X24320V14T1 [XICOR]

EEPROM, 4KX8, Serial, CMOS, PDSO14, PLASTIC, TSSOP-14;
X24320V14T1
型号: X24320V14T1
厂家: XICOR INC.    XICOR INC.
描述:

EEPROM, 4KX8, Serial, CMOS, PDSO14, PLASTIC, TSSOP-14

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路
文件: 总18页 (文件大小:266K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
32K  
4Kx 8 Bit  
X24320  
400KHz 2-Wire Serial E2PROM with Block Lock™  
DESCRIPTION  
FEATURES  
• Save Critical Data with Programmable Block  
Lock Protection  
The X24320 is a CMOS Serial E2PROM, internally  
organized 4K x 8.The device features a serial interface  
and software protocol allowing operation on a simple  
two wire bus. The bus operates at 400 KHz all the way  
down to 1.8V.  
—Block lock (0, 1/4, 1/2, or all of E2PROM array)  
—Software write protection  
—Programmable hardware write protect  
• In Circuit Programmable ROM Mode  
• 400KHz 2-Wire Serial Interface  
—Schmitt trigger input noise suppression  
—Output slope control for ground bounce noise  
elimination  
• Longer Battery Life With Lower Power  
—Active read current less than 1mA  
—Active write current less than 3mA  
—Standby current less than 1µA  
• 1.8V to 3.6V, 2.5V to 5.5V and 4.5V to 5.5V Power  
Supply Versions  
Three device select inputs (S –S ) allow up to eight  
0
2
devices to share a common two wire bus.  
A Write Protect Register at the highest address location,  
FFFFh, provides three write protection features: Software  
Write Protect, Block Lock Protect, and Programmable  
Hardware Write Protect. The Software Write Protect  
feature prevents any nonvolatile writes to the device  
until the WEL bit in the Write Protect Register is set.  
The Block Lock Protection feature gives the user four  
array block protect options, set by programming two bits  
in the Write Protect Register. The Programmable Hard-  
ware Write Protect feature allows the user to install the  
• 32 Word Page Write Mode  
—Minimizes total write time per word  
• Internally Organized 4K x 8  
• Bidirectional Data Transfer Protocol  
• Self-Timed Write Cycle  
Typical write cycle time of 5ms  
• High Reliability  
—Endurance: 1 million cycles  
—Data retention: 100 years  
• 8-Lead SOIC  
device with WP tied to V , write to and Block Lock the  
CC  
desired portions of the memory array in circuit, and then  
enable the In Circuit Programmable ROM Mode by pro-  
gramming the WPEN bit HIGH in the Write Protect Reg-  
ister. After this, the Block Locked portions of the array,  
including the Write Protect Register itself, are perma-  
nently protected from being erased.  
Xicor E2PROMs are designed and tested for applica-  
tions requiring extended endurance. Inherent data  
retention is greater than 100 years.  
• 14-Lead TSSOP  
—8-Lead PDIP  
BLOCK DIAGRAM  
Data Register  
Serial E2PROM Data  
and Address (SDA)  
Y Decode Logic  
Serial E2PROM  
Command  
SCL  
Decode  
and  
Array  
Page  
Decode  
Logic  
4K x 8  
Control  
Logic  
1K x 8  
1K x 8  
Block Lock and  
Write Protect  
Control Logic  
S
S
S
2
1
0
Device  
Select  
Logic  
Write  
Protect  
Register  
2K x 8  
Write Voltage  
Control  
WP  
Xicor, Inc. 2000 Patents Pending  
7035-1.2 10/27/00 EP  
Characteristics subject to change without notice. 1 of 18  
X24320  
PIN DESCRIPTIONS  
Serial Clock (SCL)  
PIN CONFIGURATION  
8-Lead DIP/SOIC  
The SCL input is used to clock all data into and out of  
the device.  
S
0
1
2
8
7
V
CC  
S
S
1
2
WP  
Serial Data (SDA)  
X24320  
3
4
6
5
SCL  
SDA  
SDA is a bidirectional pin used to transfer data into and  
out of the device. It is an open drain output and may be  
wire-ORed with any number of open drain or open col-  
lector outputs.  
V
SS  
14-Lead TSSOP  
An open drain output requires the use of a pull-up  
resistor. For selecting typical values, refer to the Pull-up  
resistor selection graph at the end of this data sheet.  
S
0
14  
1
V
CC  
S
1
13  
12  
11  
2
WP  
NC  
NC  
NC  
NC  
NC  
3
4
Device Select (S , S , S )  
0
1
2
X24320  
The device select inputs (S , S , S ) are used to set  
0
1
2
the first three bits of the 8-bit slave address. This  
allows up to eight devices to share a common bus.  
These inputs can be static or actively driven. If used  
10  
9
5
6
NC  
S
2
SCL  
SDA  
V
SS  
7
8
statically they must be tied to V or V  
as appropri-  
SS  
CC  
ate. If actively driven, they must be driven with CMOS  
levels (driven to V or V ).  
CC  
SS  
DEVICE OPERATION  
The device supports a bidirectional bus oriented proto-  
col. The protocol defines any device that sends data  
onto the bus as a transmitter, and the receiving device  
as the receiver. The device controlling the transfer is a  
master and the device being controlled is the slave.  
The master will always initiate data transfers, and pro-  
vide the clock for both transmit and receive operations.  
Therefore, the device will be considered a slave in all  
applications.  
Write Protect (WP)  
The Write Protect input controls the Hardware Write  
Protect feature. When held LOW, Hardware Write Pro-  
tection is disabled. When this input is held HIGH, and  
the WPEN bit in the Write Protect Register is set HIGH,  
the Write Protect Register is protected, preventing  
changes to the Block Lock Protection and WPEN bits.  
PIN NAMES  
Symbol  
Description  
Device Select Inputs  
Serial Data  
Clock and Data Conventions  
Data states on the SDA line can change only during  
SCL LOW. SDA state changes during SCL HIGH are  
reserved for indicating start and stop conditions. Refer  
to Figures 1 and 2.  
S , S , S  
0
1
2
SDA  
SCL  
WP  
Serial Clock  
Write Protect  
Ground  
Start Condition  
V
SS  
All commands are preceded by the start condition,  
which is a HIGH to LOW transition of SDA when SCL is  
HIGH. The device continuously monitors the SDA and  
SCL lines for the start condition and will not respond to  
any command until this condition has been met.  
V
Supply Voltage  
No Connect  
CC  
NC  
Characteristics subject to change without notice. 2 of 18  
X24320  
Figure 1. Data Validity  
SCL  
SDA  
Data Stable  
Data  
Change  
Figure 2. Definition of Start and Stop  
SCL  
SDA  
START Bit  
STOP Bit  
Stop Condition  
The device will respond with an acknowledge after rec-  
ognition of a start condition and its slave address. If  
both the device and a write operation have been  
selected, the device will respond with an acknowledge  
after the receipt of each subsequent 8-bit word.  
All communications must be terminated by a stop con-  
dition, which is a LOW to HIGH transition of SDA when  
SCL is HIGH. The stop condition is also used to place  
the device into the standby power mode after a read  
sequence. A stop condition can only be issued after  
the transmitting device has released the bus.  
In the read mode the device will transmit eight bits of  
data, release the SDA line and monitor the line for an  
acknowledge. If an acknowledge is detected and no  
stop condition is generated by the master, the device  
will continue to transmit data. If an acknowledge is not  
detected, the device will terminate further data trans-  
missions. The master must then issue a stop condition  
to return the device to the standby power mode and  
place the device into a known state.  
Acknowledge  
Acknowledge is a software convention used to indicate  
successful data transfer. The transmitting device, either  
master or slave, will release the bus after transmitting  
eight bits. During the ninth clock cycle the receiver will  
pull the SDA line LOW to acknowledge that it received  
the eight bits of data. Refer to Figure 3.  
Figure 3. Acknowledge Response From Receiver  
SCL From  
Master  
1
8
9
Data Output  
From Transmitter  
Data Output  
From Receiver  
START  
Acknowledge  
Characteristics subject to change without notice. 3 of 18  
X24320  
DEVICE ADDRESSING  
Figure 4. Device Addressing  
Following a start condition, the master must output the  
address of the slave it is accessing.The first four bits of  
the Slave Address Byte are the device type identifier  
bits. These must equal “1010”. The next 3 bits are the  
device select bits S , S , and S . This allows up to 8  
Device Type  
Identifier  
Device  
Select  
1
0
1
0
S
2
S
1
S
R/W  
0
0
1
2
devices to share a single bus.These bits are compared  
SLAVE ADDRESS BYTE  
to the S , S , and S device select input pins. The last  
0
1
2
bit of the Slave Address Byte defines the operation to  
be performed. When the R/W bit is a one, then a read  
operation is selected. When it is zero then a write oper-  
ation is selected. Refer to figure 4. After loading the  
Slave Address Byte from the SDA bus, the device com-  
pares the device type bits with the value “1010” and the  
device select bits with the status of the device select  
input pins. If the compare is not successful, no  
acknowledge is output during the ninth clock cycle and  
the device returns to the standby mode.  
High Order Word Address  
0 A11 A10 A9 A8  
0
0
0
X24320 WORD ADDRESS BYTE 1  
Low Order Address  
The word address is either supplied by the master or  
obtained from an internal counter, depending on the  
operation. The master must supply the two Word  
Address Bytes as shown in Figure 4.  
A7  
A6  
A4 A3  
A2 A1  
A0  
A5  
WORD ADDRESS BYTE 0  
The internal organization of the E2 array is 128 pages  
by 32 bytes per page. The page address is partially  
contained in the Word Address Byte 1 and partially in  
bits 7 through 5 of the Word Address Byte 0. The byte  
address is contained in bits 4 through 0 of the Word  
Address Byte 0. See Figure 4.  
D7 D6 D5  
D4 D3  
D2 D1 D0  
DATA BYTE  
Characteristics subject to change without notice. 4 of 18  
X24320  
WRITE OPERATIONS  
Byte Write  
operation after the first data word is transferred, the  
master can transmit up to thirty-one more words. The  
device will respond with an acknowledge after the  
receipt of each word, and then the byte address is  
internally incremented by one. The page address  
remains constant. When the counter reaches the end  
of the page, it “rolls over” and goes back to the first  
byte of the current page. This means that the master  
can write 32 words to the page beginning at any byte. If  
the master begins writing at byte 16, and loads 32  
words, then the first 16 words are written to bytes 16  
through 31, and the last 16 words are written to bytes 0  
through 15. Afterwards, the address counter would  
point to byte 16. If the master writes more than 32  
words, then the previously loaded data is overwritten  
by the new data, one byte at a time.  
For a write operation, the device requires the Slave  
Address Byte, the Word Address Byte 1, and the Word  
Address Byte 0, which gives the master access to any  
one of the words in the array. Upon receipt of the Word  
Address Byte 0, the device responds with an acknowl-  
edge, and waits for the first eight bits of data. After  
receiving the 8 bits of the data byte, the device again  
responds with an acknowledge. The master then termi-  
nates the transfer by generating a stop condition, at  
which time the device begins the internal write cycle to  
the nonvolatile memory. While the internal write cycle  
is in progress the device inputs are disabled and the  
device will not respond to any requests from the  
master. The SDA pin is at high impedance. See  
Figure 5.  
The master terminates the data byte loading by issuing  
a stop condition, which causes the device to begin the  
nonvolatile write cycle. As with the byte write opera-  
tion, all inputs are disabled until completion of the  
internal write cycle. Refer to Figure 6 for the address,  
acknowledge, and data transfer sequence.  
Page Write  
The device is capable of a thirty-two byte page write  
operation. It is initiated in the same manner as the byte  
write operation; but instead of terminating the write  
Figure 5. Byte Write Sequence  
S
S
T
A
R
T
Word Address  
Byte 1  
Word Address  
Byte 0  
Signals From  
The Master  
Slave  
Address  
T
O
P
Data  
SDA Bus  
S 1 0 1 0  
0
P
A
C
K
A
C
K
A
C
K
A
C
K
Signals From  
The Slave  
Figure 6. Page Write Sequence  
(0 n 31)  
S
T
A
R
T
Word Address  
Byte 1  
Word Address  
Byte 0  
Data  
(0)  
Data  
(n)  
Signals From  
The Master  
Slave  
Address  
S
T
O
P
SDA Bus  
1 0 1 0  
S
0
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Signals From  
The Slave  
Characteristics subject to change without notice. 5 of 18  
X24320  
Acknowledge Polling  
READ OPERATIONS  
The maximum write cycle time can be significantly  
reduced using Acknowledge Polling. To initiate  
Acknowledge Polling, the master issues a start condi-  
tion followed by the Slave Address Byte for a write or  
read operation. If the device is still busy with the inter-  
nal write cycle, then no ACK will be returned. If the  
device has completed the internal write operation, an  
ACK will be returned and the host can then proceed  
with the read or write operation. Refer to Figure 7.  
Read operations are initiated in the same manner as  
write operations with the exception that the R/W bit of  
the Slave Address Byte is set to one. There are three  
basic read operations: Current Address Reads, Ran-  
dom Reads, and Sequential Reads.  
Current Address Read  
Internally, the device contains an address counter that  
maintains the address of the last word read or written  
incremented by one. After a read operation from the  
last address in the array, the counter will “roll over” to  
the first address in the array. After a write operation to  
the last address in a given page, the counter will “roll  
over” to the first address on the same page.  
Figure 7. Acknowledge Polling Sequence  
Byte Load Completed  
By Issuing STOP  
Enter ACK Polling  
Upon receipt of the Slave Address Byte with the R/W  
bit set to one, the device issues an acknowledge and  
then transmits the eight bits of the Data Byte. The mas-  
ter terminates the read operation when it does not  
respond with an acknowledge during the ninth clock  
and then issues a stop condition. Refer to figure 8 for  
the address, acknowledge, and data transfer  
sequence.  
Issue  
START  
Issue Slave  
Address Byte  
Issue STOP  
(Read or Write)  
It should be noted that the ninth clock cycle of the read  
operation is not a “don’t care.” To terminate a read  
operation, the master must either issue a stop condi-  
tion during the ninth cycle or hold SDA HIGH during  
the ninth clock cycle and then issue a stop condition.  
ACK  
Returned?  
NO  
YES  
Figure 8. Current Address Read Sequence  
HIGH  
Voltage  
Cycle Complete.  
Continue  
S
NO  
Signals From  
The Master  
T
A
R
T
S
T
O
P
Slave  
Address  
Sequence?  
SDA Bus  
S 1 0 1 0  
1
P
YES  
A
C
K
Signals From  
The Slave  
Data  
Continue Normal  
Read or Write  
Command Sequence  
Issue STOP  
PROCEED  
Characteristics subject to change without notice. 6 of 18  
X24320  
Random Read  
The next Current Address Read operation will read  
from the newly loaded address.  
Random read operation allows the master to access  
any memory location in the array. Prior to issuing the  
Slave Address Byte with the R/W bit set to one, the  
master must first perform a “Dummy” write operation.  
The master issues the start condition and the Slave  
Address Byte with the R/W bit low, receives an  
acknowledge, then issues the Word Address Byte 1,  
receives another acknowledge, then issues the Word  
Address Byte 0. After the device acknowledges receipt  
of the Word Address Byte 0, the master issues another  
start condition and the Slave Address Byte with the R/W  
bit set to one. This is followed by an acknowledge and  
then eight bits of data from the device. The master ter-  
minates the read operation by not responding with an  
acknowledge and then issuing a stop condition. Refer  
to figure 9 for the address, acknowledge, and data  
transfer sequence.  
Sequential Read  
Sequential reads can be initiated as either a current  
address read or random read. The first Data Byte is  
transmitted as with the other modes; however, the  
master now responds with an acknowledge, indicating  
it requires additional data. The device continues to out-  
put data for each acknowledge received. The master  
terminates the read operation by not responding with  
an acknowledge and then issuing a stop condition.  
The data output is sequential, with the data from  
address n followed by the data from address n + 1. The  
address counter for read operations increments  
through all byte addresses, allowing the entire memory  
contents to be read during one operation. At the end of  
the address space the counter “rolls over” to address  
0000h and the device continues to output data for each  
acknowledge received. Refer to Figure 10 for the  
acknowledge and data transfer sequence.  
The device will perform a similar operation called “Set  
Current Address” if a stop is issued instead of the sec-  
ond start shown in Figure 9. The device will go into  
standby mode after the stop and all bus activity will be  
ignored until a start is detected. The effect of this oper-  
ation is that the new address is loaded into the address  
counter, but no data is output by the device.  
Figure 9. Random Read Sequence  
S
S
T
A
R
T
A
R
Signals From  
The Master  
Word Address  
Byte 1  
Words Address  
Byte 0  
Slave  
Address  
S
T
O
P
Slave  
Address  
T
T
SDA Bus  
1
S 1 0 1 0  
0
S
P
A
C
K
A
C
K
A
C
K
A
C
K
Signals From  
The Slave  
Data  
Figure 10. Sequential Read Sequence  
Slave  
Address  
A
C
K
A
C
K
A
C
K
S
T
O
P
Signals From  
The Master  
SDA Bus  
1
P
A
C
K
Signals From  
The Slave  
Data  
(1)  
Data  
(2)  
Data  
(n–1)  
Data  
(n)  
(n is any integer greater than 1)  
Characteristics subject to change without notice. 7 of 18  
X24320  
WRITE PROTECT REGISTER (WPR)  
Writing to the Write Protect Register  
WPEN: Write Protect Enable Bit (Nonvolatile)  
The Write Protect (WP) pin and the Write Protect  
Enable (WPEN) bit in the Write Protect Register control  
the Programmable Hardware Write Protection feature.  
Hardware Write Protection is enabled when the WP pin  
is HIGH and the WPEN bit is HIGH, and disabled when  
either the WP pin is LOW or the WPEN bit is LOW. Fig-  
ure 12 defines the write protect status for each combi-  
nation of WPEN and WP. When the chip is Hardware  
Write Protected, nonvolatile writes are disabled to the  
Write Protect Register, including the Block Lock Pro-  
tect bits and the WPEN bit itself, as well as to the Block  
Lock protected sections in the memory array. Only the  
sections of the memory array that are not Block Lock  
protected, and the volatile bits WEL and RWEL, can be  
written.  
The Write Protect Register can only be modified by  
performing a “Byte Write” operation directly to the  
address FFFFh as described below.  
The Data Byte must contain zeroes where indicated in  
the procedural descriptions below; otherwise the oper-  
ation will not be performed. Only one Data Byte is  
allowed for each register write operation. The part will  
not acknowledge any data bytes after the first byte is  
entered. The user then has to issue a stop to initiate  
the nonvolatile write cycle that writes BL0, BL1, and  
WPEN to the nonvolatile bits. A stop must also be  
issued after volatile register write operations to put the  
device into Standby.  
In Circuit Programmable ROM Mode  
The state of the Write Protect Register can be read by  
performing a random byte read at FFFFh at any time.  
The part will reset itself after the first byte is read. The  
master should supply a stop condition to be consistent  
with the protocol, but a stop is not required to end this  
operation. After the read, the address counter contains  
0000h.  
Note that when the WPEN bit is write protected, it can-  
not be changed back to a LOW state; so write protec-  
tion is enabled as long as the WP pin is held HIGH.  
Thus an In Circuit Programmable ROM function can be  
implemented by hardwiring the WP pin to V , writing  
to and Block Locking the desired portion of the array to  
be ROM, and then programming the WPEN bit HIGH.  
CC  
Write Protect Register: WPR (ADDR = FFFF )  
h
Unused Bit Positions  
7
6
5
4
3
2
1
0
Bits 0, 5 & 6 are not used. All writes to the WPR must  
have zeros in these bit positions. The data byte output  
during a WPR read will contain zeros in these bits.  
WPEN  
0
0
BL1 BL0  
RWEL WEL  
0
WEL: Write Enable Latch (Volatile)  
0 = Write Enable Latch reset, writes disabled.  
Writing to the WEL and RWEL Bits  
WEL and RWEL are volatile latches that power up in  
the LOW (disabled) state. While the WEL bit is LOW,  
writes to any address other than FFFFh will be ignored  
(no acknowledge will be issued after the Data Byte).  
The WEL bit is set by writing 00000010 to address  
FFFFh. Once set, WEL remains HIGH until either it is  
reset to 0 (by writing 00000000 to FFFFh) or until the  
part powers up again. Writes to WEL and RWEL do not  
cause a nonvolatile write cycle, so the device is ready for  
the next operation immediately after the stop condition.  
1 = Write Enable Latch set, writes enabled.  
RWEL: Register Write Enable Latch (Volatile)  
0 = Register Write Enable Latch reset, writes to the  
Write Protect Register disabled.  
1 = Register Write Enable Latch set, writes to the  
Write Protect Register enabled.  
BL0, BL1: Block Lock Protect Bits (Nonvolatile)  
The Block Lock Protect Bits, BL0 and BL1, determine  
which blocks of the array are protected. A write to a  
protected block of memory is ignored, but will receive  
an acknowledge. The master must issue a stop to put  
the part into standby, just as it would for a valid write;  
but the stop will not initiate an internal nonvolatile write  
cycle. See Figure 11.  
The RWEL bit controls writes to the Block Lock Protect  
bits, BL0 and BL1, and the WPEN bit. If RWEL is 0  
then no writes can be performed on BL0, BL1, or  
WPEN. RWEL is reset when the device powers up or  
after any nonvolatile write, including writes to the Block  
Lock Protect bits, WPEN bit, or any bytes in the memory  
Characteristics subject to change without notice. 8 of 18  
X24320  
array. When RWEL is set, WEL cannot be reset, nor  
can RWEL and WEL be reset in one write operation.  
RWEL can be reset by writing 00000010 to FFFFh; but  
this is the same operation as in step 3 described  
below, and will result in programing BL0, BL1, and  
WPEN.  
RWEL is reset to zero in step 3 so that user is required  
to perform steps 2 and 3 to make another change.  
RWEL must be 0 in step 3. If the RWEL bit in the data  
byte for step 3 is a one, then no changes are made to  
the Write Protect Register and the device remains at  
step 2.  
The WP pin must be LOW or the WPEN bit must be  
LOW before a nonvolatile register write operation is ini-  
tiated. Otherwise, the write operation will abort and the  
device will go into standby mode after the master  
issues the stop condition in step 3.  
Writing to the BL and WPEN Bits  
A 3 step sequence is required to change the nonvola-  
tile Block Lock Protect or Write Protect Enable bits:  
1) Set WEL=1, Write 00000010 to address FFFFh  
(Volatile Write Cycle.)  
Step 3 is a nonvolatile write operation, requiring t  
to  
WC  
complete (acknowledge polling may be used to reduce  
this time requirement). It should be noted that step 3  
MUST end with a stop condition. If a start condition is  
issued during or at the end of step 3 (instead of a stop  
condition) the device will abort the nonvolatile register  
write and remain at step 2. If the operation is aborted  
with a start condition, the master must issue a stop to  
put the device into standby mode.  
2) Set RWEL=1, Write 00000110 to address FFFFh  
(Volatile Write Cycle.)  
3) Set BL1, BL0, and/or WPEN bits, Write u00xy010 to  
address FFFFh, where u=WPEN, x=BL1, and  
y=BL0. (Nonvolatile Write Cycle.)  
The three step sequence was created to make it diffi-  
cult to change the contents of the Write Protect Regis-  
ter accidentally. If WEL was set to one by a previous  
register write operation, the user may start at step 2.  
Block Lock Protect Bits and Protected Addresses  
BL1  
BL0  
Protected Addresses  
Array Location  
No Protect  
Upper 1/4  
0
0
1
1
0
1
0
1
None  
C00h - FFFh  
800h - FFFh  
000h - FFFh  
Upper 1/2  
Full Array  
WP Pin and WPEN Bit Functionality  
Memory Array Not  
Memory Array Block  
WP  
WPEN  
Lock Block Protected  
Lock Protected  
Block Lock Bits  
WPEN Bit  
Unprotected  
Unprotected  
Protected  
0
X
0
1
Writable  
Protected  
Unprotected  
Unprotected  
Protected  
X
Writable  
Protected  
1
Writable  
Protected  
Characteristics subject to change without notice. 9 of 18  
X24320  
ABSOLUTE MAXIMUM RATINGS  
COMMENT  
Temperature under Bias, X24320..........–65 to +135°C  
Storage temperature ...............................–6 to +150°C  
Stresses above those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device.  
This is a stress rating only and the functional operation  
of the device at these or any other conditions above  
those indicated in the operational sections of this spec-  
ification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect  
device reliability.  
Voltage on any pin with respect to V .......1V to +7V  
SS  
D.C. output current ............................................... 5mA  
Lead temperature (soldering, 10 seconds).........300°C  
RECOMMENDED OPERATING CONDITIONS  
Temperature  
Commercial  
Industrial  
Min.  
0°C  
Max.  
+70°C  
+85°C  
Supply Voltage  
X24320  
Limits  
4.5V to 5.5V  
2.5V to 5.5V  
1.8V to 3.6V  
–40°C  
X24320–2.5  
X24320–1.8  
D.C. OPERATING CHARACTERISTICS  
Limits  
Symbol  
Parameter  
Min.  
Max.  
Units  
mA  
Test Conditions  
I
I
V
V
Supply Current (Read)  
Supply Current (Write)  
1
3
SCL = V X 0.1/V X 0.9 Levels  
CC CC  
CC1  
CC2  
CC  
@ 400KHz, SDA = Open, All Other  
Inputs = V or V – 0.3V  
mA  
CC  
SS  
CC  
(1)  
I
I
V
Standby Current  
Standby Current  
5
1
µA  
µA  
SCL = SDA = V , All Other Inputs =  
CC  
SB1  
SB2  
CC  
CC  
V
or V – 0.3V, V = 5V ± 10%  
CC CC  
SS  
(1)  
V
SCL = SDA = V , All Other Inputs =  
CC  
V
or V – 0.3V, V = 2.5V  
CC CC  
SS  
I
Input Leakage Current  
Output Leakage Current  
Input LOW Voltage  
10  
10  
µA  
µA  
V
V
= V to V  
CC  
LI  
IN  
SS  
I
V
= V to V  
SS  
CC  
LO  
OUT  
(2)  
V
–0.5  
V
x 0.3  
lL  
CC  
(2)  
V
Input HIGH Voltage  
Output LOW Voltage  
V
x 0.7  
V
+ 0.5  
V
IH  
CC  
CC  
V
0.4  
V
I
= 3mA  
OL  
OL  
(3)  
hys  
V
Hysteresis of Schmitt Trigger  
Inputs  
V
x 0.05  
V
CC  
CAPACITANCE T = +25°C, f = 1MHz, V  
= 5V  
A
CC  
Symbol  
Parameter  
Max.  
Units  
pF  
Test Conditions  
(3)  
I/O  
C
Input/Output Capacitance (SDA)  
8
6
V
= 0V  
= 0V  
I/O  
(3)  
IN  
C
Input Capacitance (S , S , S , SCL, WP)  
pF  
V
IN  
0
1
2
Notes: (1) Must perform a stop command prior to measurement.  
(2) V min. and V max. are for reference only and are not 100% tested.  
IL  
IH  
(3) This parameter is periodically sampled and not 100% tested.  
Characteristics subject to change without notice. 10 of 18  
X24320  
A.C. CONDITIONS OF TEST  
EQUIVALENT A.C. LOAD CIRCUIT  
Input pulse levels  
V
x 0.1 to V x 0.9  
CC  
CC  
5V  
Input rise and fall times  
Input and output timing levels  
10ns  
V
X 0.5  
1.53KΩ  
CC  
Output  
100pF  
A.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.)  
Read & Write Cycle Limits  
Symbol  
Parameter  
Min.  
0
Max.  
Units  
KHz  
ns  
f
SCL Clock Frequency  
400  
SCL  
t
Noise Suppression Time  
50  
I
Constant at SCL, SDA Inputs  
SCL LOW to SDA Data Out Valid  
Time the Bus Must Be Free Before a New Transmission Can Start  
Start Condition Hold Time  
t
0.1  
1.2  
0.6  
1.2  
0.6  
0.6  
0
0.9  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
ns  
ns  
µs  
ns  
AA  
t
BUF  
t
t
HD:STA  
t
Clock LOW Period  
LOW  
t
Clock HIGH Period  
HIGH  
Start Condition Setup Time (for a Repeated Start Condition)  
Data In Hold Time  
SU:STA  
HD:DAT  
t
t
Data In Setup Time  
100  
SU:DAT  
t
SDA and SCL Rise Time  
300  
300  
R
t
SDA and SCL Fall Time  
F
t
Stop Condition Setup Time  
Data Out Hold Time  
0.6  
50  
SU:STO  
t
300  
DH  
(4)  
b
t
Output Fall Time  
20+0.1C  
OF  
Notes: (4) Cb = Total capacitance of one bus line in pF  
POWER-UP TIMING(5)  
Symbol  
Parameter  
Max.  
Units  
t
Power-up to Read Operation  
Power-up to Write Operation  
1
5
ms  
ms  
PUR  
t
PUW  
Notes: (5) t  
and t  
are the delays required from the time V is stable until the specified operation can be initiated. These parameters  
CC  
PUR  
PUW  
are periodically sampled and not 100% tested.  
Characteristics subject to change without notice. 11 of 18  
X24320  
Bus Timing  
t
t
t
R
t
HIGH  
LOW  
F
SCL  
t
t
t
t
SU:STO  
t
HD:STA  
HD:DAT  
SU:DAT  
SU:STA  
SDA IN  
t
t
t
BUF  
AA  
DH  
SDA OUT  
Write Cycle Limits  
Symbol  
Parameter  
Min.  
Typ.(6)  
Max.  
Units  
(7)  
WC  
t
Write Cycle Time  
5
10  
ms  
Notes: (6) Typical values are for T = 25°C and nominal supply voltage (5V).  
A
(7) t  
is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum  
WR  
time the device requires to automatically complete the internal write operation.  
The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/write  
cycle. During the write cycle, the X24320 bus interface circuits are disabled, SDA is allowed to remain HIGH, and  
the device does not respond to its slave address.  
Bus Timing  
SCL  
ACK  
SDA  
8th Bit  
Word n  
t
WC  
STOP  
Condition  
START  
Condition  
Characteristics subject to change without notice. 12 of 18  
X24320  
Guidelines for Calculating Typical Values of Bus  
Pull-Up Resistors  
Symbol Table  
WAVEFORM  
INPUTS  
OUTPUTS  
120  
Must be  
steady  
Will be  
steady  
VCC MAX  
RMIN  
=
=1.8KΩ  
IOL MIN  
100  
80  
May change  
from Low to  
High  
Will change  
from Low to  
High  
tR  
RMAX  
Max.  
=
CBUS  
May change  
from High to  
Low  
Will change  
from High to  
Low  
60  
Resistance  
40  
20  
Don’t Care:  
Changes  
Allowed  
Changing:  
State Not  
Known  
Min.  
Resistance  
N/A  
Center Line  
is High  
Impedance  
0
20  
40  
60  
80  
0
100  
120  
Bus Capacitance (Pf)  
Characteristics subject to change without notice. 13 of 18  
X24320  
PACKAGING INFORMATION  
8-Lead Plastic Dual In-Line Package Type P  
0.430 (10.92)  
0.360 (9.14)  
0.260 (6.60)  
0.240 (6.10)  
Pin 1 Index  
Pin 1  
0.060 (1.52)  
0.020 (0.51)  
0.300  
(7.62) Ref.  
Half Shoulder Width On  
All End Pins Optional  
0.145 (3.68)  
0.128 (3.25)  
Seating  
Plane  
0.025 (0.64)  
0.015 (0.38)  
0.065 (1.65)  
0.150 (3.81)  
0.125 (3.18)  
0.045 (1.14)  
0.110 (2.79)  
0.090 (2.29)  
0.020 (0.51)  
0.016 (0.41)  
0.325 (8.25)  
0.300 (7.62)  
.073 (1.84)  
Max.  
0°  
Typ. 0.010 (0.25)  
15°  
NOTE:  
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH  
Characteristics subject to change without notice. 14 of 18  
X24320  
PACKAGING INFORMATION  
8-Lead Plastic Small Outline Gull Wing Package Type S  
0.150 (3.80) 0.228 (5.80)  
0.158 (4.00) 0.244 (6.20)  
Pin 1 Index  
Pin 1  
0.014 (0.35)  
0.019 (0.49)  
0.188 (4.78)  
0.197 (5.00)  
(4X) 7°  
0.053 (1.35)  
0.069 (1.75)  
0.004 (0.19)  
0.010 (0.25)  
0.050 (1.27)  
0.010 (0.25)  
0.050"Typical  
X 45°  
0.020 (0.50)  
0.050"  
Typical  
0° - 8°  
0.0075 (0.19)  
0.010 (0.25)  
0.250"  
0.016 (0.410)  
0.037 (0.937)  
0.030"  
Typical  
8 Places  
FOOTPRINT  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
Characteristics subject to change without notice. 15 of 18  
X24320  
PACKAGING INFORMATION  
14-Lead Plastic, TSSOP, Package Type V  
.025 (.65) BSC  
.169 (4.3)  
.177 (4.5)  
.252 (6.4) BSC  
.193 (4.9)  
.200 (5.1)  
.047 (1.20)  
.0075 (.19)  
.0118 (.30)  
.002 (.05)  
.006 (.15)  
.010 (.25)  
Gage Plane  
0° - 8°  
Seating Plane  
.019 (.50)  
.029 (.75)  
Detail A (20X)  
.031 (.80)  
.041 (1.05)  
See Detail “A”  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
Characteristics subject to change without notice. 16 of 18  
X24320  
Ordering Information  
X24320  
X
X
-X  
V
Range  
Device  
CC  
Blank = 5V ±10%  
2.5 = 2.5V to 5.5V  
1.8 = 1.8V to 3.6V  
Temperature Range  
Blank = 0 to +70°C  
I = –40 to +85°C  
Package  
X24320  
S8 = 8-Lead SOIC  
V14 = 14-Lead TSSOP  
P = 8-Lead PDIP  
Characteristics subject to change without notice. 17 of 18  
X24320  
Part Mark Convention  
X24320  
X
X
Blank = 8-Lead SOIC  
V = 14-Lead TSSOP  
P = 8-Lead PDIP  
Blank = 4.5V to 5.5V, 0 to +70°C  
I = 4.5V to 5.5V, –40 to +85°C  
AE = 2.5V to 5.5V, 0 to +70°C  
AF = 2.5V to 5.5V, –40 to +85°C  
AG = 1.8V to 3.6V, 0 to +70°C  
AH = 1.8V to 3.6V, –40 to +85°C  
LIMITED WARRANTY  
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express,  
statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes  
no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and  
without notice.  
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied.  
TRADEMARK DISCLAIMER:  
Xicor and the Xicor logo are registered trademarks of Xicor, Inc. AutoStore, Direct Write, Block Lock, SerialFlash, MPS, and XDCP are also trademarks of Xicor, Inc. All  
others belong to their respective owners.  
U.S. PATENTS  
Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846;  
4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691; 5,161,137;  
5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending.  
LIFE RELATED POLICY  
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and  
correction, redundancy and back-up features to prevent such an occurence.  
Xicor’s products are not authorized for use in critical components in life support devices or systems.  
1.  
Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to  
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.  
2.  
A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
Characteristics subject to change without notice. 18 of 18  

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