1 000 MHz 77.086
2 : 2 200 MHz 92.535
6.1797
28.438
10
Data Sheet PU10557EJ02V0DS
UPC3227TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
1.25±0.1
0.1 MIN.
11
Data Sheet PU10557EJ02V0DS
UPC3227TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground terminals must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC line.
(4) The DC cut capacitor must be attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260 C or below
: 10 seconds or less
: 60 seconds or less
: 120 30 seconds
: 3 times
Time at temperature of 220 C or higher
Preheating time at 120 to 180 C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260 C or below
WS260
HS350
: 10 seconds or less
Preheating temperature (package surface temperature) : 120 C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
: 350 C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution Do not use different soldering methods together (except for partial heating).
12
Data Sheet PU10557EJ02V0DS
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Restricted Substance
per RoHS
Concentration Limit per RoHS
(values are not yet fixed)
Concentration contained
in CEL devices
-A
-AZ
(*)
Lead (Pb)
Mercury
< 1000 PPM
< 1000 PPM
< 100 PPM
< 1000 PPM
< 1000 PPM
< 1000 PPM
Not Detected
Not Detected
Cadmium
Hexavalent Chromium
PBB
Not Detected
Not Detected
Not Detected
Not Detected
PBDE
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance
content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information
provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better
integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL
suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to
customer on an annual basis.
See CEL Terms and Conditions for additional clarification of warranties and liability.
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