AFBR-57M5APZ [AGILENT]

Fiber Optic Device;
AFBR-57M5APZ
型号: AFBR-57M5APZ
厂家: AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述:

Fiber Optic Device

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Agilent AFBR-57M5APZ  
Digital Diagnostic SFP, 850 nm,  
2.125/1.0625 and 1.25 GBd Ethernet,  
RoHS Compliant Optical Transceiver  
Data Sheet  
Features, continued  
• Link lengths at 2.125 GBd:  
300 m with 50 µm MMF,  
150 m with 62.5 µm MMF  
• Link lengths at 1.0625 GBd:  
500 m with 50 µm MMF,  
300 m with 62.5 µm MMF  
850 nm, SFP (Small Form Pluggable), RoHS Compliant,  
Low Voltage (3.3 V) Digital Diagnostic Optical Transceiver  
• Link lengths at 1.25 GBd:  
2 to 550 m with 50 µm MMF,  
2 to 275 m with 62.5 µm MMF  
Description  
Features  
• LC Duplex optical connector  
interface conforming to ANSI  
TIA/EIA604-10 (FOCIS 10A)  
Agilent’s AFBR-57M5APZ optical  
transceiver supports high-speed  
serial links over multimode  
optical fiber at signaling rates up  
to 2.125 Gb/s. Compliant with  
Small Form Pluggable (SFP)  
Multi Source Agreement (MSA)  
mechanical and electrical  
• Fully RoHS Compliant  
• Diagnostic features per SFF-8472  
“Diagnostic Monitoring Interface  
for Optical Transceivers”  
• 850 nm Vertical Cavity Surface  
Emitting Laser (VCSEL) source  
technology  
• Real time monitoring of:  
Transmitted optical power  
Received optical power  
Laser bias current  
Temperature  
• IEC 60825-1 Class 1/CDRH Class 1  
laser eye safe  
specifications for LC Duplex  
transceivers, ANSI Fibre  
Applications  
Supply voltage  
Channel FC-PI, FC-PI-2 and  
compliant with IEEE 802.3 for  
gigabit applications. The part is  
electrically interoperable with  
SFP conformant devices.  
• Fibre channel systems  
– Director class switches  
– Fabric switches  
• Wide temperature and supply  
voltage operation (-10°C to 85°C)  
(3.3 V ± 10%)  
• Transceiver specifications per SFP  
(SFF-8074i) Multi-Source Agree-  
ment and SFF-8472 (revision 9.3)  
2.125 GBd Fibre Channel  
operation for FC-PI 200-M5-SN-I  
and 200-M6-SN-I  
– HBA cards  
• Disk and tape drive arrays  
Related Products  
• AFBR-59R5LZ: 850 nm +3.3 V LC  
SFF 2x7 for 4.25/2.125/1.0625  
GBd Fibre Channel  
1.0625 GBd Fibre Channel  
operation for FC-PI 100-M5-SN-I  
and 100-M6-SN-I  
• AFBR-57R5APZ: 850 nm +3.3 V LC  
SFP for 4.25/2.125/1.0625 GBd  
Fibre Channel  
1.25 GBd operation for IEEE 802.3  
Gigabit Ethernet 1000Base-SX  
Description, continued  
As an enhancement to the  
memory address 0xA0, is  
organized in compliance with  
SFF-8074i. New digital diag-  
nostic information, bytes 0-255  
at memory address 0xA2, is  
compliant to SFF-8472. The new  
diagnostic information provides  
the opportunity for Predictive  
Failure Identification, Com-  
pliance Prediction, Fault  
Isolation and Component  
Monitoring.  
issues. Received optical power is  
also available to assess  
compliance of a cable plant and  
remote transmitter. When  
operating out of requirements,  
the link cannot guarantee error  
free transmission.  
conventional SFP interface  
defined in SFF-8074i, the AFBR-  
57M5APZ is compliant to SFF-  
8472 (digital diagnostic interface  
for optical transceivers). Using  
the 2-wire serial interface  
defined in the SFF-8472 MSA,  
the AFBR-57M5APZ provides  
real time temperature, supply  
voltage, laser bias current, laser  
average output power and  
received input power. This  
information is in addition to  
conventional SFP base data. The  
digital diagnostic interface also  
adds the ability to disable the  
transmitter (TX_DISABLE),  
monitor for Transmitter Faults  
(TX_FAULT), and monitor for  
Receiver Loss of Signal (RX_LOS).  
Fault Isolation  
The fault isolation feature allows  
a host to quickly pinpoint the  
location of a link failure,  
minimizing downtime. For  
optical links, the ability to  
identify a fault at a local device,  
remote device or cable plant is  
crucial to speeding service of an  
installation. AFBR-57M5APZ  
real-time monitors of Tx_Bias,  
Tx_Power, Vcc, Temperature  
and Rx_Power can be used to  
assess local transceiver current  
operating conditions. In  
Predictive Failure Identification  
The AFBR-57M5APZ predictive  
failure feature allows a host to  
identify potential link problems  
before system performance is  
impacted. Prior identification of  
link problems enables a host to  
service an application via “fail  
over” to a redundant link or  
replace a suspect device,  
Installation  
maintaining system uptime in  
the process. For applications  
where ultra-high system uptime  
is required, a digital SFP  
provides a means to monitor two  
real-time laser metrics asso-  
ciated with observing laser  
degradation and predicting  
failure: average laser bias  
addition, status flags Tx_Disable  
and Rx Loss of Signal (LOS) are  
mirrored in memory and  
available via the two-wire serial  
interface.  
The AFBR-57M5APZ can be  
installed in any SFF-8074i  
compliant Small Form Pluggable  
(SFP) port regardless of host  
equipment operating status. The  
AFBR-57M5APZ is hot-  
pluggable, allowing the module  
to be installed while the host  
system is operating and on-line.  
Upon insertion, the transceiver  
housing makes initial contact  
with the host board SFP cage,  
mitigating potential damage due  
to Electro-Static Discharge (ESD).  
Component Monitoring  
Component evaluation is a more  
casual use of the AFBR-  
57M5APZ real-time monitors of  
Tx_Bias, Tx_Power, Vcc,  
Temperature and Rx_Power.  
Potential uses are as debugging  
aids for system installation and  
design, and transceiver  
parametric evaluation for  
factory or field qualification. For  
example, temperature per  
module can be observed in high  
density applications to facilitate  
thermal evaluation of blades,  
PCI cards and systems.  
current (Tx_Bias) and average  
laser optical power (Tx_Power).  
Compliance Prediction  
Compliance prediction is the  
ability to determine if an optical  
transceiver is operating within  
its operating and environmental  
requirements. AFBR-57M5APZ  
devices provide real-time access  
to transceiver internal supply  
voltage and temperature,  
Digital Diagnostic Interface  
and Serial Identification  
The 2-wire serial interface is  
based on ATMEL AT24C01A  
series EEPROM protocol and  
signaling detail. Conventional  
EEPROM memory, bytes 0-255 at  
allowing a host to identify  
potential component compliance  
2
OPTICAL INTERFACE  
LIGHT FROM FIBER  
ELECTRICAL INTERFACE  
RECEIVER  
RD+ (RECEIVE DATA)  
RD(RECEIVE DATA)  
Rx LOSS OF SIGNAL  
AMPLIFICATION  
& QUANTIZATION  
PHOTO-DETECTOR  
MOD-DEF2 (SDA)  
CONTROLLER & MEMORY  
MOD-DEF1 (SCL)  
MOD-DEF0  
TRANSMITTER  
TX_DISABLE  
LASER  
DRIVER &  
SAFETY  
TD+ (TRANSMIT DATA)  
TD(TRANSMIT DATA)  
TX_FAULT  
LIGHT TO FIBER  
VCSEL  
CIRCUITRY  
Figure 1. Transceiver functional diagram.  
Transmitter Section  
allows normal transceiver  
low signal indicates normal laser  
operation and a high signal  
operation. In the event of a fault  
(e.g. eye safety circuit activated),  
cycling this control signal resets  
the module as depicted in  
The transmitter section includes  
consists of the Transmitter  
Optical SubAssembly (TOSA)  
and laser driver circuitry. The  
TOSA, containing an 850 nm  
VCSEL (Vertical Cavity Surface  
Emitting Laser) light source, is  
located at the optical interface  
and mates with the LC optical  
connector. The TOSA is driven  
by a custom IC which uses the  
incoming differential high speed  
logic signal to modulate the laser  
diode driver current. This Tx  
laser driver circuit regulates the  
optical power at a constant level  
provided the incoming data  
pattern is dc balanced (8B/10B  
code, for example).  
indicates a fault. The TX_FAULT  
will be latched high when a laser  
fault occurs and is cleared by  
toggling the TX_DISABLE input  
or power cycling the transceiver.  
The transmitter fault condition  
can also be monitored via the  
two-wire serial interface  
Figure 4. An internal pull up  
resistor disables the transceiver  
transmitter until the host pulls  
the input low. Host systems  
should allow a 10 ms interval  
between successive assertions of  
this control signal. Tx_Disable  
can also be asserted via the two-  
wire serial interface (address  
A2h, byte 110, bit 6) and  
(address A2, byte 110, bit 2).  
Eye Safety Circuit  
The AFBR-57M5APZ provides  
Class 1 (single fault tolerant) eye  
safety by design and has been  
tested for compliance with the  
requirements listed in Table 1.  
The eye safety circuit  
continuously monitors the  
optical output power level and  
will disable the transmitter upon  
detecting an unsafe condition  
beyond the scope of Class 1  
certification. Such unsafe  
monitored (address A2h,  
byte 110, bit 7).  
The contents of A2h, byte 110,  
bit 6 are logic OR’d with  
hardware Tx_Disable (pin 3) to  
control transmitter operation.  
Transmit Disable (Tx_Disable)  
The AFBR-57M5APZ accepts a  
TTL and CMOS compatible  
transmit disable control signal  
input (pin 3) which shuts down  
the transmitter optical output. A  
high signal implements this  
function while a low signal  
Transmit Fault (Tx_Fault)  
A catastrophic laser fault will  
activate the transmitter signal,  
TX_FAULT, and disable the  
laser. This signal is an open  
collector output (pull-up  
conditions can be due to inputs  
from the host board (Vcc  
fluctuation, unbalanced code) or  
a fault within the transceiver.  
required on the host board). A  
3
Receiver Section  
The AFBR-57M5APZ high speed  
transmit and receive interfaces  
require SFP MSA compliant signal  
lines on the host board. To  
simplify board requirements,  
biasing resistors and ac coupling  
capacitors are incorporated into  
the SFP transceiver module (per  
SFF-8074i) and hence are not  
required on the host board. The  
Tx_Disable, Tx_Fault, and  
Rx_LOS lines require TTL lines on  
the host board (per SFF-8074i) if  
used. If an application chooses  
not to take advantage of the  
functionality of these pins, care  
must be taken to ground  
adjustments are made at the  
factory prior to shipment.  
The receiver section includes the  
Receiver Optical SubAssembly  
(ROSA) and the amplification/  
quantization circuitry. The  
ROSA, containing a PIN  
Tampering with, modifying,  
misusing or improperly handling  
the AFBR-57M5APZ will void the  
product warranty. It may also  
result in improper operation and  
possibly overstress the laser  
source. Performance degradation  
or device failure may result.  
Connection of the AFBR-  
photodiode and custom  
transimpedance amplifier, is  
located at the optical interface  
and mates with the LC optical  
connector. The ROSA output is  
fed to a custom IC that provides  
post-amplification and  
57M5APZ to a light source not  
compliant with ANSI FC-PI or  
IEEE 802.3 specifications,  
quantization.  
operating above maximum  
operating conditions or in a  
manner inconsistent with it’s  
design and function may result in  
exposure to hazardous light  
radiation and may constitute an  
act of modifying or manufacturing  
a laser product. Persons  
performing such an act are  
required by law to re-certify and  
re-identify the laser product  
under the provisions of U.S. 21  
CFR (Subchapter J) and TUV.  
Receiver Loss of Signal (Rx_LOS)  
The post-amplification IC also  
includes transition detection  
circuitry which monitors the ac  
level of incoming optical signals  
and provides a TTL/CMOS  
compatible status signal to the  
host (pin 8). An adequate optical  
input results in a low Rx_LOS  
output while a high Rx_LOS  
output indicates an unusable  
optical input. The Rx_LOS  
thresholds are factory set so that  
a high output indicates a definite  
optical fault has occurred.  
Rx_LOS can also be monitored  
via the two-wire serial interface  
(address A2h, byte 110, bit 1).  
Tx_Disable (for normal  
operation).  
Figure 2 depicts the recom-  
mended interface circuit to link  
the AFBR-57M5APZ to  
supporting physical layer ICs.  
Timing for MSA compliant  
control signals implemented in  
the transceiver are listed in  
Figure 4.  
Ordering Information  
Application Support  
Please contact your local field  
sales engineer or one of Agilent  
Technologies franchised  
An Evaluation Kit and Reference  
Designs are available to assist in  
evaluation of the AFBR-  
57M5APZ. Please contact your  
local Field Sales representative  
for availability and ordering  
details.  
distributors for ordering  
information. For technical  
information, please visit Agilent  
Technologies’ WEB page at  
www.agilent.com or contact  
Agilent Technologies Semicon-  
ductor Products Customer  
Response Center at 1-800-235-  
0312. For information related to  
SFF Committee documentation  
visit www.sffcommittee.org.  
Functional Data I/O  
The AFBR-57M5APZ interfaces  
with the host circuit board  
through twenty I/O pins (SFP  
electrical connector) identified  
by function in Table 2. The  
board layout for this interface is  
depicted in Figure 6.  
Caution  
There are no user serviceable  
parts nor maintenance  
requirements for the AFBR-  
57M5APZ. All mechanical  
4
Regulatory Compliance  
The first case is during handling of regulation by the FCC in the United  
The AFBR-57M5APZ complies with the transceiver prior to insertion  
all applicable laws and regulations into an SFP compliant cage. To  
as detailed in Table 1. Certification protect the device, it’s important  
States, CENELEC EN55022 (CISPR  
22) in Europe and VCCI in Japan.  
The AFBR-57M5APZ’s compliance  
to these standards is detailed in  
Table 1. The metal housing and  
shielded design of the AFBR-  
57M5APZ minimizes the EMI  
challenge facing the equipment  
designer.  
level is dependent on the overall  
configuration of the host  
to use normal ESD handling pre-  
cautions. These include use of  
grounded wrist straps, work-  
benches and floor wherever a  
transceiver is handled.  
equipment. The transceiver  
performance is offered as a figure  
of merit to assist the designer.  
Electrostatic Discharge (ESD)  
The AFBR-57M5APZ is compatible  
with ESD levels found in typical  
manufacturing and operating  
environments as described in Table  
1. In the normal handling and  
operation of optical transceivers,  
ESD is of concern in two  
The second case to consider is  
static discharges to the exterior of  
the host equipment chassis after  
installation. If the optical interface  
is exposed to the exterior of host  
equipment cabinet, the transceiver  
may be subject to system level ESD  
requirements.  
EMI Immunity (Susceptibility)  
Due to its shielded design, the EMI  
immunity of the AFBR-57M5APZ  
exceeds typical industry standards.  
Flammability  
The AFBR-57M5APZ optical  
transceiver is made of metal and  
high strength, heat resistant,  
chemical resistant and UL 94V-0  
flame retardant plastic.  
circumstances.  
Electromagnetic Interference (EMI)  
Equipment incorporating gigabit  
transceivers is typically subject to  
Table 1. Regulatory Compliance  
Feature  
Test Method  
Performance  
Class 1 (> 2000 Volts)  
Electrostatic Discharge (ESD)  
to the Electrical Pins  
MIL-STD-883C  
Method 3015.4  
Electrostatic Discharge (ESD)  
to the Duplex LC Receptacle  
Variation of IEC 61000-4-2  
Typically, no damage occurs with 25 kV when  
the duplex LC connector receptacle is  
contacted by a Human Body Model probe.  
GR1089  
10 contacts of 8 kV on the electrical faceplate  
with device inserted into a panel.  
Electrostatic Discharge (ESD)  
to the Optical Connector  
Variation of IEC 801-2  
Air discharge of 15 kV (min.) contact to  
connector without damage.  
Electromagnetic Interference  
(EMI)  
FCC Class B  
CENELEC EN55022 Class B  
(CISPR 22A)  
System margins are dependent on customer  
board and chassis design.  
VCCI Class 1  
Immunity  
Variation of IEC 61000-4-3  
Typically shows no measurable effect from a  
10 V/m field swept from 10 MHz to 1 GHz.  
Laser Eye Safety and  
Equipment Type Testing  
US FDA CDRH AEL Class 1  
US21 CFR, Subchapter J per  
Paragraphs 1002.10  
and 1002.12  
CDRH certification # 9720151-55  
TUV file # TBD  
BAUART  
¨
GEPRUFT  
(IEC) EN60825-1: 1994 + A11 + A2  
(IEC) EN60825-2: 1994 + A1  
(IEC) EN60950: 1992 + A1 + A2 +  
A3 + A4 + A11  
¨
TUV  
TYPE  
APPROVED  
Rheinland  
Product Safety  
Component Recognition  
Underwriters Laboratories and  
Canadian Standards Association  
Joint Component Recognition  
for Information Technology  
Equipment including Electrical  
Business Equipment  
UL File #E173874  
RoHS Compliance  
5
Less than 1000 ppm of cadmium, lead, mercury,  
hexavalent chromium, polybrominated biphenyls,  
and polybrominated biphenyl ethers.  
V
,T  
CC  
GND,T  
6.8 kΩ  
Tx DIS  
Tx_DISABLE  
Tx_FAULT  
Tx FAULT  
0.01 µF  
0.01 µF  
TD+  
100 Ω  
TD–  
LASER DRIVER  
4.7 k to 10 kΩ  
0.1 µF  
1 µH  
V
V
,T  
CC  
3.3 V  
10 µF  
SERDES IC  
0.1 µF  
V
,R  
V
CC  
1 µH  
10 µF  
,R  
PROTOCOL IC  
CC  
,R  
CC  
0.1 µF  
50 Ω  
4.7 k to  
10 kΩ  
50 Ω  
0.01 µF  
RD+  
100 Ω  
RD–  
0.01 µF  
Rx LOS  
LOSS OF SIGNAL  
POST AMPLIFIER  
3.3 V  
GND,R  
4.7 k to 10 kΩ  
4.7 k to 10 kΩ  
MOD_DEF0  
MOD_DEF1  
MOD_DEF2  
4.7 k to 10 kΩ  
MODULE DETECT  
SCL  
SDA  
Figure 2. Typical application configuration.  
1 µH  
1 µH  
V
T
CC  
0.1 µF  
0.1 µF  
3.3 V  
V
R
CC  
10 µF  
0.1 µF  
10 µF  
SFP MODULE  
HOST BOARD  
NOTE: INDUCTORS MUST HAVE LESS THAN 1 SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE.  
Figure 3. Recommended power supply filter.  
6
Table 2. Pin Description  
Pin  
1
Name  
VeeT  
Function/Description  
Notes  
Transmitter Ground  
2
TX_FAULT  
TX_DISABLE  
MOD-DEF2  
MOD-DEF1  
MOD-DEF0  
N.C.  
Transmitter Fault Indication – High indicates a fault condition  
Transmitter Disable – Module electrical input disables on high or open  
Module Definition 2 – Two wire serial ID interface data line (SDA)  
Module Definition 1 – Two wire serial ID interface clock line (SCL)  
Module Definition 0 – Grounded in module (module present indicator)  
Note 1  
Note 2  
Note 3  
Note 3  
Note 3  
3
4
5
6
7
8
RX_LOS  
VeeR  
Loss of Signal – High indicates loss of received optical signal  
Receiver Ground  
Note 4  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
VeeR  
Receiver Ground  
VeeR  
Receiver Ground  
RD-  
Inverse Received Data Out  
Received Data Out  
Note 5  
Note 5  
RD+  
VeeR  
Receiver Ground  
VccR  
Receiver Power + 3.3 V  
Transmitter Power + 3.3 V  
Transmitter Ground  
Note 6  
Note 6  
VccT  
VeeT  
TD+  
Transmitter Data In  
Note 7  
Note 7  
TD-  
Inverse Transmitter Data In  
Transmitter Ground  
VeeT  
Notes:  
1. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7 k – 10 kresistor on the host board. When high, this output  
indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8 V.  
2. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is internally pulled up (within the transceiver) with a 6.8 kΩ  
resistor.  
Low (0 – 0.8 V):  
Between (0.8 V and 2.0 V):  
High (2.0 – Vcc max) or OPEN:  
Transmitter on  
Undefined  
Transmitter Disabled  
3. The signals Mod-Def 0, 1, 2 designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 kresistor on the host board.  
Mod-Def 0 is grounded by the module to indicate the module is present  
Mod-Def 1 is serial clock line (SCL) of two wire serial interface  
Mod-Def 2 is serial data line (SDA) of two wire serial interface  
4. RX_LOS (Rx Loss of Signal) is an open collector/drain output that must be pulled up with a 4.7 k – 10 kresistor on the host board. When high, this  
output indicates the received optical power is below the worst case receiver sensitivity (as defined by the standard in use). Low indicates normal  
operation. In the low state, the output will be pulled to < 0.8 V.  
5. RD-/+ designate the differential receiver outputs. They are AC coupled 100 differential lines which should be terminated with 100 differential  
at the host SERDES input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these lines will be  
between 600 and 1600 mV differential (300 – 800 mV single ended) when properly terminated.  
6. VccR and VccT are the receiver and transmitter power supplies. They are defined at the SFP connector pin. The maximum supply current is 300 mA  
and the associated in-rush current will typically be no more than 30 mA above steady state after 2 microseconds.  
7. TD-/+ designate the differential transmitter inputs. They are AC coupled differential lines with 100 differential termination inside the module. The  
AC coupling is done inside the module and is not required on the host board. The inputs will accept differential swings of 400 – 2400 mV (200 –  
1200 mV single ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single ended) be used for best  
EMI performance.  
7
Table 3. Absolute Maximum Ratings  
Parameter  
Symbol  
TS  
Minimum  
Maximum  
100  
Unit  
C
Notes  
Storage Temperature  
Case Operating Temperature  
Relative Humidity  
-40  
-40  
5
Note 1, 2  
Note 1, 2  
Note 1  
TC  
100  
C
RH  
95  
%
V
Supply Voltage  
VccT, R  
VIN  
-0.5  
-0.5  
3.8  
Note 1, 2, 3  
Note 1  
Low Speed Input Voltage  
Vcc+0.5  
V
Notes;  
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short  
period of time. See Reliability Data Sheet for specific reliability performance.  
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not  
implied, and damage to the device may occur over an extended period of time.  
3. The module supply voltages, VCCT and VCCR must not differ by more than 0.5 V or damage to the device may occur.  
Table 4. Recommended Operating Conditions  
Parameter  
Symbol  
TC  
Minimum  
-10  
Maximum  
85  
Unit  
°C  
Notes  
Case Operating Temperature  
Supply Voltage  
Data Rate  
Note 1, 2  
Note 2  
Note 2  
VccT, R  
2.97  
3.63  
V
1.0625  
2.125  
Gb/s  
Notes:  
1. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system  
thermal design.  
2. Recommended Operating Conditions are those values for which functional performance and device reliability is implied.  
Table 5. Transceiver Electrical Characteristics  
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ± 10%)  
Parameter  
Symbol  
Minimum  
Typical  
Maximum  
Unit  
Notes  
AC Electrical Characteristics  
Power Supply Noise Rejection (peak-peak)  
DC Electrical Characteristics  
Module Supply Current  
PSNR  
100  
mV  
Note 1  
ICC  
210  
mA  
mW  
V
Power Dissipation  
PDISS  
VOH  
VOL  
765  
Low Speed Outputs:  
Transmit Fault (TX_FAULT), Loss of Signal  
(RX_LOS), MOD-DEF 2  
2.0  
VccT,R+0.3  
0.8  
Note 2  
Note 3  
V
Low Speed Inputs:  
Transmit Disable (TX_DIS),  
MOD-DEF 1, MOD-DEF2  
VIH  
VIL  
2.0  
0
Vcc  
0.8  
V
V
Notes:  
1. Filter per SFP specification is required on host board to remove 10 Hz to 2 MHz content.  
2. Pulled up externally with a 4.7 k – 10 kresistor on the host board to 3.3 V.  
3. Mod-Def1 and Mod-Def2 must be pulled up externally with a 4.7 k – 10 kresistor on the host board to 3.3 V.  
8
Table 6. Transmitter and Receiver Electrical Characteristics  
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ± 10%)  
Parameter  
Symbol  
Minimum  
Typical Maximum  
Unit  
Notes  
High Speed Data Input:  
VI  
400  
2400  
mV  
Note 1  
Transmitter Differential Input Voltage (TD +/-)  
High Speed Data Output:  
Receiver Differential Output Voltage (RD +/-)  
Vo  
TJ  
600  
1600  
mV  
Note 2  
Note 3  
Receiver Contributed Total Jitter  
(2.125 Gb/s)  
0.26  
124  
UI  
ps  
UI  
ps  
UI  
ps  
ps  
Receiver Contributed Total Jitter  
(1.0625 Gb/s)  
TJ  
0.22  
205  
Note 3  
Note 3  
Note 4  
Receiver Contributed Total Jitter  
(1.25 Gb/s)  
TJ  
0.332  
266  
Receiver Electrical Output Rise & Fall Times  
(20-80%)  
tr, tf  
50  
150  
Notes:  
1. Internally AC coupled and terminated (100 Ohm differential).  
2. Internally AC coupled but requires an external load termination (100 Ohm differential).  
3. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed RJ  
and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from the  
oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual  
contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with the  
worst case specified component jitter input.  
4. 20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern.  
9
Table 7. Transmitter Optical Characteristics  
(TC = -10°C to 85°C, VccT, VccR = 3.3V ±10%)  
Parameter  
Symbol  
Minimum Typical Maximum Unit  
Notes  
Modulated Optical Output Power (OMA)  
(Peak-to-Peak) 2.125 Gb/s  
Tx,OMA  
196  
µW  
Note 1  
Modulated Optical Output Power (OMA)  
(Peak-to-Peak) 1.0625 Gb/s  
Tx,OMA  
156  
µW  
Note 2  
Average Optical Output Power  
Optical Extinction Ratio  
Pout  
ER  
-9.0  
9
dBm  
dB  
Note 3, 4  
Note 5  
Center Wavelength  
lC  
830  
860  
0.85  
150  
-118  
0.25  
120  
0.27  
252  
0.284  
227  
-35  
nm  
nm  
ps  
Spectral Width – rms  
s,rms  
tr, tf  
RIN  
TJ  
Optical Rise/Fall Time (2.125 Gb/s)  
RIN 12 (OMA)  
20% - 80%  
Note 6  
dB/Hz  
UI  
Transmitter Contributed Total Jitter (2.125 Gb/s)  
ps  
Transmitter Contributed Total Jitter (1.0625 Gb/s) TJ  
UI  
Note 6  
ps  
Transmitter Contributed Total Jitter (1.25 Gb/s)  
TJ  
UI  
Note 6  
ps  
Pout TX_DISABLE Asserted  
POFF  
dBm  
Notes:  
1. An OMA of 196 µW is approximately equal to an average power of –9 dBm, avg assuming an Extinction Ratio of 9 dB.  
2. An OMA of 156 µW is approximately equal to an average power of –10 dBm, avg assuming an Extinction Ratio of 9 dB.  
3. Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power, max.  
4. Into 50/125 µm (0.2 NA) multi-mode optical fiber.  
5. Extinction ratio of 9 dB valid when RATE_SELECT signal is driven low.  
6. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed RJ  
-12  
and contributed DJ. Contributed RJ is calculated for 1x10 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from the  
oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual  
contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with the  
worst case specified component jitter input.  
10  
Table 8. Receiver Optical Characteristics  
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)  
Parameter  
Symbol  
Min. Typ.  
Max.  
Unit  
Notes  
Input Optical Power [Overdrive]  
PIN  
0
dBm, avg  
Input Optical Modulation Amplitude  
(Peak-to-Peak) 2.125 Gb/s [Sensitivity]  
OMA  
49  
31  
µW, OMA Notes 1, 2  
µW, OMA Notes 1, 3  
dBm  
Input Optical Modulation Amplitude  
(Peak-to-Peak) 1.0625 Gb/s [Sensitivity]  
OMA  
Receiver Sensitivity  
(Optical Input Power)  
PRMIN  
17  
Stressed Receiver Sensitivity  
(OMA) 2.125 Gb/s  
96  
µW, OMA 50/125 µm fiber, Note 4  
109  
55  
µW, OMA 62.5/125 µm fiber, Note 4  
Stressed Receiver Sensitivity  
(OMA) 1.0625 Gb/s  
µW, OMA 50/125 µm fiber, Note 5  
67  
µW, OMA 62.5/125 µm fiber, Note 5  
Stressed Receiver Sensitivity  
(OMA) 1.25 Gb/s  
-13.5  
-12.5  
12  
dBm  
dBm  
dB  
Return Loss  
Bit Error Rate  
BER  
PA  
10^-12  
27.5  
Loss of Signal – Assert  
µW, OMA  
-30  
31  
-17.5  
dBm, avg Note 6  
µW, OMA  
Loss of Signal - De-Assert  
PD  
-17.0  
0.5  
dBm, avg Note 6  
dB  
Loss of Signal Hysteresis  
PD - PA  
Notes:  
1. Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input.  
2. An OMA of 49 µW is approximately equal to an average power of –15 dBm, avg with an Extinction Ratio of 9 dB.  
3. An OMA of 31 µW is approximately equal to an average power of –17 dBm, avg with an Extinction Ratio of 9 dB.  
4. 2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 1.26 dB for 50 µm fiber and 2.03 dB for 62.5 µm fiber. Stressed receiver DCD  
component min. (at TX) is 40 ps.  
5. 1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 0.96 dB for 50 µm fiber and 2.18 dB for 62.5 µm fiber. Stressed receiver DCD  
component min. (at TX) is 80 ps.  
6. These average power values are specified with an Extinction Ratio of 9 dB. The loss of signal circuitry responds to valid 8B/10B encoded peak to  
peak input optical power, not average power.  
11  
Table 9. Transceiver SOFT DIAGNOSTIC Timing Characteristics  
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ± 10%)  
Parameter  
Symbol  
Minimum  
Maximum  
Unit  
µs  
Notes  
Hardware TX_DISABLE Assert Time  
Hardware TX_DISABLE Negate Time  
Time to initialize, including reset of TX_FAULT  
Hardware TX_FAULT Assert Time  
Hardware TX_DISABLE to Reset  
Hardware RX_LOS DeAssert Time  
Hardware RX_LOS Assert Time  
Software TX_DISABLE Assert Time  
Software TX_DISABLE Negate Time  
Software Tx_FAULT Assert Time  
Software Rx_LOS Assert Time  
Software Rx_LOS De-Assert Time  
Analog parameter data ready  
Serial bus hardware ready  
t_off  
10  
Note 1  
Note 2  
Note 3  
Note 4  
Note 5  
Note 6  
Note 7  
Note 8  
Note 9  
Note 10  
Note 11  
Note 12  
Note 13  
Note 14  
Note 15  
t_on  
1
ms  
ms  
µs  
t_init  
300  
100  
t_fault  
t_reset  
10  
µs  
t_loss_on  
t_loss_off  
t_off_soft  
t_on_soft  
t_fault_soft  
t_loss_on_soft  
t_loss_off_soft  
t_data  
100  
100  
100  
100  
100  
100  
100  
1000  
300  
10  
µs  
µs  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
ms  
kHz  
t_serial  
Write Cycle Time  
t_write  
Serial ID Clock Rate  
f_serial_clock  
400  
Notes:  
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.  
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.  
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.  
4. From power on or negation of TX_FAULT using TX_DISABLE.  
5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.  
6. Time from loss of optical signal to Rx_LOS Assertion.  
7. Time from valid optical signal to Rx_LOS De-Assertion.  
8. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured  
from falling clock edge after stop bit of write transaction.  
9. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of nominal.  
10. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.  
11. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal.  
12. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal.  
13. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.  
14. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).  
15. Time from stop bit to completion of a 1-8 byte write command.  
12  
Table 10. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics  
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ± 10%)  
Parameter  
Symbol Min. Units Notes  
Transceiver Internal Temperature  
Accuracy  
TINT  
±3.0  
°C  
Temperature is measured internal to the transceiver.  
Valid from = -10°C to 85°C case temperature.  
Transceiver Internal Supply  
Voltage Accuracy  
VINT  
±0.1  
V
Supply voltage is measured internal to the transceiver  
and can, with less accuracy, be correlated to  
voltage at the SFP Vcc pin. Valid over 3.3 V ± 10%.  
Transmitter Laser DC Bias Current  
Accuracy  
IINT  
PT  
±10  
±3.0  
±3.0  
%
IINT is better than ±10% of the nominal value.  
Transmitted Average Optical  
Output Power Accuracy  
dB  
dB  
Coupled into 50/125 µm multi-mode fiber. Valid from  
100 µW to 500 µW, avg.  
Received Average Optical Input  
Power Accuracy  
PR  
Coupled from 50/125 µm multi-mode fiber. Valid from  
31 µW to 500 µW, avg.  
V
T,R > 2.97 V  
TX_FAULT  
V
T,R > 2.97 V  
TX_FAULT  
CC  
CC  
TX_DISABLE  
TX_DISABLE  
TRANSMITTED SIGNAL  
TRANSMITTED SIGNAL  
t_init  
t_init  
t-init: TX DISABLE NEGATED  
t-init: TX DISABLE ASSERTED  
V
T,R > 2.97 V  
TX_FAULT  
TX_FAULT  
TX_DISABLE  
CC  
TX_DISABLE  
TRANSMITTED SIGNAL  
TRANSMITTED SIGNAL  
t_off  
t_on  
t_init  
INSERTION  
t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED  
t-off & t-on: TX DISABLE ASSERTED THEN NEGATED  
OCCURANCE OF FAULT  
OCCURANCE OF FAULT  
TX_FAULT  
TX_FAULT  
TX_DISABLE  
TX_DISABLE  
TRANSMITTED SIGNAL  
TRANSMITTED SIGNAL  
t_fault  
t_reset  
* SFP SHALL CLEAR TX_FAULT IN  
t_init*  
< t_init IF THE FAILURE IS TRANSIENT  
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED  
t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED  
OCCURANCE OF FAULT  
TX_FAULT  
TX_DISABLE  
OCCURANCE  
OF LOSS  
OPTICAL SIGNAL  
LOS  
TRANSMITTED SIGNAL  
t_fault  
t_loss_on  
t_loss_off  
t_reset  
* SFP SHALL CLEAR TX_FAULT IN  
t_init*  
< t_init IF THE FAILURE IS TRANSIENT  
t-fault: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL NOT RECOVERED  
t-loss-on & t-loss-off  
Figure 4. Transceiver timing diagrams (module installed except where noted).  
13  
Table 12. EEPROM Serial ID Memory Contents Conventional SFP Memory (Address A0h)  
Byte # Data  
Decimal Hex  
Byte #  
Decimal  
Data  
Hex  
Notes  
Notes  
0
03  
04  
07  
00  
00  
00  
00  
20  
40  
0C  
05  
01  
15  
00  
00  
00  
55  
55  
00  
00  
41  
47  
49  
4C  
45  
4E  
54  
20  
20  
SFP physical device  
SFP function defined by serial ID only  
LC optical connector  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
00  
30  
D3  
41  
46  
42  
52  
2D  
35  
37  
4D  
35  
41  
50  
5A  
20  
20  
20  
20  
20  
20  
20  
20  
03  
52  
00  
Hex Byte of Vendor OUI[4]  
1
Hex Byte of Vendor OUI[4]  
2
Hex Byte of Vendor OUI[4]  
3
“A” - Vendor Part Number ASCII character  
“F” - Vendor Part Number ASCII character  
“B” - Vendor Part Number ASCII character  
“R” - Vendor Part Number ASCII character  
“-” - Vendor Part Number ASCII character  
“5” - Vendor Part Number ASCII character  
“7” - Vendor Part Number ASCII character  
“M” - Vendor Part Number ASCII character  
“5” - Vendor Part Number ASCII character  
“A” - Vendor Part Number ASCII character  
“P” - Vendor Part Number ASCII character  
“Z” - Vendor Part Number ASCII character  
“ ” - Vendor Part Number ASCII character  
“ ” - Vendor Part Number ASCII character  
“ ” - Vendor Part Number ASCII character  
“ ” - Vendor Part Number ASCII character  
“ ” - Vendor Part Number ASCII character  
“ ” - Vendor Part Number ASCII character  
“ ” - Vendor Part Number ASCII character  
“ ” - Vendor Part Number ASCII character  
Hex Byte of Laser Wavelength[5]  
4
5
6
7
Intermediate distance (per FC-PI)  
8
Shortwave laser without OFC (open fiber control)  
Multi-mode 50 µm and 62.5 µm optical media  
100 & 200 Mbytes/sec FC-PI speed[1]  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Compatible with 8B/10B encoded data  
2100 MBit/sec nominal bit rate (2.125 Gbit/s)  
300 m of 50/125 µm fiber @ 2.125GBit/sec[2]  
150 m of 62.5/125 µm fiber @ 2.125GBit/sec[3]  
“A” - Vendor Name ASCII character  
“G” - Vendor Name ASCII character  
“I” - Vendor Name ASCII character  
“L” - Vendor Name ASCII character  
“E” - Vendor Name ASCII character  
“N” - Vendor Name ASCII character  
“T” - Vendor Name ASCII character  
“ ” - Vendor Name ASCII character  
“ ” - Vendor Name ASCII character  
Hex Byte of Laser Wavelength[5]  
Checksum for Bytes 0-62[6]  
00  
3A  
Hardware SFP TX_DISABLE, TX_FAULT,  
& RX_LOS  
29  
30  
31  
32  
33  
34  
20  
20  
20  
20  
20  
20  
“ ” - Vendor Name ASCII character  
“ ” - Vendor Name ASCII character  
“ ” - Vendor Name ASCII character  
“ ” - Vendor Name ASCII character  
“ ” - Vendor Name ASCII character  
“ ” - Vendor Name ASCII character  
66  
00  
00  
67  
68-83  
84-91  
92  
Vendor Serial Number ASCII characters[7]  
Vendor Date Code ASCII characters[8]  
Digital Diagnostics, Internal Cal, Rx Pwr Avg  
68  
F0  
93  
A/W, Soft SFP TX_DISABLE, TX_FAULT,  
& RX_LOS  
35  
36  
20  
00  
“ ” - Vendor Name ASCII character  
94  
01  
00  
SFF-8472 Compliance to revision 9.3  
Checksum for Bytes 64-94[6]  
95  
96 - 255  
Notes:  
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec.  
2. Link distance with 50/125 µm cable at 1.0625 GBit/sec is 500 m. Link distance at 2.125 GBit/sec is 300 m.  
3. Link distance with 62.5/125 µm cable at 1.0625 GBit/sec is 300 m. Link distance with 62.5/125 µm cable at 2.125 GBit/sec is 150 m.  
4. The IEEE Organizationally Unique Identifier (OUI) assigned to Agilent Technologies is 00-30-D3 (3 bytes of hex).  
5. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.  
6. Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074) and stored prior to product shipment.  
7. Addresses 68-83 specify the AFBR-57M5APZ ASCII serial number and will vary on a per unit basis.  
8. Addresses 84-91 specify the AFBR-57M5APZ ASCII date code and will vary on a per date code basis.  
14  
Table 13: EEPROM Serial ID Memory Contents Enhanced Feature Set Memory (Address A2h)  
Byte #  
Byte #  
Byte #  
Decimal Notes  
Decimal Notes  
Decimal Notes  
0
Temp H Alarm MSB[1]  
26  
Tx Pwr L Alarm MSB[4]  
104  
Real Time Rx Pwr  
MSB[5]  
1
2
3
4
5
6
Temp H Alarm LSB[1]  
Temp L Alarm MSB[1]  
Temp L Alarm LSB[1]  
Temp H Warning MSB[1]  
Temp H Warning LSB[1]  
Temp L Warning MSB[1]  
27  
28  
29  
30  
31  
32  
Tx Pwr L Alarm LSB[4]  
105  
106  
107  
108  
109  
110  
Real Time Rx Pwr LSB[5]  
Reserved  
Tx Pwr H Warning MSB[4]  
Tx Pwr H Warning LSB[4]  
Tx Pwr L Warning MSB[4]  
Tx Pwr L Warning LSB[4]  
Rx Pwr H Alarm MSB[5]  
Reserved  
Reserved  
Reserved  
Status/Control - See  
Table 14  
7
Temp L Warning LSB[1]  
Vcc H Alarm MSB[2]  
Vcc H Alarm LSB[2]  
33  
Rx Pwr H Alarm LSB[5]  
Rx Pwr L Alarm MSB[5]  
Rx Pwr L Alarm LSB[5]  
Rx Pwr H Warning MSB[5]  
Rx Pwr H Warning LSB[5]  
Rx Pwr L Warning MSB[5]  
Rx Pwr L Warning LSB[5]  
Reserved  
111  
112  
113  
114  
115  
116  
117  
Reserved  
8
34  
Flag Bits - See Table 15  
Flag Bits - See Table 15  
Reserved  
9
35  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
Vcc L Alarm MSB[2]  
Vcc L Alarm LSB[2]  
36  
37  
Reserved  
Vcc H Warning MSB[2]  
Vcc H Warning LSB[2]  
Vcc L Warning MSB[2]  
Vcc L Warning LSB[2]  
Tx Bias H Alarm MSB[3]  
Tx Bias H Alarm LSB[3]  
Tx Bias L Alarm MSB[3]  
Tx Bias L Alarm LSB[3]  
38  
Flag Bits - See Table 15  
Flag Bits - See Table 15  
39  
40-55  
56-94  
95  
118-127 Reserved  
External Calibration Constants[6] 128-247 Customer Writeable  
Checksum for Bytes 0-94[7]  
Real Time Temperature MSB[1]  
Real Time Temperature LSB[1]  
Real Time Vcc MSB[2]  
248-255 Vendor Specific  
96  
97  
98  
Tx Bias H Warning MSB[3] 99  
Real Time Vcc LS[2]  
Tx Bias H Warning LSB[3]  
Tx Bias L Warning MSB[3]  
Tx Bias L Warning LSB[3]  
Tx Pwr H Alarm MSB[4]  
Tx Pwr H Alarm LSB[4]  
100  
Real Time Tx Bias MSB[3]  
Real Time Tx Bias LSB[3]  
Real Time Tx Power MSB[4]  
Real Time Tx Power LSB[4]  
101  
102  
103  
Notes:  
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256°C.  
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 µV.  
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 µA.  
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.  
5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.  
6. Bytes 56-94 are not intended for use with AFBR-57M5APZ, but have been set to default values per SFF-8472.  
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.  
15  
Table 14. EEPROM Serial ID Memory Contents Soft Commands (Address A2h, Byte 110)  
Status/  
Bit # Control Name  
Description  
Notes  
7
6
5
4
3
2
1
0
TX_ DISABLE State  
Digital state of SFP TX_ DISABLE Input Pin (1 = TX_DISABLE asserted)  
Read/write bit for changing digital state of TX_DISABLE function  
Note 1  
Note 1, 2  
Soft TX_ DISABLE  
Reserved  
Reserved  
Reserved  
TX_FAULT State  
RX_LOS State  
Data Ready (Bar)  
Digital state of the SFP TX_FAULT Output Pin (1 = TX_FAULT asserted)  
Digital state of the SFP RX_LOS Output Pin (1 = RX_LOS asserted)  
Note 1  
Note 1  
Indicates transceiver is powered and real time sense data is ready. (0 = Ready) Note 3  
Notes:  
1. The response time for soft commands of the AFBR-57M5APZ is 100 msec as specified by the MSA SFF-8472.  
2. Bit 6 is logic OR’d with the SFP TX_DISABLE input pin 3 ... either asserted will disable the SFP transmitter.  
3. AFBR-57M5APZ meets the MSA SFF-8472 data ready timing of 1000 msec.  
Table 15. EEPROM Serial ID Memory Contents Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117)  
Byte Bit  
Flag Bit Name  
Description  
112  
7
Temp High Alarm  
Temp Low Alarm  
Set when transceiver internal temperature exceeds high alarm threshold  
Set when transceiver internal temperature exceeds low alarm threshold  
Set when transceiver internal supply voltage exceeds high alarm threshold  
Set when transceiver internal supply voltage exceeds low alarm threshold  
Set when transceiver laser bias current exceeds high alarm threshold  
Set when transceiver laser bias current exceeds low alarm threshold  
Set when transmitted average optical power exceeds high alarm threshold  
Set when transmitted average optical power exceeds low alarm threshold  
Set when received average optical power exceeds high alarm threshold  
Set when received average optical power exceeds low alarm threshold  
6
5
Vcc High Alarm  
4
Vcc Low Alarm  
3
Tx Bias High Alarm  
Tx Bias Low Alarm  
Tx Power High Alarm  
Tx Power Low Alarm  
Rx Power High Alarm  
Rx Power Low Alarm  
Reserved  
2
1
0
113  
116  
7
6
0-5  
7
Temp High Warning  
Temp Low Warning  
Vcc High Warning  
Vcc Low Warning  
Tx Bias High Warning  
Tx Bias Low Warning  
Tx Power High Warning  
Tx Power Low Warning  
Rx Power High Warning  
Rx Power Low Warning  
Reserved  
Set when transceiver internal temperature exceeds high warning threshold  
Set when transceiver internal temperature exceeds low warning threshold  
Set when transceiver internal supply voltage exceeds high warning threshold  
Set when transceiver internal supply voltage exceeds low warning threshold  
Set when transceiver laser bias current exceeds high warning threshold  
Set when transceiver laser bias current exceeds low warning threshold  
Set when transmitted average optical power exceeds high warning threshold  
Set when transmitted average optical power exceeds low warning threshold  
Set when received average optical power exceeds high warning threshold  
Set when received average optical power exceeds low warning threshold  
6
5
4
3
2
1
0
117  
7
6
0-5  
16  
AFBR-57M5APZ  
AFBR-57M5APZ  
Figure 5. Module drawing.  
17  
X
Y
34.5  
10  
3x  
7.2  
7.1  
10x 1.05 ± 0.01  
0.1 L X A S  
2.5  
0.85 ± 0.05  
0.1 S X Y  
16.25  
MIN. PITCH  
1
2.5  
B
A
1
PCB  
EDGE  
3.68  
5.68  
20  
PIN 1  
8.58  
8.48  
2x 1.7  
11.08  
14.25  
11.93  
16.25  
REF.  
9.6  
4.8  
11  
10  
SEE DETAIL 1  
9x 0.95 ± 0.05  
2.0  
11x  
0.1 L X A S  
11x 2.0  
5
26.8  
2
10  
3x  
3
41.3  
42.3  
5
3.2  
20x 0.5 ± 0.03  
0.9  
0.06  
L
A S B S  
LEGEND  
20  
PIN 1  
10.53  
10.93  
1. PADS AND VIAS ARE CHASSIS GROUND  
2. THROUGH HOLES, PLATING OPTIONAL  
11.93  
9.6  
0.8  
TYP.  
11  
10  
3. HATCHED AREA DENOTES COMPONENT  
AND TRACE KEEPOUT (EXCEPT  
CHASSIS GROUND)  
4
4. AREA DENOTES COMPONENT  
KEEPOUT (TRACES ALLOWED)  
2 ± 0.005 TYP.  
0.06 A S B S  
2x 1.55 ± 0.05  
0.1 L A S B S  
L
DIMENSIONS ARE IN MILLIMETERS  
DETAIL 1  
Figure 6. SFP host board mechanical layout.  
18  
1.7 ± 0.9  
3.5 ± 0.3  
41.78 ± 0.5  
Tcase REFERENCE POINT  
CAGE ASSEMBLY  
15 MAX.  
11.73 REF  
15.25 ± 0.1  
9.8 MAX.  
10 REF  
(to PCB)  
10.4 ± 0.1  
PCB  
16.25 ± 0.1 MIN. PITCH  
0.4 ± 0.1  
(below PCB)  
DIMENSIONS ARE IN MILLIMETERS  
Figure 7. SFP Assembly drawing.  
19  
Customer Manufacturing Processes  
This module is pluggable and is  
not designed for aqueous wash,  
IR reflow, or wave soldering  
processes.  
www.agilent.com/semiconductors  
For product information and a complete list of  
distributors, please go to our web site.  
For technical assistance call:  
Americas/Canada: +1 (800) 235-0312 or  
(916) 788-6763  
Europe: +49 (0) 6441 92460  
China: 10800 650 0017  
Hong Kong: (+65) 6756 2394  
India, Australia, New Zealand: (+65) 6755 1939  
Japan: (+81 3) 3335-8152(Domestic/Interna-  
tional), or 0120-61-1280(Domestic Only)  
Korea: (+65) 6755 1989  
Singapore, Malaysia, Vietnam, Thailand,  
Philippines, Indonesia: (+65) 6755 2044  
Taiwan: (+65) 6755 1843  
Data subject to change.  
Copyright © 2005 Agilent Technologies, Inc.  
September 21, 2005  
5989-2639EN  

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