VS-HFA25TB60HN3 [VISHAY]

DIODE RECTIFIER DIODE, Rectifier Diode;
VS-HFA25TB60HN3
型号: VS-HFA25TB60HN3
厂家: VISHAY    VISHAY
描述:

DIODE RECTIFIER DIODE, Rectifier Diode

超快软恢复二极管 快速软恢复二极管 局域网
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VS-HFA25TB60HN3  
Vishay Semiconductors  
www.vishay.com  
HEXFRED®  
Ultrafast Soft Recovery Diode, 25 A  
FEATURES  
• Ultrafast and ultrasoft recovery  
• Very low IRRM and Qrr  
• AEC-Q101 qualified, meets JESD 201 class 2  
whisker test  
• Material categorization:  
For definitions of compliance please see  
www.vishay.com/doc?99912  
TO-220AC  
BENEFITS  
• Reduced RFI and EMI  
Base  
cathode  
• Reduced power loss in diode and switching transistor  
• Higher frequency operation  
• Reduced snubbing  
• Reduced parts count  
1
3
DESCRIPTION  
Cathode Anode  
VS-HFA25TB60... is a state of the art ultrafast recovery  
diode. Employing the latest in epitaxial construction and  
advanced processing techniques it features a superb  
combination of characteristics which result in performance  
which is unsurpassed by any rectifier previously available.  
With basic ratings of 600 V and 25 A continuous current, the  
VS-HFA25TB60... is especially well suited for use as the  
companion diode for IGBTs and MOSFETs. In addition to  
ultrafast recovery time, the HEXFRED® product line features  
extremely low values of peak recovery current (IRRM) and  
does not exhibit any tendency to “snap-off” during the  
tb portion of recovery. The HEXFRED features combine to  
offer designers a rectifier with lower noise and significantly  
lower switching losses in both the diode and the switching  
transistor. These HEXFRED advantages can help to  
significantly reduce snubbing, component count and  
heatsink sizes. The HEXFRED VS-HFA25TB60... is ideally  
suited for applications in power supplies and power  
conversion systems (such as inverters), motor drives, and  
many other similar applications where high speed, high  
efficiency is needed.  
PRODUCT SUMMARY  
Package  
TO-220AC  
25 A  
IF(AV)  
VR  
600 V  
VF at IF  
1.7 V  
t
rr typ.  
23 ns  
TJ max.  
150 °C  
Single die  
Diode variation  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
VR  
TEST CONDITIONS  
VALUES  
UNITS  
Cathode to anode voltage  
600  
V
Maximum continuous forward current  
Single pulse forward current  
IF  
TC = 100 °C  
25  
225  
IFSM  
IFRM  
A
Maximum repetitive forward current  
100  
TC = 25 °C  
125  
Maximum power dissipation  
PD  
W
TC = 100 °C  
50  
Operating junction and storage temperature range  
TJ, TStg  
- 55 to + 150  
°C  
Revision: 28-Mar-12  
Document Number: 94412  
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-HFA25TB60HN3  
Vishay Semiconductors  
www.vishay.com  
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Cathode to anode  
breakdown voltage  
VBR  
IR = 100 μA  
600  
-
-
IF = 25 A  
IF = 50 A  
-
-
-
-
-
-
1.3  
1.5  
1.3  
1.5  
600  
55  
1.7  
2.0  
V
Maximum forward voltage  
VFM  
See fig. 1  
IF = 25 A, TJ = 125 °C  
VR = VR rated  
1.7  
20  
Maximum reverse  
leakage current  
IRM  
See fig. 2  
See fig. 3  
μA  
TJ = 125 °C, VR = 0.8 x VR rated  
VR = 200 V  
2000  
100  
Junction capacitance  
Series inductance  
CT  
LS  
pF  
Measured lead to lead 5 mm from package  
body  
-
8.0  
-
nH  
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V  
TJ = 25 °C  
MIN.  
TYP.  
23  
MAX.  
-
UNITS  
trr  
-
-
-
-
-
-
-
Reverse recovery time  
See fig. 5, 6 and 16  
trr1  
50  
75  
ns  
trr2  
TJ = 125 °C  
105  
4.5  
160  
10  
IRRM1  
IRRM2  
Qrr1  
TJ = 25 °C  
Peak recovery current  
See fig. 7 and 8  
A
IF = 25 A  
TJ = 125 °C  
TJ = 25 °C  
TJ = 125 °C  
8.0  
15  
dIF/dt = 200 A/μs  
VR = 200 V  
112  
420  
375  
1200  
Reverse recovery charge  
See fig. 9 and 10  
nC  
Qrr2  
Peak rate of fall of recovery  
current during tb  
See fig. 11 and 12  
dI(rec)M/dt1 TJ = 25 °C  
dI(rec)M/dt2 TJ = 125 °C  
-
-
250  
160  
-
-
A/μs  
THERMAL - MECHANICAL SPECIFICATIONS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Lead temperature  
Tlead  
0.063” from case (1.6 mm) for 10 s  
-
-
300  
°C  
Thermal resistance,  
junction to case  
RthJC  
RthJA  
RthCS  
-
-
-
-
-
1.0  
80  
-
Thermal resistance,  
junction to ambient  
Typical socket mount  
K/W  
Thermal resistance,  
case to heatsink  
Mounting surface, flat, smooth and greased  
0.5  
-
-
2.0  
-
-
g
Weight  
0.07  
oz.  
6.0  
(5.0)  
12  
(10)  
kgf · cm  
(lbf · in)  
Mounting torque  
Marking device  
-
Case style TO-220AC  
HFA25TB60H  
Revision: 28-Mar-12  
Document Number: 94412  
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-HFA25TB60HN3  
Vishay Semiconductors  
www.vishay.com  
1000  
10 000  
1000  
100  
TJ = 150 °C  
TJ = 125 °C  
TJ = 150 °C  
TJ = 125 °C  
TJ = 25 °C  
10  
10  
1
TJ = 25 °C  
0.1  
1
0.01  
0.6  
1.0  
1.4  
1.8  
2.2  
2.6  
0
100  
200  
300  
400  
500  
600  
VFM - Forward Voltage Drop (V)  
94065_01  
94065_02  
VR - Reverse Voltage (V)  
Fig. 1 - Maximum Forward Voltage Drop vs.  
Instantaneous Forward Current  
Fig. 2 - Typical Reverse Current vs. Reverse Voltage  
1000  
TJ = 25 °C  
100  
10  
1
10  
100  
1000  
94065_03  
VR - Reverse Voltage (V)  
Fig. 3 - Typical Junction Capacitance vs.  
Reverse Voltage  
10  
1
PDM  
t1  
D = 0.50  
D = 0.20  
D = 0.10  
D = 0.05  
D = 0.02  
t2  
0.1  
Notes:  
1. Duty factor D = t1/t2  
2. Peak TJ = PDM x ZthJC + TC  
Single pulse  
(thermal response)  
D = 0.01  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
94065_04  
t1 - Rectangular Pulse Duration (s)  
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics  
Revision: 28-Mar-12  
Document Number: 94412  
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-HFA25TB60HN3  
Vishay Semiconductors  
www.vishay.com  
140  
120  
1400  
1200  
1000  
800  
600  
400  
200  
0
VR = 200 V  
TJ = 125 °C  
TJ = 25 °C  
VR = 200 V  
TJ = 125 °C  
TJ = 25 °C  
IF = 50 A  
IF = 25 A  
IF = 10 A  
100  
IF = 50 A  
IF = 25 A  
IF = 10 A  
80  
60  
40  
20  
100  
1000  
100  
1000  
94065_05  
94065_07  
dIF/dt (A/µs)  
dIF/dt (A/µs)  
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt  
Fig. 7 - Typical Stored Charge vs. dIF/dt  
30  
10 000  
VR = 200 V  
TJ = 125 °C  
TJ = 25 °C  
VR = 200 V  
TJ = 125 °C  
TJ = 25 °C  
25  
IF = 20 A  
IF = 25 A  
IF = 10 A  
20  
IF = 50 A  
IF = 25 A  
IF = 10 A  
15  
1000  
10  
5
0
100  
100  
1000  
100  
1000  
94065_06  
dIF/dt (A/µs)  
Fig. 6 - Typical Recovery Current vs. dIF/dt  
94065_08  
dIF/dt (A/µs)  
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt  
Revision: 28-Mar-12  
Document Number: 94412  
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-HFA25TB60HN3  
Vishay Semiconductors  
www.vishay.com  
VR = 200 V  
0.01 Ω  
L = 70 μH  
D.U.T.  
D
dIF/dt  
adjust  
IRFP250  
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit  
(3)  
trr  
IF  
ta  
tb  
0
(4)  
Qrr  
(2)  
IRRM  
0.5 IRRM  
(5)  
dI(rec)M/dt  
0.75 IRRM  
dIF/dt  
(1)  
(4) Qrr - area under curve defined by trr  
(1) dIF/dt - rate of change of current  
and IRRM  
through zero crossing  
trr x IRRM  
(2) IRRM - peak reverse recovery current  
Qrr  
=
2
(3) trr - reverse recovery time measured  
from zero crossing point of negative  
going IF to point where a line passing  
through 0.75 IRRM and 0.50 IRRM  
extrapolated to zero current.  
(5) dI(rec)M/dt - peak rate of change of  
current during tb portion of trr  
Fig. 10 - Reverse Recovery Waveform and Definitions  
Revision: 28-Mar-12  
Document Number: 94412  
5
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-HFA25TB60HN3  
Vishay Semiconductors  
www.vishay.com  
ORDERING INFORMATION TABLE  
Device code  
N3  
VS- HF  
A
25  
TB  
60  
H
8
1
2
3
4
5
6
7
1
2
3
4
-
-
-
-
-
Vishay Semiconductors product  
HEXFRED® family  
Electron irradiated  
Current rating (25 = 25 A)  
Package:  
4
5
4
6
7
TB = TO-220AC  
-
-
-
Voltage rating (60 = 600 V)  
H = AEC-Q101 qualified  
Environmental digit:  
4
8
-N3 = Halogen-free, RoHS compliant, and totally lead (Pb)-free  
ORDERING INFORMATION (Example)  
PREFERRED P/N  
QUANTITY PER T/R  
MINIMUM ORDER QUANTITY  
PACKAGING DESCRIPTION  
Antistatic plastic tube  
VS-HFA25TB60HN3  
50  
1000  
LINKS TO RELATED DOCUMENTS  
Dimensions  
www.vishay.com/doc?95221  
Part marking information  
SPICE model  
www.vishay.com/doc?95068  
www.vishay.com/doc?95471  
Revision: 28-Mar-12  
Document Number: 94412  
6
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Legal Disclaimer Notice  
www.vishay.com  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical  
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements  
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular  
product with the properties described in the product specification is suitable for use in a particular application. Parameters  
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All  
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please  
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by  
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
Material Category Policy  
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the  
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council  
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment  
(EEE) - recast, unless otherwise specified as non-compliant.  
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that  
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.  
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free  
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference  
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21  
conform to JEDEC JS709A standards.  
Revision: 02-Oct-12  
Document Number: 91000  
1

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