AFBR-5805TZ [AVAGO]
ATM Transceivers for SONET OC-3 / SDH STM-1 in Low Cost 1 x 9 Package Style; ATM收发器用于SONET OC - 3 / SDH STM - 1的低成本1 ×9封装形式
| 型号： | AFBR-5805TZ |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | ATM Transceivers for SONET OC-3 / SDH STM-1 in Low Cost 1 x 9 Package Style |
| 文件： | 总14页 (文件大小：223K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AFBR-5805Z/5805TZ/5805AZ/5805ATZ
ATM Transceivers for SONET OC-3 / SDH STM-1
in Low Cost 1 x 9 Package Style
Data Sheet
Description
Features
Full compliance with ATM forum UNI SONET OC-3 mul-
timode fiber physical layer specification
Multisourced 1 x 9 package style with choice of duplex
SC or duplex ST* receptacle
Wave solder and aqueous wash process compatibility
Manufactured in an ISO 9002 certified facility
Single +3.3 V or +5.0 V power supply
The AFBR-5800Z family of transceivers from Avago Tech-
nologies provide the system designer with products
to implement a range of solutions for multimode fiber
SONET OC-3 (SDH STM-1) physical layers for ATM and
other services.
The transceivers are all supplied in the industry standard
1 x 9 SIP package style with either a duplex SC or a duplex
ST* connector interface.
RoHS Compliance
Applications
Multimode fiber ATM backbone links
Multimode fiber ATM wiring closet to desktop links
ATM 2 km Backbone Links
The AFBR-5805Z/-5805TZ are 1300nm products with
optical performance compliant with the SONET STS-3c
(OC-3) Physical Layer Interface Specification. This physical
layer is defined in the ATM Forum User-Network Interface
(UNI) Specification Version 3.0. This document references
the ANSI T1E1.2 specification for the details of the inter-
face for 2 km multimode fiber backbone links.
The ATM 100 Mb/s-125 MBd Physical Layer interface is
best implemented with the AFBR-5803 family of Fast Eth-
ernet and FDDI Transceivers which are specified for use in
this 4B/5B encoded physical layer per the FDDI PMD stan-
dard.
Transmitter Sections
and pin out are compliant with the multisource definition
of the 1 x 9 SIP. The low profile of the Avago Technologies
transceiver design complies with the maximum height
allowed for the duplex SC connector over the entire
length of the package.
The transmitter section of the AFBR-5803Z and AFBR-
5805Z series utilize 1300 nm InGaAsP LEDs. These LEDs
are packaged in the optical subassembly portion of the
transmitter section. They are driven by a custom silicon IC
which converts differential PECL logic signals, ECL refer-
enced (shifted) to a +3.3 V or +5.0 V supply, into an analog
LED drive current.
The optical subassemblies utilize a high volume assem-
bly process together with low cost lens elements which
result in a cost effective building block.
Receiver Sections
The electrical subassembly consists of a high volume
multilayer printed circuit board on which the IC chips and
various surface-mounted passive circuit elements are at-
tached.
The receiver section of the AFBR-5803Z and AFBR-
5805Z series utilize InGaAs PIN photodiodes coupled to
a custom silicon transimpedance preamplifier IC. These
are packaged in the optical subassembly portion of the
receiver.
The package includes internal shields for the electrical
and optical subassemblies to ensure low EMI emissions
and high immunity to external EMI fields.
These PIN/preamplifier combinations are coupled to
a custom quantizer IC which provides the final pulse
shaping for the logic output and the Signal Detect func-
tion. The data output is dif-ferential. The signal detect
output is single-ended. Both data and signal detect
outputs are PECL compatible, ECL referenced (shifted) to
a 3.3 V or +5.0 V power supply.
The outer housing including the duplex SC connector or
the duplex ST ports is molded of filled nonconductive
plastic to provide mechanical strength and electrical iso-
lation. The solder posts of the Avago Technologies design
are isolated from the circuit design of the transceiver
and do not require connection to a ground plane on the
circuit board.
Package
The overall package concept for the Avago Technologies
transceivers consists of three basic elements; the two
optical subassemblies, an electrical subassembly and the
housing as illustrated in Figure1a and Figure 1b.
The transceiver is attached to a printed circuit board with
the nine signal pins and the two solder posts which exit
the bottom of the housing. The two solder posts provide
the primary mechanical strength to withstand the loads
imposed on the transceiver by mating with duplex or
simplex SC or ST connectored fiber cables.
The package outline drawing and pin out are shown in
Figures 2a, 2b and 3. The details of this package outline
ELECTRICAL SUBASSEMBLY
DUPLEX SC
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1a. SC Connector Block Diagram
2
ELECTRICAL SUBASSEMBLY
DUPLEX ST
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1b. ST Connector Block Diagram.
39.12
(1.540)
12.70
(0.500)
Case Temperature
Measurement Point
MAX.
6.35
(0.250)
AREA
RESERVED
FOR
PROCESS
PLUG
25.40
(1.000)
12.70
(0.500)
MAX.
5.93 ± 0.1
(0.233 ± 0.004)
+ 0.08
0.75
– 0.05
3.30 ± 0.38
(0.130 ± 0.015)
+ 0.003
– 0.002
10.35
(0.407)
)
(0.030
MAX.
2.92
(0.115)
+ 0.25
18.52
(0.729)
1.27
– 0.05
+ 0.010
– 0.002
0.46
(0.018)
4.14
(0.163
(0.050
)
Ø
(9x)
NOTE 1
NOTE 1
17.32 20.32
(0.682 (0.800) (0.918)
23.32
23.55
(0.927)
20.32
(0.800)
16.70
(0.657)
[8x(2.54/.100)]
0.87
(0.034)
23.24
(0.915)
15.88
(0.625)
Note 1: Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts
have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2a. Package Outline Drawing
3
42
(1.654)
MAX.
5.99
(0.236)
24.8
(0.976)
12.7
(0.500)
25.4
(1.000)
MAX.
Case Temperature
Measurement Point
+ 0.08
- 0.05
+ 0.003
0.5
(0.020)
(
- 0.002
(
12.0
(0.471)
MAX.
2.6 ±0.4
(0.102 ± 0.016)
3.3 ± 0.38
(0.130 ± 0.015)
± 0.38
(± 0.015)
20.32
0.46
Ø
(0.018)
2.6
(0.102)
Ø
+ 0.25
- 0.05
1.27
NOTE 1
(0.050)
+ 0.010
- 0.002
(
)
20.32
(0.800)
17.4
(0.685)
[(8x (2.54/0.100)]
20.32
(0.800)
22.86
(0.900)
21.4
(0.843)
3.6
(0.142)
1.3
(0.051)
23.38
18.62
(0.921)
(0.733)
Note 1:
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts
have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2b. ST Package Outline Drawing
1 = VEE
2 = RD
3 = RD
4 = SD
5 = VCC
6 = VCC
7 = TD
8 = TD
9 = VEE
N/C
Rx
Tx
N/C
TOP VIEW
Figure 3. Pin Out Diagram.
4
12
10
8
Application Information
AFBR-5805Z, 62.5/125 μm
The Applications Engineering group in the Avago Tech-
nologies Fiber Optics Communication Division is avail-
able to assist you with the technical understanding and
design trade-offs associated with these transceivers. You
can contact them through your Avago Technologies sales
representative.
AFBR-5805Z
50/125 μm
6
4
The following information is provided to answer some of
the most common questions about the use of these parts.
2
0
0.3 0.5
1.0
1.5
2.0
2.5
Transceiver Optical Power Budget versus Link Length
FIBER OPTIC CABLE LENGTH (km)
Optical Power Budget (OPB) is the available optical power
for a fiber optic link to accommodate fiber cable losses
plus losses due to in-line connectors, splices, optical
switches, and to provide margin for link aging and un-
planned losses due to cable plant reconfiguration or
repair.
Figure 4. Optical Power Budget at BOL versus
Fiber Optic Cable Length.
Figure 4 illustrates the predicted OPB associated with the
transceiver series specified in this data sheet at the Begin-
ning of Life (BOL). These curves represent the attenuation
and chromatic plus modal dispersion losses associated
with the 62.5/125 μm and 50/125 μm fiber cables only.
The area under the curves represents the remaining OPB
at any link length, which is available for overcoming non-
fiber cable related losses.
Avago Technologies’ LED technology has produced 1300
nm LED devices with lower aging characteristics than nor-
mally associated with these technologies in the industry.
The industry convention is 1.5 dB aging for 1300 nm LEDs.
The Avago Technologies 1300 nm LEDs are specified to
experience less than 1 dB of aging over normal commeri-
cal equipment mission life periods. Contact your Avago
Technologies sales representative for additional details.
Figure 4 was generated for the 1300 nm transceivers with
a Avago Technologies fiber optic link model containing
the current industry conventions for fiber cable specifica-
tions and the draft ANSI T1E1.2. These optical parameters
are reflected in the guaranteed performance of the trans-
ceiver specifications in this data sheet. This same model
has been used extensively in the ANSI and IEEE commit-
tees, including the ANSI T1E1.2 committee, to establish
the optical performance requirements for various fiber
optic interface standards. The cable parameters used
come from the ISO/IEC JTC1/SC 25/WG3 Generic Cabling
for Customer Premises per DIS 11801 document and the
EIA/TIA-568-A Commercial Building Telecommunications
Cabling Standard per SP-2840.
5
Transceiver Signaling Operating Rate Range and BER
Performance
Transceiver Jitter Performance
The Avago Technologies 1300 nm transceivers are de-
signed to operate per the system jitter allocations stated
in Table B1 of Annex B of the draft ANSI T1E1.2 Revision 3
standard.
For purposes of definition, the symbol (Baud) rate, also
called signaling rate, is the reciprocal of the symbol time.
Data rate (bits/sec) is the symbol rate divided by the en-
coding factor used to encode the data (symbols/bit).
The Avago Technologies 1300 nm transmitters will toler-
ate the worst case input electrical jitter allowed in Annex
B without violating the worst case output jitter require-
ments.
When used in 155 Mb/s SONET OC-3 applications the
performance of the 1300 nm transceivers, AFBR-5805 is
guaranteed to the full conditions listed in product speci-
fication tables.
The Avago Technologies 1300 nm receivers will toler-
ate the worst case input optical jitter allowed in Annex
B without violating the worst case output electrical jitter
allowed.
The transceivers may be used for other applications at
signaling rates different than 155 Mb/s with some varia-
tion in the link optical power budget. Figure 5 gives an
indication of the typical performance of these products at
different rates.
The jitter specifications stated in the following 1300 nm
transceiver specification tables are derived from the
values in Tables B1 of Annex B. They represent the worst
case jitter contribution that the transceivers are allowed
to make to the overall system jitter without violating the
Annex B allocation example. In practice the typical con-
tribution of the Avago Technologies transceivers is well
below these maximum allowed amounts.
These transceivers can also be used for applications
which require different Bit Error Rate (BER) performance.
Figure 6 illustrates the typical trade-off between link BER
and the receivers input optical power level.
2.5
-2
1 x 10
2.0
1.5
1.0
-3
-4
1 x 10
1 x 10
AFBR-5805Z SERIES
-5
-6
1 x 10
1 x 10
CENTER OF SYMBOL
-7
-8
-9
-10
-11
-12
0.5
0
1 x 10
1 x 10
1 x 10
1 x 10
1 x 10
1 x 10
0.5
0
25
50
75 100 125 150 175 200
SIGNAL RATE (MBd)
-6
-4
-2
0
2
4
RELATIVE INPUT OPTICAL POWER - dB
CONDITIONS:
1. PRBS 2 7-1
CONDITIONS:
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
1. 155 MBd
3. BER = 10 -6
2. PRBS 2 7-1
4. TA = +25° C
3. CENTER OF SYMBOL SAMPLING
4. T A = +25°C
5. V = 3.3 V to 5 V dc
5. V = 3.3 V to 5 V dc
CC
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
CC
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 5. Transceiver Relative Optical Power Budget
at Constant BER vs. Signaling Rate.
Figure 6. Bit Error Rate vs. Relative Receiver Input
Optical Power.
6
Recommended Handling Precautions
Shipping Container
Avago Technologies recommends that normal static pre-
cautions be taken in the handling and assembly of these
transceivers to prevent damage which may be induced
by electrostatic discharge (ESD). The AFBR-5800Z series
of transceivers meet MIL-STD-883C Method 3015.4 Class
2 products.
The transceiver is packaged in a shipping container de-
signed to protect it from mechanical and ESD damage
during shipment or storage.
Board Layout - Decoupling Circuit and Ground Planes
It is important to take care in the layout of your circuit
board to achieve optimum performance from these trans-
ceivers. Figure 7 provides a good example of a schematic
for a power supply decoupling circuit that works well
with these parts. It is further recommended that a con-
tiguous ground plane be provided in the circuit board di-
rectly under the transceiver to provide a low inductance
ground for signal return current. This recommendation is
in keeping with good high frequency board layout prac-
tices.
Care should be used to avoid shorting the receiver data or
signal detect outputs directly to ground without proper
current limiting impedance.
Solder and Wash Process Compatibility
The transceivers are delivered with protective process
plugs inserted into the duplex SC or duplex ST connector
receptacle. This process plug protects the optical subas-
semblies during wave solder and aqueous wash process-
ing and acts as a dust cover during shipping.
These transceivers are compatible with either industry
standard wave or hand solder processes.
Rx
Tx
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
AFBR-5805Z
TOP VIEW
Rx
VEE
1
Rx
Tx
Tx
RD
2
RD
3
SD
4
VCC
VCC
TD
7
TD
8
VEE
5
6
9
C1
C2
VCC
R2
R3
L1
L2
C4
TERMINATION
AT PHY
DEVICE
INPUTS
R1
R4
VCC
C3
V
C5
CC FILTER
AT VCC PINS
TRANSCEIVER
R9
R5
R7
TERMINATION
AT TRANSCEIVER
INPUTS
C6
R6
R8
R10
RD
RD
SD
VCC
TD
TD
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 OHMS FOR +5.0 V OPERATION, 82 OHMS FOR +3.3 V OPERATION.
R2 = R3 = R5 = R7 = R9 = 82 OHMS FOR +5.0 V OPERATION, 130 OHMS FOR +3.3 V OPERATION.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Figure 7. Recommended Decoupling and Termination Circuits
7
Board Layout - Hole Pattern
Board Layout - Mechanical
The Avago Technologies transceiver complies with the
circuit board “Common Transceiver Footprint” hole
pattern defined in the original multisource announce-
ment which defined the 1 x 9 package style. This drawing
is reproduced in Figure 8 with the addition of ANSI
Y14.5M compliant dimensioning to be used as a guide in
the mechanical layout of your circuit board.
For applications interested in providing a choice of either
a duplex SC or a duplex ST connector interface, while uti-
lizing the same pinout on the printed circuit board, the ST
port needs to protrude from the chassis panel a minimum
of 9.53mm for sufficient clearance to install the ST con-
nector.
Please refer to Figure 8a for a mechanical layout detailing
the recommended location of the duplex SC and duplex
ST transceiver packages in relation to the chassis panel.
42.0
24.8
9.53
(NOTE 1)
12.0
0.51
12.09
20.32
(0.800)
25.4
2 x Ø 1.9 0.1
(0.075 0.004)
39.12
11.1
6.79
0.75
9 x Ø 0.8 0.1
(0.032 0.004)
20.32
(0.800)
25.4
2.54
(0.100)
TOP VIEW
NOTE 1: MINIMUM DISTANCE FROM FRONT
OF CONNECTOR TO THE PANEL FACE.
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Figure 8b. Recommended Common Mechanical Layout for SC and ST 1 x 9
Connectored Transceivers.
Figure 8a. Recommended Board Layout Hole Pattern
8
Regulatory Compliance
Electromagnetic Interference (EMI)
These transceiver products are intended to enable com- Most equipment designs utilizing these high speed trans-
mercial system designers to develop equipment that ceivers from Avago Technologies will be required to meet
complies with the various international regulations gov- the requirements of FCC in the United States, CENELEC
erning certification of Information Technology Equip- EN55022 (CISPR 22) in Europe and VCCI in Japan.
ment. See the Regulatory Compliance Table for details.
These products are suitable for use in designs ranging
Additional information is available from your Avago Tech-
from a desktop computer with a single transceiver to a
nologies sales representative.
concentrator or switch product with large number of
transceivers.
Electrostatic Discharge (ESD)
In all well-designed chassis, the two 0.5” holes required
There are two design cases in which immunity to ESD
for ST connectors to protrude through will provide 4.6dB
damage is important.
more shielding than one 1.2” duplex SC rectangular
The first case is during handling of the transceiver prior
to mounting it on the circuit board. It is important to
use normal ESD handling precautions for ESD sensitive
devices. These precautions include using grounded wrist
straps, work benches, and floor mats in ESD controlled
areas.
cutout. Thus, in a well-designed chassis, the duplex ST 1 x
9 transceiver emissions will be identical to the duplex SC
1 x 9 transceiver emissions.
200
3.0
180
The second case to consider is static discharges to the
exterior of the equipment chassis containing the trans-
ceiver parts. To the extent that the duplex SC connector
is exposed to the outside of the equipment chassis it may
be subject to whatever ESD system level test criteria that
the equipment is intended to meet.
1.0
160
1.5
140
2.0
tr/f – TRANSMITTER
OUTPUT OPTICAL
RISE/FALL TIMES – ns
2.5
3.0
120
100
1260
1280
1300
1320
1340
1360
l
– TRANSMITTER OUTPUT OPTICAL RISE/FALL TIMES – ns
C
AFBR-5805 TRANSMITTER TEST RESULTS OF I , DI AND
C
t
ARE CORRELATED AND COMPLY WITH THE ALLOWED
r/f
SPECTRAL WIDTH AS A FUNCTION OF CENTER WAVELENGTH
FOR VARIOUS RISE AND FALL TIMES.
Figure 9. Transmitter Output Optical Spectral Width (FWHM) vs.
Transmitter Output Optical Center Wavelength and Rise/Fall Times.
Regulatory Compliance Table
Feature
Test Method
Performance
Electrostatic Discharge
(ESD) to the Electrical Pins Method 3015.4
MIL-STD-883C
Class 2 (2000 to 3999 Volts)
Withstand up to 2200 V applied between electrical pins
Electrostatic Discharge
Variation of
Typically withstand at least 25 kV without damage when the Duplex
SC Connector Receptacle is contacted by a Human Body Model
probe.
(ESD) to the Duplex SC
IEC 801-2
Receptacle
Electromagnetic
Interference (EMI)
FCC Class B
Transceivers typically provide a 13 dB margin (with duplex SC
receptacle) or a 9 dB margin (with duplex ST receptacles) to the
noted standard limits. However, it should be noted that final margin
depends on the customer’s board and chassis design.
CENELEC CEN55022
Class B (CISPR 22B)
VCCI Class 2
Immunity
Variation of IEC 61000-4-3 Typically show no measurable effect from a 10 V/m field swept from
10 to 450 MHz applied to the transceiver when mounted to a circuit
card without a chassis enclosure.
9
5
4
3
2
1
0
Immunity
Equipment utilizing these transceivers will be subject to
radio-frequency electromagnetic fields in some environ-
ments. These transceivers have a high immunity to such
fields.
AFBR-5805Z SERIES
Transceiver Reliability and Performance Qualification
Data
The 1 x 9 transceivers have passed Avago Technologies’
reliability and performance qualification testing and are
undergoing ongoing quality monitoring. Details are avail-
able from your Avago Technologies sales representative.
-3
-2
-1
EYE SAMPLING TIME POSITION (ns)
0
1
2
3
CONDITIONS:
1. TA = +25° C
2. VCC = 3.3 V to 5 V dc
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
4. INPUT OPTICAL POWER IS NORMALIZED TO
CENTER OF DATA SYMBOL.
Ordering Information
5. NOTE 16 AND 17 APPLY.
The AFBR-5805Z/-5805TZ 1300 nm products are available
for production orders through the Avago Technologies
Component Field Sales Offices and Authorized Distribu-
tors world wide.
Figure 10. Relative Input Optical Power vs. Eye
Sampling Time Position.
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to
each parameter in isolation, all other parameters having values within the recommended operating conditions. It
should not be assumed that limiting values of more than one parameter can be applied to the product at the same
time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability.
Parameter
Symbol
TS
Min.
Typ.
Max.
+100
+260
10
Unit
°C
Reference
Storage Temperature
Lead Soldering Temperature
Lead Soldering Time
Supply Voltage
-40
TSOLD
tSOLD
VCC
VI
°C
sec.
V
-0.5
-0.5
7.0
Data Input Voltage
Differential Input Voltage
Output Current
VCC
1.4
V
VD
V
Note 1
IO
50
mA
10
Recommended Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Ambient Operating Temperature
AFBR-5805Z/5805TZ
AFBR-5805AZ/5805ATZ
TA
TA
0
-10
+70
+85
°C
°C
Note A
Note B
Supply Voltage
VCC
VCC
3.135
4.75
3.5
5.25
V
V
Data Input Voltage - Low
VIL - VCC
VIH - VCC
RL
-1.810
-1.165
-1.475
-0.880
V
Data Input Voltage - High
V
Data and Signal Detect Output Load
50
W
Note 2
Notes:
A. Ambient Operating Temperature corresponds to transceiver case temperature of 0°C mininum to +85 °C maximum with necessary airflow
applied. Recommended case temperature measurement point can be found in Figure 2.
B. Ambient Operating Temperature corresponds to transceiver case temperature of -10 °C mininum to +100 °C maximum with necessary airflow
applied. Recommended case temperature measurement point can be found in Figure 2.
Transmitter Electrical Characteristics
(AFBR-5805Z/5805TZ: T = 0°C to +70°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
(AFBR-5805AZ/5805ATZ: T = -10°C to +85°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
Parameter
Symbol
ICC
Min.
Typ.
Max.
175
Unit
Reference
Note 3
Supply Current
135
mA
Power Dissipation
at VCC = 3.3 V
at VCC = 5.0 V
PDISS
PDISS
IIL
0.45
0.67
-2
0.6
0.9
W
W
Data Input Current - Low
-350
μA
μA
Data Input Current - High
IIH
18
350
Receiver Electrical Characteristics
(AFBR-5805Z/5805TZ: T = 0°C to +70°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
(AFBR-5805AZ/5805ATZ: T = -10°C to +85°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V
A
CC
Parameter
Symbol
ICC
Min.
Typ.
87
Max.
120
0.25
0.45
-1.55
-0.88
2.2
Unit
mA
W
W
V
Reference
Note 4
Note 5
Supply Current
Power Dissipation at VCC = 3.3 V
at VCC = 5.0 V
PDISS
PDISS
VOL - VCC
VOH - VCC
tr
0.15
0.3
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
-1.83
-1.085
0.35
Note 6
Note 6
Note 7
Note 7
Note 6
Note 6
Note 7
Note 7
V
ns
ns
V
Data Output Fall Time
tf
0.35
2.2
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Output Rise Time
Signal Detect Output Fall Time
VOL - VCC
VOH - VCC
tr
-1.83
-1.085
0.35
-1.55
-0.88
2.2
V
ns
ns
tf
0.35
2.2
11
Transmitter Optical Characteristics
(AFBR-5805Z/5805TZ: T = 0°C to +70°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
(AFBR-5805AZ/5805ATZ: T = -10°C to +85°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Output Optical Power
62.5/125 μm, NA = 0.275 Fiber
BOL
EOL
PO
-19
-20
-14
dBm avg.
Note 8
Output Optical Power
50/125 μm, NA = 0.20 Fiber
BOL
EOL
PO
-22.5
-23.5
-14
dBm avg.
Note 8
Optical Extinction Ratio
10
dB
Note 9
Output Optical Power at
Logic “0”State
PO (“0”)
-45
dBm avg.
Note 10
Center Wavelength
Spectral Width - FWHM
Optical Rise Time
lC
Dl
tr
1270
1310
137
1.9
1380
nm
nm
ns
Note 22
Note 22
0.6
0.6
3.0
Note 11, 22
Figure 9
Optical Fall Time
tf
1.6
3.0
ns
Note 11, 22
Figure 9
Systematic Jitter Contributed
by the Transmitter
SJ
RJ
1.2
ns p-p
ns p-p
Note 12
Random Jitter Contributed
by the Transmitter
0.69
Note 13
Receiver Optical and Electrical Characteristics
(AFBR-5805Z/5805TZ: T = 0°C to +70°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
(AFBR-5805AZ/5805ATZ: T = -10°C to +85°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Input Optical Power
PIN Min. (W)
-34
-30
dBm avg.
Note 14
Minimum at Window Edge
Figure 10
Input Optical Power
PIN Min. (C)
-35
-31
dBm avg.
Note 15
Minimum at Eye Center
Figure 10
Input Optical Power Maximum
Operating Wavelength
PIN Max.
-14
dBm avg.
nm
Note 14
l
1270
1380
1.2
Systematic Jitter Contributed
by the Receiver
SJ
ns p-p
Note 16
Note 17
Random Jitter Contributed
by the Receiver
RJ
1.91
-31
ns p-p
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
PA
PD +1.5 dB
dBm avg.
dBm avg.
dB
Note 18
Note 19
PD
-45
1.5
0
PA - PD
Signal Detect Assert Time
(off to on)
2
8
100
350
μs
Note 20
Note 21
Signal Detect Deassert Time
(on to off)
0
μs
12
Notes:
12. Systematic Jitter contributed by the transmitter is defined as the
combination of Duty Cycle Distortion and Data Dependent Jitter.
Systematic Jitter is measured at 50% threshold using a 155.52 MBd
1. This is the maximum voltage that can be applied across the Differen-
tial Transmitter Data Inputs to prevent damage to the input ESD pro-
tection circuit.
7
(77.5 MHz square-wave), 2 -1 psuedo random data pattern input
signal.
2. The outputs are terminated with 50 connected to V -2 V.
CC
3. The power supply current needed to operate the transmitter is pro-
vided to differential ECL circuitry. This circuitry maintains a nearly
constant current flow from the power supply. Constant current op-
eration helps to prevent unwanted electrical noise from being gen-
erated and conducted or emitted to neighboring circuitry.
13. Random Jitter contributed by the transmitter is specified with a
155.52 MBd (77.5 MHz square-wave) input signal.
14. This specification is intended to indicate the performance of the
receiver section of the transceiver when Input Optical Power signal
characteristics are present per the following definitions. The Input
Optical Power dynamic range from the minimum level (with a
window time-width) to the maximum level is the range over which
4. This value is measured with the outputs terminated into 50
W connected to V - 2 V and an Input Optical Power level of
-14 dBm average.
5. The power dissipation value is the power dissipated in the receiver
itself. Power dissipation is calculated as the sum of the products of
supply voltage and currents, minus the sum of the products of the
output voltages and currents.
6. This value is measured with respect to V with the output termi-
nated into 50 connected to V - 2 V.
7. The output rise and fall times are measured between 20% and 80%
CC
the receiver is guaranteed to provide output data with a Bit Error
-10
Ratio (BER) better than or equal to 1 x 10
.
• At the Beginning of Life (BOL)
• Over the specified operating temperature and voltage ranges
CC
23
• Input is a 155.52 MBd, 2 - 1 PRBS data pattern with 72 “1”s and
CC
72“0”s inserted per the CCITT (now ITU-T) recommendation G.958
Appendix I.
levels with the output connected to V -2 V through 50 .
CC
• Receiver data window time-width is 1.23 ns or greater for the
clock recovery circuit to operate in. The actual test data window
time-width is set to simulate the effect of worst case optical input
jitter based on the transmitter jitter values from the specification
tables. The test window time-width is AFBR-5805 3.32 ns.
8. These optical power values are measured with the following condi-
tions:
• The Beginning of Life (BOL) to the End of Life (EOL) optical
power degradation is typically 1.5 dB per the industry con-
vention for long wavelength LEDs. The actual degradation
observed in Avago Technologies’ 1300 nm LED products is
< 1 dB, as specified in this data sheet.
• Transmitter operating with a 155.52 MBd, 77.5 MHz square-wave,
input signal to simulate any cross-talk present between the trans-
mitter and receiver sections of the transceiver.
• Over the specified operating voltage and temperature ranges.
• With 25 MBd (12.5 MHz square-wave), input signal.
15. All conditions of Note 14 apply except that the measurement is
made at the center of the symbol with no window time-width.
16. Systematic Jitter contributed by the receiver is defined as the
combination of Duty Cycle Distortion and Data Dependent Jitter.
Systematic Jitter is measured at 50% threshold using a 155.52 MBd
• At the end of one meter of noted optical fiber with cladding
modes removed.
The average power value can be converted to a peak power value by
adding 3 dB.
7
(77.5 MHz square-wave), 2 - 1 psuedo random data pattern input
9. The Extinction Ratio is a measure of the modulation depth of
the optical signal. The data “1” output optical power is com-
pared to the data “0” peak output optical power and expressed
in decibels. With the transmitter driven by a 25 MBd (12.5 MHz
square-wave) input signal, the average optical power is mea-
sured. The data “1” peak power is then calculated by adding
3 dB to the measured average optical power. The data “0” output
optical power is found by measuring the optical power when the
transmitter is driven by a logic “0” input. The extinction ratio is the
ratio of the optical power at the “1” level compared to the optical
power at the “0”level expressed in decibels.
signal.
17. Random Jitter contributed by the receiver is specified with a 155.52
MBd (77.5 MHz square-wave) input signal.
18. This value is measured during the transition from low to high levels
of input optical power.
19. This value is measured during the transition from high to low levels
of input optical power.
20. The Signal Detect output shall be asserted within 100 μs after a step
increase of the Input Optical Power.
21. Signal detect output shall be de-asserted within 350 μs after a step
decrease in the Input Optical Power.
10. The transmitter will provide this low level of Output Optical Power
when driven by a logic “0” input. This can be useful in link trouble-
shooting.
22. The AFBR-5805 transceiver complies with the requirements for the
trade-offs between center wavelength, spectral width, and rise/fall
times shown in Figure 9. This figure is derived from the FDDI PMD
standard (ISO/IEC 9314-3 : 1990 and ANSI X3.166 - 1990) per the de-
scription in ANSI T1E1.2 Revision 3. The interpretation of this figure is
that values of Center Wavelength and Spectral Width must lie along
the appropriate Optical Rise/Fall Time curve.
11. The relationship between Full Width Half Maximum and RMS values
for Spectral Width is derived from the assumption of a Gaussian
shaped spectrum which results in a 2.35 X RMS = FWHM relation-
ship. The optical rise and fall times are measured from 10% to 90%
when the transmitter is driven by a 25 MBd (12.5 MHz square-wave)
input signal. The ANSI T1E1.2 committee has designated the pos-
sibility of defining an eye pattern mask for the transmitter optical
output as an item for further study. Avago Technologies will incor-
porate this requirement into the specifications for these products if
it is defined. The AFBR-5805 products typically comply with the tem-
plate requirements of CCITT (now ITU-T) G.957 Section 3.2.5, Figure
2 for the STM-1 rate, excluding the optical receiver filter normally
associated with single mode fiber measurements which is the likely
source for the ANSI T1E1.2 committee to follow in this matter.
13
Ordering Information
The AFBR-5805Z/5805TZ/5805AZ/5805ATZ 1300 nm
products are available for production orders through the
Avago Technologies Component Field Sales Offices and
Authorized Distributors world wide.
0 °C to +70 °C
AFBR-5805Z/5805TZ
-10 °C to +85 °C
AFBR-5805AZ/5805ATZ
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
Note:
The “T”in the product numbers indicates a transceiver with a duplex
ST connector receptacle. Product numbers without a “T”indicate
transceivers with a duplex SC connector receptacle.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-3433EN
AV02-0433EN - April 9, 2012
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