AD76871 [ADI]
18-Bit, 2 MSPS PulSAR 15 mW ADC in LFCSP (QFN); 18位， 2 MSPS的PulSAR 15毫瓦ADC的LFCSP （ QFN ）
| 型号： | AD76871 |
| 厂家： | 
ADI |
| 描述： | 18-Bit, 2 MSPS PulSAR 15 mW ADC in LFCSP (QFN) |
| 文件： | 总28页 (文件大小：472K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
18-Bit, 2 MSPS PulSAR
15 mW ADC in LFCSP (QFN)
AD7986
FEATURES
APPLICATION DIAGRAM
1.8V
18-bit resolution with no missing codes
Throughput: 2 MSPS (TURBO = high), 1.5 MSPS (TURBO = low)
Low power dissipation
15 mW at 2 MSPS, with external reference
26 mW at 2 MSPS with internal reference
INL: 1 LSB typical, 2.5 LSB maximum
SNR
95.5 dB, with on-chip reference
97.0 dB, with external reference
4.096 V internal reference: typical drift of 10 ppm/°C
True differential analog input voltage range: VREF
0 V to VREF with VREF up to 5.0 V
TO
2.7V
V+
5V
2.5V
15Ω
0V
TO
VIO
TURBO
SDI
BVDD
AVDD,
DVDD
2.7nF
V
V
VIO
REF
IN+
V–
V+
3- OR 4-WIRE
INTERFACE:
SPI, CS
DAISY CHAIN
(TURBO = LOW)
AD7986
SCK
IN–
SDO
1
CNV
REF GND
15Ω
REF
TO
0V
10µF
2.7nF
V–
NOTES
1. GND REFERS TO REFGND, AGND, AND DGND.
Allows use of any input range
Figure 1.
No pipeline delay
Logic interface: 1.8 V/2.5 V/2.7 V
GENERAL DESCRIPTION
The AD7986 is an 18-bit, 2 MSPS successive approximation,
analog-to-digital converter (ADC). It contains a low power,
high speed, 18-bit sampling ADC, an internal conversion clock,
an internal reference (and buffer), error correction circuits, and
a versatile serial interface port. On the rising edge of CNV, the
AD7986 samples the voltage difference between the IN+ and
IN− pins. The voltages on these pins usually swing in opposite
phases between 0 V and VREF. It features a very high sampling
rate turbo mode (TURBO = high) and a reduced power normal
mode (TURBO = low) for low power applications where the
power is scaled with the throughput.
Serial interface: SPI/QSPI™/MICROWIRE™/DSP compatible
Ability to daisy-chain multiple ADCs with busy indicator
20-lead 4 mm × 4 mm LFCSP (QFN)
APPLICATIONS
Battery-powered equipment
Data acquisition systems
Medical instruments
Seismic data acquisition systems
In normal mode (TURBO = low), the SPI-compatible serial
interface also features the ability, using the SDI input, to daisy-
chain several ADCs on a single 3-wire bus and provide an
optional busy indicator. It is compatible with 1.8 V, 2.5 V, and 2.7 V
using the separate VIO supply.
The AD7986 is available in a 20-lead LFCSP (QFN) with
operation specified from −40°C to +85°C.
Table 1. MSOP, LFCSP (QFN) 14-/16-/18-Bit PulSAR® ADCs
Type
14-Bit
16-Bit
100 kSPS
AD7940
AD7680
AD7683
AD7684
250 kSPS
AD79421
AD76851
AD76871
AD7694
AD76911
400 kSPS to 500 kSPS
AD79461
AD76861
AD76881
AD76931
≥1000 kSPS
ADC Driver
AD79801
AD79831
ADA4941-1
ADA4841-x
AD76901
AD79821
AD79841
AD7986
18-Bit
ADA4941-1
ADA4841-x
AD8021
1 Pin-for-pin compatible.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2009–2011 Analog Devices, Inc. All rights reserved.
AD7986
TABLE OF CONTENTS
Features .............................................................................................. 1
Analog Inputs.............................................................................. 15
Driver Amplifier Choice ........................................................... 15
Voltage Reference Input ............................................................ 16
Power Supply............................................................................... 16
Digital Interface .............................................................................. 17
Data Reading Options ............................................................... 18
Applications....................................................................................... 1
Application Diagram........................................................................ 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 5
Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 9
Terminology .................................................................................... 12
Theory of Operation ...................................................................... 13
Circuit Information.................................................................... 13
Converter Operation.................................................................. 13
Conversion Modes of Operation.............................................. 13
Typical Connection Diagram.................................................... 14
CS
CS
CS
CS
Mode, 3-Wire Without Busy Indicator ............................. 19
Mode, 3-Wire with Busy Indicator .................................... 20
Mode, 4-Wire Without Busy Indicator ............................. 21
Mode, 4-Wire with Busy Indicator .................................... 22
Chain Mode Without Busy Indicator...................................... 23
Chain Mode with Busy Indicator............................................. 24
Application Hints ........................................................................... 25
Layout .......................................................................................... 25
Evaluating the AD7986 Performance...................................... 25
Outline Dimensions....................................................................... 27
Ordering Guide .......................................................................... 27
REVISION HISTORY
3/11—Rev. A to Rev. B
Added Common-Mode Input Range Parameter, Table 2 ........... 3
8/10—Rev. 0 to Rev. A
Changes to Conversion Time: CNV Rising Edge to Data
Available (Turbo Mode/Normal Mode) Parameter, Table 4....... 5
Changes to Figure 32...................................................................... 22
4/09—Revision 0: Initial Version
Rev. B | Page 2 of 28
AD7986
SPECIFICATIONS
AVDD = DVDD = 2.5 V, BVDD = 5 V, VIO = 1.8 V to 2.7 V, VREF = 4.096 V, TA = −40°C to +85°C, unless otherwise noted.
Table 2.
Parameter
Conditions
Min
Typ
Max
Unit
RESOLUTION
18
Bits
ANALOG INPUT
Voltage Range
(IN+) − (IN−)
IN+, IN−
IN+, IN−
fIN = 500 kHz
Acquisition phase
−VREF
−0.1
VREF × 0.475
+VREF
VREF + 0.1
VREF × 0.525
V
V
V
dB1
nA
Absolute Input Voltage
Common-Mode Input Range
Analog Input CMRR
Leakage Current at 25°C
Input Impedance
ACCURACY
VREF × 0.5
100
250
See the Analog Inputs section
No Missing Codes
Differential Linearity Error
Integral Linearity Error
Transition Noise
18
−0.95
−2.50
Bits
0.60
1.00
2.0
2.4
0.5
+1.50
+2.50
LSB2
LSB2
LSB2
LSB2
3
Gain Error, TMIN to TMAX
−20
+20
Gain Error Temperature Drift
ppm/°C
mV
3
Zero Error, TMIN to TMAX
−0.8
+0.8
Zero Temperature Drift
Power Supply Sensitivity
THROUGHPUT
Conversion Rate
Transient Response
AC ACCURACY
0.3
4
ppm/°C
LSB2
AVDD = 2.5 V 5%
Full-scale step
0
2.00
100
MSPS
ns
Dynamic Range
VREF = 4.096 V, internal reference
VREF = 5.0 V, external reference
95.5
97
96.5
98
dB1
Signal-to-Noise Ratio, SNR
fIN = 20 kHz, VREF = 4.096 V, internal 94.5
reference
95.5
dB1
dB1
fIN = 20 kHz, VREF = 5.0 V, external
reference
96.5
97.0
Spurious-Free Dynamic Range, SFDR
Total Harmonic Distortion4, THD
fIN = 20 kHz
fIN = 20 kHz, VREF = 4.096 V, internal
reference
−115
−113
dB1
dB1
fIN = 20 kHz, VREF = 5.0 V, external
reference
fIN = 20 kHz, VREF = 4.096 V
−114
95.5
dB1
dB1
Signal-to-(Noise + Distortion), SINAD
SAMPLING DYNAMICS
94.5
−3 dB Input Bandwidth
Aperture Delay
19
0.7
MHz
ns
1 All specifications expressed in decibels are referred to a full-scale input FSR and tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
2 LSB means least significant bit. With the 4.096 V input range, one LSB is 31.25 µV.
3 See the Terminology section. These specifications include full temperature range variation but not the error contribution from the external reference.
4 Tested fully in production at fIN = 1 kHz.
Rev. B | Page 3 of 28
AD7986
AVDD = DVDD = 2.5 V, BVDD = 5 V, VIO = 1.8 V to 2.7 V, VREF = 4.096 V, TA = −40°C to +85°C, unless otherwise noted.
Table 3.
Parameter
Conditions
Min
Typ
Max
Unit
INTERNAL REFERENCE
Output Voltage
Temperature Drift
Line Regulation
Turn-On Settling Time
REFIN Output Voltage
REFIN Output Resistance
EXTERNAL REFERENCE
Voltage Range
Current Drain
PDREF = low
TA= 25°C
−40°C to +85°C
AVDD = 2.5 V 5%
CREF = 10 μF, CREFBUFIN = 0.1 μF
REFIN @ 25°C
4.081
4.096
10
50
220
1.2
7.5
4.111
V
ppm/°C
ppm/V
ms
V
kΩ
PDREF = high, REFIN = low
2 MSPS, VREF = 5.0 V
2.4
5.1
V
µA
500
REFERENCE BUFFER
REFIN Input Voltage Range
REFIN Input Current
DIGITAL INPUTS
Logic Levels
1.2
160
V
µA
VIL
VIH
IIL
IIH
−0.3
+0.9 × VIO
−1
+0.1 × VIO
VIO + 0.3
+1
V
V
µA
µA
−1
+1
DIGITAL OUTPUTS
Data Format
Serial, 18 bits, twos complement
Pipeline Delay
Conversion results available immediately
after completed conversion
VOL
VOH
ISINK = +500 µA
ISOURCE = −500 µA
0.4
V
V
VIO − 0.3
POWER SUPPLIES
AVDD, DVDD
BVDD
2.375
4.75
1.8
2.5
5.0
2.5
2.625
5.25
2.7
V
VIO
Specified performance
V
VIO Range
V
Standby Current1, 2
Power Dissipation
With Internal Reference
Without Internal Reference
With Internal Reference
Without Internal Reference
TEMPERATURE RANGE3
Specified Performance
AVDD = DVDD = VIO = 2.5 V, BVDD = 5.0 V
2.25
µA
2 MSPS throughput
2 MSPS throughput
1.5 MSPS throughput
1.5 MSPS throughput
29
15
26
11.5
34
16.5
30
mW
mW
mW
mW
13
TMIN to TMAX
−40
+85
°C
1 With all digital inputs forced to VIO or GND as required.
2 During acquisition phase.
3 Contact an Analog Devices, Inc., sales representative for the extended temperature range.
Rev. B | Page 4 of 28
AD7986
TIMING SPECIFICATIONS
AVDD = DVDD = 2.5 V, BVDD = 5 V, VIO = 1.8 V to 2.7 V, VREF = 4.096 V, TA = −40°C to +85°C, unless otherwise noted.1
Table 4.
Parameter
Symbol
tCONV
tACQ
Min
Typ
Max
Unit
Conversion Time: CNV Rising Edge to Data Available (Turbo Mode/Normal Mode)
Acquisition Time
400/500 ns
100
ns
Time Between Conversions (Turbo Mode/Normal Mode)
CNV Pulse Width (CS Mode)
tCYC
tCNVH
500/660
10
ns
ns
Data Read During Conversion (Turbo Mode/Normal Mode)
Quiet Time During Acquisition from Last SCK Falling Edge to CNV Rising Edge
SCK Period (CS Mode)
tDATA
tQUIET
tSCK
200/300 ns
20
9
ns
ns
ns
ns
ns
ns
SCK Period (Chain Mode)
SCK Low Time
SCK High Time
SCK Falling Edge to Data Remains Valid
tSCK
tSCKL
tSCKH
tHSDO
tDSDO
tEN
11
3.5
3.5
2
SCK Falling Edge to Data Valid Delay
6
10
8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CNV or SDI Low to SDO D17 MSB Valid (CS Mode)
CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode)
SDI Valid Setup Time from CNV Rising Edge
SDI Valid Hold Time from CNV Rising Edge (CS Mode)
SDI Valid Hold Time from CNV Rising Edge (Chain Mode)
SCK Valid Setup Time from CNV Rising Edge (Chain Mode)
SCK Valid Hold Time from CNV Rising Edge (Chain Mode)
SDI Valid Setup Time from SCK Falling Edge (Chain Mode)
SDI Valid Hold Time from SCK Falling Edge (Chain Mode)
SDI High to SDO High (Chain Mode with Busy Indicator)
tDIS
tSSDICNV
tHSDICNV
tHSDICNV
tSSCKCNV
tHSCKCNV
tSSDISCK
tHSDISCK
tDSDOSDI
4
0
0
5
5
2
3
5
1 See Figure 2 and Figure 3 for load conditions.
10% VIO
500µA
I
OL
90% VIO
tDELAY
tDELAY
1
1
V
V
V
IH
IH
1.4V
TO SDO
1
1
V
IL
IL
C
L
20pF
1
MINIMUM V AND MAXIMUM V USED. SEE DIGITAL INPUTS
IH
IL
SPECIFICATIONS IN TABLE 3.
500µA
I
OH
Figure 2. Load Circuit for Digital Interface Timing
Figure 3. Voltage Levels for Timing
Rev. B | Page 5 of 28
AD7986
ABSOLUTE MAXIMUM RATINGS
Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
Rating
Analog Inputs
IN+, IN− to GND1
−0.3 V to VREF + 0.3 V
or 130 mA
Supply Voltage
REF, BVDD to GND, REFGND
AVDD, DVDD, VIO to GND
AVDD and DVDD to VIO
Digital Inputs to GND
Digital Outputs to GND
Storage Temperature Range
Junction Temperature
θJA Thermal Impedance
20-Lead LFCSP (QFN)
Lead Temperatures
−0.3 V to +6.0 V
−0.3 V to +2.7 V
+3 V to −6 V
−0.3 V to VIO + 0.3 V
−0.3 V to VIO + 0.3 V
−65°C to +150°C
150°C
ESD CAUTION
30.4°C/W
Vapor Phase (60 sec)
Infrared (15 sec)
215°C
220°C
1 See the Analog Inputs section for an explanation of IN+ and IN−.
Rev. B | Page 6 of 28
AD7986
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
REF
REF
REFGND
REFGND
IN–
1
2
3
4
5
15 TURBO
14 SDI
13 CNV
12 SCK
11 DVDD
AD7986
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED
RELIABILITY OF THE SOLDER JOINTS, IT
IS RECOMMENDED THAT THE PAD BE
SOLDERED TO THE SYSTEM
GROUND PLANE.
Figure 4. Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
Mnemonic
Type1 Description
1, 2
REF
AI
Reference Output/Input Voltage.
When PDREF = low, the internal reference and buffer are enabled, producing 4.096 V on this pin.
When PDREF = high, the internal reference and buffer are disabled, allowing an externally supplied
voltage reference up to 5.0 V.
Decoupling is required with or without the internal reference and buffer. This pin is referred to the
REFGND pins and should be decoupled closely to the REFGND pins with a 10 µF capacitor.
3, 4
5
6
REFGND
IN−
IN+
AI
AI
AI
DI
Reference Input Analog Ground.
Differential Negative Analog Input.
Differential Positive Analog Input.
Internal Reference Power-Down Input.
7
PDREF
When low, the internal reference is enabled.
When high, the internal reference is powered down and an external reference must be used.
8
VIO
P
Input/Output Interface Digital Power. Nominally at the same supply as the host interface
(1.8 V, 2.5 V, or 2.7 V).
9
SDO
DO
P
P
DI
DI
Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.
Digital Power Ground.
Digital Power. Nominally at 2.5 V.
10
11
12
13
DGND
DVDD
SCK
Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this clock.
CNV
Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions
and selects the interface mode of the part: chain mode or CS mode. In CS mode, the SDO pin is
enabled when CNV is low. In chain mode, the data should be read when CNV is high.
14
15
SDI
DI
DI
Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC as
follows:
Chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a data
input to daisy-chain the conversion results of two or more ADCs onto a single SDO line. The digital
data level on SDI is output on SDO with a delay of 18 SCK cycles.
CS mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV can
enable the serial output signals when low. If SDI or CNV is low when the conversion is complete, the
busy indicator feature is enabled.
TURBO
Conversion Mode Selection.
When TURBO = high, the maximum throughput (2 MSPS) is achieved. The ADC does not power down
between conversions.
When TURBO = low, the maximum throughput is lower (1.5 MSPS). The ADC powers down between
conversions.
Rev. B | Page 7 of 28
AD7986
Pin No.
16
17,18
19
Mnemonic
AVDD
AGND
Type1 Description
P
P
P
Input Analog Power. Nominally at 2.5 V.
Analog Power Ground.
Reference buffer power. Nominally 5.0 V.
BVDD
If an external reference buffer is used to achieve the maximum SNR performance with 5 V reference,
the reference buffer must be powered down by connecting the REFIN pin to ground. The external
reference buffer must be connected to the BVDD pin.
20
REFIN
AI/O
Internal Reference Output/Reference Buffer Input.
When PDREF = low, the internal band gap reference produces a 1.2 V (typical) voltage on this pin,
which needs external decoupling (0.1 µF typical).
When PDREF = high, use an external reference to provide a 1.2 V (typical) to this pin.
When PDREF = high, and REFIN = low, the on-chip reference buffer and band gap are powered down.
An external reference must be connected to REF and BVDD.
21 (EPAD) Exposed Pad EP
The exposed pad is not connected internally. For increased reliability of the solder joints, it is
recommended that the pad be soldered to the system ground plane.
1 AI = analog input, AI/O = bidirectional analog; DI = digital input, DO = digital output, and P = power.
Rev. B | Page 8 of 28
AD7986
TYPICAL PERFORMANCE CHARACTERISTICS
AVDD = DVDD = VIO = 2.5 V, BVDD = 5.0 V, VREF = 5.0 V, external reference (PDREF = high, REFIN = low), unless otherwise noted.
2.5
2.0
2.0
POSITIVE INL = +1.57LSB
NEGATIVE INL = –1.25LSB
POSITIVE DNL = +0.54LSB
NEGATIVE DNL = –0.60LSB
1.5
1.5
1.0
1.0
0.5
0.5
0
0
–0.5
–1.0
–1.5
–2.0
–2.5
–0.5
–1.0
–1.5
–2.0
0
65,536
131,072
CODE
196,608
262,144
0
65,536
131,072
CODE
196,608
262,144
Figure 5. Integral Nonlinearity vs. Code
Figure 8. Differential Nonlinearity vs. Code
45,000
40,000
35,000
30,000
25,000
20,000
15,000
10,000
5000
45,000
40,000
35,000
30,000
25,000
20,000
15,000
10,000
5000
41,811
41,434
38,665
35,204
34,894
30,897
10,211
8250
7662
6399
2283
1661
3FF8
1418
1002
34
142
101
68
0
3
0
0
0
4
1
0
1
0
0
3FF5
3FF7
3FF9
3FFB
3FFD
3FFF
3FF6
3FFA
3FFC
3FFE
CODE IN HEX
CODE IN HEX
Figure 6. Histogram of DC Input at Code Center (External Reference)
Figure 9. Histogram of DC Input at Code Transition (External Reference)
45,000
40,000
35,000
37,385
36,210
39,395
40,000
35,000
30,000
31,020
29,138
30,000
25,000
22,077
25,000
20,000
18,953
20,000
15,000
10,000
5000
0
15,000
12,773
11,107
10,000
6879
6513
3662
3FF0
5000
0
2932
3FF6
1438
547
1282
150
407
55
35
165
0
1
0
3
0
1
16
0
3FFEC 3FFEE
3FF2
3FF4
3FF8
3FFEB 3FFED 3FFEF 3FF1
3FF3
3FF5
3FF7
3FF9
CODE IN HEX
CODE IN HEX
Figure 7. Histogram of DC Input at Code Center (Internal Reference)
Figure 10. Histogram of DC Input at Code Transition (Internal Reference)
Rev. B | Page 9 of 28
AD7986
0
–20
0
–20
fS = 2MSPS
fIN = 20kHz
fS = 2MSPS
fIN = 20kHz
SNR = 97.0dB
THD = –114.0dB
SINAD = 97.0dB
SNR = 95.5dB
THD = –113.0dB
SINAD = 95.5dB
–40
–40
–60
–60
–80
–80
–100
–120
–140
–160
–180
–100
–120
–140
–160
–180
–200
0
200k
400k
600k
800k
1M
0
200k
400k
600k
800k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 11. FFT Plot (External Reference)
Figure 14. FFT Plot (Internal Reference)
100
95
18
17
16
15
14
–95
–100
–105
–110
–115
–120
–125
125
SNR
120
115
110
105
100
95
SINAD
ENOB
SFDR
THD
90
85
80
2.5
3.0
3.5
4.0
4.5
5.0
2.5
3.0
3.5
4.0
4.5
5.0
REFERENCEVOLTAGE(V)
REFERENCE VOLTAGE (V)
Figure 12. SNR, SINAD, and ENOB vs. Reference Voltage
Figure 15. THD and SFDR vs. Reference Voltage
100
95
90
85
80
–80
–85
–90
–95
–100
–105
–110
–115
–120
–125
1k
10k
100k
FREQUENCY (Hz)
1M
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 13. SINAD vs. Frequency
Figure 16. THD vs. Frequency
Rev. B | Page 10 of 28
AD7986
100
99
98
97
96
95
94
93
92
91
90
3.0
2.5
2.0
1.5
1.0
0.5
0
I
REF
I
AVDD
I
BVDD
–10
–9
–8
–7
–6
–5
–4
–3
–2
–1
0
–55
–35
–15
5
25
45
65
85
105
125
INPUT LEVEL (dB)
TEMPERATURE (C)
Figure 17. SNR vs. Input Level
Figure 19. Operating Currents vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.5
0
14
12
10
8
I
REF
I
I
AVDD
DVDD
6
4
I
+ I
DVDD
+ I
VIO
AVDD
I
BVDD
2
I
VIO
0
–55
2.375
2.425
2.475
2.525
2.575
2.625
125
–35
–15
5
25
45
65
85
105
AVDD AND DVDD VOLTAGE (V)
TEMPERATURE (°C)
Figure 18. Operating Currents vs. Supply Voltage
Figure 20. Power-Down Currents vs. Temperature
Rev. B | Page 11 of 28
AD7986
TERMINOLOGY
Noise-Free Code Resolution
Noise-free code resolution is the number of bits beyond which it is
impossible to distinctly resolve individual codes. It is calculated as
Integral Nonlinearity Error (INL)
INL refers to the deviation of each individual code from a line
drawn from negative full scale through positive full scale. The
point used as negative full scale occurs ½ LSB before the first
code transition. Positive full scale is defined as a level 1½ LSB
beyond the last code transition. The deviation is measured from
the middle of each code to the true straight line (see Figure 22).
Noise-Free Code Resolution = log2(2N/Peak-to-Peak Noise)
and is expressed in bits.
Effective Resolution
Effective resolution is calculated as
Differential Nonlinearity Error (DNL)
Effective Resolution = log2(2N/RMS Input Noise)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
and is expressed in bits.
Total Harmonic Distortion (THD)
Zero Error
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in decibels.
Zero error is the difference between the ideal midscale voltage,
that is, 0 V, from the actual voltage producing the midscale
output code, that is, 0 LSB.
Dynamic Range
Gain Error
Dynamic range is the ratio of the rms value of the full scale to
the total rms noise measured with the inputs shorted together.
The value for dynamic range is expressed in decibels. It is
measured with a signal at −60 dBF so that it includes all noise
sources and DNL artifacts.
The first transition (from 100 ... 00 to 100 ... 01) should occur at
a level ½ LSB above nominal negative full scale (−4.095984 V
for the 4.096 V range). The last transition (from 011 … 10 to
011 … 11) should occur for an analog voltage 1½ LSB below
the nominal full scale (+4.095953 V for the 5 V range). The
gain error is the deviation of the difference between the actual
level of the last transition and the actual level of the first
transition from the difference between the ideal levels.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms
amplitude of the input signal and the peak spurious signal.
Signal-to-(Noise + Distortion) (SINAD)
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components that are less than
the Nyquist frequency, including harmonics but excluding dc.
The value of SINAD is expressed in decibels.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD as follows:
ENOB = (SINADdB − 1.76)/6.02
Aperture Delay
Aperture delay is the measure of the acquisition performance
and is the time between the rising edge of the CNV input and
when the input signal is held for a conversion.
and is expressed in bits.
Transient Response
Transient response is the time required for the ADC to accurately
acquire its input after a full-scale step function is applied.
Rev. B | Page 12 of 28
AD7986
THEORY OF OPERATION
IN+
SWITCHES CONTROL
CONTROL
SW+
SW–
MSB
LSB
LSB
131,072C 65,536C
4C
4C
2C
2C
C
C
C
C
BUSY
REF
COMP
LOGIC
REFGND
131,072C 65,536C
MSB
OUTPUT CODE
CNV
IN–
Figure 21. ADC Simplified Schematic
two capacitor arrays are then disconnected from the analog
inputs and connected to the REFGND input. Therefore, the
differential voltage between Input IN+ and Input IN− captured
at the end of the acquisition phase is applied to the comparator
inputs, causing the comparator to become unbalanced. By
switching each element of the capacitor array between
REFGND and REF, the comparator input varies by binary-
weighted voltage steps (VREF/2, VREF/4 … VREF/262,144). The
control logic toggles these switches, starting with the MSB, to
bring the comparator back into a balanced condition. After the
completion of this process, the part returns to the acquisition
phase, and the control logic generates the ADC output code and
a busy signal indicator.
CIRCUIT INFORMATION
The AD7986 is a fast, low power, single-supply, precise, 18-bit
ADC using a successive approximation architecture. The AD7986
features different modes to optimize performance according to
the application. In turbo mode, the AD7986 is capable of convert-
ing 2,000,000 samples per second (2 MSPS).
The AD7986 provides the user with an on-chip track-and-hold
and does not exhibit any pipeline delay or latency, making it ideal
for multiple multiplexed channel applications.
The AD7986 can be interfaced to any 1.8 V to 2.7 V digital logic
family. It is available in a 20-lead LFCSP (QFN) that allows space
savings and flexible configurations.
Because the AD7986 has an on-board conversion clock, the
serial clock, SCK, is not required for the conversion process.
CONVERTER OPERATION
The AD7986 is a successive approximation ADC based on a
charge redistribution DAC. Figure 21 shows the simplified
schematic of the ADC. The capacitive DAC consists of two
identical arrays of 18 binary-weighted capacitors that are
connected to the two comparator inputs.
CONVERSION MODES OF OPERATION
The AD7986 features two conversion modes of operation: turbo
and normal. Turbo conversion mode (TURBO = high) allows
the fastest conversion rate of up to 2 MSPS, and does not power
down between conversions. The first conversion in turbo mode
should be ignored because it contains meaningless data. For
applications that require lower power and slightly slower
sampling rates, the normal mode (TURBO = low) allows a
maximum conversion rate of 1.5 MSPS, and powers down
between conversion. The first conversion in normal mode does
contain meaningful data.
During the acquisition phase, terminals of the array tied to the
input of the comparator are connected to AGND via SW+ and
SW−. All independent switches are connected to the analog
inputs. Therefore, the capacitor arrays are used as sampling
capacitors and acquire the analog signal on the IN+ and IN−
inputs. When the acquisition phase is complete and the CNV
input goes high, a conversion phase is initiated. When the
conversion phase begins, SW+ and SW− are opened first. The
Rev. B | Page 13 of 28
AD7986
Transfer Functions
Table 7. Output Codes and Ideal Input Voltages
Analog Input
VREF = 5 V
Digital Output
The ideal transfer characteristic for the AD7986 is shown in
Figure 22 and Table 7.
Description
FSR − 1 LSB
Midscale + 1 LSB
Midscale
Midscale − 1 LSB
−FSR + 1 LSB
−FSR
Code (Hex)
0x1FFFF1
0x00001
0x00000
0x3FFFF
0x20001
0x200002
+4.095969 V
+31.25 µV
0 V
−31.25 µV
−4.095969 V
−4.096 V
011 ... 111
011 ... 110
011 ... 101
1 This is also the code for an overranged analog input (VIN+ − VIN− above VREF
REFGND).
−
2 This is also the code for an underranged analog input (VIN+ − VIN− below REFGND).
100 ... 010
100 ... 001
100 ... 000
TYPICAL CONNECTION DIAGRAM
Figure 23 shows an example of the recommended connection
diagram for the AD7986 when multiple supplies are available.
–FSR
–FSR + 1 LSB
+FSR – 1 LSB
+FSR – 1.5 LSB
ANALOG INPUT
–FSR + 0.5 LSB
Figure 22. ADC Ideal Transfer Function
5V
1.8V TO 2.7V
2.5V
V+
15Ω
AVDD,
DVDD
VIO
BVDD
0V TO V
REF
2.7nF
TURBO
SDI
VIO
3- OR 4-WIRE
INTERFACE:
SPI, CS
IN+
IN–
V–
V+
SCLK
SDO
AD7986
DAISY CHAIN (TURBO = LOW)
CNV
15Ω
1
REF GND
V
TO 0V
REF
2.7nF
10µF
V–
NOTES
1. GND REFERS TO REFGND, AGND, AND DGND.
Figure 23. Typical Application Diagram with Multiple Supplies
Rev. B | Page 14 of 28
AD7986
ANALOG INPUTS
DRIVER AMPLIFIER CHOICE
Figure 24 shows an equivalent circuit of the input structure of
the AD7986.
Although the AD7986 is easy to drive, the driver amplifier must
meet the following requirements:
The two diodes, D1 and D2, provide ESD protection for the
analog inputs, IN+ and IN−. Care must be taken to ensure that
the analog input signal does not exceed the reference input
voltage (REF) by more than 0.3 V. If the analog input signal
exceeds this level, the diodes become forward-biased and start
conducting current. These diodes can handle a forward-biased
current of 130 mA maximum. However, if the supplies of the
input buffer (for example, the V+ and V− supplies of the buffer
amplifier in Figure 23) are different from those of REF, the
analog input signal may eventually exceed the supply rails by
more than 0.3 V. In such a case (for example, an input buffer
with a short circuit), the current limitation can be used to
protect the part.
•
The noise generated by the driver amplifier must be kept as
low as possible to preserve the SNR and transition noise
performance of the AD7986. The noise from the driver is
filtered by the AD7986 analog input circuit’s one-pole, low-
pass filter, made by RIN and CIN or by the external filter, if
one is used. Because the typical noise of the AD7986 is
62.5 µV rms, the SNR degradation due to the amplifier is
62.5
SNRLOSS = 20 log
π
34.42 + f−3dB (NeN )2
2
where:
f–3dB is the input bandwidth, in megahertz, of the AD7986
REF
(20 MHz) or the cutoff frequency of the input filter, if
one is used.
N is the noise gain of the amplifier (for example, 1 in buffer
D1
D2
C
IN
R
IN
IN+ OR IN–
GND
C
PIN
configuration).
eN is the equivalent input noise voltage of the op amp, in
nV/√Hz.
Figure 24. Equivalent Analog Input Circuit
The analog input structure allows the sampling of the true
differential signal between IN+ and IN−. By using these
differential inputs, signals common to both inputs are rejected.
•
•
For ac applications, the driver should have a THD perfor-
mance commensurate with the AD7986.
For multichannel multiplexed applications, the driver
amplifier and the AD7986 analog input circuit must settle
for a full-scale step onto the capacitor array at an 18-bit level
(0.0004%, 4 ppm). In the data sheet of the driver amplifier,
settling at 0.1% to 0.01% is more commonly specified. This
may differ significantly from the settling time at an 18-bit
level and should be verified prior to driver selection.
During the acquisition phase, the impedance of the analog
inputs (IN+ or IN−) can be modeled as a parallel combination
of Capacitor CPIN and the network formed by the series connection
of RIN and CIN. CPIN is primarily the pin capacitance. RIN is typically
400 Ω and is a lumped component composed of serial resistors
and the on resistance of the switches. CIN is typically 30 pF and
is mainly the ADC sampling capacitor.
Table 8. Recommended Driver Amplifiers
During the sampling phase, where the switches are closed, the
input impedance is limited to CPIN. RIN and CIN make a one-pole,
low-pass filter that reduces undesirable aliasing effects and
limits noise.
Amplifier
Typical Application
AD8021
AD8022
ADA4899-1
AD8014
Very low noise and high frequency
Low noise and high frequency
Ultralow noise and high frequency
Low power and high frequency
When the source impedance of the driving circuit is low, the
AD7986 can be driven directly. Large source impedances
significantly affect the ac performance, especially THD. The
dc performances are less sensitive to the input impedance. The
maximum source impedance depends on the amount of THD
that can be tolerated. The THD degrades as a function of the
source impedance and the maximum input frequency.
Rev. B | Page 15 of 28
AD7986
The advantages of directly using the external voltage reference are:
VOLTAGE REFERENCE INPUT
•
The SNR and dynamic range improvement (about 1.7 dB)
resulting from the use of a larger reference voltage (5 V)
instead of a typical 4.096 V reference when the internal
reference is used. This is calculated by
The AD7986 allows the choice of a very low temperature drift
internal voltage reference, an external reference, or an external
buffered reference.
The internal reference of the AD7986 provides excellent
performance and can be used in almost all applications.
4.096
5.0
SNR = 20 log
Internal Reference, REF = 4.096V (PDREF = Low)
To use the internal reference, the PDREF input must be low.
This enables the on-chip band gap reference and buffer, result-
ing in a 4.096 V reference on the REF pin (1.2 V on REFIN).
•
The power savings when the internal reference is powered
down (PDREF high).
Reference Decoupling
The internal reference is temperature compensated to 4.096 V
15 mV. The reference is trimmed to provide a typical drift of
10 ppm/°C.
The AD7986 voltage reference input, REF, has a dynamic input
impedance that requires careful decoupling between the REF
and REFGND pins. The Layout section describes how this can
be done.
The output resistance of REFIN is 6 kΩ when the internal
reference is enabled. It is necessary to decouple this pin with a
ceramic capacitor of at least 100 nF. The output resistance of
REFIN and the decoupling capacitor form an RC filter, which
helps to reduce noise.
When using an external reference, a very low impedance source
(for example, a reference buffer using the AD8031 or the
AD8605), and a 10 µF (X5R, 0805 size) ceramic chip capacitor
are appropriate for optimum performance.
Because the output impedance of REFIN is typically 6 kΩ, relative
humidity (among other industrial contaminants) can directly
affect the drift characteristics of the reference. A guard ring is
typically used to reduce the effects of drift under such circum-
stances. However, the fine pitch of the AD7986 makes this
difficult to implement. One solution, in these industrial and
other types of applications, is to use a conformal coating, such as
Dow Corning® 1-2577 or HumiSeal® 1B73.
If an unbuffered reference voltage is used, the decoupling value
depends on the reference used. For instance, a 22 µF (X5R,
1206 size) ceramic chip capacitor is appropriate for optimum
performance using a low temperature drift ADR43x reference.
If desired, a reference decoupling capacitor with values as small
as 2.2 µF can be used with minimal impact on performance,
especially DNL.
Regardless, there is no need for an additional lower value ceramic
decoupling capacitor (for example, 100 nF) between the REF
and REFGND pins.
External 1.2 V Reference and Internal Buffer (PDREF = High)
To use an external reference along with the internal buffer, PDREF
should be high. This powers down the internal reference and
allows the 1.2 V reference to be applied to REFIN, producing
4.096 V (typically) on the REF pin.
POWER SUPPLY
The AD7986 uses four power supply pins: an analog supply
(AVDD), a buffer supply (BVDD), a digital supply (DVDD),
and a digital input/output interface supply (VIO). VIO allows
direct interface with any logic between 1.8 V and 2.7 V. To reduce
the number of supplies needed, VIO, DVDD, and AVDD can
be tied together. The AD7986 is independent of power supply
sequencing among all of its supplies. Additionally, it is very
insensitive to power supply variations over a wide frequency range.
External Reference (PDREF = High, REFIN = Low)
To apply an external reference voltage directly to the REF pin,
PDREF should be tied high, and REFIN should be tied low.
BVDD should also be driven to the same potential as REF. For
example, if REF = 2.5 V, BVDD should be tied to 2.5 V.
Rev. B | Page 16 of 28
AD7986
DIGITAL INTERFACE
Although the AD7986 has a reduced number of pins, it offers
flexibility in its serial interface modes.
CS
mode if CNV or
The busy indicator feature is enabled in
SDI is low when the ADC conversion ends (see Figure 28 and
Figure 32), and TURBO must be kept low for both digital
interfaces.
CS
When in
mode, the AD7986 is compatible with SPI,
MICROWIRE™, QSPI™, and digital hosts. In this mode, the
AD7986 can use either a 3-wire or a 4-wire interface. A 3-wire
interface using the CNV, SCK, and SDO signals minimizes
wiring connections, which is useful, for instance, in isolated
applications. A 4-wire interface using the SDI, CNV, SCK, and
SDO signals allows CNV, which initiates conversions, to be
independent of the readback timing (SDI). This is useful in low
jitter sampling or simultaneous sampling applications.
When CNV is low, reading can occur during conversion and
acquisition, and when split across acquisition and conversion,
as detailed in the following sections.
A discontinuous SCK is recommended because the part is
selected with CNV low, and SCK activity begins to clock
out data.
Note that in the following sections, the timing diagrams
indicate digital activity (SCK, CNV, SDI, and SDO) during
the conversion. However, due to the possibility of performance
degradation, digital activity should occur only prior to the safe
data reading time, tDATA, because the AD7986 provides error
correction circuitry that can correct for an incorrect bit decision
during this time. From tDATA to tCONV, there is no error correction,
and conversion results may be corrupted. Similarly, tQUIET, the
time from the last falling edge of SCK to the rising edge of C N V,
must remain free of digital activity. The user should configure
the AD7986 and initiate the busy indicator (if desired in normal
mode) prior to tDATA. It is also possible to corrupt the sample by
having SCK near the sampling instant. Therefore, it is recom-
mended to keep the digital pins quiet for approximately 20 ns
before and 10 ns after the rising edge of CNV, using a
When in chain mode, the AD7986 provides a daisy-chain feature
using the SDI input for cascading multiple ADCs on a single
data line similar to a shift register. Chain mode is only available
in normal mode (TURBO = low).
The mode in which the part operates depends on the SDI level
CS
when the CNV rising edge occurs. The
mode is selected if
SDI is high, and the chain mode is selected if SDI is low. The
SDI hold time is such that when SDI and CNV are connected
together, the chain mode is always selected.
In normal mode operation, the AD7986 offers the option of
forcing a start bit in front of the data bits. This start bit can be
used as a busy signal indicator to interrupt the digital host and
trigger the data reading. Otherwise, without a busy indicator,
the user must time out the maximum conversion time prior to
readback.
discontinuous SCK whenever possible to avoid any potential
performance degradation.
Rev. B | Page 17 of 28
AD7986
To determine how to split the read for a particular SCK frequency,
follow these examples to read data from conversion (n − 1).
DATA READING OPTIONS
There are three different data reading options for the AD7986.
There is the option to read during conversion, to split the read
across acquisition and conversion (see Figure 27 and Figure 28),
and in normal mode, to read during acquisition. The desired
SCK frequency largely determines which reading option to
pursue.
For turbo mode (2 MSPS),
fSCK = 65 MHz; tDATA = 200 ns
Number_SCK_Edges = 65 MHz × 200 ns = 13
Thirteen bits are read during conversion (n), and five bits are
read during acquisition (n).
Reading During Conversion, Fast Hosts (Turbo or
Normal Mode)
For normal mode (1.5 MSPS),
When reading during conversion (n), conversion results are for
the previous (n − 1) conversion. Reading should only occur up
to tDATA and, because this time is limited, the host must use a
fast SCK.
f
SCK = 50 MHz; tDATA = 300 ns
Number_SCK_Edges = 50 MHz × 300 ns = 15
Fifteen bits are read during conversion (n), and three bits are
read during acquisition (n).
The required SCK frequency is calculated by
For slow throughputs, the time restriction is dictated by the
user’s required throughput, and the host is free to run at any
speed. Similar to the reading during acquisition, for slow hosts,
the data access must take place during the acquisition phase
with additional time into the conversion.
Number _ SCK _ Edges
fSCK
≥
tDATA
To determine the SCK frequency, follow these examples to read
data from conversion (n − 1).
Note that data access spanning conversion requires the CNV to
be driven high to initiate a new conversion, and data access is
not allowed when CNV is high. Thus, the host must perform
two bursts of data access when using this method.
Turbo mode (2 MSPS):
Number_SCK_Edges = 18; tDATA = 200 ns
fSCK = 18/200 ns = 90 MHz
Normal mode (1.5 MSPS):
Reading During Acquisition, Any Speed Hosts (Turbo or
Normal Mode)
Number_SCK_Edges = 18; tDATA = 300 ns
When reading during acquisition (n), conversion results are
for the previous (n − 1) conversion. Maximum throughput is
achievable in normal mode (1.5 MSPS); however, in turbo
mode, 2 MSPS throughput is not achievable.
f
SCK = 18/300 ns = 60 MHz
The time between tDATA and tCONV is an I/O quiet time where
digital activity should not occur, or sensitive bit decisions may
be corrupt.
For the maximum throughput, the only time restriction is that
the reading takes place during the tACQ (minimum) time. For
slow throughputs, the time restriction is dictated by throughput
required by the user, and the host is free to run at any speed.
Thus for slow hosts, data access must take place during the
acquisition phase.
Split-Reading, Any Speed Host (Turbo or Normal Mode)
To allow for slower SCK, there is the option of a split read where
data access starts at the current acquisition (n) and spans into the
conversion (n). Conversion results are for the previous (n − 1)
conversion.
Similar to reading during conversion, split-reading should only
occur up to tDATA. For the maximum throughput, the only time
restriction is that split-reading take place during the tACQ
(minimum) + tDATA − tQUIET time. The time between the falling
edge of SCK and CNV rising is an acquisition quiet time, tQUIET
.
Rev. B | Page 18 of 28
AD7986
conversion time elapses and then held high for the maximum
possible conversion time to avoid the generation of the busy
signal indicator. When the conversion is complete, the AD7986
enters the acquisition phase and powers down. When CNV
goes low, the MSB is output onto SDO. The remaining data bits
are clocked by subsequent SCK falling edges. The data is valid on
both SCK edges. Although the rising edge can be used to
capture the data, a digital host using the SCK falling edge allows
a faster reading rate, provided that it has an acceptable hold
time. After the 18th SCK falling edge or when CNV goes high
(whichever occurs first), SDO returns to high impedance.
CS MODE, 3-WIRE WITHOUT BUSY INDICATOR
This mode is usually used when a single AD7986 is connected
to an SPI-compatible digital host. The connection diagram is
shown in Figure 25, and the corresponding timing is given in
Figure 26.
With SDI tied to VIO, a rising edge on CNV initiates a conversion,
CS
selects the
mode, and forces SDO to high impedance. Once
a conversion is initiated, it continues until completion irrespective
of the state of CNV. This can be useful, for instance, to bring
CNV low to select other SPI devices, such as analog multiplexers;
however, CNV must be returned high before the minimum
CONVERT
DIGITAL HOST
CNV
VIO
SDI
SDO
DATA IN
AD7986
SCK
CLK
CS
Figure 25. Mode, 3-Wire Without Busy Indicator Connection Diagram (SDI High)
tCYC
>
tCONV
tCONV
tCONV
tDATA
tDATA
tCNVH
SDI = 1
CNV
tACQ
(I/O QUIET
TIME)
ACQUISITION
(n + 1)
ACQUISITION
(n - 1)
(I/O QUIET
TIME)
(QUIET
TIME)
ACQUISITION (n)
CONVERSION (n – 1)
CONVERSION (n)
tQUIET
SCK
SDO
1
16
17
18
2
16
17
18
tSCK
tHSDO
tDSDO
tEN
tEN
2
1
0
17
16
15
BEGIN DATA (n – 1)
2
1
0
tDIS
tDIS
tDIS
tDIS
END DATA (n – 2)
END DATA (n – 1)
CS
Figure 26. Mode, 3-Wire Without Busy Indicator Serial Interface Timing (SDI High)
Rev. B | Page 19 of 28
AD7986
When the conversion is complete, SDO goes from high imped-
ance to low impedance. With a pull-up on the SDO line, this
transition can be used as an interrupt signal to initiate the data
reading controlled by the digital host. The AD7986 then enters
the acquisition phase and powers down. The data bits are then
clocked out, MSB first, by subsequent SCK falling edges. The
data is valid on both SCK edges. Although the rising edge can
be used to capture the data, a digital host using the SCK falling
edge allows a faster reading rate, provided that it has an acceptable
hold time. After the optional 19th SCK falling edge, SDO returns
to high impedance.
CS MODE, 3-WIRE WITH BUSY INDICATOR
This mode is usually used when a single AD7986 is connected
to an SPI-compatible digital host having an interrupt input.
It is only available in normal conversion mode (TURBO = low).
The connection diagram is shown in Figure 27, and the
corresponding timing is given in Figure 28.
With SDI tied to VIO, a rising edge on CNV initiates a conversion,
CS
selects the
mode, and forces SDO to high impedance. SDO
is maintained in high impedance until the completion of the
conversion irrespective of the state of CNV. Prior to the minimum
conversion time, CNV can be used to select other SPI devices,
such as analog multiplexers, but CNV must be returned low
before the minimum conversion time elapses and then held low
for the maximum possible conversion time to guarantee the
generation of the busy signal indicator.
If multiple AD7986 devices are selected at the same time, the
SDO output pin handles this contention without damage or
induced latch-up. Meanwhile, it is recommended to keep this
contention as short as possible to limit extra power dissipation.
CONVERT
VIO
47kΩ
DIGITAL HOST
CNV
VIO
SDI
SDO
DATA IN
IRQ
AD7986
SCK TURBO
CLK
CS
Figure 27. Mode, 3-Wire with Busy Indicator Connection Diagram (SDI High)
TURBO = 0
SDI = 1
tCYC
tCNVH
CNV
tCONV
tACQ
(QUIET
TIME)
ACQUISITION
CONVERSION
ACQUISITION
tSCK
tQUIET
tSCKL
SCK
SDO
1
2
3
17
18
19
tHSDO
tSCKH
tDSDO
D16
tDIS
D17
D1
D0
CS
Figure 28. Mode, 3-Wire with Busy Indicator Serial Interface Timing (SDI High)
Rev. B | Page 20 of 28
AD7986
but SDI must be returned high before the minimum conversion
time elapses and then held high for the maximum possible
conversion time to avoid the generation of the busy signal
indicator. When the conversion is complete, the AD7986 enters
the acquisition phase and powers down. Each ADC result can
be read by bringing its SDI input low, which consequently
outputs the MSB onto SDO. The remaining data bits are then
clocked by subsequent SCK falling edges. The data is valid on
both SCK edges. Although the rising edge can be used to capture
the data, a digital host using the SCK falling edge allows a faster
reading rate, provided that it has an acceptable hold time. After
the 18th SCK falling edge, SDO returns to high impedance and
another AD7986 can be read.
CS MODE, 4-WIRE WITHOUT BUSY INDICATOR
This mode is usually used when multiple AD7986 devices are
connected to an SPI-compatible digital host.
A connection diagram example using two AD7986 devices is
shown in Figure 29, and the corresponding timing is given in
Figure 30.
With SDI high, a rising edge on CNV initiates a conversion, selects
CS
the
mode, and forces SDO to high impedance. In this mode,
CNV must be held high during the conversion phase and the
subsequent data readback. (If SDI and CNV are low, SDO is
driven low.) Prior to the minimum conversion time, SDI can be
used to select other SPI devices, such as analog multiplexers,
CS2
CS1
CONVERT
CNV
CNV
DIGITAL HOST
SDI
SDO
AD7986
SDI
SDO
AD7986
SCK
SCK
DATA IN
CLK
CS
Figure 29. Mode, 4-Wire Without Busy Indicator Connection Diagram
tCYC
tCONV
tDATA
tCONV
tDATA
CNV
tACQ
(I/O QUIET
TIME)
(QUIET
TIME)
(I/O QUIET
TIME)
ACQUISITION
(n – 1)
ACQUISITION
(n + 1)
ACQUISITION (n)
CONVERSION (n – 1)
tHSDICNV
CONVERSION (n)
SDI
tSSDICNV
tQUIET
SCK
1
16
17
18
2
16
2
17
1
18
tSCK
tHSDO
tDSDO
tEN
tEN
2
1
0
17
16
15
0
SDO
tHSDO
tDIS
tDIS
END DATA (n – 2)
BEGIN DATA (n – 1)
END DATA (n – 1)
CS
Figure 30. Mode, 4-Wire Without Busy Indicator Serial Interface Timing
Rev. B | Page 21 of 28
AD7986
used to select other SPI devices, such as analog multiplexers,
but SDI must be returned low before the minimum conversion
time elapses and then held low for the maximum possible
conversion time to guarantee the generation of the busy signal
indicator. When the conversion is complete, SDO goes from
high impedance to low impedance. With a pull-up on the SDO
line, this transition can be used as an interrupt signal to initiate
the data readback controlled by the digital host. The AD7986
then enters the acquisition phase and powers down. The data
bits are then clocked out, MSB first, by subsequent SCK falling
edges. The data is valid on both SCK edges. Although the rising
edge can be used to capture the data, a digital host using the
SCK falling edge allows a faster reading rate, provided that it
has an acceptable hold time. After the optional 19th SCK falling
edge or SDI going high (whichever occurs first), SDO returns to
high impedance.
CS MODE, 4-WIRE WITH BUSY INDICATOR
This mode is usually used when a single AD7986 is connected
to an SPI-compatible digital host with an interrupt input and
when it is desired to keep CNV, which is used to sample the
analog input, independent of the signal used to select the data
reading. This independence is particularly important in
applications where low jitter on CNV is desired. This mode is
only available in normal conversion mode (TURBO = low).
The connection diagram is shown in Figure 31, and the
corresponding timing is given in Figure 32.
With SDI high, a rising edge on CNV initiates a conversion,
CS
selects the
mode, and forces SDO to high impedance. In this
mode, CNV must be held high during the conversion phase and
the subsequent data readback. (If SDI and CNV are low, SDO is
driven low.) Prior to the minimum conversion time, SDI can be
CS1
CONVERT
VIO
47kΩ
DIGITAL HOST
CNV
SDI
SDO
DATA IN
IRQ
AD7986
TURBO
SCK
CLK
CS
Figure 31. Mode, 4-Wire with Busy Indicator Connection Diagram
TURBO = 0
CNV
tCYC
tACQ
tCONV
(I/O QUIET
TIME)
ACQUISITION
CONVERSION
ACQUISITION
tSSDICNV
SDI
tSCK
tHSDICNV
tSCKL
tQUIET
SCK
SDO
1
2
3
17
tSCKH
18
19
tHSDO
tDSDO
tDIS
tEN
D17
D16
D1
D0
CS
Figure 32. Mode, 4-Wire with Busy Indicator Serial Interface Timing
Rev. B | Page 22 of 28
AD7986
held high during the conversion phase and the subsequent data
readback. When the conversion is complete, the MSB is output
onto SDO, and the AD7986 enters the acquisition phase and
powers down. The remaining data bits stored in the internal
shift register are clocked by subsequent SCK falling edges. For
each ADC, SDI feeds the input of the internal shift register and
is clocked by the SCK falling edge. Each ADC in the chain
outputs its data MSB first, and 18 × N clocks are required to
read back the N ADCs. The data is valid on both SCK edges.
Although the rising edge can be used to capture the data, a
digital host using the SCK falling edge allows a faster reading
rate and consequently more AD7986 devices in the chain,
provided that the digital host has an acceptable hold time. The
maximum conversion rate may be reduced due to the total
readback time.
CHAIN MODE WITHOUT BUSY INDICATOR
This mode can be used to daisy-chain multiple AD7986 devices
on a 3-wire serial interface. It is only available in normal conver-
sion mode (TURBO = low). This feature is useful for reducing
component count and wiring connections, for example, in
isolated multiconverter applications or for systems with a
limited interfacing capacity. Data readback is analogous to
clocking a shift register.
A connection diagram example using two AD7986 devices is
shown in Figure 33, and the corresponding timing is given in
Figure 34.
When SDI and CNV are low, SDO is driven low. With SCK low,
a rising edge on CNV initiates a conversion, selects the chain
mode, and disables the busy indicator. In this mode, CNV is
CONVERT
CNV
CNV
DIGITAL HOST
DATA IN
SDI
SDO
AD7986
SDI
SDO
AD7986
A
B
TURBO
TURBO
SCK
SCK
CLK
Figure 33. Chain Mode Without Busy Indicator Connection Diagram
TURBO= 0
tCYC
CNV = SDI
A
tCONV
tACQ
ACQUISITION
CONVERSION
ACQUISITION
tSCK
tSSCKCNV
tSCKH
SCK
1
2
3
4
17
18
19
20
21
35
36
37
38
39
53
54
55
tHSCKCNV
tSSDISCK
tSCKL
tDSDOSDI
tHSDISCK
tEN
SDO = SDI
D
17
D
16
D
15
A
D
A
1
D
D
0
A
A
B
A
A
tHSDO
tDSDO
tDSDOSDI
tDSDOSDI
tDSDOSDI
SDO = SDI
B
D
17
D
D
16
D 15
B
D
D
1
0
D
17
D
16
D 1
A
D 0
A
C
B
B
B
B
A
A
tDSDOSDI
SDO
D
17
16
D
15
1
D
0
D
17
D
16
D
1
D
0
D
17
D
16
D
1
D 0
A
C
C
C
C
C
C
B
B
B
B
A
A
A
Figure 34. Chain Mode Without Busy Indicator Serial Interface Timing
Rev. B | Page 23 of 28
AD7986
subsequent data readback. When all ADCs in the chain have
completed their conversions, the SDO pin of the ADC closest to
the digital host (see the AD7986 ADC labeled C in Figure 35) is
driven high. This transition on SDO can be used as a busy indicator
to trigger the data readback controlled by the digital host. The
AD7986 then enters the acquisition phase and powers down.
The data bits stored in the internal shift register are clocked out,
MSB first, by subsequent SCK falling edges. For each ADC, SDI
feeds the input of the internal shift register and is clocked by the
SCK falling edge. Each ADC in the chain outputs its data MSB
first, and 18 × N + 1 clocks are required to read back the N ADCs.
Although the rising edge can be used to capture the data, a digital
host using the SCK falling edge allows a faster reading rate and
consequently more AD7986 devices in the chain, provided that
the digital host has an acceptable hold time.
CHAIN MODE WITH BUSY INDICATOR
This mode can also be used to daisy-chain multiple AD7986
devices on a 3-wire serial interface while providing a busy
indicator. This feature is useful for reducing component count
and wiring connections, for example, in isolated multiconverter
applications or for systems with a limited interfacing capacity.
Data readback is analogous to clocking a shift register. A
connection diagram example using three AD7986 devices is
shown in Figure 35, and the corresponding timing is given in
Figure 36.
When SDI and CNV are low, SDO is driven low. With SCK
high, a rising edge on CNV initiates a conversion, selects the
chain mode, and enables the busy indicator feature. In this
mode, CNV is held high during the conversion phase and the
CONVERT
CNV
CNV
CNV
DIGITAL HOST
SDI
SDO
AD7986
SDI
SDO
SDI
SDO
AD7986
AD7986
DATA IN
IRQ
A
B
C
SCK
SCK
SCK
TURBO
TURBO
TURBO
CLK
Figure 35. Chain Mode with Busy Indicator Connection Diagram
TURBO = 0
tCYC
CNV = SDI
A
tCONV
tACQ
ACQUISITION
CONVERSION
ACQUISITION
tSCK
tQUIET
tSCKH
SCK
1
2
3
4
17
18
19
20
21
35
36
37
38
39
53
54
55
tHSCKCNV
tSSDISCK
tSCKL
tDSDOSDI
tHSDISCK
tEN
SDO = SDI
A
D
17
D
16
D
15
D
A
1
D 0
A
B
A
A
A
tHSDO
tDSDO
tDSDOSDI
tDSDOSDI
tDSDOSDI
SDO = SDI
B
D
17
D
D
16
D
15
B
D
D
1
D
0
D
17
D
16
D 1
A
D 0
A
C
B
B
B
B
A
A
tDSDOSDI
SDO
D
17
16
D
15
1
D
0
D
17
D
16
D
1
D
0
D
17
D
16
D
1
D 0
A
C
C
C
C
C
C
B
B
B
B
A
A
A
Figure 36. Chain Mode with Busy Indicator Serial Interface Timing
Rev. B | Page 24 of 28
AD7986
APPLICATION HINTS
The AD7986 voltage reference input, REF, has a dynamic input
impedance and should be decoupled with minimal parasitic induc-
tances. This is done by placing the reference decoupling ceramic
capacitor close to, ideally right up against, the REF and REFGND
pins and connecting them with wide, low impedance traces.
LAYOUT
The printed circuit board (PCB) that houses the AD7986 should
be designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7986, with its analog signals on the left side and its digital
signals on the right side, eases this task.
Finally, the power supplies, VDD and VIO of the AD7986,
should be decoupled with ceramic capacitors, typically 100 nF,
placed close to the AD7986 and connected using short, wide
traces to provide low impedance paths and to reduce the effect
of glitches on the power supply lines.
Avoid running digital lines under the device because these couple
noise onto the die, unless a ground plane under the AD7986 is
used as a shield. Fast switching signals, such as CNV or clocks,
should not run near analog signal paths. Crossover of digital
and analog signals should be avoided.
EVALUATING THE AD7986 PERFORMANCE
At least one ground plane should be used. It can be common or
split between the digital and analog sections. In the latter case,
the planes should be joined underneath the AD7986 devices.
The evaluation board package for the AD7986 (EVAL-AD7986EB)
includes a fully assembled and tested evaluation board and soft-
ware for controlling the board from a PC via the converter
evaluation and development board, EVAL-CED1Z.
Rev. B | Page 25 of 28
AD7986
BVDD
AVDD
REF
REF
REF
PADDLE
1
2
GND
GND
GND
GND
3
4
DVDD
5
6
GND
GND
GND
VIO
Figure 37. Example Layout of the AD7986 (Top Layer)
5V
EXTERNAL
REFERENCE
BVDD
AVDD CAVDD
CBVDD
(ADR435 OR ADR445)
REF
REF
REF
GND
CREF
GND
GND
CDVDD
DVDD
GND GND
GND GND GND
VIO
VIO
CVIO
Figure 38. Example Layout of the AD7986 (Bottom Layer)
Rev. B | Page 26 of 28
AD7986
OUTLINE DIMENSIONS
0.60 MAX
4.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
15
16
20
1
5
0.50
BSC
2.65
2.50 SQ
2.35
PIN 1
INDICATOR
3.75
BSC SQ
EXPOSED
PAD
(BOTTOM VIEW)
10
11
6
0.50
0.40
0.30
0.25 MIN
TOP VIEW
0.80 MAX
0.65 TYP
12° MAX
1.00
0.85
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SECTION OF THIS DATA SHEET.
0.30
0.23
0.18
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Package Ordering
Model1, 2, 3
Temperature Range Package Description
Option
Quantity
AD7986BCPZ
AD7986BCPZ-RL7 −40°C to +85°C
EVAL-AD7986EBZ
−40°C to +85°C
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Tray
CP-20-4
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7”Tape and Reel CP-20-4
Evaluation Board
490
1,500
EVAL-CED1Z
Converter Evaluation and Development Board
1 Z = RoHS Compliant Part.
2 The EVAL-AD7986EBZ can be used as a standalone evaluation board or in conjunction with the EVAL-CED1Z for evaluation/demonstration purposes.
3 The EVAL-CED1Z allows a PC to control and communicate with all Analog Devices evaluation boards ending in the EB designator.
Rev. B | Page 27 of 28
AD7986
NOTES
©2009–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07956-0-3/11(B)
Rev. B | Page 28 of 28
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