AFBR-5803Z [AGILENT]
FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style; FDDI ， 100 Mb / s的ATM ，并在低成本1 ×9封装形式快速以太网收发器
| 型号： | AFBR-5803Z |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style |
| 文件： | 总16页 (文件大小：288K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AFBR-5803Z/5803TZ/5803AZ/5803ATZ
FDDI, 100 Mb/s ATM, and Fast Ethernet
Transceivers in Low Cost 1 x 9 Package
Style
Data Sheet
Features
•
Full compliance with the optical
performance requirements of the
FDDI PMD standard
Description
•
•
Full compliance with the FDDI
LCF-PMD standard
The AFBR-5800Z family of
transceivers from Agilent
provide the system designer
with products to implement a
range of Fast Ethernet, FDDI
and ATM (Asynchronous
Transfer Mode) designs at the
100 Mb/s-125 MBd rate.
The AFBR-5803Z/5803TZ is
useful for both ATM 100 Mb/s
interfaces and Fast Ethernet
100 Base-FX interfaces. The
ATM Forum User-Network
Interface (UNI) Standard,
Full compliance with the optical
performance requirements of the
ATM 100 Mb/s physical layer
Full compliance with the optical
performance requirements of
100 Base-FX version of IEEE 802.3u
Multisourced 1 x 9 package style
with choice of duplex SC or
duplex ST* receptacle
Wave solder and aqueous wash
process compatible
Single +3.3 V or +5 V power
supply
•
•
Version 3.0, defines the
Physical Layer for 100 Mb/s
Multimode Fiber Interface for
ATM in Section 2.3 to be the
FDDI PMD Standard. Likewise,
the Fast Ethernet Alliance
defines the Physical Layer for
100 Base-FX for Fast Ethernet
to be the FDDI PMD Standard.
The transceivers are all
supplied in the industry
standard 1 x 9 SIP package
style with either a duplex SC
or a duplex ST* connector
interface.
•
•
•
RoHS Compliance
FDDI PMD, ATM and Fast Ethernet
2 km Backbone Links
ATM applications for physical
layers other than 100 Mb/s
Multimode Fiber Interface are
supported by Agilent. Products
are available for both the
single mode and the multi-
mode fiber SONET OC-3c
(STS-3c) ATM interfaces and
the 155 Mb/s-194 MBd multi-
mode fiber ATM interface as
specified in the ATM Forum
UNI.
Applications
•
•
The AFBR-5803Z/5803TZ are
1300 nm products with optical
performance compliant with
the FDDI PMD standard. The
FDDI PMD standard is ISO/IEC
9314-3:
Multimode fiber backbone links
Multimode fiber wiring closet to
desktop links
Very low cost multimode fiber
links from wiring closet to
desktop
•
•
1990 and ANSI X3.166 - 1990.
Multimode fiber media converters
These transceivers for 2 km
multimode fiber backbones are
supplied in the small 1 x 9
duplex SC or ST package style.
*ST is a registered trademark of AT&T
Lightguide Cable Connectors.
Contact your Agilent sales
representative for information
on these alternative Fast
Ethernet, FDDI and ATM
products.
Transmitter Sections
The package outline drawings
and pin out are shown in
Figures 2, 2a and 3. The
details of this package outline
and pin out are compliant
with the multisource definition provide mechanical strength
of the 1 x 9 SIP. The low
profile of the Agilent
The outer housing including
the duplex SC connector
receptacle or the duplex ST
ports is molded of filled
nonconductive plastic to
The transmitter section of the
AFBR-5803Z and AFBR-5805Z
series utilize 1300 nm Surface
Emitting InGaAsP LEDs. These
LEDs are packaged in the
optical subassembly portion of
the transmitter section. They
are driven by a custom silicon
IC which converts differential
PECL logic signals, ECL
and electrical isolation. The
solder posts of the Agilent
design are isolated from the
circuit design of the
transceiver and do not require
connection to a ground plane
on the circuit board.
transceiver design complies
with the maximum height
allowed for the duplex SC
referenced (shifted) to a +3.3 V connector over the entire
or +5 V supply, into an analog
LED drive current.
length of the package.
The optical subassemblies
utilize a high volume assembly
process together with low cost
lens elements which result in a two solder posts which exit
cost effective building block.
The transceiver is attached to
a printed circuit board with
the nine signal pins and the
Receiver Sections
The receiver sections of the
AFBR-5803Z and AFBR-5805Z
series utilize InGaAs PIN
photodiodes coupled to a
custom silicon transimpedance
preamplifier IC. These are
packaged in the optical sub-
assembly portion of the
receiver.
the bottom of the housing. The
two solder posts provide the
primary mechanical strength to
withstand the loads imposed
on the transceiver by mating
with duplex or simplex SC or
ST connectored fiber cables.
The electrical subassembly
consists of a high volume
multilayer printed circuit
board on which the IC chips
and various surface-mounted
passive circuit elements are
attached.
These PIN/preamplifier combi-
nations are coupled to a
custom quantizer IC which
provides the final pulse
shaping for the logic output
and the Signal Detect function.
The data output is differential.
The signal detect output is
single-ended. Both data and
signal detect outputs are PECL
compatible, ECL referenced
(shifted) to a +3.3 V or +5 V
power supply.
The package includes internal
shields for the electrical and
optical subassemblies to ensure
low EMI emissions and high
immunity to external EMI
fields.
ELECTRICAL SUBASSEMBLY
DUPLEX SC
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
QUANTIZER IC
DETECT OUT
Package
PREAMP IC
OPTICAL
The overall package concept
for the Agilent transceivers
consists of the following basic
elements; two optical
subassemblies, an electrical
subassembly and the housing
as illustrated in Figure 1 and
Figure 1a.
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1. SC Connector Block Diagram.
2
ELECTRICAL SUBASSEMBLY
DUPLEX ST
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1a. ST Connector Block Diagram.
Case Temperature
Measurement Point
39.12
(1.540)
12.70
(0.500)
MAX.
ꢀ.35
(0.250)
AREA
RESERVED
FOR
PROCESS
PLUG
25.40
MAX.
12.70
(0.500)
(1.000)
AFBR-5803Z
DATE CODE (YYWW)
SINGAPORE
AGILENT
5.93 0.1
(0.233 0.004)
+ 0.08
0.75
– 0.05
3.3 0.4
(0.130 0.01ꢀ)
3.30 0.38
(0.130 0.015)
+ 0.003
10.35
(0.407)
)
(0.030
MAX.
– 0.002
2.92
(0.115)
+ 0.25
– 0.05
18.52
(0.729)
1.27
+ 0.010
– 0.002
0.4ꢀ
(0.018)
NOTE 1
4.14
(0.1ꢀ3
(0.050
)
Ø
(9x)
NOTE 1
23.55
(0.927)
20.32
(0.800)
1ꢀ.70
(0.ꢀ57)
17.32 20.32
(0.ꢀ82 (0.800) (0.918)
23.32
[8x(2.54/.100)]
0.87
23.24
(0.915)
15.88
(0.ꢀ25)
(0.034)
Note 1:
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts
have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.
DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 2. SC Connector Package Outline Drawing with standard height.
3
42
(1.ꢀ54)
MAX.
5.99
(0.23ꢀ)
24.8
(0.97ꢀ)
12.7
(0.500)
25.4
(1.000)
MAX.
AFBR-5803TZ
DATE CODE (YYWW)
SINGAPORE
Case Temperature
Measurement Point
+ 0.08
- 0.05
+ 0.003
0.5
(0.020)
(
- 0.002
(
12.0
(0.471)
MAX.
2.ꢀ 0.4
(0.102 0.01ꢀ)
3.3 0.38
(0.130 0.015)
0.38
0.015)
20.32
(
0.4ꢀ
Ø
(0.018)
NOTE 1
2.ꢀ
Ø
+ 0.25
- 0.05
1.27
(0.102)
(0.050)
(
+ 0.010
- 0.002
)
20.32
(0.800)
17.4
(0.ꢀ85)
[(8x (2.54/0.100)]
20.32
(0.800)
22.8ꢀ
21.4
(0.843)
(0.900)
3.ꢀ
(0.142)
1.3
(0.051)
23.38
18.ꢀ2
(0.921)
(0.733)
Note 1:
Phosphor bronze is the base material for the posts & pins. For lead-free soldering, the solder posts
have Tin Copper over Nickel plating, and the electrical pins have pure Tin over Nickel plating.
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2a. ST Connector Package Outline Drawing with standard height.
1 = VEE
N/C
2 = RD
Rx
Tx
3 = RD
4 = SD
5 = VCC
ꢀ = VCC
7 = TD
8 = TD
9 = VEE
N/C
TOP VIEW
Figure 3. Pin Out Diagram.
4
Application Information
equipment mission life periods. encoding factor used to encode
The Applications Engineering
group in the Agilent Fiber
Contact your Agilent sales
representative for additional
the data
(symbols/bit).
Optics Communication Division details.
is available to assist you with
When used in Fast Ethernet,
FDDI and ATM 100 Mb/s
applications the performance
Figure 4 was generated with a
Agilent fiber optic link model
the technical understanding
and design trade-offs
associated with these trans-
ceivers. You can contact them
through your Agilent sales
representative.
containing the current industry of the 1300 nm transceivers is
conventions for fiber cable
specifications and the FDDI
PMD and LCF-PMD optical
parameters. These parameters
guaranteed over the signaling
rate of 10 MBd to
125 MBd to the full conditions
listed in individual product
The following information is
provided to answer some of
the most common questions
about the use of these parts.
are reflected in the guaranteed specification tables.
performance of the transceiver
2.5
specifications in this data
sheet. This same model has
2.0
been used extensively in the
ANSI and IEEE committees,
including the ANSI X3T9.5
committee, to establish the
optical performance require-
ments for various fiber optic
interface standards. The cable
parameters used come from
the ISO/IEC JTC1/SC 25/WG3
Generic Cabling for Customer
Premises per
DIS 11801 document and the
EIA/TIA-568-A Commercial
Building Telecommunications
Cabling Standard per SP-2840.
Transceiver Optical Power Budget
versus Link Length
Optical Power Budget (OPB) is
the available optical power for
a fiber optic link to
accommodate fiber cable losses
plus losses due to in-line
connectors, splices, optical
switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
1.5
1.0
0.5
0
0.5
0
25 50
75 100 125 150 175 200
SIGNAL RATE (MBd)
CONDITIONS:
1. PRBS 27-1
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
3. BER = 10-ꢀ
4. TA = +25˚ C
5. VCC = 3.3 V to 5 V dc
ꢀ. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 4 illustrates the pre-
dicted OPB associated with the
transceiver series specified in
this data sheet at the Beginning
of Life (BOL). These curves
represent the attenuation and
chromatic plus modal
dispersion losses associated
with the 62.5/125 µm and 50/
125 µm fiber cables only. The
area under the curves
Figure 5. Transceiver Relative Optical Power
Budget at Constant BER vs. Signaling Rate.
12
AFBR-5803, ꢀ2.5/125 µm
10
The transceivers may be used
for other applications at
signaling rates outside of the
10 MBd to 125 MBd range
with some penalty in the link
optical power budget primarily
caused by a reduction of
receiver sensitivity. Figure 5
gives an indication of the
typical performance of these
1300 nm products at different
rates.
8
AFBR-5803
50/125 µm
ꢀ
4
2
represents the remaining OPB
at any link length, which is
available for overcoming non-
fiber cable related losses.
1.
0
0
0.3 0.5
1.5
2.0
2.5
FIBER OPTIC CABLE LENGTH (km)
Figure 4. Optical Power Budget at BOL versus
Fiber Optic Cable Length.
Agilent LED technology has
produced 1300 nm LED
devices with lower aging
characteristics than normally
associated with these
technologies in the industry.
The industry convention is 1.5
dB aging for 1300 nm LEDs.
The Agilent 1300 nm LEDs will
experience less than 1 dB of
aging over normal commercial
These transceivers can also be
used for applications which
require different Bit Error
Rate (BER) performance.
Figure 6 illustrates the typical
trade-off between link BER
and the receivers input optical
power level.
Transceiver Signaling Operating
Rate Range and BER Performance
For purposes of definition, the
symbol (Baud) rate, also called
signaling rate, is the reciprocal
of the shortest symbol time.
Data rate (bits/sec) is the
symbol rate divided by the
5
1 x 10 -2
without violating the Annex E
allocation example. In practice
the typical contribution of the
Agilent transceivers is well
below these maximum allowed
amounts.
to prevent damage which may
be induced by electrostatic
discharge (ESD). The AFBR-
5800 series of transceivers
meet MIL-STD-883C Method
3015.4 Class 2 products.
1 x 10 -3
1 x 10 -4
AFBR-5803 SERIES
1 x 10 -5
1 x 10 -ꢀ
1 x 10 -7
CENTER OF SYMBOL
Recommended Handling Precautions Care should be used to avoid
Agilent recommends that
normal static precautions be
taken in the handling and
assembly of these transceivers
1 x 10 -8
1 x 10 -9
1 x 10 -10
1 x 10 -11
1 x 10 -12
shorting the receiver data or
signal detect outputs directly
to ground without proper
current limiting impedance.
-ꢀ
-4
-2
0
2
4
RELATIVE INPUT OPTICAL POWER - dB
CONDITIONS:
1. 155 MBd
2. PRBS 27-1
3. CENTER OF SYMBOL SAMPLING
4. TA = +25˚C
5. VCC= 3.3 V to 5 V dc
ꢀ. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Rx
Tx
Figure ꢀ. Bit Error Rate vs. Relative Receiver
Input Optical Power.
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
Transceiver Jitter Performance
The Agilent 1300 nm
AFBR-5803Z
transceivers are designed to
operate per the system jitter
allocations stated in Tables E1
of Annexes E of the FDDI
PMD and LCF-PMD standards.
TOP VIEW
Rx
Rx
VCC
5
Tx
Tx
VEE
VEE
RD
2
RD
3
SD
4
VCC
TD
7
TD
8
1
ꢀ
9
The Agilent 1300 nm
transmitters will tolerate the
worst case input electrical
jitter allowed in these tables
without violating the worst
case output jitter requirements
of Sections 8.1 Active Output
Interface of the FDDI PMD and
LCF-PMD standards.
C1
C2
VCC
R2
R3
L1
L2
C4
TERMINATION
AT PHY
DEVICE
INPUTS
R1
R4
VCC
C3
C5
V
CC FILTER
AT VCC PINS
TRANSCEIVER
R9
R5
R7
The Agilent 1300 nm receivers
will tolerate the worst case
input optical jitter allowed in
Sections 8.2 Active Input
TERMINATION
AT TRANSCEIVER
INPUTS
Cꢀ
Rꢀ
R8
R10
Interface of the FDDI PMD and
LCF-PMD standards without
violating the worst case output
electrical jitter allowed in the
Tables E1 of the Annexes E.
RD
RD
SD
VCC
TD
TD
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = Rꢀ = R8 = R10 = 130 OHMS FOR +5.0 V OPERATION, 82 OHMS FOR +3.3 V OPERATION.
R2 = R3 = R5 = R7 = R9 = 82 OHMS FOR +5.0 V OPERATION, 130 OHMS FOR +3.3 V OPERATION.
C1 = C2 = C3 = C5 = Cꢀ = 0.1 µF.
The jitter specifications stated
in the following 1300 nm
transceiver specification tables
are derived from the values in
Tables E1 of Annexes E. They
represent the worst case jitter
contribution that the trans-
ceivers are allowed to make to
the overall system jitter
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Figure 7. Recommended Decoupling and Termination Circuits
6
Solder and Wash Process
Compatibility
Board Layout - Decoupling Circuit
and Ground Planes
Board Layout - Hole Pattern
The Agilent transceiver
The transceivers are delivered
with protective process plugs
inserted into the duplex SC or
duplex ST connector
receptacle. This process plug
protects the optical
It is important to take care in
the layout of your circuit
board to achieve optimum
performance from these
transceivers. Figure 7 provides
complies with the circuit board
“Common Transceiver
Footprint” hole pattern defined
in the original multisource
announcement which defined
a good example of a schematic the 1 x 9 package style. This
subassemblies during wave
solder and aqueous wash
processing and acts as a dust
cover during shipping.
for a power supply decoupling
circuit that works well with
these parts. It is further
recommended that a
contiguous ground plane be
provided in the circuit board
directly under the transceiver
to provide a low inductance
ground for signal return
current. This recommendation
is in keeping with good high
frequency board layout
drawing is reproduced in
Figure 8 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout
of your circuit board.
These transceivers are compat-
ible with either industry
standard wave or hand solder
processes.
Board Layout - Mechanical
For applications providing a
choice of either a duplex SC
or a duplex ST connector
interface, while utilizing the
same pinout on the printed
circuit board, the ST port
needs to protrude from the
chassis panel a minimum of
9.53 mm for sufficient
Shipping Container
The transceiver is packaged in
a shipping container designed
to protect it from mechanical
and ESD damage during
shipment or storage.
practices.
clearance to install the ST
connector.
20.32
(0.800)
2 x Ø 1.9 0.1
(0.075 0.004)
Please refer to Figure 8a for a
mechanical layout detailing the
recommended location of the
duplex SC and duplex ST
transceiver packages in
relation to the chassis panel.
20.32
(0.800)
9 x Ø 0.8 0.1
(0.032 0.004)
2.54
(0.100)
TOP VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Figure 8. Recommended Board Layout Hole Pattern
7
42.0
24.8
9.53
12.0
(NOTE 1)
0.51
12.09
25.4
39.12
11.1
ꢀ.79
0.75
25.4
NOTE 1: MINIMUM DISTANCE FROM FRONT
OF CONNECTOR TO THE PANEL FACE.
Figure 8a. Recommended Common Mechanical Layout for SC and ST 1 x 9 Connectored Transceivers.
Regulatory Compliance
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD
damage is important.
The second case to consider is
static discharges to the exterior
of the equipment chassis con-
taining the transceiver parts.
To the extent that the duplex
SC connector is exposed to the
outside of the equipment
chassis it may be subject to
whatever ESD system level test
criteria that the equipment is
intended to meet.
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with
the various international
regulations governing certifica-
tion of Information Technology
Equipment. See the Regulatory
Compliance Table for details.
Additional information is
available from your Agilent
sales representative.
The first case is during
handling of the transceiver
prior to mounting it on the
circuit board. It is important
to use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and
floor mats in ESD controlled
areas.
8
Regulatory Compliance Table
Feature
Test Method
Performance
Electrostatic Discharge (ESD) to MIL-STD-883C
Meets Class 1 (<1999 Volts)
the Electrical Pins
Method 3015.4
Withstand up to 1500 V applied between electrical pins.
Electrostatic Discharge (ESD) to Variation of
Typically withstand at least 25 kV without damage when the Duplex SC
Connector Receptacle is contacted by a Human Body Model probe.
the Duplex SC Receptacle
IEC 801-2
Electromagnetic Interference
(EMI)
FCC Class B
Transceivers typically provide a 13 dB margin (with duplex SC receptacle) or a 9
dB margin (with duplex ST receptacles ) to the noted standard limits. However,
it should be noted that final margin depends on the customer's board and
chassis design.
CENELEC CEN55022
Class B (CISPR 22B)
VCCI Class 2
Immunity
Variation of IEC 61000-4-3
Typically show no measurable effect from a 10 V/m field swept from 10 to 450
MHz applied to the transceiver when mounted to a circuit card without a
chassis enclosure.
Electromagnetic Interference (EMI)
Most equipment designs
In all well-designed chassis,
two 0.5" holes for ST
Transceiver Reliability and
Performance Qualification Data
utilizing these high speed
transceivers from Agilent will
be required to meet the
requirements of FCC in the
United States, CENELEC
connectors to protrude through The 1 x 9 transceivers have
will provide 4.6 dB more
passed Agilent reliability and
performance qualification
testing and are undergoing
ongoing quality monitoring.
Details are available from your
Agilent sales representative.
shielding than one 1.2" duplex
SC rectangular cutout. Thus, in
a well-designed chassis, the
EN55022 (CISPR 22) in Europe duplex ST 1 x 9 transceiver
and VCCI in Japan.
emissions will be identical to
the duplex SC 1 x 9
Accessory Duplex SC Connectored
Cable Assemblies
transceiver emissions.
200
Immunity
Agilent recommends for
optimal coupling the use of
flexible-body duplex SC con-
nectored cable.
3.0
3.5
180
1.5
Equipment utilizing these
transceivers will be subject to
radio-frequency
1ꢀ0
2.0
electromagnetic fields in some
environments. These
transceivers have a high
immunity to such fields.
140
120
100
2.5
Accessory Duplex ST Connectored
Cable Assemblies
3.0
3.5
t
– TRANSMITTER
r/f
OUTPUT OPTICAL
RISE/FALL TIMES – ns
Agilent recommends the use of
Duplex Push-Pull connectored
cable for the most repeatable
optical power coupling
performance.
1200 1300 1320 1340 13ꢀ0 1380
For additional information
regarding EMI, susceptibility,
ESD and conducted noise
testing procedures and results
on the
λ
– TRANSMITTER OUTPUT OPTICAL
CENTER WAVELENGTH –nm
C
AFBR-5803Z FDDI TRANSMITTER TEST RESULTS
OF λ , ∆λ AND t ARE CORRELATED AND
COMPLY WITH THE ALLOWED SPECTRAL WIDTH
AS A FUNCTION OF CENTER WAVELENGTH FOR
VARIOUS RISE AND FALL TIMES.
C
r/f
1 x 9 Transceiver family,
please refer to Applications
Note 1075, Testing and
Measuring Electromagnetic
Compatibility Performance of
the AFBR-510X/520X Fiber
Optic Transceivers.
Figure 9. Transmitter Output Optical Spectral
Width (FWHM) vs. Transmitter Output Optical
Center Wavelength and Rise/Fall Times.
9
4.40
1.975
1.25
4.850
1.525
0.525
10.0
5.6
1.025
1.00
0.975
0.075
0.90
100% TIME
INTERVAL
40 0.7
0.50
0.10
0.725
0.725
0% TIME
INTERVAL
0.025
0.0
0.075
-0.025
-0.05
1.525
0.525
5.6
1.975
4.40
10.0
4.850
80 500 ppm
TIME – ns
THE AFBR-5803Z OUTPUT OPTICAL PULSE SHAPE SHALL FIT WITHIN THE BOUNDARIES
OF THE PULSE ENVELOPE FOR RISE AND FALL TIME MEASUREMENTS.
Figure 10. Output Optical Pulse Envelope.
5
AFBR-5803Z SERIES
4
3
-10
2.5 x 10 BER
2
-12
1.0 x 10 BER
1
0
-4 -3 -2 -1
0
1
2
3
4
EYE SAMPLING TIME POSITION (ns)
CONDITIONS:
1.TA = 25 C
2. VCC = 5 Vdc
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
4. INPUT OPTICAL POWER IS NORMALIZED TO
CENTER OF DATA SYMBOL.
5. NOTE 20 AND 21 APPLY.
Figure 11. Relative Input Optical Power vs.
Eye Sampling Time Position.
10
-31.0 dBm
MIN (PO + 4.0 dB OR -31.0 dBm)
PO = MAX (PS OR -45.0 dBm)
PA(PO + 1.5 dB
< PA < -31.0 dBm)
2
(PS = INPUT POWER FOR BER < 10 )
INPUT OPTICAL POWER
( 1.5 dB STEP INCREASE)
INPUT OPTICAL POWER
>
( 4.0 dB STEP DECREASE)
>
-45.0 dBm
ANS MAX
–
AS MAX
–
SIGNAL DETECT
–
(ON)
SIGNAL DETECT
–
(OFF)
TIME
AS MAX — MAXIMUM ACQUISITION TIME (SIGNAL).
–
AS MAX IS THE MAXIMUM SIGNAL DETECT ASSERTION TIME FOR THE STATION.
–
–
AS MAX SHALL NOT EXCEED 100.0 µs. THE DEFAULT VALUE OF AS MAX IS 100.0 µs.
–
–
ANS MAX — MAXIMUM ACQUISITION TIME (NO SIGNAL).
–
ANS MAX IS THE MAXIMUM SIGNAL DETECT DEASSERTION TIME FOR THE STATION.
–
–
ANS MAX SHALL NOT EXCEED 350 µs. THE DEFAULT VALUE OF AS MAX IS 350 µs.
–
–
Figure 12. Signal Detect Thresholds and Timing.
11
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values
of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Storage Temperature
TS
-40
+100
°C
Lead Soldering Temperature
Lead Soldering Time
Supply Voltage
TSOLD
tSOLD
VCC
VI
+260
10
°C
sec.
V
-0.5
-0.5
7.0
VCC
1.4
50
Data Input Voltage
Differential Input Voltage
Output Current
V
VD
V
Note 1
IO
mA
Recommended Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Ambient Operating Temperature
AFBR-5803Z/5803TZ
TA
0
+70
°C
Note A
Note B
AFBR-5803AZ/5803ATZ
Supply Voltage
TA
VCC
-10
3.135
+85
3.5
°C
V
VCC
4.75
5.25
V
V
V
W
Data Input Voltage - Low
VIL - VCC
VIH - VCC
RL
-1.810
-1.165
-1.475
-0.880
Data Input Voltage - High
Data and Signal Detect Output Load
50
Note 2
Notes:
A. Ambient Operating Temperature corresponds to transceiver case temperature of 0°C mininum to +85 °C maximum with necessary airflow applied.
Recommended case temperature measurement point can be found in Figure 2.
B. Ambient Operating Temperature corresponds to transceiver case temperature of -10 °C mininum to +100 °C maximum with necessary airflow
applied. Recommended case temperature measurement point can be found in Figure 2.
Transmitter Electrical Characteristics
(AFBR-5803Z/5803TZ: T = 0°C to +70°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
(AFBR-5803AZ/AFBR-5803ATZ: T = -10°C to +85°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Supply Current
ICC
133
175
mA
Note 3
Power Dissipation
at VCC = 3.3 V
at VCC = 5.0 V
PDISS
PDISS
IIL
0.45
0.76
-2
0.6
W
W
0.97
Data Input Current - Low
-350
µA
µA
Data Input Current - High
IIH
18
350
12
Receiver Electrical Characteristics
(AFBR-5803Z/5803TZ: T = 0°C to +70°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
(AFBR-5803AZ/AFBR-5803ATZ: T = -10°C to +85°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Supply Current
ICC
87
120
mA
Note 4
Power Dissipation
at VCC = 3.3 V
at VCC = 5.0 V
PDISS
0.15
0.3
0.25
0.5
W
W
V
Note 5
Note 5
Note 6
Note 6
Note 7
Note 7
Note 6
Note 6
Note 7
Note 7
PDISS
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
VOL - VCC
-1.83
-1.085
0.35
-1.55
-0.88
2.2
VOH - VCC
V
tr
ns
ns
V
Data Output Fall Time
tf
0.35
2.2
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Output Rise Time
Signal Detect Output Fall Time
VOL - VCC
-1.83
-1.085
0.35
-1.55
-0.88
2.2
VOH - VCC
V
tr
tf
ns
ns
0.35
2.2
Transmitter Optical Characteristics
(AFBR-5803Z/5803TZ: T = 0°C to +70°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
(AFBR-5803AZ/AFBR-5803ATZ: T = -10°C to +85°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
Parameter
Output Optical Power
Symbol
PO
Min.
-19
Typ.
Max.
-14
Unit
dBm avg.
Reference
Note 11
BOL
EOL
62.5/125 µm, NA = 0.275 Fiber
-20
Output Optical Power
BOL
EOL
PO
-22.5
-23.5
-14
dBm avg.
Note 11
Note 12
50/125 µm, NA = 0.20 Fiber
Optical Extinction Ratio
10
%
-10
-45
dB
dBm avg.
Output Optical Power at Logic “0” State
Center Wavelength
PO (“0”)
lC
Note 13
Note 14
Note 14
1270
1308
147
1380
nm
nm
Dl
Spectral Width - FWHM
Spectral Width - nm RMS
Optical Rise Time
63
1.9
Figure 9
Note 14, 15
tr
tf
0.6
0.6
3.0
3.0
ns
ns
Figure 9, 10
Optical Fall Time
1.6
Note 14, 15
Figure 9, 10
Duty Cycle Distortion Contributed by the Transmitter
Data Dependent Jitter Contributed by the Transmitter
Random Jitter Contributed by the Transmitter
DCD
DDJ
RJ
0.6
ns p-p
ns p-p
ns p-p
Note 16
Note 17
Note 18
0.6
0.69
13
Receiver Optical and Electrical Characteristics
(AFBR-5803Z/5803TZ: T = 0°C to +70°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
(AFBR-5803AZ/AFBR-5803ATZ: T = -10°C to +85°C, V = 3.135 V to 3.5 V or 4.75 V to 5.25 V)
A
CC
Parameter
Symbol
PIN Min. (W)
Min.
Typ.
-33.9
Max.
-31
Unit
dBm avg.
Reference
Note 19
Input Optical Power Minimum at Window Edge
Input Optical Power Minimum at Eye Center
Figure 11
P
IN Min. (C)
-35.2
-31.8
dBm avg.
Note 20
Figure 11
Input Optical Power Maximum
PIN Max.
-14
dBm avg.
nm
Note 19
l
Operating Wavelength
1270
1380
0.4
Duty Cycle Distortion Contributed by the Receiver
Data Dependent Jitter Contributed by the Receiver
Random Jitter Contributed by the Receiver
Signal Detect - Asserted
DCD
DDJ
RJ
ns p-p
ns p-p
ns p-p
dBm avg.
Note 8
Note 9
Note 10
1.0
2.14
-33
PA
PD + 1.5 dB
-45
Note 21, 22
Figure 12
Signal Detect - Deasserted
PD
dBm avg.
Note 23, 24
Figure 12
Signal Detect - Hysteresis
PA - PD
1.5
0
dB
µs
Figure 12
Signal Detect Assert Time (off to on)
AS_Max
2
8
100
350
Note 21, 22
Figure 12
Signal Detect Deassert Time (on to off)
ANS_Max
0
µs
Note 23, 24
Figure 12
Notes:
1. This is the maximum voltage that can be
applied across the Differential Transmitter
Data Inputs to prevent damage to the input
ESD protection circuit.
using an IDLE Line State, 125 MBd
• With HALT Line State, (12.5 MHz square-
wave), input signal.
(62.5 MHz square-wave), input signal. The
input optical power level is -20 dBm
average. See Application Information -
Transceiver Jitter Section for further
information.
• At the end of one meter of noted optical
fiber with cladding modes removed.
2. The outputs are terminated with 50 W
The average power value can be converted
to a peak power value by adding 3 dB.
Higher output optical power transmitters
are available on special request.
connected to V -2 V.
CC
3. The power supply current needed to operate
the transmitter is provided to differential
ECL circuitry. This circuitry maintains a
nearly constant current flow from the power
supply. Constant current operation helps to
prevent unwanted electrical noise from
being generated and conducted or emitted
to neighboring circuitry.
9. Data Dependent Jitter contributed by
the receiver is specified with the FDDI DDJ
test pattern described in the FDDI PMD
Annex A.5. The input optical power level is -
20 dBm average. See Application Informa-
tion - Transceiver Jitter Section for further
information.
12. The Extinction Ratio is a measure of the
modulation depth of the optical signal. The
data “0” output optical power is compared
to the data “1” peak output optical power
and expressed as a percentage. With the
transmitter driven by a HALT Line State
(12.5 MHz square-wave) signal, the average
optical power is measured. The data “1”
peak power is then calculated by adding 3
dB to the measured average optical power.
The data “0” output optical power is found
by measuring the optical power when the
transmitter is driven by a logic “0” input.
The extinction ratio is the ratio of the
optical power at the “0” level compared to
the optical power at the “1” level expressed
as a percentage or in decibels.
10. Random Jitter contributed by the receiver is
specified with an IDLE Line State,
4. This value is measured with the outputs
terminated into 50 W connected to V - 2 V
125 MBd (62.5 MHz square-wave), input
signal. The input optical power level is at
CC
and an Input Optical Power level of
-14 dBm average.
maximum “P
(W)”. See Application
IN Min.
5. The power dissipation value is the power
dissipated in the receiver itself. Power
dissipation is calculated as the sum of the
products of supply voltage and currents,
minus the sum of the products of the output
voltages and currents.
Information - Transceiver Jitter Section for
furtherinformation.
11. These optical power values are measured
with the following conditions:
• The Beginning of Life (BOL) to the End of
Life (EOL) optical power degradation is
typically 1.5 dB per the industry
6. This value is measured with respect to V
CC
with the output terminated into 50 W
convention for long wavelength LEDs.
The actual degradation observed in
Agilent’s 1300 nm LED products is
< 1 dB, as specified in this data sheet.
• Over the specified operating voltage and
temperature ranges.
13. The transmitter provides compliance with
the need for Transmit_Disable commands
from the FDDI SMT layer by providing an
Output Optical Power level of < -45 dBm
average in response to a logic “0” input.
This specification applies to either 62.5/125
µm or 50/125 µm fiber cables.
connected to V - 2 V.
CC
7. The output rise and fall times are measured
between 20% and 80% levels with the
output connected to V -2 V through 50 W.
CC
8. Duty Cycle Distortion contributed by the
receiver is measured at the 50% threshold
14
-2
14. This parameter complies with the FDDI PMD
requirements for the trade-offs between
center wavelength, spectral width, and rise/
fall times shown in Figure 9.
15. This parameter complies with the optical
pulse envelope from the FDDI PMD shown
in Figure 10. The optical rise and fall times
are measured from 10% to 90% when the
transmitter is driven by the FDDI HALT Line
State (12.5 MHz square-wave) input signal.
16. Duty Cycle Distortion contributed by the
transmitter is measured at a 50% threshold
using an IDLE Line State, 125 MBd
with production test equipment. The
receiver can be equivalently tested to the
worst case FDDI PMD input jitter conditions
and meet the minimum output data window
time-width of 2.13 ns. This is accomplished
by using a nearly ideal input optical signal
(no DCD, insignificant DDJ and RJ) and
measuring for a wider window time-width of
4.6 ns. This is possible due to the cumulative
effect of jitter components through their
superposition (DCD and DDJ are directly
additive and RJ components are rms
additive). Specifically, when a nearly ideal
input optical test signal is used and the
maximum receiver peak-to-peak jitter
contributions of DCD (0.4 ns), DDJ (1.0 ns),
and RJ (2.14 ns) exist, the minimum window
time-width becomes 8.0 ns -0.4 ns - 1.0 ns -
2.14 ns = 4.46 ns, or conservatively 4.6 ns.
This wider window time-width of 4.6 ns
guarantees the FDDI PMD Annex E
above 10 for an input optical data stream
that decays with a negative ramp function
instead of a step function. See Figure 12 for
moreinformation.
(62.5 MHz square-wave), input signal. See
Application Information - Transceiver Jitter
Performance Section of this data sheet for
further details.
17. Data Dependent Jitter contributed by the
transmitter is specified with the FDDI test
pattern described in FDDI PMD Annex A.5.
See Application Information - Transceiver
Jitter Performance Section of this data
sheet for further details.
18. Random Jitter contributed by the
transmitter is specified with an IDLE Line
State, 125 MBd (62.5 MHz square-wave),
input signal. See Application Information -
Transceiver Jitter Performance Section of
this data sheet for further details.
19. This specification is intended to indicate the
performance of the receiver section of the
transceiver when Input Optical Power signal
characteristics are present per the following
definitions. The Input Optical Power
minimum window time-width of 2.13 ns
under worst case input jitter conditions to
the Agilent receiver.
•
Transmitter operating with an IDLE Line
State pattern, 125 MBd (62.5 MHz
square-wave), input signal to simulate
any cross-talk present between the
transmitter and receiver sections of the
transceiver.
20. All conditions of Note 19 apply except that
the measurement is made at the center of
the symbol with no window time-width.
21. This value is measured during the transition
from low to high levels of input optical
power.
22. The Signal Detect output shall be asserted
within 100 µs after a step increase of the
Input Optical Power. The step will be from a
low Input Optical Power, - -45 dBm, into the
dynamic range from the minimum level (with
a window time-width) to the maximum level
is the range over which the receiver is
guaranteed to provide output data with a Bit
Error Ratio (BER) better than or equal to 2.5
-10
x 10
.
•
•
At the Beginning of Life (BOL)
Over the specified operating temperature
and voltage ranges
range between greater than P , and
A
-14 dBm. The BER of the receiver output will
-2
be 10 or better during the time, LS_Max
•
•
Input symbol pattern is the FDDI test
pattern defined in FDDI PMD Annex A.5
with 4B/5B NRZI encoded data that
contains a duty cycle base-line wander
effect of 50 kHz. This sequence causes a
near worst case condition for inter-
symbol interference.
Receiver data window time-width is
2.13 ns or greater and centered at
mid-symbol. This worst case window
time-width is the minimum allowed
eye-opening presented to the FDDI PHY
PM._Data indication input (PHY input)
per the example in FDDI PMD Annex E.
This minimum window time-width of 2.13
ns is based upon the worst case FDDI
PMD Active Input Interface optical
conditions for peak-to-peak DCD (1.0 ns),
DDJ (1.2 ns) and RJ (0.76 ns) presented
to the receiver.
(15 µs) after Signal Detect has been
asserted. See Figure 12 for more
information.
23. This value is measured during the transition
from high to low levels of input optical
power. The maximum value will occur when
the input optical power is either -45 dBm
average or when the input optical power
-2
yields a BER of 10 or larger, whichever
power is higher.
24. Signal detect output shall be de-asserted
within 350 µs after a step decrease in the
Input Optical Power from a level which is
the lower of; -31 dBm or P + 4 dB (P is the
D
D
power level at which signal detect was de-
asserted), to a power level of -45 dBm or
less. This step decrease will have occurred
in less than 8 ns. The receiver output will
-2
have a BER of 10 or better for a period of
12 µs or until signal detect is de-asserted.
The input data stream is the Quiet Line
State. Also, signal detect will be de-
asserted within a maximum of 350 µs after
the BER of the receiver output degrades
To test a receiver with the worst case FDDI
PMD Active Input jitter condition requires
exacting control over DCD, DDJ and RJ jitter
components that is difficult to implement
15
Ordering Information
The AFBR-5803Z/5803TZ/5803AZ/5803ATZ 1300 nm products are available for production orders
through the Agilent Component Field Sales Offices and Authorized Distributors world wide.
0 °C to +70 °C
AFBR-5803Z/5803TZ
-10 °C TO +85 °C
AFBR-5803AZ/5803ATZ
Note:
The “T” in the product numbers indicates a transceiver with a duplex ST connector receptacle.
Product numbers without a “T” indicate transceivers with a duplex SC connector receptacle.
www.agilent.com/
semiconductors
For product information and a complete list
of distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408)654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/Inter-
national), or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
Obsoletes5989-2294EN
October 4, 2005
5989-3432EN
相关型号：
AFBR-5921ALZ
Small Form Factor, Pin Through Hole (PTH), Low Voltage (3.3 V) 2x5 RoHS-Compliant Optical Transceiver for Fibre Channel 2.125/1.0625 GBd 850 nm
AVAGO
AFBR-5972Z
Compact 650nm Transceiver with Compact Versatile-Link connector for Fast Ethernet over POF
AVAGO
AFBR-5978Z
Digital Diagnostic 650nm Transceiver for Fast Ethernet (10/100 Mbps) with SC-RJ connector
AVAGO
©2020 ICPDF网 联系我们和版权申明