AD7687 [ADI]

3mW, 100kSPS, 14-Bit ADC in 6-Lead SOT-23; 为3mW , 100ksps的14位ADC,采用6引脚SOT -23
AD7687
型号: AD7687
厂家: ADI    ADI
描述:

3mW, 100kSPS, 14-Bit ADC in 6-Lead SOT-23
为3mW , 100ksps的14位ADC,采用6引脚SOT -23

文件: 总20页 (文件大小:475K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
3 mW, 100 kSPS,  
14-Bit ADC in 6-Lead SOT-23  
AD7940  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
V
Fast throughput rate: 100 kSPS  
Specified for VDD of 2.5 V to 5.5 V  
Low power  
4 mW typ at 100 kSPS with 3 V supplies  
17 mW typ at 100 kSPS with 5 V supplies  
Wide input bandwidth:  
DD  
14-BIT SUCCESSIVE  
APPROXIMATION  
ADC  
V
T/H  
IN  
SCLK  
SDATA  
CS  
CONTROL  
LOGIC  
81 dB SINAD at 10 kHz input frequency  
Flexible power/serial clock speed management  
No pipeline delays  
AD7940  
GND  
High speed serial interface  
SPI®/QSPI™/MICROWIRE™/DSP compatible  
Standby mode: 0.5 µA max  
6-Lead SOT-23 and 8-Lead MSOP packages  
Figure 1.  
Table 1. 16-Bit and 14-Bit ADC (MSOP and SOT-23)  
Type  
100 kSPS 250 kSPS 500 kSPS  
APPLICATIONS  
16-Bit True Differential  
16-Bit Pseudo Differential  
16-Bit Unipolar  
14-Bit True Differential  
14-Bit Pseudo Differential  
14-Bit Unipolar  
AD7684  
AD7683  
AD7680  
AD7687  
AD7685  
AD7688  
AD7686  
Battery-powered systems  
Personal digital assistants  
Medical instruments  
Mobile communications  
Instrumentation and control systems  
Remote data acquisition systems  
AD7944  
AD7942  
AD7947  
AD7946  
AD7940  
GENERAL DESCRIPTION  
The AD79401 is a 14-bit, fast, low power, successive approxima-  
tion ADC. The part operates from a single 2.50 V to 5.5 V power  
supply and features throughput rates up to 100 kSPS. The part  
contains a low noise, wide bandwidth track-and-hold amplifier  
that can handle input frequencies in excess of 7 MHz.  
This part features a standard successive approximation ADC  
CS  
with accurate control of the sampling instant via a  
once off conversion control.  
input and  
PRODUCT HIGHLIGHTS  
1. First 14-bit ADC in a SOT-23 package.  
2. High throughput with low power consumption.  
The conversion process and data acquisition are controlled  
CS  
using  
with microprocessors or DSPs. The input signal is sampled on  
CS  
and the serial clock, allowing the devices to interface  
3. Flexible power/serial clock speed management. The con-  
version rate is determined by the serial clock, allowing the  
conversion time to be reduced through the serial clock  
speed increase. This allows the average power consumption  
to be reduced when a power-down mode is used while not  
converting. The part also features a shutdown mode to  
maximize power efficiency at lower throughput rates.  
Power consumption is 0.5 µA max when in shutdown.  
the falling edge of  
and the conversion is also initiated at this  
point. There are no pipelined delays associated with the part.  
The AD7940 uses advanced design techniques to achieve very  
low power dissipation at fast throughput rates. The reference for  
the part is taken internally from VDD, which allows the widest  
dynamic input range to the ADC. Thus, the analog input range  
for this part is 0 V to VDD. The conversion rate is determined by  
the SCLK frequency.  
4. Reference derived from the power supply.  
5. No pipeline delay.  
1 Protected by U.S. Patent No. 6,681,332.  
Rev. 0  
Information furnished by Analog Devices is believed to be accurate and reliable.  
However, no responsibility is assumed by Analog Devices for its use, nor for any  
infringements of patents or other rights of third parties that may result from its use.  
Specifications subject to change without notice. No license is granted by implication  
or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781.329.4700  
Fax: 781.326.8703  
www.analog.com  
© 2004 Analog Devices, Inc. All rights reserved.  
 
AD7940  
TABLE OF CONTENTS  
Specifications..................................................................................... 3  
Normal Mode.............................................................................. 13  
Power-Down Mode.................................................................... 14  
Power vs. Throughput Rate........................................................... 15  
Serial Interface ................................................................................ 16  
Microprocessor Interfacing........................................................... 17  
AD7940 to TMS320C541.......................................................... 17  
AD7940 to ADSP-218x.............................................................. 17  
AD7940 to DSP563xx................................................................ 18  
Application Hints ........................................................................... 19  
Grounding and Layout .............................................................. 19  
Evaluating the AD7940 Performance ...................................... 19  
Outline Dimensions....................................................................... 20  
Ordering Guide .......................................................................... 20  
Timing Specifications....................................................................... 5  
Absolute Maximum Ratings............................................................ 6  
ESD Caution.................................................................................. 6  
Pin Configurations and Function Descriptions ........................... 7  
Terminology ...................................................................................... 8  
Typical Performance Characteristics ............................................. 9  
Circuit Information........................................................................ 11  
Converter Operation.................................................................. 11  
Analog Input ............................................................................... 11  
ADC Transfer Function................................................................. 12  
Typical Connection Diagram ................................................... 12  
Modes of Operation ....................................................................... 13  
REVISION HISTORY  
6/04—Revision 0: Initial Version  
Rev. 0 | Page 2 of 20  
AD7940  
SPECIFICATIONS1  
VDD = 2.50 V to 5.5 V, fSCLK = 2.5 MHz, fSAMPLE = 100 kSPS, unless otherwise noted; TA = TMIN to TMAX, unless otherwise noted.  
Table 2.  
1
Parameter  
B Version  
Unit  
Test Conditions/Comments  
DYNAMIC PERFORMANCE  
Signal-to-Noise + Distortion (SINAD)2  
Total Harmonic Distortion (THD)2  
Peak Harmonic or Spurious Noise (SFDR)2  
Intermodulation Distortion (IMD)2  
Second-Order Terms  
Third-Order Terms  
Aperture Delay  
Aperture Jitter  
fIN = 10 kHz sine wave  
81  
−98  
−95  
dB min  
dB typ  
dB typ  
−94  
−100  
20  
dB typ  
dB typ  
ns max  
ps typ  
30  
Full Power Bandwidth  
7
2
MHz typ  
MHz typ  
@ −3 dB  
@ −0.1 dB  
DC ACCURACY  
Resolution  
14  
13  
1
2
6
Bits min  
Bits min  
LSB max  
LSB max  
LSB max  
LSB max  
VDD = 2.5 V to 4.096 V  
VDD > 4.096 V  
VDD = 2.5 V to 4.096 V  
VDD > 4.096 V  
Integral Nonlinearity2  
Offset Error2  
Gain Error2  
8
ANALOG INPUT  
Input Voltage Ranges  
DC Leakage Current  
Input Capacitance  
LOGIC INPUTS  
0 to VDD  
0.3  
30  
V
µA max  
pF typ  
Input High Voltage, VINH  
Input Low Voltage, VINL  
2.4  
0.4  
0.8  
0.3  
10  
V min  
V max  
V max  
µA max  
pF max  
VDD = 3 V  
VDD = 5 V  
Typically 10 nA, VIN = 0 V or VDD  
Input Current, IIN  
2, 3  
Input Capacitance, CIN  
LOGIC OUTPUTS  
Output High Voltage, VOH  
Output Low Voltage, VOL  
Floating-State Leakage Current  
Floating-State Output Capacitance2, 3  
Output Coding  
VDD – 0.2  
0.4  
0.3  
V min  
ISOURCE = 200 µA; VDD = 2.50 V to 5.25 V  
ISINK = 200 µA  
V max  
µA max  
pF max  
10  
Straight (Natural) Binary  
CONVERSION RATE  
Conversion Time  
Track-and-Hold Acquisition Time  
8
µs max  
ns max  
ns max  
kSPS max  
16 SCLK cycles  
Full-scale step input  
Sine wave input ≤ 10 kHz  
See the Serial Interface section  
500  
400  
100  
Throughput Rate  
POWER REQUIREMENTS  
VDD  
2.50/5.5  
V min/V max  
IDD  
Digital I/PS = 0 V or VDD  
VDD = 5.5 V; SCLK on or off  
VDD = 3.6 V; SCLK on or off  
VDD = 5.5 V; fSAMPLE = 100 kSPS; 3.3 mA typ  
VDD = 3.6 V; fSAMPLE = 100 kSPS; 1.29 mA typ  
SCLK on or off. VDD = 5.5 V  
Normal Mode (Static)  
5.2  
2
4.8  
1.9  
0.5  
0.3  
mA max  
mA max  
mA max  
mA max  
µA max  
µA max  
Normal Mode (Operational)  
Full Power-Down Mode  
SCLK on or off. VDD = 3.6 V  
Rev. 0 | Page 3 of 20  
 
AD7940  
1
Parameter  
Power Dissipation4  
B Version  
Unit  
Test Conditions/Comments  
VDD = 5.5 V  
Normal Mode (Operational)  
26.4  
6.84  
2.5  
mW max  
mW max  
µW max  
µW max  
VDD = 5.5 V; fSAMPLE = 100 kSPS  
VDD = 3.6 V; fSAMPLE = 100 kSPS  
VDD = 5.5 V  
Full Power-Down  
1.08  
VDD = 3.6 V  
1 Temperature range for B Version is –40°C to +85°C.  
2 See the Terminology section.  
3 Sample tested at initial release to ensure compliance.  
4 See the Power vs. Throughput Rate section.  
Rev. 0 | Page 4 of 20  
 
AD7940  
TIMING SPECIFICATIONS  
Sample tested at initial release to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from  
a voltage level of 1.6 V.  
VDD = 2.50 V to 5.5 V; TA = TMIN to TMAX, unless otherwise noted.  
Table 3.  
Limit at TMIN, TMAX  
Parameter  
3 V  
5 V  
Unit  
Description  
1
fSCLK  
250  
2.5  
16 × tSCLK  
50  
250  
2.5  
16 × tSCLK  
50  
kHz min  
MHz max  
min  
tCONVERT  
tQUIET  
ns min  
Minimum quiet time required between bus relinquish and start of  
next conversion  
t1  
t2  
10  
10  
ns min  
ns min  
ns max  
ns max  
ns min  
ns min  
ns min  
ns max  
µs typ  
CS  
Minimum  
CS  
pulse width  
10  
10  
to SCLK setup time  
2
t3  
48  
35  
CS  
Delay from until SDATA three-state disabled  
Data access time after SCLK falling edge  
SCLK low pulse width  
2
t4  
120  
0.4 tSCLK  
0.4 tSCLK  
10  
45  
1
80  
t5  
t6  
t7  
0.4 tSCLK  
0.4 tSCLK  
10  
35  
1
SCLK high pulse width  
SCLK to data valid hold time  
SCLK falling edge to SDATA high impedance  
Power up time from full power-down  
3
t8  
4
tPOWER-UP  
1 Mark/space ratio for the SCLK input is 40/60 to 60/40.  
2 Measured with the load circuit of Figure 2 and defined as the time required for the output to cross 0.8 V or 2.0 V.  
3 t8 is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 2. The measured number is then extrapolated  
back to remove the effects of charging or discharging the 50 pF capacitor. This means that the time, t8, quoted in the timing characteristics is the true bus relinquish  
time of the part and is independent of the bus loading.  
4 See the Power vs. Throughput Rate section.  
200µA  
I
OL  
TO OUTPUT  
PIN  
1.6V  
C
L
50pF  
200µA  
I
OH  
Figure 2. Load Circuit for Digital Output Timing Specification  
Rev. 0 | Page 5 of 20  
 
 
 
 
 
AD7940  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Table 4.  
Parameter  
Rating  
VDD to GND  
−0.3 V to +7 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to +7 V  
−0.3 V to VDD + 0.3 V  
10 mA  
Analog Input Voltage to GND  
Digital Input Voltage to GND  
Digital Output Voltage to GND  
Input Current to Any Pin Except Supplies1  
Operating Temperature Range  
Commercial (B Version)  
Storage Temperature Range  
Junction Temperature  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress rat-  
ing only; functional operation of the device at these or any  
other conditions above those listed in the operational sections  
of this specification is not implied. Exposure to absolute maxi-  
mum rating conditions for extended periods may affect device  
reliability.  
−40°C to +85°C  
−65°C to +150°C  
150°C  
SOT-23 Package, Power Dissipation  
θJA Thermal Impedance  
θJC Thermal Impedance  
MSOP Package, Power Dissipation  
θJA Thermal Impedance  
θJC Thermal Impedance  
Lead Temperature, Soldering  
Vapor Phase (60 secs)  
450 mW  
229.6°C/W  
91.99°C/W  
450 mW  
205.9°C/W  
43.74°C/W  
215°C  
220°C  
4 kV  
Infared (15 secs)  
ESD  
1 Transient currents of up to 100 mA will not cause SCR latch-up.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the  
human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. 0 | Page 6 of 20  
 
 
AD7940  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
SOT-23  
MSOP  
V
1
2
3
6
5
4
CS  
V
1
2
3
4
8
7
6
5
CS  
DD  
DD  
AD7940  
AD7490  
GND  
SDATA  
SCLK  
GND  
GND  
SDATA  
NC  
TOP VIEW  
TOP VIEW  
V
IN  
(Not to Scale)  
(Not to Scale)  
V
SCLK  
IN  
Figure 3. SOT-23 Pin Configuration  
NC = NO CONNECT  
Figure 4. MSOP Pin Configuration  
Table 5. Pin Function Descriptions  
Pin No.  
SOT-23  
Pin No.  
MSOP  
Mnemonic Function  
1
2
1
2, 3  
VDD  
GND  
Power Supply Input. The VDD range for the AD7940 is from 2.5 V to 5.5 V.  
Analog Ground. Ground reference point for all circuitry on the AD7940. All analog input signals should  
be referred to this GND voltage.  
3
4
4
5
VIN  
SCLK  
Analog Input. Single-ended analog input channel. The input range is 0 V to VDD.  
Serial Clock. Logic input. SCLK provides the serial clock for accessing data from this part. This clock  
input is also used as the clock source for the AD7940's conversion process.  
5
7
SDATA  
Data Out. Logic output. The conversion result from the AD7940 is provided on this output as a serial  
data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream from the  
AD7940 consists of two leading zeros followed by 14 bits of conversion data that are provided MSB  
CS  
first. This will be followed by four trailing zeroes if is held low for a total of 24 SCLK cycles. See the  
Serial Interface section.  
6
8
6
CS  
Chip Select. Active low logic input. This input provides the dual function of initiating conversions on  
the AD7940 and framing the serial data transfer.  
No Connect. This pin should be left unconnected.  
N/A  
NC  
Rev. 0 | Page 7 of 20  
 
AD7940  
TERMINOLOGY  
Integral Nonlinearity  
Total Harmonic Distortion (THD)  
This is the maximum deviation from a straight line passing  
through the endpoints of the ADC transfer function. The end-  
points of the transfer function are zero scale, a point 1/2 LSB  
below the first code transition, and full scale, a point 1/2 LSB  
above the last code transition.  
THD is the ratio of the rms sum of harmonics to the funda-  
mental. For the AD7940, it is defined as  
2
V22 + V32 + V42 + V52 + V6  
THD(dB) = 20log  
V
1
where V1 is the rms amplitude of the fundamental and V2, V3,  
V4, V5, and V6 are the rms amplitudes of the second through the  
sixth harmonics.  
Differential Nonlinearity  
This is the difference between the measured and the ideal 1 LSB  
change between any two adjacent codes in the ADC.  
Peak Harmonic or Spurious Noise  
Offset Error  
Peak harmonic or spurious noise is defined as the ratio of the  
rms value of the next largest component in the ADC output  
spectrum (up to fS/2, excluding dc) to the rms value of the fun-  
damental. Normally, the value of this specification is deter-  
mined by the largest harmonic in the spectrum, but for ADCs  
where the harmonics are buried in the noise floor, it will be a  
noise peak.  
This is the deviation of the first code transition (00 . . . 000) to  
(00 . . . 001) from the ideal, i.e., AGND + 1 LSB.  
Gain Error  
This is the deviation of the last code transition (111 . . . 110) to  
(111 . . . 111) from the ideal (i.e., VREF − 1 LSB) after the offset  
error has been adjusted out.  
Track-and-Hold Acquisition Time  
Intermodulation Distortion  
The track-and-hold amplifier returns to track mode at the end  
of conversion. The track-and-hold acquisition time is the time  
required for the output of the track-and-hold amplifier to reach  
its final value, within 1 LSB, after the end of the conversion.  
See the Serial Interface section for more details.  
With inputs consisting of sine waves at two frequencies, fa and fb,  
any active device with nonlinearities will create distortion prod-  
ucts at sum and difference frequencies of mfa nfb where m, n =  
0, 1, 2, 3. Intermodulation distortion terms are those for which  
neither m nor n are equal to zero. For example, the second-order  
terms include (fa + fb) and (fa − fb), while the third-order terms  
include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa −2fb).  
Signal-to-(Noise + Distortion) Ratio  
This is the measured ratio of signal-to-(noise + distortion) at  
the output of the ADC. The signal is the rms amplitude of the  
fundamental. Noise is the sum of all nonfundamental signals up  
to half the sampling frequency (fS/2, excluding dc). The ratio  
depends on the number of quantization levels in the digitization  
process; the more levels, the smaller the quantization noise. The  
theoretical signal-to-(noise + distortion) ratio for an ideal N-bit  
converter with a sine wave input is given by  
The AD7940 is tested using the CCIF standard where two input  
frequencies near the top end of the input bandwidth are used.  
In this case, the second-order terms are usually distanced in  
frequency from the original sine waves, while the third-order  
terms are usually at a frequency close to the input frequencies.  
As a result, the second- and third-order terms are specified  
separately. The calculation of the intermodulation distortion is  
as per the THD specification where it is the ratio of the rms  
sum of the individual distortion products to the rms amplitude  
of the sum of the fundamentals expressed in dBs.  
Signal-to-(Noise + Distortion) = (6.02 N + 1.76) dB  
Thus, for a 14-bit converter, this is 86.04 dB.  
Rev. 0 | Page 8 of 20  
 
AD7940  
TYPICAL PERFORMANCE CHARACTERISTICS  
Figure 5 shows a typical FFT plot for the AD7940 at 100 kSPS  
sample rate and 10 kHz input frequency. Figure 6 shows the  
signal-to-(noise + distortion) ratio performance versus the  
input frequency for various supply voltages while sampling at  
100 kSPS with an SCLK of 2.5 MHz.  
Figure 7 shows a graph of the total harmonic distortion versus  
the analog input frequency for various supply voltages, while  
Figure 8 shows a graph of the total harmonic distortion versus  
the analog input frequency for various source impedances (see  
the Analog Input section). Figure 9 and Figure 10 show the  
typical INL and DNL plots for the AD7940.  
0
110  
V
= 4.75V  
DD  
F
T
= 100kSPS  
= 25°C  
SAMPLE  
F
F
= 100kSPS  
= 10kHz  
SAMPLE  
A
–20  
–40  
IN  
105  
100  
95  
SNR = 84.48dB  
V
= 3.6V  
DD  
SINAD = 84.35dB  
THD = –98.97dB  
SFDR = –100.84dB  
V
= 3V  
DD  
V
V
= 2.7V  
= 4.3V  
DD  
DD  
–60  
–80  
–100  
–120  
–140  
–160  
V
= 5.25V  
DD  
90  
V
= 2.5V  
V
= 4.75V  
DD  
DD  
85  
80  
0
10k  
20k  
30k  
40k  
50k  
10  
100  
FREQUENCY (kHz)  
INPUT FREQUENCY (kHz)  
Figure 5. AD7940 Dynamic Performance at 100 kSPS  
Figure 7. AD7940 THD vs. Analog Input Frequency  
for Various Supply Voltages at 100 kSPS  
90  
85  
80  
75  
110  
105  
100  
95  
F
T
V
= 100kSPS  
SAMPLE  
F
T
= 100kSPS  
= 25°C  
SAMPLE  
= 25°C  
A
A
= 4.75V  
DD  
V
= 5.25V  
V
= 4.75V  
DD  
DD  
R
R
= 10  
= 50Ω  
IN  
V
V
V
V
= 4.3V  
= 3.6V  
= 3V  
DD  
DD  
DD  
DD  
IN  
90  
R
= 100Ω  
IN  
85  
V
= 2.5V  
= 2.7V  
DD  
80  
75  
R
= 1000Ω  
IN  
70  
10  
10  
100  
100  
INPUT FREQUENCY (kHz)  
INPUT FREQUENCY (kHz)  
Figure 6. AD7940 SINAD vs. Analog Input Frequency  
for Various Supply Voltages at 100 kSPS  
Figure 8. AD7940 THD vs. Analog Input Frequency  
for Various Source Impedances  
Rev. 0 | Page 9 of 20  
 
 
 
 
 
AD7940  
1.0  
0.8  
0.6  
0.4  
0.2  
0
0.8  
0.6  
V
= 3.00V  
V
= 3.00V  
DD  
DD  
TEMP = 25°C  
TEMP = 25°C  
0.4  
0.2  
0
–0.2  
–0.4  
–0.6  
–0.8  
–0.2  
–0.4  
–0.6  
0
2000 4000 6000 8000 10000 12000 14000 16000 18000  
CODE  
0
2000 4000 6000 8000 10000 12000 14000 16000 18000  
CODE  
Figure 9. AD7940 Typical INL  
Figure 10. AD7940 Typical DNL  
Rev. 0 | Page 10 of 20  
AD7940  
CIRCUIT INFORMATION  
The AD7940 is a fast, low power, 14-bit, single-supply ADC. The  
part can be operated from a 2.50 V to 5.5 V supply.When operated  
at either 5 V or 3 V supply, the AD7940 is capable of throughput  
rates of 100 kSPS when provided with a 2.5 MHz clock.  
CAPACITIVE  
DAC  
SAMPLING  
A
CAPACITOR  
V
IN  
SW1  
CONTROL  
LOGIC  
B
CONVERSION  
SW2  
PHASE  
The AD7940 provides the user with an on-chip track-and-hold  
ADC and a serial interface housed in a tiny 6-lead SOT-23  
package or in an 8-lead MSOP package, which offer the user  
considerable space-saving advantages over alternative solutions.  
The serial clock input accesses data from the part and also pro-  
vides the clock source for the successive approximation ADC.  
The analog input range for the AD7940 is 0 V to VDD. An external  
reference is not required for the ADC nor is there a reference on-  
chip. The reference for the AD7940 is derived from the power  
supply and thus gives the widest dynamic input range.  
COMPARATOR  
V
/2  
DD  
Figure 12. ADC Conversion Phase  
ANALOG INPUT  
Figure 13 shows an equivalent circuit of the analog input struc-  
ture of the AD7940. The two diodes, D1 and D2, provide ESD  
protection for the analog inputs. Care must be taken to ensure  
that the analog input signal never exceeds the supply rails by  
more than 300 mV. This will cause these diodes to become  
forward-biased and to start conducting current into the sub-  
strate. The maximum current these diodes can conduct without  
causing irreversible damage to the part is 10 mA. Capacitor C1  
in Figure 13 is typically about 5 pF and primarily can be attrib-  
uted to pin capacitance. Resistor R1 is a lumped component  
made up of the on resistance of a switch (track-and-hold  
switch). This resistor is typically about 25 Ω. Capacitor C2 is the  
ADC sampling capacitor and has a capacitance of 25 pF typi-  
cally. For ac applications, removing high frequency components  
from the analog input signal is recommended by use of an RC  
low-pass filter on the relevant analog input pin. In applications  
where harmonic distortion and signal-to-noise ratio are critical,  
the analog input should be driven from a low impedance source.  
Large source impedances will significantly affect the ac per-  
formance of the ADC. This may necessitate the use of an input  
buffer amplifier. The choice of the op amp will be a function of  
the particular application. When no amplifier is used to drive  
the analog input, the source impedance should be limited to low  
values. The maximum source impedance will depend on the  
amount of total harmonic distortion (THD) that can be toler-  
ated. The THD will increase as the source impedance increases,  
and performance will degrade (see Figure 8).  
The AD7940 also features a power-down option to save power  
between conversions. The power-down feature is implemented  
across the standard serial interface as described in the Modes of  
Operation section.  
CONVERTER OPERATION  
The AD7940 is a 14-bit, successive approximation ADC based  
around a capacitive DAC. The AD7940 can convert analog  
input signals in the 0 V to VDD range. Figure 11 and Figure 12  
show simplified schematics of the ADC. The ADC comprises of  
control logic, SAR, and a capacitive DAC. Figure 11 shows the  
ADC during its acquisition phase. SW2 is closed and SW1 is in  
Position A. The comparator is held in a balanced condition and  
the sampling capacitor acquires the signal on the selected VIN  
channel.  
CAPACITIVE  
DAC  
SAMPLING  
A
CAPACITOR  
V
IN  
SW1  
CONTROL  
LOGIC  
B
ACQUISITION  
PHASE  
SW2  
COMPARATOR  
V
/2  
DD  
V
DD  
Figure 11. ADC Acquisition Phase  
C2  
30pF  
D1  
R1  
V
When the ADC starts a conversion, SW2 will open and SW1  
will move to Position B, causing the comparator to become  
unbalanced (Figure 12). The control logic and the capacitive  
DAC are used to add and subtract fixed amounts of charge  
from the sampling capacitor to bring the comparator back into  
a balanced condition. When the comparator is rebalanced, the  
conversion is complete. The control logic generates the ADC  
output code (see the ADC Transfer Function section).  
IN  
C1  
4pF  
D2  
CONVERSION PHASE - SWITCH OPEN  
TRACK PHASE - SWITCH CLOSED  
Figure 13. Equivalent Analog Input Circuit  
Rev. 0 | Page 11 of 20  
 
 
 
 
AD7940  
ADC TRANSFER FUNCTION  
The output coding of the AD7940 is straight binary. The de-  
signed code transitions occur at successive integer LSB values,  
i.e., 1 LSB, 2 LSBs. The LSB size is VDD/16384. The ideal transfer  
characteristic for the AD7940 is shown in Figure 14.  
In fact, because the supply current required by the AD7940 is so  
low, a precision reference can be used as the supply source to  
the AD7940. For example, a REF19x voltage reference (REF195  
for 5 V or REF193 for 3 V) or an AD780 can be used to supply  
the required voltage to the ADC (see Figure 15). This configura-  
tion is especially useful if the power supply available is quite  
noisy, or if the system supply voltages are at some value other  
than the required operating voltage of the AD7940, e.g., 15 V.  
The REF19x or AD780 will output a steady voltage to the  
AD7940. Recommended decoupling capacitors are a 100 nF low  
ESR ceramic (Farnell 335-1816) and a 10 µF low ESR tantalum  
(Farnell 197-130).  
111...111  
111...110  
111...000  
1 LSB = V /16384  
DD  
011...111  
3V  
5V  
SUPPLY  
REF193  
10µF  
000...010  
000...001  
000...000  
0.1µF  
10µF  
0.1µF  
TANT  
1 LSB  
+V –1 LSB  
DD  
V
DD  
0V  
SCLK  
ANALOG INPUT  
0V TO V  
DD  
INPUT  
V
IN  
SDATA  
CS  
µC/µP  
AD7940  
Figure 14. AD7940 Transfer Characteristic  
GND  
TYPICAL CONNECTION DIAGRAM  
Figure 15 shows a typical connection diagram for the AD7940.  
SERIAL  
INTERFACE  
VREF is taken internally from VDD and as such should be well  
decoupled. This provides an analog input range of 0 V to VDD.  
The conversion result is output in a 16-bit word. This 16-bit  
data stream consists of two leading zeros, followed by the 14 bits  
of conversion data, MSB first. For applications where power  
consumption is a concern, the power-down mode should be  
used between conversions or bursts of several conversions to  
improve power performance (see the Modes of Operation  
section).  
Figure 15. Typical Connection Diagram  
Digital Inputs  
The digital inputs applied to the AD7940 are not limited by the  
maximum ratings that limit the analog inputs. Instead, the digi-  
tal inputs applied can go to 7 V and are not restricted by the  
V
DD + 0.3 V limit as on the analog inputs. For example, if the  
AD7940 were operated with a VDD of 3 V, 5 V logic levels could  
be used on the digital inputs. However, it is important to note  
that the data output on SDATA will still have 3 V logic levels  
when VDD = 3 V.  
CS  
Another advantage of SCLK and  
not being restricted by the  
VDD + 0.3 V limit is the fact that power supply sequencing issues  
are avoided. If one of these digital inputs is applied before VDD,  
there is no risk of latch-up as there would be on the analog  
inputs if a signal greater than 0.3 V were applied prior to VDD.  
Rev. 0 | Page 12 of 20  
 
 
 
 
AD7940  
MODES OF OPERATION  
The mode of operation of the AD7940 is selected by controlling  
CS  
The conversion is initiated on the falling edge of  
as  
CS  
the (logic) state of the  
two possible modes of operation, normal and power-down. The  
CS  
signal during a conversion. There are  
described in the Serial Interface section. To ensure that the part  
CS  
remains fully powered up at all times,  
at least 10 SCLK falling edges have elapsed after the falling edge  
CS CS  
must remain low until  
point at which  
initiated will determine whether or not the AD7940 will enter  
CS  
is pulled high after the conversion has been  
of . If  
is brought high any time after the 10th SCLK falling  
power-down mode. Similarly, if already in power-down,  
can  
edge, but before the 16th SCLK falling edge, the part will remain  
powered up, but the conversion will be terminated and SDATA  
will go back into three-state. At least 16 serial clock cycles are  
required to complete the conversion and access the complete  
control whether the device will return to normal operation or  
remain in power-down. These modes of operation are designed  
to provide flexible power management options. These options  
can optimize the power dissipation/throughput rate ratio for  
differing application requirements.  
CS  
CS  
conversion result.  
may idle low until  
may idle high until the next conversion or  
returns high sometime prior to the next  
CS  
conversion, effectively idling  
low.  
NORMAL MODE  
Once a data transfer is complete (SDATA has returned to three-  
state), another conversion can be initiated after the quiet time,  
This mode provides the fastest throughput rate performance  
because the user does not have to worry about the power-up  
times with the AD7940 remaining fully powered all the time.  
Figure 16 shows the general diagram of the operation of the  
AD7940 in this mode.  
CS  
tQUIET, has elapsed by bringing  
low again.  
CS  
1
12  
16  
SCLK  
1 LEADING ZERO + CONVERSION RESULT  
SDATA  
Figure 16. Normal Mode Operation  
Rev. 0 | Page 13 of 20  
 
 
AD7940  
POWER-DOWN MODE  
This mode is intended for use in applications where slower  
throughput rates are required. Either the ADC is powered down  
between each conversion, or a series of conversions may be  
performed at a high throughput rate, and then the ADC is pow-  
ered down for a relatively long duration between these bursts of  
several conversions. When the AD7940 is in power-down, all  
analog circuitry is powered down.  
In order to exit this mode of operation and power up the  
AD7940 again, a dummy conversion is performed. On the fal-  
CS  
ling edge of , the device will begin to power up and will  
CS  
continue to power up as long as  
is held low until after the  
falling edge of the 10th SCLK. The device will be fully powered  
up once at least 16 SCLKs (or approximately 6 µs) have elapsed  
and valid data will result from the next conversion as shown in  
CS  
Figure 18. If  
is brought high before the 10th falling edge of  
To enter power-down, the conversion process must be inter-  
SCLK, regardless of the SCLK frequency, the AD7940 will go  
back into power-down again. This avoids accidental power-up  
due to glitches on the  
CS  
rupted by bringing  
edge of SCLK and before the 10th falling edge of SCLK as  
CS  
high anywhere after the second falling  
CS  
line or an inadvertent burst of 8 SCLK  
is low. So although the device may begin to  
CS  
shown in Figure 17. Once  
window of SCLKs, the part will enter power-down, the  
CS  
has been brought high in this  
CS  
cycles while  
power-up on the falling edge of , it will power down again on  
conversion that was initiated by the falling edge of  
will be  
CS  
CS  
the rising edge of  
falling edge.  
as long as it occurs before the 10th SCLK  
terminated, and SDATA will go back into three-state. If  
is  
brought high before the second SCLK falling edge, the part will  
remain in normal mode and will not power down. This will  
CS  
avoid accidental power-down due to glitches on the  
line.  
CS  
1
2
10  
16  
SCLK  
THREE-STATE  
SDATA  
Figure 17. Entering Power-Down Mode  
THE PART IS FULLY POWERED  
UP WITH V FULLY ACQUIRED  
IN  
THE PART BEGINS  
TO POWER UP  
tPOWER UP  
CS  
1
10  
16  
1
16  
SCLK  
INVALID DATA  
VALID DATA  
SDATA  
Figure 18. Exiting Power-Down Mode  
Rev. 0 | Page 14 of 20  
 
 
 
AD7940  
POWER VS. THROUGHPUT RATE  
By using the power-down mode on the AD7940 when not  
converting, the average power consumption of the ADC  
decreases at lower throughput rates. Figure 19 shows how as the  
throughput rate is reduced, the part remains in its shutdown  
state longer, and the average power consumption over time  
drops accordingly.  
Figure 19 shows the power dissipation versus the throughput  
rate when using the power-down mode with 3.6 V supplies and  
a 2.5 MHz SCLK.  
10  
V
= 3.6V  
DD  
F
= 2.5MHz  
SCLK  
For example, if the AD7940 is operated in a continuous sam-  
pling mode, with a throughput rate of 10 kSPS and an SCLK of  
2.5 MHz (VDD = 3.6 V), and the device is placed in power-down  
mode between conversions, the power consumption is calcu-  
lated as follows. The maximum power dissipation during nor-  
mal operation is 6.84 mW (VDD = 3.6 V). If the power-up time  
from power-down is 1 µs, and the remaining conversion time is  
6.4 µs, (using a 16 SCLK transfer), then the AD7940 can be said  
to dissipate 6.84 mW for 7.4 µs during each conversion cycle.  
With a throughput rate of 10 kSPS, the cycle time is 100 µs. For  
the remainder of the conversion cycle, 92.6 µs, the part remains  
in power-down mode. The AD7940 can be said to dissipate  
1.08 µW for the remaining 92.6 µs of the conversion cycle.  
Therefore, with a throughput rate of 10 kSPS, the average power  
dissipated during each cycle is  
1
0.1  
0.01  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
50  
THROUGHPUT (kSPS)  
Figure 19. Power vs. Throughput Using Power-Down Mode at 3.6 V  
(7.4/100) × (6.84 mW) + (92.6/100) × (1.08 µW) = 0.51 mW  
Rev. 0 | Page 15 of 20  
 
 
AD7940  
SERIAL INTERFACE  
provides the first leading zero to be read in by the microcontroller  
or DSP. The remaining data is then clocked out by subsequent  
SCLK falling edges beginning with the second leading zero, thus  
the first falling clock edge on the serial clock has the first leading  
zero provided and also clocks out the second leading zero. The  
data transfer will consist of two leading zeros followed by the 14  
bits of data. The final bit in the data transfer is valid on the 16th  
falling edge, having been clocked out on the previous (15th)  
falling edge.  
Figure 20 shows the detailed timing diagram for serial interfac-  
ing to the AD7940. The serial clock provides the conversion  
clock and also controls the transfer of information from the  
AD7940 during conversion.  
CS  
The  
signal initiates the data transfer and conversion process.  
CS  
The falling edge of  
puts the track-and-hold into hold mode,  
takes the bus out of three-state, and samples the analog input.  
The conversion is also initiated at this point and will require at  
least 16 SCLK cycles to complete. Once 15 SCLK falling edges  
have elapsed, the track-and-hold will go back into track mode  
on the next SCLK rising edge as shown in Figure 20 at Point B.  
On the 16th SCLK falling edge, the SDATA line will go back  
It is also possible to take valid data on each SCLK rising edge  
rather than falling edge, since the SCLK cycle time is long  
enough to ensure the data is ready on the rising edge of SCLK.  
CS  
However, the first leading zero will still be driven by the  
CS  
into three-state. If the rising edge of  
occurs before 16 SCLKs  
falling edge, and so it can be taken only on the first SCLK falling  
edge. It may be ignored, and the first rising edge of SCLK after  
have elapsed, the conversion will be terminated and the SDATA  
line will go back into three-state; otherwise SDATA returns to  
three-state on the 16th SCLK falling edge as shown in Figure 20.  
CS  
the  
falling edge would have the second leading zero pro-  
vided and the 15th rising SCLK edge would have DB0 provided.  
This method may not work with most microcontrollers/DSPs, but  
could possibly be used with FPGAs and ASICs.  
Sixteen serial clock cycles are required to perform the conver-  
sion process and to access data from the AD7940.  
CS  
going low  
CS  
tCONVERT  
t2  
t6  
B
1
2
3
4
5
13  
14  
t5  
15  
16  
t8  
SCLK  
t7  
tQUIET  
3-STATE  
t3  
t4  
DB11  
SDATA  
0
ZERO  
DB13  
DB12  
DB10  
DB2  
DB1  
DB0  
3-STATE  
2 LEADING ZEROS  
Figure 20. AD7940 Serial Interface Timing Diagram  
Rev. 0 | Page 16 of 20  
 
 
AD7940  
MICROPROCESSOR INTERFACING  
The serial interface on the AD7940 allows the part to be directly  
connected to a range of many different microprocessors. This  
section explains how to interface the AD7940 with some of the  
more common microcontroller and DSP serial interface  
protocols.  
AD7940 TO ADSP-218x  
The ADSP-218x family of DSPs can be interfaced directly to the  
AD7940 with no glue logic required. The SPORT control regis-  
ter should be set up as follows:  
TFSW = RFSW = 1, Alternate Framing  
INVRFS = INVTFS = 1, Active Low Frame Signal  
DTYPE = 00, Right Justify Data  
SLEN = 1111, 16-Bit Data-Words  
ISCLK = 1, Internal Serial Clock  
TFSR = RFSR = 0, Frame First Word  
IRFS = 0  
AD7940 TO TMS320C541  
The serial interface on the TMS320C541 uses a continuous  
serial clock and frame synchronization signals to synchronize  
the data transfer operations with peripheral devices such as the  
CS  
AD7940. The  
input allows easy interfacing between the  
TMS320C541 and the AD7940 with no glue logic required. The  
serial port of the TMS320C541 is set up to operate in burst  
mode with internal CLKX (TX serial clock) and FSX (TX frame  
sync). The serial port control register (SPC) must have the  
following setup:  
ITFS = 1  
FO = 0  
To implement power-down mode, SLEN should be set to 0111  
to issue an 8-bit SCLK burst.  
FSM = 1  
MCM = 1  
TXM = 1  
The connection diagram is shown in Figure 22. The ADSP-218x  
has the TFS and RFS of the SPORT tied together, with TFS set  
as an output and RFS set as an input. The DSP operates in alter-  
nate framing mode, and the SPORT control register is set up as  
described. The frame synchronization signal generated on the  
The format bit, FO, must be set to 1 to set the word length to  
8 bits, in order to implement the power-down mode on the  
AD7940. The connection diagram is shown in Figure 21. It  
should be noted that for signal processing applications, it is  
imperative that the frame synchronization signal from the  
TMS320C541 provide equidistant sampling.  
CS  
TFS is tied to , and, as with all signal processing applications,  
equidistant sampling is necessary. In this example, the timer  
interrupt is used to control the sampling rate of the ADC.  
ADSP-218x*  
SCLK  
AD7940*  
TMS320C541*  
CLKX  
AD7940*  
SCLK  
SCLK  
SDATA  
CS  
DR  
CLKR  
SDATA  
CS  
DR  
RFS  
TFS  
FSX  
FSR  
*ADDITIONAL PINS OMITTED FOR CLARITY  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 22. Interfacing to the ADSP-218x  
Figure 21. Interfacing to the TMS320C541  
The timer register is loaded with a value that provides an  
interrupt at the required sample interval. When an interrupt is  
received, the values in the transmit autobuffer start to be trans-  
mitted and TFS is generated. The TFS is used to control the  
RFS and, therefore, the reading of data. The data is stored in the  
receive autobuffer for processing or to be shifted later. The fre-  
quency of the serial clock is set in the SCLKDIV register. When  
the instruction to transmit with TFS is given, i.e., TX0 = AX0,  
the state of the SCLK is checked. The DSP waits until the SCLK  
has gone high, low, and high before transmission will start. If  
the timer and SCLK values are chosen such that the instruction  
to transmit occurs on or near the rising edge of SCLK, the data  
may be transmitted, or it may wait until the next clock edge.  
Rev. 0 | Page 17 of 20  
 
 
 
AD7940  
For example, if the ADSP-2189 had a 20 MHz crystal, such that  
it had a master clock frequency of 40 MHz, the master cycle  
time would be 25 ns. If the SCLKDIV register is loaded with the  
value 7, then a SCLK of 2.5 MHz is obtained, and 16 master  
clock periods will elapse for every 1 SCLK period. Depending  
on the throughput rate selected, if the timer register was loaded  
with the value 803 (803 + 1 = 804), then 50.25 SCLKs will occur  
between interrupts and subsequently between transmit instruc-  
tions. This situation will result in nonequidistant sampling since the  
transmit instruction is occurring on a SCLK edge. If the number of  
SCLKs between interrupts is a whole integer figure of N, then equi-  
distant sampling will be implemented by the DSP.  
AD7940 TO DSP563xx  
The connection diagram in Figure 23 shows how the AD7940  
can be connected to the ESSI (synchronous serial interface) of  
the DSP-563xx family of DSPs from Motorola. Each ESSI (two  
on board) is operated in synchronous mode (SYN bit in CRB =  
1) with internally generated 1-bit clock period frame sync for  
both Tx and Rx (Bits FSL1 = 0 and FSL0 = 0 in CRB). Normal  
operation of the ESSI is selected by making MOD = 0 in the  
CRB. Set the word length to 16 by setting bits WL1 = 1 and WL0  
= 0 in CRA. The FSP bit in the CRB should be set to 1 so that  
the frame sync is negative. It should be noted that for signal  
processing applications, it is imperative that the frame synchro-  
nization signal from the DSP-563xx provide equidistant  
sampling.  
In the example shown in Figure 23, the serial clock is taken from  
the ESSI so the SCK0 pin must be set as an output, SCKD = 1.  
DSP-563xx*  
AD7940*  
SCLK  
SCK  
SRD  
STD  
DOUT  
CS  
*ADDITIONAL PINS OMITTED FOR CLARITY  
Figure 23. Interfacing to the DSP-563xx  
Rev. 0 | Page 18 of 20  
 
 
AD7940  
APPLICATION HINTS  
GROUNDING AND LAYOUT  
Good decoupling is also very important. All analog supplies  
should be decoupled with 10 µF tantalum in parallel with 0.1 µF  
capacitors to AGND, as discussed in the Typical Connection  
Diagram section. To achieve the best performance from these  
decoupling components, the user should attempt to keep the  
distance between the decoupling capacitors and the VDD and  
GND pins to a minimum, with short track lengths connecting  
the respective pins.  
The printed circuit board that houses the AD7940 should be  
designed such that the analog and digital sections are separated  
and confined to certain areas of the board. This facilitates the  
use of ground planes that can be separated easily. A minimum  
etch technique is generally best for ground planes, since it gives  
the best shielding. Digital and analog ground planes should be  
joined at only one place. If the AD7940 is in a system where  
multiple devices require an AGND to DGND connection, the  
connection should still be made at one point only, a star ground  
point that should be established as close as possible to the AD7940.  
EVALUATING THE AD7940 PERFORMANCE  
The recommended layout for the AD7940 is outlined in the  
evaluation board for the AD7940. The evaluation board package  
includes a fully assembled and tested evaluation board, docu-  
mentation, and software for controlling the board from the PC  
via the evaluation board controller. The evaluation board con-  
troller can be used in conjunction with the AD7940 evaluation  
board, as well as many other Analog Devices evaluation boards  
ending in the CB designator, to demonstrate/evaluate the ac and  
dc performance of the AD7940.  
Avoid running digital lines under the device since these will  
couple noise onto the die. The analog ground plane should be  
allowed to run under the AD7940 to avoid noise coupling. The  
power supply lines to the AD7940 should use as large a trace as  
possible to provide low impedance paths and reduce the effects  
of glitches on the power supply line. Fast switching signals, such  
as clocks, should be shielded with digital ground to avoid radi-  
ating noise to other sections of the board, and clock signals  
should never be run near the analog inputs. Avoid crossover of  
digital and analog signals. Traces on opposite sides of the board  
should run at right angles to each other, which will reduce the  
effects of feedthrough through the board. A microstrip tech-  
nique is by far the best but is not always possible with a double-  
sided board. In this technique, the component side of the board  
is dedicated to ground planes while the signals are placed on the  
solder side.  
The software allows the user to perform ac (fast Fourier trans-  
form) and dc (histogram of codes) tests on the AD7940. The  
software and documentation are on a CD shipped with the  
evaluation board.  
Rev. 0 | Page 19 of 20  
 
AD7940  
OUTLINE DIMENSIONS  
2.90 BSC  
6
1
5
2
4
3
2.80 BSC  
1.60 BSC  
PIN 1  
INDICATOR  
0.95 BSC  
1.90  
BSC  
1.30  
1.15  
0.90  
1.45 MAX  
0.22  
0.08  
10°  
4°  
0°  
0.60  
0.45  
0.30  
0.50  
0.30  
0.15 MAX  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-178AB  
Figure 24. 6-Lead Small Outline Transistor Package [SOT-23] (RJ-6). Dimensions shown in millimeters.  
3.00  
BSC  
8
5
4
4.90  
BSC  
3.00  
BSC  
PIN 1  
0.65 BSC  
1.10 MAX  
0.15  
0.00  
0.80  
0.60  
0.40  
8°  
0°  
0.38  
0.22  
0.23  
0.08  
COPLANARITY  
0.10  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-187AA  
Figure 25. 8-Lead Micro Small Outline Package [MSOP] (RM-8). Dimensions shown in millimeters.  
ORDERING GUIDE  
Linearity  
Package  
Description  
Package  
Option  
Models  
Temperature Range  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
−40°C to +85°C  
Error (LSB)1  
Branding  
CRB  
CRB  
CRB  
CRB  
AD7940BRJ-R2  
AD7940BRJ-REEL7  
AD7940BRM  
AD7940BRM-REEL7  
EVAL-AD7940CB2  
EVAL-CONTROL BRD23  
14 Bits min  
14 Bits min  
14 Bits min  
14 Bits min  
Small Outline Transistor Package (SOT-23)  
Small Outline Transistor Package (SOT-23)  
Micro Small Outline Package (MSOP)  
Micro Small Outline Package (MSOP)  
Evaluation Board  
RJ-6  
RJ-6  
RM-8  
RM-8  
Controller Board  
1 Linearity error here refers to no missing codes.  
2 This can be used as a standalone evaluation board or in conjunction with the Evaluation Controller Board for evaluation/demonstration purposes.  
3 This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators. To order a complete  
evaluation kit, the particular ADC evaluation board needs to be ordered, e.g., EVAL-AD7940CB, the EVAL-CONTROL BRD2, and a 12 V ac transformer. See the Evaluation  
Board application note for more information.  
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and regis-  
tered trademarks are the property of their respective owners.  
D03305–0–6/04(0)  
Rev. 0 | Page 20 of 20  
 
 
 
 

相关型号:

AD76871

18-Bit, 2 MSPS PulSAR 15 mW ADC in LFCSP (QFN)
ADI

AD7687BCPWP

IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, DSO10, 3 X 3 MM, QFN-10, Analog to Digital Converter
ADI

AD7687BCPZ-R2

16-Bit, 1.5 LSB INL, 250 kSPS PulSAR™ Differential ADC in MSOP/QFN
ADI

AD7687BCPZRL7

16-Bit, 1.5 LSB INL, 250 kSPS PulSAR™ Differential ADC in MSOP/QFN
ADI

AD7687BRM

1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, MO-187BA, MSOP-10
ADI

AD7687BRMRL7

IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, MO-187BA, MSOP-10, Analog to Digital Converter
ADI

AD7687BRMZ

16-Bit, 1.5 LSB INL, 250 kSPS PulSAR™ Differential ADC in MSOP/QFN
ADI

AD7687BRMZRL7

16-Bit, 1.5 LSB INL, 250 kSPS PulSAR™ Differential ADC in MSOP/QFN
ADI

AD7688

16-Bit, +/-0.65 LSB INL, 500 kSPS PulSAR Differential ADC in MSOP/QFN
ADI

AD76881

14-Bit, 500 kSPS PulSAR ADC in MSOP
ADI

AD7688BCPRL7

IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, 3 X 3 MM, QFN-10, Analog to Digital Converter
ADI

AD7688BCPWP

IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, 3 X 3 MM, QFN-10, Analog to Digital Converter
ADI