AFBR-5803ATQZ [AVAGO]

FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style; FDDI , 100 Mb / s的ATM ,并在低成本1 ×9封装形式快速以太网收发器
AFBR-5803ATQZ
型号: AFBR-5803ATQZ
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style
FDDI , 100 Mb / s的ATM ,并在低成本1 ×9封装形式快速以太网收发器

光纤 异步传输模式 放大器 PC 以太网 ATM 通信
文件: 总16页 (文件大小:489K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AFBR-5803AQZ and AFBR-5803ATQZ  
FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers  
in Low Cost 1 x 9 Package Style  
Data Sheet  
Description  
Features  
Full compliance with the optical performance re-  
The AFBR-5800Z family of transceivers from Avago Tech-  
nologies provide the system designer with products  
to implement a range of Fast Ethernet, FDDI and ATM  
(Asynchronous Transfer Mode) designs at the 100 Mb/s-  
125 MBd rate.  
quirements of the FDDI PMD standard  
Full compliance with the FDDI LCF-PMD standard  
Full compliance with the optical performance re-  
quirements of the ATM 100 Mb/s physical layer  
The transceivers are all supplied in the industry standard  
1 x 9 SIP package style with either a duplex SC or a duplex  
ST* connector interface.  
Full compliance with the optical performance re-  
quirements of 100 Base-FX version of IEEE802.3u  
Multisourced 1 x 9 package style with choice of  
FDDI PMD, ATM and Fast Ethernet 2 km Backbone Links  
duplex SC or duplex ST* receptacle  
Wave solder and aqueous wash process compatible  
Single +3.3 V or +5 V power supply  
RoHS Compliance  
The AFBR-5803AQZ/ATQZ are 1300 nm products with  
optical performance compliant with the FDDI PMD  
standard. The FDDI PMD standard is ISO/IEC 9314-3: 1990  
and ANSI X3.166 - 1990.  
Industrial range -40 to 85C  
These transceivers for 2 km multimode fiber backbones  
are supplied in the small 1 x 9 duplex SC or ST package  
style.  
Applications  
The AFBR-5803AQZ/ATQZ is useful for both ATM 100  
Mb/s interfaces and Fast Ethernet 100 Base-FX inter-  
faces. The ATM Forum User-Network Interface (UNI)  
Standard, Version 3.0, defines the Physical Layer for 100  
Mb/s Multimode Fiber Interface for ATM in Section 2.3 to  
be the FDDI PMD Standard. Likewise, the Fast Ethernet  
Alliance defines the Physical Layer for 100 Base-FX for  
Fast Ethernet to be the FDDI PMD Standard.  
Multimode fiber backbone links  
Multimode fiber wiring closet to desktop links  
Very low cost multimode fiber links from wiring  
closet to desktop  
Multimode fiber media converters  
*ST is a registered trademark of AT&T Lightguide Cable Connectors.  
ATM applications for physical layers other than 100 Mb/s  
Multimode Fiber Interface are supported by Avago Tech-  
nologies. Products are available for both the single mode  
and the multimode fiber SONET OC-3c (STS-3c) ATM in-  
terfaces and the 155 Mb/s-194 MBd multimode fiber ATM  
interface as specified in the ATM Forum UNI.  
Contact your Avago Technologies sales representative  
for information on these alternative Fast Ethernet, FDDI  
and ATM products.  
of the 1 x 9 SIP. The low profile of the Avago Technologies  
transceiver design complies with the maximum height  
allowed for the duplex SC connector over the entire  
length of the package.  
Transmitter Sections  
The transmitter section of the AFBR-5803AQZ and AFBR-  
5805Z series utilize 1300 nm Surface Emitting InGaAsP  
LEDs. These LEDs are packaged in the optical subassem-  
bly portion of the transmitter section. They are driven  
by a custom silicon IC which converts differential PECL  
logic signals, ECL referenced (shifted) to a +3.3 V or +5 V  
supply, into an analog LED drive current.  
The optical subassemblies utilize a high volume assembly  
process together with low cost lens elements which result  
in a cost effective building block.  
The electrical subassembly consists of a high volume  
multilayer printed circuit board on which the IC chips  
and various surface-mounted passive circuit elements  
Receiver Sections  
The receiver sections of the AFBR-5803AQZ and AFBR- are attached.  
5805Z series utilize InGaAs PIN photodiodes coupled to  
The package includes internal shields for the electrical  
and optical subassemblies to ensure low EMI emissions  
and high immunity to external EMI fields.  
a custom silicon transimpedance preamplifier IC. These  
are packaged in the optical subassembly portion of the  
receiver.  
The outer housing including the duplex SC connector  
receptacle or the duplex ST ports is molded of filled  
nonconductive plastic to provide mechanical strength  
and electrical isolation. The solder posts of the Avago  
Technologies design are isolated from the circuit design  
of the transceiver and do not require connection to a  
ground plane on the circuit board.  
These PIN/preamplifier combinations are coupled to  
a custom quantizer IC which provides the final pulse  
shaping for the logic output and the Signal Detect  
function. The data output is differential. The signal detect  
output is single-ended. Both data and signal detect  
outputs are PECL compatible, ECL referenced (shifted) to  
a +3.3 V or +5 V power supply.  
The transceiver is attached to a printed circuit board with  
the nine signal pins and the two solder posts which exit  
the bottom of the housing. The two solder posts provide  
the primary mechanical strength to withstand the loads  
imposed on the transceiver by mating with duplex or  
simplex SC or ST connectored fiber cables.  
Package  
The overall package concept for the Avago Technologies  
transceivers consists of the following basic elements; two  
optical subassemblies, an electrical subassembly and the  
housing as illustrated in Figure1 and Figure 1a.  
The package outline drawings and pin out are shown in  
Figures 2, 2a and 3. The details of this package outline  
and pin out are compliant with the multisource definition  
ELECTRICAL SUBASSEMBLY  
DUPLEX SC  
RECEPTACLE  
DIFFERENTIAL  
DATA OUT  
PIN PHOTODIODE  
SINGLE-ENDED  
SIGNAL  
DETECT OUT  
QUANTIZER IC  
PREAMP IC  
OPTICAL  
SUBASSEMBLIES  
DIFFERENTIAL  
DATA IN  
LED  
DRIVER IC  
TOP VIEW  
Figure 1. SC Connector Block Diagram.  
2
ELECTRICAL SUBASSEMBLY  
DUPLEX ST  
RECEPTACLE  
DIFFERENTIAL  
DATA OUT  
PIN PHOTODIODE  
SINGLE-ENDED  
SIGNAL  
DETECT OUT  
QUANTIZER IC  
PREAMP IC  
OPTICAL  
SUBASSEMBLIES  
DIFFERENTIAL  
DATA IN  
LED  
DRIVER IC  
TOP VIEW  
Figure 1a. ST Connector Block Diagram.  
Case Temperature  
Measurement Point  
39.12  
(1.540)  
12.70  
(0.500)  
MAX.  
6.35  
(0.250)  
AREA  
RESERVED  
FOR  
PROCESS  
PLUG  
25.40  
MAX.  
12.70  
(0.500)  
(1.000)  
AFBR-5803AQZ  
DATE CODE (YYWW)  
SINGAPORE  
AVAGO  
5.93 0.1  
(0.233 0.004)  
+ 0.08  
0.75  
– 0.05  
2.6 0.4  
(0.102 0.016)  
3.30 0.38  
(0.130 0.015)  
+ 0.003  
10.35  
(0.407)  
)
(0.030  
MAX.  
– 0.002  
2.92  
(0.115)  
+ 0.25  
– 0.05  
18.52  
(0.729)  
1.27  
+ 0.010  
– 0.002  
0.46  
(0.018)  
NOTE 1  
4.14  
(0.163  
(0.050  
)
Ø
(9x)  
NOTE 1  
23.55  
(0.927)  
20.32  
(0.800)  
16.70  
(0.657)  
17.32 20.32  
(0.682 (0.800) (0.918)  
23.32  
[8x(2.54/.100)]  
0.87  
23.24  
(0.915)  
15.88  
(0.625)  
(0.034)  
Note 1:  
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts  
have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.  
DIMENSIONS ARE IN MILLIMETERS (INCHES).  
Figure 2. SC Connector Package Outline Drawing with standard height.  
3
42  
(1.654)  
MAX.  
5.99  
(0.236)  
24.8  
(0.976)  
12.7  
(0.500)  
25.4  
(1.000)  
MAX.  
AFBR-5803AQZ  
DATE CODE (YYWW)  
SINGAPORE  
Case Temperature  
Measurement Point  
+ 0.08  
- 0.05  
+ 0.003  
0.5  
(0.020)  
(
- 0.002  
(
12.0  
(0.471)  
MAX.  
2.6 0.4  
(0.102 0.016)  
3.3 0.38  
(0.130 0.015)  
0.38  
0.015)  
20.32  
(
0.46  
Ø
(0.018)  
NOTE 1  
2.6  
Ø
+ 0.25  
- 0.05  
1.27  
(0.102)  
(0.050)  
(
+ 0.010  
- 0.002  
)
20.32  
(0.800)  
17.4  
(0.685)  
[(8x (2.54/0.100)]  
20.32  
(0.800)  
22.86  
21.4  
(0.843)  
(0.900)  
3.6  
(0.142)  
1.3  
(0.051)  
23.38  
18.62  
(0.921)  
(0.733)  
Note 1:  
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts  
have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.  
DIMENSIONS IN MILLIMETERS (INCHES).  
Figure 2a. ST Connector Package Outline Drawing with standard height.  
1 = VEE  
N/C  
2 = RD  
Rx  
3 = RD  
4 = SD  
5 = VCC  
6 = VCC  
7 = TD  
8 = TD  
9 = VEE  
Tx  
N/C  
TOP VIEW  
Figure 3. Pin Out Diagram.  
4
optic link model containing the current industry conven-  
tions for fiber cable specifications and the FDDI PMD  
and LCF-PMD optical parameters. These parameters are  
reflected in the guaranteed performance of the trans-  
ceiver specifications in this data sheet. This same model  
has been used extensively in the ANSI and IEEE commit-  
tees, including the ANSI X3T9.5 committee, to establish  
the optical performance requirements for various fiber  
optic interface standards. The cable parameters used  
come from the ISO/IEC JTC1/SC 25/WG3 Generic Cabling  
for Customer Premises per DIS 11801 document and the  
EIA/TIA-568-A Commercial Building Telecommunications  
Cabling Standard per SP-2840.  
Application Information  
The Applications Engineering group in the Avago Tech-  
nologies Fiber Optics Communication Division is available  
to assist you with the technical understanding and design  
trade-offs associated with these transceivers. You can  
contact them through your Avago Technologies sales  
representative.  
The following information is provided to answer some  
of the most common questions about the use of these  
parts.  
Transceiver Optical Power Budget versus Link Length  
Optical Power Budget (OPB) is the available optical  
power for a fiber optic link to accommodate fiber cable  
losses plus losses due to in-line connectors, splices,  
optical switches, and to provide margin for link aging  
and unplanned losses due to cable plant reconfiguration  
or repair.  
Transceiver Signaling Operating Rate Range and BER  
Performance  
For purposes of definition, the symbol (Baud) rate, also  
called signaling rate, is the reciprocal of the shortest  
symbol time. Data rate (bits/sec) is the symbol rate  
divided by the encoding factor used to encode the data  
(symbols/bit).  
Figure 4 illustrates the predicted OPB associated with  
the transceiver series specified in this data sheet at the  
Beginning of Life (BOL). These curves represent the at-  
tenuation and chromatic plus modal dispersion losses as-  
sociated with the 62.5/125 µm and 50/125 µm fiber cables  
only. The area under the curves represents the remaining  
OPB at any link length, which is available for overcoming  
non-fiber cable related losses.  
When used in Fast Ethernet, FDDI and ATM 100 Mb/s ap-  
plications the performance of the 1300 nm transceivers  
is guaranteed over the signaling rate of 10 MBd to 125  
MBd to the full conditions listed in individual product  
specification tables.  
The transceivers may be used for other applications at  
signaling rates outside of the 10 MBd to 125 MBd range  
with some penalty in the link optical power budget  
primarily caused by a reduction of receiver sensitivity.  
Figure 5 gives an indication of the typical performance of  
these 1300 nm products at different rates.  
Avago Technologies LED technology has produced  
1300 nm LED devices with lower aging characteristics  
than normally associated with these technologies in the  
industry. The industry convention is 1.5 dB aging for 1300  
nm LEDs. The Avago Technologies 1300 nm LEDs will  
experience less than 1dB of aging over normal commer-  
cial equipment mission life periods. Contact your Avago  
Technologies sales representative for additional details.  
These transceivers can also be used for applications which  
require different Bit Error Rate (BER) performance. Figure 6  
illustrates the typical trade-off between link BER and the  
receivers input optical power level.  
Figure 4 was generated with a Avago Technologies fiber  
2.5  
12  
AFBR-5803, 62.5/125 µm  
10  
2.0  
CONDITIONS:  
1. PRBS 27-1  
2. DATA SAMPLED  
AT CENTER OF  
DATA SYMBOL.  
3. BER = 10-6  
1.5  
1.0  
8
AFBR-5803  
50/125 µm  
6
4. TA = +25˚ C  
5. VCC = 3.3 V to 5 V dc  
6. INPUT OPTICAL  
RISE/FALL TIMES  
= 1.0/2.1 ns.  
0.5  
0
4
2
0
0.5  
0
25 50  
75 100 125 150 175 200  
SIGNAL RATE (MBd)  
0.3 0.5  
1.0  
1.5  
2.0  
2.5  
FIBER OPTIC CABLE LENGTH (km)  
Figure 5. Transceiver Relative Optical Power Budget at Constant BER vs.  
Signaling Rate.  
Figure 4. Optical Power Budget at BOL versus Fiber  
Optic Cable Length.  
5
1 x 10-2  
1 x 10-3  
Transceiver Jitter Performance  
The Avago Technologies 1300 nm transceivers are  
designed to operate per the system jitter allocations  
stated in Tables E1 of Annexes E of the FDDI PMD and  
LCF-PMD standards.  
1 x 10-4  
1 x 10-5  
1 x 10-6  
AFBR-5803 SERIES  
-7  
CENTER OF SYMBOL  
The Avago Technologies 1300 nm transmitters will  
tolerate the worst case input electrical jitter allowed in  
these tables without violating the worst case output jitter  
requirements of Sections 8.1 Active Output Interface of  
the FDDI PMD and LCF-PMD standards.  
1 x 10  
-8  
1 x 10  
-9  
1 x 10  
1 x 10-10  
1 x 10-11  
1 x 10-12  
-6  
-4  
-2  
0
2
4
RELATIVE INPUT OPTICAL POWER - dB  
The Avago Technologies 1300 nm receivers will tolerate  
the worst case input optical jitter allowed in Sections 8.2  
Active Input Interface of the FDDI PMD and LCF-PMD  
standards without violating the worst case output electri-  
cal jitter allowed in the Tables E1 of the Annexes E.  
CONDITIONS:  
1. 155 MBd  
2. PRBS 27-1  
3. CENTER OF SYMBOL SAMPLING  
4. TA = +25˚C  
5. VCC= 3.3 V to 5 V dc  
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.  
The jitter specifications stated in the following 1300 nm  
transceiver specification tables are derived from the  
values in Tables E1 of Annexes E. They represent the worst  
case jitter contribution that the transceivers are allowed  
to make to the overall system jitter without violating the  
Annex E allocation example. In practice the typical con-  
tribution of the Avago Technologies transceivers is well  
below these maximum allowed amounts.  
Figure 6. Bit Error Rate vs. Relative Receiver Input Optical Power.  
Rx  
Tx  
NO INTERNAL CONNECTION  
NO INTERNAL CONNECTION  
AFBR-5803  
TOP VIEW  
Rx  
VEE  
1
Rx  
Tx  
Tx  
RD  
2
RD  
3
SD  
4
VCC  
VCC  
TD  
7
TD  
8
VEE  
5
6
9
C1  
C2  
VCC  
R2  
R3  
L1  
L2  
C4  
TERMINATION  
AT PHY  
DEVICE  
INPUTS  
R1  
R4  
VCC  
C3  
C5  
VCC FILTER  
AT VCC PINS  
R5  
R7  
TRANSCEIVER  
R9  
TERMINATION  
AT TRANSCEIVER  
INPUTS  
C6  
R6  
R8  
R10  
RD  
RD  
SD  
VCC  
TD  
TD  
NOTES:  
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT  
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT  
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.  
R1 = R4 = R6 = R8 = R10 = 130 OHMS FOR +5.0 V OPERATION, 82 OHMS FOR +3.3 V OPERATION.  
R2 = R3 = R5 = R7 = R9 = 82 OHMS FOR +5.0 V OPERATION, 130 OHMS FOR +3.3 V OPERATION.  
C1 = C2 = C3 = C5 = C6 = 0.1 µF.  
C4 = 10 µF.  
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.  
Figure 7. Recommended Decoupling and Termination Circuits  
6
It is important to take care in the layout of your circuit  
board to achieve optimum performance from these  
transceivers. Figure ꢀ provides a good example of a  
schematic for a power supply decoupling circuit that  
works well with these parts. It is further recommended  
that a contiguous ground plane be provided in the  
circuit board directly under the transceiver to provide  
a low inductance ground for signal return current. This  
recommendation is in keeping with good high frequency  
board layout practices.  
Recommended Handling Precautions  
Avago Technologies recommends that normal static pre-  
cautions be taken in the handling and assembly of these  
transceivers to prevent damage which may be induced  
by electrostatic discharge (ESD). The AFBR-5800 series of  
transceivers meet MIL-STD-883C Method 3015.4 Class 2  
products.  
Care should be used to avoid shorting the receiver data  
or signal detect outputs directly to ground without  
proper current limiting impedance.  
Board Layout - Hole Pattern  
Solder and Wash Process Compatibility  
The Avago Technologies transceiver complies with the  
circuit board “Common Transceiver Footprint” hole  
pattern defined in the original multisource announce-  
ment which defined the 1 x 9 package style. This drawing  
is reproduced in Figure 8 with the addition of ANSI  
Y14.5M compliant dimensioning to be used as a guide in  
the mechanical layout of your circuit board.  
The transceivers are delivered with protective process  
plugs inserted into the duplex SC or duplex ST connector  
receptacle. This process plug protects the optical subas-  
semblies during wave solder and aqueous wash process-  
ing and acts as a dust cover during shipping.  
These transceivers are compatible with either industry  
standard wave or hand solder processes.  
Board Layout - Mechanical  
For applications providing a choice of either a duplex SC  
or a duplex ST connector interface, while utilizing the  
same pinout on the printed circuit board, the ST port  
needs to protrude from the chassis panel a minimum  
of 9.53 mm for sufficient clearance to install the ST  
connector.  
Shipping Container  
The transceiver is packaged in a shipping container  
designed to protect it from mechanical and ESD damage  
during shipment or storage.  
Board Layout - Decoupling Circuit and Ground Planes  
Please refer to Figure 8a for a mechanical layout detailing  
the recommended location of the duplex SC and duplex  
ST transceiver packages in relation to the chassis panel.  
20.32  
(0.800)  
2 x Ø 1.9 0.1  
(0.075 0.004)  
20.32  
(0.800)  
9 x Ø 0.8 0.1  
(0.032 0.004)  
2.54  
(0.100)  
TOP VIEW  
DIMENSIONS ARE IN MILLIMETERS (INCHES)  
Figure 8. Recommended Board Layout Hole Pattern  
42.0  
24.8  
9.53  
12.0  
(NOTE 1)  
0.51  
12.09  
25.4  
39.12  
11.1  
6.79  
0.75  
25.4  
NOTE 1: MINIMUM DISTANCE FROM FRONT  
OF CONNECTOR TO THE PANEL FACE.  
Figure 8a. Recommended Common Mechanical Layout for SC and ST 1 x 9 Connectored Transceivers.  
The first case is during handling of the transceiver prior  
to mounting it on the circuit board. It is important to  
use normal ESD handling precautions for ESD sensitive  
devices. These precautions include using grounded wrist  
straps, work benches, and floor mats in ESD controlled  
areas.  
Regulatory Compliance  
These transceiver products are intended to enable  
commercial system designers to develop equipment  
that complies with the various international regula-  
tions governing certification of Information Technology  
Equipment. See the Regulatory Compliance Table for  
details. Additional information is available from your  
Avago Technologies sales representative.  
The second case to consider is static discharges to the  
exterior of the equipment chassis containing the trans-  
ceiver parts. To the extent that the duplex SC connector  
is exposed to the outside of the equipment chassis it may  
be subject to whatever ESD system level test criteria that  
the equipment is intended to meet.  
Electrostatic Discharge (ESD)  
There are two design cases in which immunity to ESD  
damage is important.  
8
Regulatory Compliance Table  
Feature  
Test Method  
Performance  
Electrostatic Discharge (ESD)  
to the Electrical Pins  
MIL-STD-883  
Method 3015.4  
Meets Class 1 (<1999 Volts)  
Withstand up to 1500 V applied between electrical pins.  
Electrostatic Discharge (ESD)  
to the Duplex SC Receptacle  
Variation of  
IEC 801-2  
Typically withstand at least 25 kV without damage when the Duplex  
SC Connector Receptacle is contacted by a Human Body Model  
probe.  
Electromagnetic  
Interference (EMI)  
FCC Class B  
Transceivers typically provide a 13 dB margin (with duplex SC  
receptacle) or a 9 dB margin (with duplex ST receptacles ) to the  
noted standard limits. However, it should be noted that final margin  
depends on the customer’s board and chassis design.  
CENELEC CEN55022  
Class B (CISPR 22B)  
VCCI Class 2  
Immunity  
Variation of  
IEC 61000-4-3  
Typically show no measurable effect from a 10 V/m field swept from  
10 to 450 MHz applied to the transceiver when mounted to a circuit  
card without a chassis enclosure.  
For additional information regarding EMI, susceptibility,  
ESD and conducted noise testing procedures and results  
on the 1 x 9 Transceiver family, please refer to Applica-  
tions Note 10ꢀ5, Testing and Measuring Electro­agnetic  
Co­patibility Perfor­ance of the AFBR-510X/520X Fiber  
Optic Transceivers.  
Electromagnetic Interference (EMI)  
Most equipment designs utilizing these high speed trans-  
ceivers from Avago Technologies will be required to meet  
the requirements of FCC in the United States, CENELEC  
EN55022 (CISPR 22) in Europe and VCCI in Japan.  
In all well-designed chassis, two 0.5” holes for ST con-  
nectors to protrude through will provide 4.6dB more  
shielding than one 1.2” duplex SC rectangular cutout.  
Thus, in a well-designed chassis, the duplex ST 1 x 9  
transceiver emissions will be identical to the duplex SC 1  
x 9 transceiver emissions.  
Transceiver Reliability and Performance Qualification  
Data  
The 1 x 9 transceivers have passed Avago Technologies  
reliability and performance qualification testing and are  
undergoing ongoing quality monitoring. Details are avail-  
able from your Avago Technologies sales representative.  
Immunity  
Accessory Duplex SC Connectored Cable Assemblies  
Equipment utilizing these transceivers will be subject to  
radio-frequency electromagnetic fields in some environ-  
ments. These transceivers have a high immunity to such  
fields.  
Avago Technologies recommends for optimal coupling  
the use of flexible-body duplex SC connectored cable.  
Accessory Duplex ST Connectored Cable Assemblies  
Avago Technologies recommends the use of Duplex  
Push-Pull connectored cable for the most repeatable  
optical power coupling performance.  
200  
AFBR-5103 FDDI  
TRANSMITTER  
TEST RESULTS  
3.0  
180  
OF λ , ∆λ AND  
C
1.5  
t
ARE CORRELATED  
r/f  
AND COMPLY WITH  
THE ALLOWED  
160  
140  
120  
100  
2.0  
2.5  
3.5  
SPECTRAL WIDTH  
AS A FUNCTION OF  
CENTER WAVELENGTH  
FOR VARIOUS RISE  
AND FALL TIMES.  
3.0  
3.5  
t
– TRANSMITTER  
r/f  
OUTPUT OPTICAL  
RISE/FALL TIMES – ns  
1200  
1300 1320 1340 1360 1380  
λ
– TRANSMITTER OUTPUT OPTICAL  
CENTER WAVELENGTH –nm  
C
Figure 9. Transmitter Output Optical Spectral Width (FWHM) vs. Transmitter  
Output Optical Center Wavelength and Rise/Fall Times.  
9
4ꢀ40  
1ꢀ9.5  
1ꢀ25  
4ꢀ850  
1ꢀ525  
0ꢀ525  
10ꢀ0  
5ꢀ6  
1ꢀ025  
1ꢀ00  
0ꢀ9.5  
0ꢀ0.5  
0ꢀ90  
100% TIME  
INTERVAL  
40 0ꢀ.  
0ꢀ50  
0ꢀ10  
0ꢀ.25  
0ꢀ.25  
0% TIME  
INTERVAL  
0ꢀ025  
0ꢀ0  
0ꢀ0.5  
-0ꢀ025  
-0ꢀ05  
1ꢀ525  
0ꢀ525  
5ꢀ6  
1ꢀ9.5  
4ꢀ40  
10ꢀ0  
4ꢀ850  
80 500 ꢁꢁp  
TIME – ns  
THE AFBR-5103Z OUTPUT OPTICAL PULSE SHAPE SHALL FIT WITHIN THE BOUNDARIES  
OF THE PULSE ENVELOPE FOR RISE AND FALL TIME MEASUREMENTSꢀ  
Figure 10. Output Optical Pulse Envelope.  
5
AFBR-5103/-5104/-5105  
SERIES  
4
3
-10  
2.5 x 10 BER  
2
-12  
1.0 x 10 BER  
1
0
-4 -3 -2 -1  
0
1
2
3
4
EYE SAMPLING TIME POSITION (ns)  
CONDITIONS:  
1.TA = 25 C  
2. VCC = 5 Vdc  
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.  
4. INPUT OPTICAL POWER IS NORMALIZED TO  
CENTER OF DATA SYMBOL.  
5. NOTE 20 AND 21 APPLY.  
Figure 11. Relative Input Optical Power vs. Eye  
Sampling Time Position.  
10  
-31ꢀ0 dBp  
MIN (PO + 4ꢀ0 dB OR -31ꢀ0 dBp)  
PO = MAX (PS OR -45ꢀ0 dBp)  
PA(PO + 1ꢀ5 dB  
< PA < -31ꢀ0 dBp)  
2
(PS = INPUT POWER FOR BER < 10 )  
INPUT OPTICAL POWER  
INPUT OPTICAL POWER  
(
>
>
4ꢀ0 dB STEP DECREASE)  
(
1ꢀ5 dB STEP INCREASE)  
-45ꢀ0 dBp  
ANS MAX  
AS MAX  
SIGNAL DETECT  
(ON)  
SIGNAL DETECT  
(OFF)  
TIME  
AS MAX — MAXIMUM ACQUISITION TIME (SIGNAL)ꢀ  
AS MAX IS THE MAXIMUM SIGNAL DETECT ASSERTION TIME FOR THE STATIONꢀ  
AS MAX SHALL NOT EXCEED 100ꢀ0 µsꢀ THE DEFAULT VALUE OF AS MAX IS 100ꢀ0 µsꢀ  
ANS MAX — MAXIMUM ACQUISITION TIME (NO SIGNAL)ꢀ  
ANS MAX IS THE MAXIMUM SIGNAL DETECT DEASSERTION TIME FOR THE STATIONꢀ  
ANS MAX SHALL NOT EXCEED 350 µsꢀ THE DEFAULT VALUE OF AS MAX IS 350 µsꢀ  
Figure 12. Signal Detect Thresholds and Timing.  
11  
Absolute Maximum Ratings  
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parame-  
ter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that  
limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum  
ratings for extended periods can adversely affect device reliability.  
Parameter  
Symbol  
TS  
Min.  
-40  
Typ.  
Max.  
+100  
+260  
10  
Unit  
°C  
Reference  
Storage Temperature  
Lead Soldering Temperature  
Lead Soldering Time  
Supply Voltage  
TSOLD  
tSOLD  
VCC  
VI  
°C  
sec.  
V
-0.5  
-0.5  
ꢀ.0  
Data Input Voltage  
Differential Input Voltage  
Output Current  
VCC  
1.4  
V
VD  
V
Note 1  
IO  
50  
mA  
Recommended Operating Conditions  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Reference  
Ambient Operating Temperature  
AFBR-5803AQZ/5803ATQZ  
TA  
-40  
+85  
°C  
VV  
V
Note A  
Supply Voltage  
VCCVCC  
VIL - VCC  
VIH - VCC  
RL  
3.1354.ꢀ5  
-1.810  
-1.165  
3.55.25  
-1.4ꢀ5  
-0.880  
Data Input Voltage - Low  
Data Input Voltage - High  
Data and Signal Detect Output Load  
Notes:  
V
W
50  
Note 2  
A. Ambient Operating Temperature corresponds to transceiver case temperature of -40 °C mininum to +100 °C maximum with necessary airflow  
applied. Recommended case temperature measurement point can be found in Figure 2.  
Transmitter Electrical Characteristics  
(AFBR-5803AQZ/AFBR-5803ATQZ: T = -40°C to +85°C, V = 3.135 V to 3.5 V or 4.ꢀ5 V to 5.25 V)  
A
CC  
Parameter  
Supply Current  
Symbol  
ICC  
Min.  
Typ.  
133  
0.45  
0.ꢀ6  
-2  
Max.  
1ꢀ5  
0.6  
Unit  
mA  
W
Reference  
Note 3  
Power  
Dissipation  
at VCC = 3.3 V  
at VCC = 5.0 V  
PDISS  
PDISS  
IIL  
0.9ꢀ  
W
Data Input Current - Low  
Data Input Current - High  
-350  
µA  
µA  
IIH  
18  
350  
12  
Receiver Electrical Characteristics  
(AFBR-5803AQZ/AFBR-5803ATQZ: T = -40°C to +85°C, V = 3.135 V to 3.5 V or 4.ꢀ5 V to 5.25 V)  
A
CC  
Parameter  
Symbol  
ICC  
Min.  
Typ.  
8ꢀ  
Max.  
120  
0.25  
0.5  
Unit  
mA  
W
W
V
Reference  
Note 4  
Note 5  
Note 5  
Note 6  
Note 6  
Note ꢀ  
Note ꢀ  
Note 6  
Note 6  
Note ꢀ  
Note ꢀ  
Supply Current  
Power  
Dissipation  
at VCC = 3.3 V  
at VCC = 5.0 V  
PDISS  
PDISS  
VOL - VCC  
VOH - VCC  
tr  
0.15  
0.3  
Data Output Voltage - Low  
Data Output Voltage - High  
Data Output Rise Time  
-1.83  
-1.085  
0.35  
-1.55  
-0.88  
2.2  
V
ns  
ns  
V
Data Output Fall Time  
tf  
0.35  
2.2  
Signal Detect Output Voltage - Low  
Signal Detect Output Voltage - High  
Signal Detect Output Rise Time  
Signal Detect Output Fall Time  
VOL - VCC  
VOH - VCC  
tr  
-1.83  
-1.085  
0.35  
-1.55  
-0.88  
2.2  
V
ns  
ns  
tf  
0.35  
2.2  
Transmitter Optical Characteristics  
(AFBR-5803AQZ/AFBR-5803ATQZ: T = -40°C to +85°C, V = 3.135 V to 3.5 V or 4.ꢀ5 V to 5.25 V)  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Reference  
Output Optical Power  
62.5/125 µm, NA = 0.2ꢀ5 Fiber  
BOL  
EOL  
PO  
-19  
-20  
-14  
dBm avg. Note 11  
Output Optical Power  
50/125 µm, NA = 0.20 Fiber  
BOL  
EOL  
PO  
-22.5  
-23.5  
-14  
dBm avg. Note 11  
Optical Extinction Ratio  
10  
%
Note 12  
-10  
dB  
Output Optical Power at Logic “0State  
Center Wavelength  
PO (“0”)  
-45  
dBm avg. Note 13  
lC  
12ꢀ0  
1308  
1380  
nm  
Note 14  
Spectral Width  
- FWHMSpectral Width  
- nm RMS  
Dl  
tr  
14ꢀ  
63  
nm  
Note 14  
Figure 9  
Optical Rise Time  
0.6  
0.6  
1.9  
3.0  
3.0  
0.6  
0.6  
0.69  
ns  
Note 14, 15  
Figure 9, 10  
Optical Fall Time  
tf  
1.6  
ns  
Note 14, 15  
Figure 9, 10  
Duty Cycle Distortion Contributed  
by the Transmitter  
DCD  
DDJ  
RJ  
ns p-p  
ns p-p  
ns p-p  
Note 16  
Note 1ꢀ  
Note 18  
Data Dependent Jitter Contributed  
by the Transmitter  
Random Jitter Contributed  
by the Transmitter  
13  
Receiver Optical and Electrical Characteristics  
(AFBR-5803AQZ/AFBR-5803ATQZ: T = -40°C to +85°C, V = 3.135 V to 3.5 V or 4.ꢀ5 V to 5.25 V)  
A
CC  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Reference  
Input Optical Power Minimum at Window Edge PIN Min. (W)  
-33.9  
-31  
dBm avg. Note 19  
Figure 11  
Input Optical Power Minimum at Eye Center  
PIN Min. (C)  
-35.2  
-31.8  
dBm avg. Note 20  
Figure 11  
Input Optical Power Maximum  
Operating Wavelength  
PIN Max.  
l
-14  
dBm avg. Note 19  
nm  
12ꢀ0  
1380  
0.4  
Duty Cycle Distortion Contributed  
by the Receiver  
DCD  
ns p-p  
ns p-p  
ns p-p  
Note 8  
Note 9  
Note 10  
Data Dependent Jitter Contributed  
by the Receiver  
DDJ  
1.0  
Random Jitter Contributed by the Receiver  
Signal Detect - Asserted  
RJ  
PA  
2.14  
-33  
PD + 1.5 dB  
-45  
dBm avg. Note 21, 22  
Figure 12  
Signal Detect - Deasserted  
PD  
dBm avg. Note 23, 24  
Figure 12  
Signal Detect - Hysteresis  
PA - PD  
1.5  
0
dB  
µs  
Figure 12  
Signal Detect Assert Time (off to on)  
AS_Max  
2
8
100  
350  
Note 21, 22  
Figure 12  
Signal Detect Deassert Time (on to o)  
ANS_Max  
0
µs  
Note 23, 24  
Figure 12  
Notes:  
1. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs to prevent damage to the input ESD protec-  
tion circuit.  
2. The outputs are terminated with 50W connected to V -2 V.  
CC  
3. The power supply current needed to operate the transmitter is provided to differential ECL circuitry. This circuitry maintains a nearly constant  
current flow from the power supply. Constant current operation helps to prevent unwanted electrical noise from being generated and con-  
ducted or emitted to neighboring circuitry.  
4. This value is measured with the outputs terminated into 50 W connected to V - 2 V and an Input Optical Power level of  
CC  
-14 dBm average.  
5. The power dissipation value is the power dissipated in the receiver itself. Power dissipation is calculated as the sum of the products of supply  
voltage and currents, minus the sum of the products of the output voltages and currents.  
6. This value is measured with respect to V with the output terminated into 50 W connected to V - 2 V.  
CC  
CC  
ꢀ. The output rise and fall times are measured between 20% and 80% levels with the output connected to V -2 V through 50 W.  
CC  
8. Duty Cycle Distortion contributed by the receiver is measured at the 50% threshold using an IDLE Line State, 125 MBd  
(62.5 MHz square-wave), input signal. The input optical power level is -20 dBm average. See Application Information - Transceiver Jitter Sec-  
tion for further information.  
9. Data Dependent Jitter contributed by the receiver is specified with the FDDI DDJ test pattern described in the FDDI PMD Annex A.5. The  
input optical power level is -20 dBm average. See Application Information - Transceiver Jitter Section for further information.  
10. Random Jitter contributed by the receiver is specified with an IDLE Line State,  
125 MBd (62.5 MHz square-wave), input signal. The input optical power level is at maximum “P  
ceiver Jitter Section for further information.  
(W). See Application Information - Trans-  
IN Min.  
11. TheTsheeoBpetgicinalnpinogwoefrLviafelu(eBsOaLr)etomtehaesuErneddowfiLthifeth(EeOfoLl)loowptiincgalcpoonwdeitriodnesg: radation is typically 1.5 dB per the industry convention for long  
wavelength LEDs. The actual degradation observed in Avago Technologies1300 nm LED products is  
< 1 dB, as specified in this data sheet.  
Over the specified operating voltage and temperature ranges.  
With HALT Line State, (12.5 MHz square-wave), input signal.  
At the end of one meter of noted optical fiber with cladding modes removed.  
The average power value can be converted to a peak power value by adding 3 dB. Higher output optical power transmitters are available on  
special request.  
14  
12. The Extinction Ratio is a measure of the modulation depth of the optical signal. The data “0output optical power is compared to the data “1”  
peak output optical power and expressed as a percentage. With the transmitter driven by a HALT Line State (12.5 MHz square-wave) signal,  
the average optical power is measured. The data “1peak power is then calculated by adding 3 dB to the measured average optical power.  
The data “0output optical power is found by measuring the optical power when the transmitter is driven by a logic “0input. The extinction  
ratio is the ratio of the optical power at the “0level compared to the optical power at the “1level expressed as a percentage or in decibels.  
13. The transmitter provides compliance with the need for Transmit_Disable commands from the FDDI SMT layer by providing an Output Optical  
Power level of <-45 dBm average in response to a logic “0input. This specification applies to either 62.5/125 µm or 50/125 µm fiber cables.  
14. This parameter complies with the FDDI PMD requirements for the trade-offs between center wavelength, spectral width, and rise/fall times  
shown in Figure 9.  
15. This parameter complies with the optical pulse envelope from the FDDI PMD shown in Figure 10. The optical rise and fall times are measured  
from 10% to 90% when the transmitter is driven by the FDDI HALT Line State (12.5 MHz square-wave) input signal.  
16. Duty Cycle Distortion contributed by the transmitter is measured at a 50% threshold using an IDLE Line State, 125 MBd  
(62.5 MHz square-wave), input signal. See Application Information - Transceiver Jitter Performance Section of this data sheet for further de-  
tails.  
1ꢀ. Data Dependent Jitter contributed by the transmitter is specified with the FDDI test pattern described in FDDI PMD Annex A.5. See Applica-  
tion Information - Transceiver Jitter Performance Section of this data sheet for further details.  
18. Random Jitter contributed by the transmitter is specified with an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. See Applica-  
tion Information - Transceiver Jitter Performance Section of this data sheet for further details.  
19. This specification is intended to indicate the performance of the receiver section of the transceiver when Input Optical Power signal char-  
acteristics are present per the following definitions. The Input Optical Power dynamic range from the minimum level (with a window time-  
width) to the maximum level is the range over which the receiver is guaranteed to provide output data with a Bit Error Ratio (BER) better than  
-10  
or equal to 2.5 x 10  
.
At the Beginning of Life (BOL)  
Over the specified operating temperature and voltage ranges  
Input symbol pattern is the FDDI test pattern defined in FDDI PMD Annex A.5 with 4B/5B NRZI encoded data that contains a duty cycle  
base-line wander effect of 50kHz. This sequence causes a near worst case condition for inter-symbol interference.  
Receiver data window time-width is  
2.13 ns or greater and centered at  
mid-symbol. This worst case window time-width is the minimum allowed  
eye-opening presented to the FDDI PHY PM._Data indication input (PHY input) per the example in FDDI PMD Annex E. This minimum win-  
dow time-width of 2.13 ns is based upon the worst case FDDI PMD Active Input Interface optical conditions for peak-to-peak DCD (1.0 ns),  
DDJ (1.2 ns) and RJ (0.ꢀ6 ns) presented to the receiver.  
To test a receiver with the worst case FDDI PMD Active Input jitter condition requires exacting control over DCD, DDJ and RJ jitter compo-  
nents that is difficult to implement with production test equipment. The receiver can be equivalently tested to the worst case FDDI PMD  
input jitter conditions and meet the minimum output data window time-width of 2.13 ns. This is accomplished by using a nearly ideal input  
optical signal (no DCD, insignificant DDJ and RJ) and measuring for a wider window time-width of 4.6 ns. This is possible due to the cumula-  
tive effect of jitter components through their superposition (DCD and DDJ are directly additive and RJ components are rms additive). Specifi-  
cally, when a nearly ideal input optical test signal is used and the maximum receiver peak-to-peak jitter contributions of DCD (0.4 ns), DDJ  
(1.0 ns), and RJ (2.14 ns) exist, the minimum window time-width becomes 8.0 ns -0.4 ns - 1.0 ns - 2.14 ns = 4.46 ns, or conservatively 4.6ns.  
This wider window time-width of 4.6 ns guarantees the FDDI PMD Annex E minimum window time-width of 2.13 ns under worst case input  
jitter conditions to the Avago Technologies receiver.  
Transmitter operating with an IDLE Line State pattern, 125 MBd (62.5 MHz square-wave), input signal to simulate any cross-talk present  
between the transmitter and receiver sections of the transceiver.  
20. All conditions of Note 19 apply except that the measurement is made at the center of the symbol with no window time-width.  
21. This value is measured during the transition from low to high levels of input optical power.  
22. The Signal Detect output shall be asserted within 100 µs after a step increase of the Input Optical Power. The step will be from a low Input  
Optical Power, -45 dBm, into the range between greater than P , and  
A
-2  
-14 dBm. The BER of the receiver output will be 10 or better during the time, LS_Max (15 µs) after Signal Detect has been asserted. See Fig-  
ure 12 for more information.  
23. This value is measured during the transition from high to low levels of input optical power. The maximum value will occur when the input  
-2  
optical power is either -45 dBm average or when the input optical power yields a BER of 10 or larger, whichever power is higher.  
24. Signal detect output shall be de-asserted within 350 µs after a step decrease in the Input Optical Power from a level which is the lower of; -31  
dBm or P + 4 dB (P is the power level at which signal detect was de-asserted), to a power level of -45 dBm or less. This step decrease will  
D
D
-2  
have occurred in less than 8 ns. The receiver output will have a BER of 10 or better for a period of 12 µs or until signal detect is de-asserted.  
The input data stream is the Quiet Line State. Also, signal detect will be de-asserted within a maximum of 350µs after the BER of the receiver  
output degrades above 10 for an input optical data stream that decays with a negative ramp function instead of a step function. See Figure  
-2  
12 for more information.  
15  
Ordering Information  
The 5803AQZ/5803ATQZ 1300 nm products are available for production orders through the Avago Technologies  
Component Field Sales Offices and Authorized Distributors world wide.  
-40 °C TO +85 °C  
AFBR-5803AQZ/5803ATQZ  
Note:  
The “Tin the product numbers indicates a transceiver with a duplex ST connector receptacle.  
Product numbers without a “Tindicate transceivers with a duplex SC connector receptacle.  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.  
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.  
AV02-0253EN - August 27, 2008  

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