AO3403_11 [AOS]

30V P-Channel MOSFET; 30V P沟道MOSFET
AO3403_11
型号: AO3403_11
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

30V P-Channel MOSFET
30V P沟道MOSFET

文件: 总5页 (文件大小:500K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AO3403  
30V P-Channel MOSFET  
General Description  
Product Summary  
VDS  
The AO3403 uses advanced trench technology to provide  
excellent RDS(ON) and low gate charge. This device is  
suitable for use as a load switch or in PWM applications.  
-30V  
ID (at VGS=-10V)  
RDS(ON) (at VGS=-10V)  
RDS(ON) (at VGS =-4.5V)  
RDS(ON) (at VGS =-2.5V)  
-2.6A  
< 115m  
< 150mΩ  
< 200mΩ  
SOT23  
D
Top View  
Bottom View  
D
D
G
G
S
S
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
-30  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
VGS  
±12  
TA=25°C  
TA=70°C  
-2.6  
Continuous Drain  
Current  
ID  
A
-2.2  
Pulsed Drain Current C  
IDM  
PD  
-13  
TA=25°C  
TA=70°C  
1.4  
W
°C  
Power Dissipation B  
0.9  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 150  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
70  
Max  
90  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Lead  
t
10s  
RθJA  
Steady-State  
Steady-State  
100  
63  
125  
80  
RθJL  
Rev 10: Jan. 2011  
www.aosmd.com  
Page 1 of 5  
AO3403  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=-250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
-30  
V
VDS=-30V, VGS=0V  
-1  
µA  
-5  
IDSS  
Zero Gate Voltage Drain Current  
TJ=55°C  
VDS=0V, VGS= ±12V  
VDS=VGS ID=-250µA  
VGS=-10V, VDS=-5V  
VGS=-10V, ID=-2.6A  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
±100  
-1.4  
nA  
V
VGS(th)  
ID(ON)  
-0.6  
-13  
-1  
A
88  
143  
103  
139  
8
115  
200  
150  
200  
mΩ  
TJ=125°C  
RDS(ON)  
Static Drain-Source On-Resistance  
VGS=-4.5V, ID=-2A  
mΩ  
mΩ  
S
VGS=-2.5V, ID=-1A  
VDS=-5V, ID=-2.6A  
IS=-1A,VGS=0V  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
-0.78  
-1  
V
Maximum Body-Diode Continuous Current  
-1.5  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
260  
37  
20  
8
315  
12  
pF  
pF  
pF  
VGS=0V, VDS=-15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
VGS=0V, VDS=0V, f=1MHz  
4
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
5.9  
2.8  
0.7  
1
7.2  
3.5  
nC  
nC  
nC  
nC  
ns  
Qg(4.5V) Total Gate Charge  
VGS=-10V, VDS=-15V, ID=-2.6A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
6
VGS=-10V, VDS=-15V,  
3.5  
20  
5
ns  
RL=5.76, RGEN=3Ω  
tD(off)  
tf  
ns  
ns  
trr  
IF=-2.6A, dI/dt=100A/µs  
IF=-2.6A, dI/dt=100A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
11.5  
4.5  
15  
ns  
Qrr  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
value in any given application depends on the user's specific board design.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using 10s junction-to-ambient thermal resistance.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep  
initialTJ=25°C.  
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with  
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev 10: Jan. 2011  
www.aosmd.com  
Page 2 of 5  
AO3403  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
15  
12  
9
10  
8
-10V  
-6V  
-4.5V  
VDS=-5V  
-3V  
6
-2.5V  
4
6
125°C  
VGS=-2V  
2
25°C  
3
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
1
2
3
4
5
-VGS(Volts)  
Figure 2: Transfer Characteristics (Note E)  
-VDS (Volts)  
Fig 1: On-Region Characteristics (Note E)  
210  
190  
170  
150  
130  
110  
90  
2
VGS=-2.5V  
VGS=-4.5V  
VGS=-10V  
ID=-2.6A  
1.8  
1.6  
1.4  
1.2  
1
VGS=-4.5V  
I =-2A 
D
VGS=-2.5V  
ID=-1A  
VGS=-10V  
70  
0.8  
50  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
-ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
250  
200  
150  
100  
50  
1.0E+02  
1.0E+01  
ID=-2.6A  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
25°C  
25°C  
0.0  
0.2  
0.4  
-VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
1.2  
0
2
4
6
8
10  
-VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Rev 10: Jan. 2011  
www.aosmd.com  
Page 3 of 5  
AO3403  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
400  
VDS=-15V  
ID=-2.6A  
8
Ciss  
300  
200  
100  
0
6
4
Coss  
2
Crss  
0
0
1
2
3
4
5
6
0
5
10  
15  
20  
25  
30  
Qg (nC)  
-VDS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
10000  
1000  
100  
10  
100.0  
10.0  
1.0  
TA=25°C  
10µs  
RDS(ON)  
limited  
100µs  
1ms  
10ms  
0.1  
TJ(Max)=150°C  
TA=25°C  
10s  
DC  
1
0.0  
0.00001  
0.001  
0.1  
10  
1000  
0.01  
0.1  
1
10  
100  
-VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
1
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJA=125°C/W  
0.1  
0.01  
PD  
Single Pulse  
0.001  
Ton  
T
0.001  
0.00001  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev 10: Jan. 2011  
www.aosmd.com  
Page 4 of 5  
AO3403  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
-
-10V  
-
VDCC  
Qgs  
Qgd  
+
Vds  
VDCC  
+
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
toff  
ton  
t
td(off)  
td(on)  
t
r
f
Vgs  
-
90%  
10%  
DUT  
Vdd  
Vgs  
VDC  
+
Rg  
Vgs  
Vds  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
EAR= 1/2 LIA2R  
L
Vds  
Id  
Vgs  
Vds  
-
BVDSS  
Vgs  
Vdd  
VDC  
+
Id  
Rg  
I AR  
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
-Isd  
-IF  
Isd  
Vgs  
dI/dt  
-IRM  
+
Vdd  
VDC  
Vdd  
-
-Vds  
Rev 10: Jan. 2011  
www.aosmd.com  
Page 5 of 5  

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