ZXMS6003TA [ZETEX]
Transistor;
| 型号： | ZXMS6003TA |
| 厂家： | 
ZETEX SEMICONDUCTORS |
| 描述： | Transistor |
| 文件： | 总10页 (文件大小：500K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZXMS6003G
60V N-channel self protected enhancement mode
IntelliFETTM MOSFET with programmable current limit
Summary
Continuous drain source voltage
On-state resistance
V
= 60V
DS
500m⍀
1.4A
Nominal load current (V = 5V)
IN
Clamping energy
550mJ
Description
Self protected low side MOSFET. Monolithic
over temperature, over current, over voltage
(active clamp) and ESD protected logic level
functionality. Intended as a general purpose
S
Status
IN
D
switch,
with
status
indication
and
Rprog
programmable current limit.
Top view
Note: Rprog must be connected between the
Status and IN pins
Features
•
Current limit programmable via external
resistor
•
•
•
Over-current protection
Input Protection (ESD)
•
•
•
•
Status pin (analog status indication)
Short circuit protection with auto restart
Over voltage protection (active clamp)
Thermal shutdown with auto restart
Load dump protection (actively protects
load)
•
•
Logic Level Input
High continuous current rating
Ordering information
Device
Part mark Reel size Tape width Quantity
(inches)
(mm)
per reel
ZXMS6003TA
ZXMS6003
7
12
1,000
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ZXMS6003G
Functional block diagram
Status /
current limit
D
Over voltage
protection
IN
Over current
protection
Human body
Logic
ESD protection
Over temperature
protection
S
Applications and information
•
•
•
•
•
•
Especially suited for loads with a high in-rush current such as lamps and motors.
All types of resistive, inductive and capacitive loads in switching applications.
C compatible power switch for 12V and 24V DC applications.
Automotive rated.
Replaces electromechanical relays and discrete circuits.
Linear mode capability - the current-limiting protection circuitry is designed to de-activate at
low V , in order not to compromise the load current during normal operation. The design
DS
max. DC operating current is therefore determined by the thermal capability of the package/
board combination, rather than by the protection circuitry.
Note: This does not compromise the product's ability to self-protect during short-circuit load
conditions.
•
•
Status pin voltage reflects the gate drive being applied internally to the power MOSFET.
With V = 5V:
IN
Status voltage ~ 5V indicates normal operation.
Status voltage ~ (2-3)V indicates that the device is in current-limiting mode.
Status voltage < 1V indicates that the device is in thermal shutdown.
The current limit is programmable via an external resistor Rprog connected between Status
and IN pins:
Rprog vs Current Limit
10
1
Vin=5V
Vin=10V
0.1
0.01
0
20
40
60
80
100
Rprog (KΩ)
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ZXMS6003G
Absolute maximum ratings
Parameter
Symbol
Limit
Unit
Continuous drain-source voltage
V
60
V
DS
(a)
(a)
V
V
36
20
V
V
Drain-source voltage for short circuit protection V =5V
DS(SC)
DS(SC)
IN
Drain-source voltage for short circuit protection V =10V
IN
Continuous input voltage
Peak input voltage
V
V
-0.2 ... +10
-0.2 ... +20
-40 to +150
-55 to +150
2.5
V
V
IN
IN
Operating temperature range
Storage temperature range
(a)
T ,
°C
°C
W
j
T
stg
P
Power dissipation @ T
=25°C
D
amb
(b)
I
I
1.6
1.4
A
A
Continuous drain current @ V =10V; T
=25°C
D
IN
amb
(b)
Continuous drain current @ V =5V; T
=25°C
D
IN
amb
(b)
I
I
3
8
A
A
Continuous source current (body diode)
S
(c)
Pulsed source current (body diode)
S
Unclamped single pulse inductive energy
Load dump protection
E
550
80
mJ
V
AS
LoadDump
V
Electrostatic discharge (human body model)
V
4000
V
ESD
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
E
40/150/56
Thermal resistance
Parameter
Symbol
Limit
Unit
Junction to ambient
R
50
°C/W
⍜JA
⍜JA
Junction to ambient
R
28
°C/W
NOTES:
(a) For ID(LIM) < 1.2A (see safe operating area curve).
(b)For a device surface mounted on 50mm x 50mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight
copper.
(c) For a device surface mounted on FR4 board and measured at t<=10s.
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ZXMS6003G
Characteristics
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ZXMS6003G
Electrical characteristics (at T
= 25°C unless otherwise stated)
amb
Parameter
Symbol
Min
Typ
Max
Unit Conditions
Static Characteristics
Drain-source clamp voltage
V
60
70
0.1
3
75
3
V
A
A
V
I =10mA
D
DS(AZ)
Off state drain current
Off state drain current
I
I
V
V
V
=12V, V =0V
IN
DSS
DS
DS
DS
15
=32V, V =0V
DSS
IN
(*)
V
1
2.1
0.7
1.5
4
=V , I =1mA
Input threshold voltage
IN(th)
GS
D
Input current
Input current
Input current
I
I
I
1.2
2.7
7
mA V =+5V
IN
IN
mA V =+7V
IN
IN
IN
mA V =+10V
IN
Static drain-source on-state
resistance
R
R
I
520
675
m⍀ V =5V, I =0.2A
IN D
DS(on)
Static drain-source on-state
resistance
385
0.3
500
0.4
m⍀ V =10V, I =0.5A
IN D
DS(on)
(†)
0.2
0.7
A
A
V =5V, Vds=10V
Rprog=20k
Current limit
D(LIM)
IN
(†)
I
0.9
1.2
V =10V, Vds=10V,
Current limit
D(LIM)
IN
Rprog=20k
Dynamic characteristics
Turn-on time (V to 90% I )
t
t
3.0
13
8
10
20
20
10
s
s
Rprog=20k, R =22⍀,
L
IN
D
on
V =0 to 10V,
IN
V
=12V
DD
Turn-off time (V to 90% I )
Rprog=20k, R =22⍀,
L
IN
D
off
V =10V to 0V,
IN
V
=12V
DD
Slew rate on (70 to 50% V ) -dV /dt
V/s Rprog=20k, R =22⍀,
L
DD
DS
on
V =0 to 10V,
IN
V
=12V
DD
Slew rate off (50 to 70% V ) DV /dt
3.2
V/s Rprog=20k, R =22⍀,
L
DD
DS
on
V =10V to 0V,
IN
V
=12V
DD
NOTES:
(*) Protection features may operate outside spec for VIN<4.5V
(†) The drain current is limited to a reduced value when Vds exceeds a safe level.
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ZXMS6003G
Electrical characteristics (at T
= 25°C unless otherwise stated) (cont.)
amb
Parameter
Symbol
Min
Typ
Max
Unit Conditions
(‡)
Protection functions
Required input voltage for
over temperature protection
V
4.5
V
PROT
Thermal overload trip
temperature
T
150
175
1
°C
JT
Thermal hysteresis
°C
Unclamped single pulse
inductive energy
E
E
550
200
mJ
I
V
)=0.7A,
D(ISO
AS
=32V
DD
T =25°C
j
Unclamped single pulse
inductive energy
mJ
I
V
)=0.7A,
D(ISO
AS
=32V
DD
T =150°C
j
Status flag
Over temperature active
1
V
V >4V
IN
Over current active
pin tracks internal gate
voltage
Inverse diode
Source drain voltage
V
1
V
V =0V, -I =1.4A
IN D
SD
NOTES:
(‡) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
datasheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed
for continuous, repetitive operation.
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ZXMS6003G
Typical characteristics
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ZXMS6003G
Intentionally left blank
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ZXMS6003G
Package outline - SOT223
DIM
Millimeters
Min Max
Inches
Min
DIM
Millimeters
Min Max
Inches
Max
0.071
0.004
0.033
0.122
0.013
0.264
Min
0.0905 BSC
0.181 BSC
Max
A
A1
b
-
1.80
0.10
0.84
3.10
0.33
6.70
-
e
e1
E
2.30 BSC
4.60 BSC
0.02
0.66
2.90
0.23
6.30
0.0008
0.026
0.114
0.009
0.248
6.70
7.30
0.264
0.287
b2
C
E1
L
3.30
0.90
-
3.70
0.130
0.355
-
0.146
-
-
-
-
D
-
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 1 - February 2007
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ZXMS6003G
Definitions
Product change
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.
Applications disclaimer
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,
opportunity or consequential loss in the use of these circuit applications, under any circumstances.
Life support
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labelling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or to affect its safety or effectiveness.
Reproduction
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the
company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a
representation relating to the products or services concerned.
Terms and Conditions
All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two
when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.
Quality of product
Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our
regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.
ESD (Electrostatic discharge)
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.
Devices suspected of being affected should be replaced.
Green compliance
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding
regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to
reduce the use of hazardous substances and/or emissions.
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with
WEEE and ELV directives.
Product status key:
“Preview”
“Active”
Future device intended for production at some point. Samples may be available
Product status recommended for new designs
“Last time buy (LTB)”
Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs” Device is still in production to support existing designs and production
“Obsolete”
Production has been discontinued
Datasheet status key:
“Draft version”
This term denotes a very early datasheet version and contains highly provisional information, which
may change in any manner without notice.
“Provisional version”
“Issue”
This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.
However, changes to the test conditions and specifications may occur, at any time and without notice.
This term denotes an issued datasheet containing finalized specifications. However, changes to
specifications may occur, at any time and without notice.
Zetex sales offices
Europe
Americas
Asia Pacific
Corporate Headquarters
Zetex GmbH
Kustermann-park
Balanstraße 59
D-81541 München
Germany
Zetex Inc
Zetex (Asia Ltd)
Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
United Kingdom
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Telephone: (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
© 2007 Published by Zetex Semiconductors plc
Issue 1 - February 2007
© Zetex Semiconductors plc 2007
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相关型号：
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DIODES
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