TISP61521DR-S [BOURNS]
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS; 双正向导电的P- GATE闸流体可编程过电压保护
| 型号： | TISP61521DR-S |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | DUAL FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS |
| 文件： | 总11页 (文件大小：199K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TISP61521
T
N
IA
L
P
S
M
N
E
O
L
IO
C
B
S
S
A
R
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
PROGRAMMABLE OVERVOLTAGE PROTECTORS
H
E
IL
o
V
A
V
*R
A
TISP61521 SLIC Protector
Overvoltage Protection for High Voltage Negative Rail
Ringing SLICs
D Package (Top View)
1
8
7
6
5
K1
G
K1 (Tip)
(Tip)
Dual Voltage-Programmable Protectors
- Supports Battery Voltages Down to -150 V
- Low 3 mA max. Gate Triggering Current
- High 150 mA min. Holding Current
2
A
A
(Ground)
(Ground)
(Gate)
3
4
NC
K2
K2 (Ring)
(Ring)
Rated for International Surge Wave Shapes
MD6XANB
NC - No internal connection
Terminal typical application names shown in
parenthesis
I
Voltage
TSP
A
Standard
Waveshape
2/10
GR-1089-CORE
170
Device Symbol
K1
ITU-T K.22
VDE 0878
1.2/50
50
K1
G
1.2/50
10/160
0.5/700
IEC 61000-4-5
FCC Part 68 Type A
I3124
100
50
A
A
40
ITU-T K.20,
VDE 0433
10/700
40
IEC 61000-4-5
9/720
10/560
10/1000
FCC Part 68 Type B
FCC Part 68 Type A
GR-1089-CORE
40
35
30
K2
K2
Terminals K1, K2 and A correspond to the alternative
line designators of T, R and G or A, B and C. The
negative protection voltage is controlled by the
voltage, VGG, applied to the G terminal.
SD6XAEB
Functional Replacements for
Functional
............................................ UL Recognized Components
Device Type Package Type
Replacement
LCP1511D,
8-pin Small-Outline TISP61521D
LCP1521
How To Order
For Standard
For Lead Free
Termination Finish Termination Finish
Device
Package
Carrier
Embossed Tape Reeled
Tube
Order As
TISP61521DR
TISP61521D
Order As
TISP61521DR-S
TISP61521D-S
TISP61521
D (8-pin Small-Outline)
Description
The TISP61521 is a dual forward-conducting buffered p-gate overvoltage protector. It is designed to protect monolithic SLICs (Subscriber Line
Interface Circuits) against overvoltages on the telephone line caused by lightning, a.c. power contact and induction. The TISP61521 limits
voltages that exceed the SLIC supply rail voltage. The TISP61521 parameters are specified to allow equipment compliance with Bellcore
GR-1089-CORE, Issue 1 and ITU-T recommendation K.20.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
Description (continued)
The SLIC line driver section is typically powered from 0 V (ground) and a negative voltage in the region of -20 V to -150 V. The protector gate is
connected to this negative supply. This references the protection (clipping) voltage to the negative supply voltage. The protection voltage will
then track the negative supply voltage and the overvoltage stress on the SLIC is minimized.
Positive overvoltages are clipped to ground by diode forward conduction. Negative overvoltages are initially clipped close to the SLIC negative
supply rail value. If sufficient current is available from the overvoltage, then the protector will switch into a low voltage on-state condition. As
the overvoltage subsides, the high holding current of TISP61521 crowbar prevents d.c. latchup.
These monolithic protection devices are fabricated in ion-implanted planar vertical power structures for high reliability and in normal system
operation they are virtually transparent. The TISP61521 buffered gate design reduces the loading on the SLIC supply during overvoltages
caused by power cross and induction. The TISP61521 is available in an 8-pin plastic small-outline surface mount package.
Absolute Maximum Ratings, T = 25 °C (Unless Otherwise Noted)
J
Rating
Symbol
Value
-175
-162
Unit
V
Repetitive peak off-state voltage, V = 0, -40 °C ≤ T ≤ 85 °C (see Note 1)
V
DRM
GK
J
Repetitive peak gate-cathode voltage, V = 0, -40 °C ≤ T ≤ 85 °C (see Note 1)
V
GKRM
V
KA
J
Non-repetitive peak on-state pulse current (see Note 2)
2/10 µs (GR-1089-CORE, 2/10 µs voltage waveshape)
1/20 µs (K.22, VDE0878, 1.2/50 voltage waveshape)
8/20 µs (IEC 61000-4-5, combination wave generator, 1.2/50 voltage, 8/20 current)
10/160 µs (FCC Part 68, 10/160 µs voltage waveshape)
0.2/310 µs (I3124, 0.5/700 µs voltage waveshape)
5/310 µs (VDE 0433, 10/700 µs voltage waveshape)
5/310 µs (ITU-T K.20/21, K.44 10/700 µs voltage wave shape)
5/320 µs (FCC Part 68, 9/720 µs voltage waveshape)
10/560 µs (FCC Part 68, 10/560 µs voltage waveshape)
10/1000 µs (GR-1089-CORE, 10/1000 µs voltage waveshape)
Non-repetitive peak on-state current, 50 Hz (see Notes 2 and 3)
0.01 s
170
50
100
50
I
40
A
TSP
40
40
40
35
30
I
15
5
A
TSM
1 s
Non-repetitive peak gate current, 10 ms half-sine wave, cathodes commoned (see Notes 1 and
2)
I
+2
A
GSM
Junction temperature
T
-40 to +150
-65 to +150
°C
J
Storage temperature range
T
°
C
stg
NOTES: 1. These voltage ratings are set by the -150 V maximum supply voltage plus the 12 V diode overshoot (V
) and the 25 V SCR
GKRM
overshoot (V
).
DRM
2. Initially, the protector must be in thermal equilibrium. The surge may be repeated after the device returns to its initial conditions. The
rated current values may be applied either to the Ring to Ground or to the Tip to Ground terminal pairs. Additionally, both terminal
pairs may have their rated current values applied simultaneously (in this case, the Ground terminal current will be twice the rated
current value of an individual terminal pair).
3. Values for V
= -48 V. For values at other voltages, see Figure 2.
GG
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
Recommended Operating Conditions
Component
Min
100
25
Typ
Max
Unit
nF
C1
Gate decoupling capacitor
220
series resistor for GR-1089-CORE, 2/10, 10/360 and 10/1000 first-level surge survival
Ω
series resistor for GR-1089-CORE, 2/10, 10/360 and 10/1000 first-level and 2/10 second-level
surge survival
40
Ω
series resistor for K.20, K.21 and K.45 coordination with a 400 V primary protector
series resistor for K.44 4 kV 10/700 surge survival
10
60
20
0
Ω
Ω
Ω
Ω
Ω
Ω
series resistor for FCC Part 68 Type A 10/160 and 10/560 surge survival
series resistor for FCC Part 68 Type B 9/720 surge survival
series resistor for VDE 0433 2 kV 10/700 surge survival
R
S
10
0
series resistor for VDE 0878 2 kV 1.2/50 surge survival
series resistor for IEC 6100-4-5 4 kV, 10/700, class 5, long distance balanced circuits surge
survival with a 400 V primary protector
10
0
Ω
Ω
series resistor for IEC 6100-4-5 1.2/50-8/20combination generator, classes 0 to 5 (500 V to
4 kV maximum), short distance balanced circuits surge survival.
Electrical Characteristics, T = 25 °C (Unless Otherwise Noted)
J
Parameter
Test Conditions
Min
Typ
Max
-5
Unit
µA
T = 25 °C
J
I
Off-state current
V
= V
, V = 0
DRM GK
D
D
T = 85 °C
-50
µA
J
V
= -48 V, C = 220 nF
G
GG
Gate-cathode impulse 10/700, I = -30 A, R = 10 Ω
7
TM
S
V
V
GK(BO)
breakover voltage
1.2/50, I = -30 A, R = 10 Ω
10
25
TM
S
2/10, I = -38 A, R = 62 Ω,
TM
S
V
Forward voltage
I
= 5 A, t = 500 µs
2
V
V
F
F
w
10/700, I = 30 A, R = 10 Ω
5
7
F
S
Peak forward recovery
voltage
V
1.2/50, I = 30 A, R = 10 Ω
F S
2/10, I = 38 A, R = 62 Ω,
FRM
12
F
S
I
Holding current
I
= -1 A, di/dt = 1A/ms, V = -100 V
GG
-150
mA
µA
H
T
T = 25 °C
-5
J
I
Gate reverse current
V
= V = V
, V = 0
GKRM KA
GKS
GG
GK
T = 85 °C
-50
3.0
µA
J
I
Gate trigger current
I
= -3 A, t
≥ 20 µs, V = -100 V
mA
GT
T
p(g)
p(g)
GG
Gate-cathode trigger
voltage
V
I = -3 A, t
≥ 20 µs, V = -100 V
2.0
V
GT
T
GG
V
= -3 V
100
50
pF
pF
Cathode-anode off-
state capacitance
D
C
f = 1 MHz, V = 1 V, I = 0, (see Note 4)
d G
KA
V
= -48 V
D
NOTE 4: These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured
device terminals are a.c. connected to the guard terminal of the bridge.
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
Thermal Characteristics
Parameter
Test Conditions
T = 25 °C, EIA/JESD51-3 PCB, EIA/JESD51-
Min
Typ
Max
Unit
A
RθJA Junction to free air thermal resistance
170
°C/W
2 environment, P
= 1.7 W
TOT
Parameter Measurement Information
+i
Quadrant I
IFSP (= | TSP|)
Forward
Conduction
Characteristic
IFSM (= |ITSM|)
IF
VF
VGK(BO)
VGG
VD
+v
-v
ID
I
I(BO)
IH
IS
VT
VS
V(BO)
IT
ITSM
Quadrant III
ITSP
Switching
Characteristic
-i
PM6XAAA
Figure 1. Voltage-Current Characteristic
UnlessOtherwise Noted,All Voltagesare Referencedto the Anode
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
Thermal Information
PEAK NON-RECURRING AC
vs
CURRENT DURATION
TI61AF
20
15
RING AND TIP TERMINALS:
Equal ITSM values applied
simultaneously
GROUND TERMINAL:
Current twice ITSM value
10
8
7
6
5
4
EIA / JEDSD51
Environmentand
PCB, TA = 25 °C
3
VGG = -80 V
VGG =-60 V
2
1.5
1
VGG = -100 V
VGG = -120 V
0.8
0.7
0.6
0.5
0.01
0.1
1
10
100
1000
t — Current Duration — s
Figure 2. Non-Repetitive Peak On-State Current against Duration
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
APPLICATIONS INFORMATION
Gated Protectors
This section covers three topics. First, it is explained why gated protectors are needed. Second, the voltage limiting action of the protector is
described. Third, an example application circuit is described.
Purpose of Gated Protectors
Fixed voltage thyristor overvoltage protectors have been used since the early 1980s to protect monolithic SLICs (Subscriber Line Interface
Circuits) against overvoltages on the telephone line caused by lightning, a.c. power contact and induction. As the SLIC was usually powered
from a fixed voltage negative supply rail, the limiting voltage of the protector could also be a fixed value. The TISP1072F3 is a typical example
of a fixed voltage SLIC protector.
SLICs have become more sophisticated. To minimize power consumption, some designs automatically adjust the driver supply voltage to a
value that is just sufficient to drive the required line current. For short lines, the supply voltage would be set low, but for long lines, a higher
supply voltage would be generated to drive sufficient line current. The optimum protection for this type of SLIC would be given by a protection
voltage which tracks the SLIC supply voltage. This can be achieved by connecting the protection thyristor gate to the SLIC V
supply,
Figure 3. This gated (programmable) protection arrangement minimizes the voltage stress on the SLIC, no matter what value of supply voltage.
BATH
SLIC
PROTECTOR
SLIC
PROTECTOR
SLIC
SLIC
IF
Th5
IK
Th5
TISP
61521
TISP
61521
IG
VBAT
VBAT
C1
220 nF
C1
220 nF
AI6XABA
AI6XACA
Figure 3. Negative Overvoltage Condition
Figure 4. Positive Overvoltage Condition
Operation of Gated Protectors
Figure 3 and Figure 4 show how the TISP61521 limits negative and positive overvoltages. Positive overvoltages (Figure 4) are clipped by the
antiparallel diode of Th5 and the resulting current is diverted to ground. Negative overvoltages (Figure 3) are initially clipped close to the SLIC
negative supply rail value (V
BATH
). If sufficient current is available from the overvoltage, then Th5 will switch into a low voltage on-state
condition. As the overvoltage subsides, the high holding current of Th5 prevents d.c. latchup. The protection voltage will be the sum of the
gate supply (V ) and the peak gate-cathode voltage (V ). The protection voltage will be increased if there is a long connection
BATH GK(BO)
between the gate decoupling capacitor, C1, and the gate terminal. During the initial rise of a fast impulse, the gate current (I ) is the same as
G
the cathode current (I ). Rates of 70 A/µs can cause inductive voltages of 0.7 V in 2.5 cm of printed wiring track. To minimize this inductive
K
voltage increase of protection voltage, the length of the capacitor to gate terminal tracking should be minimized. Inductive voltages in the
protector cathode wiring will also increase the protection voltage. These voltages can be minimized by routing the SLIC connection through
the protector as shown in Figure 6.
Figure 5, which has a 10 A/µs rate of impulse current rise, shows a positive gate charge (Q ) of about 0.1 µC. With the 0.1 µF gate
GS
decoupling capacitor used, the increase in gate supply is about 1 V (= Q /C1). This change is just visible on the -72 V gate voltage, V
GS BATH
.
But the voltage increase does not directly add to the protection voltage, as the supply voltage change reaches a maximum at 0.4 µs, when the
gate current reverses polarity, and the protection voltage peaks earlier at 0.3 µs. In Figure 5, the peak clamping voltage (V ) is -77.5 V, an
increase of 5.5 V on the nominal gate supply voltage. This 5.5 V increase is the sum of the supply rail increase at that time, (0.5 V), and the
protection circuit’s cathode diode to supply rail breakover voltage (5 V). In practice, use of the recommended 220 nF gate decoupling capacitor
(BO)
would give a supply rail increase of about 0.3 V and a V
value of about -77.3 V.
(BO)
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
0
-20
-40
-60
V
V
K
BATH
-80
0.0
0.5
1.0
1.5
Time - µs
AI6XDE
1
Q
GS
I
G
0
-1
-2
-3
-4
I
K
-5
0.0
0.5
1.0
1.5
Time - µs
Figure 5. Protector Fast Impulse Clamping and Switching Waveforms
Application Circuit
Figure 6 shows a typical TISP61521 SLIC card protection circuit. The incoming line conductors, Ring (R) and Tip (T), connect to the relay
matrix via the series overcurrent protection. Fusible resistors, fuses and positive temperature coefficient (PTC) resistors can be used for
overcurrent protection. Resistors will reduce the prospective current from the surge generator for both the TISP61521 and the ring/test
protector. The TISP7xxxF3 protector has the same protection voltage for any terminal pair. This protector is used when the ring generator
configuration may be ground or battery-backed. For dedicated ground-backed ringing generators, the TISP3xxxF3 gives better protection as
its inter-conductor protection voltage is twice the conductor to ground value.
Relay contacts 3a and 3b connect the line conductors to the SLIC via the TISP61521 protector. The protector gate reference voltage comes
from the SLIC negative supply (V
). A 220 nF gate capacitor sources the high gate current pulses caused by fast rising impulses.
BATH
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
OVER-
RING/TEST
CURRENT
TEST
RELAY
RING
RELAY
SLIC
RELAY
SLIC
PROTECTOR
SLIC
PROTECTION
PROTECTION
TIP
WIRE
Th1
S3a
Th4
RSA
S1a
S2a
Th3
RSB
Th5
Th2
RING
WIRE
S3b
TISP
TISP
3xxxF3
OR
7xxxF3
61521
S1b
S2b
VBAT
C1
F
220 n
TEST
EQUIP-
MENT
RING
GENERATOR
AI6XAAB
Figure 6. Typical Application Circuit
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
MECHANICAL DATA
Device Symbolization Code
Devices will be coded as follows:
Symbolization
Device
TISP61521
Code
61521
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
MECHANICAL DATA
D008 Plastic Small-outline Package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
D008
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
4.80 - 5.00
(0.189 - 0.197)
8
7
6
5
5.80 - 6.20
(0.228 - 0.244)
INDEX
3.81 - 4.00
(0.150 - 0.157)
1
3
2
4
4.60 - 5.21
(0.181 - 0.205)
0.25 - 0.50
(0.010 - 0.020)
1.35 - 1.75
(0.053 - 0.069)
7 ° NOM
3 Places
x 45 ° N0M
0.102 - 0.203
(0.004 - 0.008)
4 ° ± 4 °
0.36 - 0.51
(0.014 - 0.020)
8 Places
7 ° NOM
4 Places
0.28 - 0.79
Pin Spacing
1.27
(0.050)
(see Note A)
6 places
(0.011 - 0.031)
0.190 - 0.229
(0.0075 - 0.0090)
0.51 - 1.12
(0.020 - 0.044)
MILLIMETERS
(INCHES)
DIMENSIONS ARE:
MDXXAAC
NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0.15 (0.006).
D. Lead tips to be planar within ±0.051 (0.002).
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61521 SLIC Protector
MECHANICAL DATA
D008 Tape DImensions
D008 Package (8-pin Small Outline) Single-Sprocket Tape
3.90 - 4.10
1.50 - 1.60
(.154 - .161)
(.059 - .063)
1.95 - 2.05
7.90 - 8.10
0.40
(.077 - .081)
(.311 - .319)
(0.016)
0.8
(0.03)
MIN.
5.40 - 5.60
(.213 - .220)
11.70 - 12.30
(.461 - .484)
Cover
Tape
6.30 - 6.50
(.248 - .256)
1.50
(.059)
ø
MIN.
0 MIN.
Carrier Tape
Embossment
2.0 - 2.2
(.079 - .087)
Direction of Feed
MILLIMETERS
(INCHES)
DIMENSIONS ARE:
NOTES: A. Taped devices are supplied on a reel of the following dimensions:-
MDXXATB
330 +0.0/-4.0
Reel diameter:
(12.992 +0.0/-.157)
100 ± 2.0
Reel hub diameter:
(3.937 ± .079)
13.0 ± 0.2
Reel axial hole:
(.512 ± .008)
B. 2500 devices are on a reel.
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
APRIL 2001 REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
相关型号：
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