AOD422 [AOS]

20V N-Channel MOSFET; 20V N沟道MOSFET
AOD422
型号: AOD422
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

20V N-Channel MOSFET
20V N沟道MOSFET

晶体 晶体管
文件: 总5页 (文件大小:428K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOD422  
20V N-Channel MOSFET  
General Description  
Product Summary  
VDS  
20V  
The AOD422 uses advanced trench technology to provide  
excellent RDS(ON), low gate charge and operation with gate  
voltages as low as 1.8V. This device is suitable for use as  
a load switch or in PWM applications. It is ESD  
protected.  
ID (at VGS=4.5V)  
RDS(ON) (at VGS=4.5V)  
RDS(ON) (at VGS =2.5V)  
RDS(ON) (at VGS =1.8V)  
20A  
< 25m  
< 28mΩ  
< 34mΩ  
ESD protected  
100% UIS Tested  
TO252  
DPAK  
D
Top View  
Bottom View  
D
D
G
S
G
S
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
20  
±8  
20  
16  
V
V
VGS  
TC=25°C  
Continuous Drain  
Current G  
ID  
TC=100°C  
A
Pulsed Drain Current C  
IDM  
90  
TA=25°C  
TA=70°C  
8
6.5  
Continuous Drain  
Current  
IDSM  
A
Avalanche Current C  
IAS, IAR  
15  
A
Avalanche energy L=0.1mH C  
EAS, EAR  
11  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
37  
PD  
W
18  
TA=25°C  
2.5  
PDSM  
W
°C  
Power Dissipation A  
1.6  
TA=70°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 175  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
16.7  
40  
Max  
25  
50  
4
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
t
10s  
RθJA  
Steady-State  
Steady-State  
RθJC  
3
Rev 5: July 2010  
www.aosmd.com  
Page 1 of 5  
AOD422  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
20  
V
VDS=20V, VGS=0V  
1
IDSS  
Zero Gate Voltage Drain Current  
µA  
5
TJ=55°C  
VDS=0V, VGS= ±4.5V  
±1  
±10  
1.1  
uA  
uA  
V
IGSS  
Gate-Body leakage current  
VDS=0V, VGS= ±8V  
VGS(th)  
ID(ON)  
VDS=VGS ID=250µA  
VGS=4.5V, VDS=5V  
VGS=4.5V, ID=10A  
0.4  
45  
0.7  
Gate Threshold Voltage  
On state drain current  
A
16  
22  
25  
31  
28  
34  
mΩ  
TJ=125°C  
RDS(ON)  
Static Drain-Source On-Resistance  
VGS=2.5V, ID=8A  
VGS=1.8V, ID=5A  
VDS=5V, ID=10A  
IS=1A,VGS=0V  
18  
mΩ  
mΩ  
S
21  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
55  
0.62  
1
V
Maximum Body-Diode Continuous Current  
20  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1035 1295 1650  
pF  
pF  
VGS=0V, VDS=10V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
110  
50  
160  
87  
210  
125  
2.7  
pF  
VGS=0V, VDS=0V, f=1MHz  
VGS=4.5V, VDS=10V, ID=10A  
0.9  
1.8  
ΚΩ  
SWITCHING PARAMETERS  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
10  
4.2  
nC  
nC  
nC  
ns  
ns  
us  
us  
2.6  
280  
328  
3.76  
2.24  
VGS=10V, VDS=10V, RL=1,  
RGEN=3Ω  
tD(off)  
tf  
trr  
IF=10A, dI/dt=500A/µs, VGS=-9V  
IF=10A, dI/dt=500A/µs, VGS=-9V  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
25  
75  
ns  
Qrr  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends  
on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep initial  
TJ =25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.  
G. The maximum current rating is package limited.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev 5: July 2010  
www.aosmd.com  
Page 2 of 5  
AOD422  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
30  
25  
20  
15  
10  
5
25  
20  
15  
10  
5
4.5V  
2.5V  
VDS=5V  
1.8V  
3.1V  
125°C  
VGS=1.5V  
25°C  
0
0
0
0.5  
1
1.5  
2
2.5  
0
0.5  
1
1.5  
VDS (Volts)  
2
2.5  
3
VGS(Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
30  
25  
20  
15  
10  
1.6  
VGS=2.5V  
ID=8A  
1.4  
1.2  
1
VGS=1.8V  
VGS=2.5V  
VGS=1.8V  
ID=5A  
VGS=4.5V  
VGS=4.5V  
ID=10A  
0.8  
0
25  
50  
75  
100  
125  
150  
175  
0
5
10  
ID (A)  
15  
20  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. JunctionTemperature  
(Note E)  
60  
50  
40  
30  
20  
10  
1.0E+01  
ID=10A  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
25°C  
125°C  
25°C  
0
2
4
6
8
0.0  
0.2  
0.4  
VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
1.2  
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Rev 5: July 2010  
www.aosmd.com  
Page 3 of 5  
AOD422  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
5
4
3
2
1
0
1800  
VDS=10V  
ID=10A  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
Ciss  
Coss  
Crss  
0
2
4
6
8
10  
12  
0
5
10  
15  
20  
Qg (nC)  
VDS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
10000  
1000  
100  
10  
1000.0  
100.0  
10.0  
1.0  
TJ(Max)=175°C  
TA=25°C  
10µs  
100µs  
RDS(ON)  
1ms  
10ms  
DC  
TJ(Max)=175°C  
TC=25°C  
0.1  
1
0.0  
0.00001  
0.001  
0.1  
10  
1000  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
VDS (Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
1
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJA=50°C/W  
0.1  
P
0.01  
0.001  
Single Pulse  
0.01  
Ton  
T
0.00001  
0.0001  
0.001  
0.1  
Pulse Width (s)  
1
10  
100  
1000  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note H)  
Rev 5: July 2010  
www.aosmd.com  
Page 4 of 5  
AOD422  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
Rev 5: July 2010  
www.aosmd.com  
Page 5 of 5  

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