SUD50N06-36-T4-E3 [VISHAY]

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET;
SUD50N06-36-T4-E3
型号: SUD50N06-36-T4-E3
厂家: VISHAY    VISHAY
描述:

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

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中文:  中文翻译
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New Product  
SUD50N06-36  
Vishay Siliconix  
N-Channel 60-V (D-S), 150 °C MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFET  
100 % Rg & UIS Tested  
VDS (V)  
rDS(on) (Ω)  
Qg (Typ)  
I
D (A)a  
12  
RoHS  
0.036 at VGS = 10 V  
0.042 at VGS = 4.5 V  
COMPLIANT  
60  
10.5 nC  
12  
APPLICATIONS  
LCD TV Inverter  
Push Pull Converter  
TO-252  
D
G
Drain Connected to Tab  
G
D
S
Top View  
S
Order Number:  
SUD50N06-36-E3 (Lead (Pb)-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
60  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
12a  
12a  
5.9b  
4.7b  
50  
12a  
2.0b  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
IAS  
15  
Single Pulse Avalanche Current  
Avalanche Energy  
L = 0.1 mH  
EAS  
mJ  
W
11.2  
24  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
15.3  
2.4b  
1.5b  
- 55 to 150  
Maximum Power Dissipation  
PD  
TJ, Tstg  
°C  
Operating Junction and Storage Temperature Range  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb  
Symbol  
RthJA  
Typical  
Maximum  
Unit  
Steady State  
Steady State  
43  
52  
°C/W  
RthJC  
Maximum Junction-to-Case  
4.3  
5.2  
Notes:  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
Document Number: 70437  
S-72510-Rev. A, 03-Dec-07  
www.vishay.com  
1
New Product  
SUD50N06-36  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
Static  
Drain-Source Breakdown Voltage  
VDS Temperature Coefficient  
VGS(th) Temperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
VDS  
ΔVDS/TJ  
ΔVGS(th)/TJ  
VGS(th)  
VGS = 0 V, ID = 1 mA  
ID = 250 µA  
60  
V
55  
mV/°C  
- 6.3  
VDS = VGS, ID = 250 µA  
1.0  
30  
3.0  
100  
1
V
IGSS  
VDS = 0 V, VGS  
=
20 V  
nA  
VDS = 60 V, VGS = 0 V  
VDS = 60 V, VGS = 0 V, TJ = 70 °C  
VDS 5 V, VGS = 10 V  
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
IDSS  
ID(on)  
rDS(on)  
gfs  
µA  
A
20  
VGS = 10 V, ID = 10 A  
0.028  
0.033  
20  
0.036  
0.042  
Drain-Source On-State Resistancea  
Ω
S
VGS = 4.5 V, ID = 8 A  
Forward Transconductancea  
Dynamicb  
VDS = 15 V, ID = 10 A  
Input Capacitance  
Ciss  
Coss  
Crss  
1100  
90  
55  
21  
10.5  
3.5  
4.2  
3.3  
18  
250  
35  
68  
6
Output Capacitance  
Reverse Transfer Capacitance  
VDS = 30 V, VGS = 0 V, f = 1 MHz  
VDS = 30 V, VGS = 10 V, ID = 5 A  
pF  
32  
16  
Total Gate Charge  
Qg  
nC  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
Turn-On Delay Time  
Rise Time  
Qgs  
Qgd  
Rg  
VDS = 30 V, VGS = 4.5 V, ID = 5 A  
f = 1 MHz  
6.5  
30  
Ω
td(on)  
tr  
td(off)  
tf  
td(on)  
tr  
td(off)  
tf  
400  
55  
VDD = 30 V, RL = 1 Ω  
ID 30 A, VGEN = 4.5 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
110  
12  
ns  
Turn-On Delay Time  
Rise Time  
9
18  
VDD = 30 V, RL = 1 Ω  
ID 30 A, VGEN = 10 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
19  
7
30  
14  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
Pulse Diode Forward Currenta  
Body Diode Voltage  
IS  
ISM  
VSD  
trr  
TC = 25 °C  
IS = 5.5 A  
20  
50  
1.2  
50  
50  
A
0.85  
25  
25  
19  
6
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
Notes:  
ns  
nC  
Qrr  
ta  
IF = 5.5 A, di/dt = 100 A/µs, TJ = 25 °C  
ns  
tb  
a. Pulse test; pulse width 300 µs, duty cycle 2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
www.vishay.com  
2
Document Number: 70437  
S-72510-Rev. A, 03-Dec-07  
New Product  
SUD50N06-36  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
45  
45  
36  
27  
18  
9
V
GS  
= 10 thru 5 V  
36  
27  
18  
9
4 V  
T
C
= 25 °C  
T
C
= 125 °C  
3 V  
- 55 °C  
0
0
0
1
2
3
4
5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
V
DS  
- Drain-to-Source Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
0.060  
0.055  
0.050  
0.045  
0.040  
0.035  
0.030  
0.025  
1500  
1200  
900  
600  
300  
0
C
iss  
V
GS  
= 4.5 V  
V
GS  
= 10 V  
C
oss  
C
rss  
0
9
18  
27  
36  
45  
0
10  
20  
30  
40  
50  
60  
V
DS  
- Drain-to-Source Voltage (V)  
I
D
- Drain Current (A)  
Capacitance  
On-Resistance vs. Drain Current  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
10  
8
I
D
= 10 A  
I
D
= 5 A  
V
GS  
= 10 V  
V
DS  
= 30 V  
6
V
= 4.5 V  
GS  
V
DS  
= 48 V  
4
2
0
- 50 - 25  
0
25  
50  
75  
100 125 150  
0
5
10  
15  
20  
25  
T
J
- Junction Temperature (°C)  
Q
g
- Total Gate Charge (nC)  
On-Resistance vs. Junction Temperature  
Gate Charge  
Document Number: 70437  
S-72510-Rev. A, 03-Dec-07  
www.vishay.com  
3
New Product  
SUD50N06-36  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
0.10  
100  
10  
I
D
= 10 A  
0.08  
0.06  
0.04  
0.02  
0.00  
T
J
= 150 °C  
1
T
J
= 25 °C  
125 °C  
25 °C  
0.1  
0.01  
0.001  
0
1
2
3
4
5
6
7
8
9
10  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4  
- Source-to-Drain Voltage (V)  
V
- Gate-to-Source Voltage (V)  
GS  
V
SD  
On-Resistance vs. Gate-to-Source Voltage  
Source-Drain Diode Forward Voltage  
0.5  
0.2  
80  
64  
48  
32  
16  
0
- 0.1  
- 0.4  
- 0.7  
- 1.0  
I
= 5 mA  
D
I
D
= 250 µA  
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.001  
0.01  
0.1  
1
10  
T
J
- Temperature (°C)  
Time (s)  
Single Pulse Power, Junction-to-Ambient  
Threshold Voltage  
100  
80  
64  
48  
32  
16  
0
Limited by r  
*
DS(on)  
10  
1
1 ms  
10 ms  
100 ms  
1 s  
10 s  
0.1  
DC  
T
A
= 25 °C  
Single Pulse  
0.01  
0.01  
0.001  
0.01  
0.1  
1
10  
0.1  
1
10  
100  
V
DS  
- Drain-to-Source Voltage (V)  
Time (s)  
* V  
GS  
minimum V at which r  
is specified  
GS  
DS(on)  
Single Pulse Power, Junction-to-Case  
Safe Operating Area, Junction-to-Ambient  
www.vishay.com  
4
Document Number: 70437  
S-72510-Rev. A, 03-Dec-07  
New Product  
SUD50N06-36  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
100  
7
6
4
3
1
0
Limited by r  
*
DS(on)  
10  
1
100 µs  
1 ms  
10 ms  
100 ms, 1 s  
0.1  
T
C
= 25 °C  
Single Pulse  
0.01  
0.01  
0
25  
50  
75  
100  
125  
150  
0.1  
1
10  
100  
V
- Drain-to-Source Voltage (V)  
DS  
T
A
- Ambient Temperature (°C)  
* V  
GS  
minimum V at which r  
is specified  
GS  
DS(on)  
Current Derating*, Junction-to-Ambient  
Safe Operating Area, Junction-to-Case  
21  
17  
13  
8
30  
24  
18  
12  
6
Package Limited  
4
0
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
T
C
- Case Temperature (°C)  
T
C
- Case Temperature (°C)  
Power Derating*, Junction-to-Case  
Current Derating*, Junction-to-Case  
3.0  
2.4  
1.8  
1.2  
0.6  
0.0  
* The power dissipation PD is based on TJ(max) = 175 °C, using  
junction-to-case thermal resistance, and is more useful in settling the  
upper dissipation limit for cases where additional heatsinking is  
used. It is used to determine the current rating, when this rating falls  
below the package limit.  
0
25  
50  
75  
100  
125  
150  
T
C
- Case Temperature (°C)  
Power Derating*, Junction-to-Ambient  
Document Number: 70437  
S-72510-Rev. A, 03-Dec-07  
www.vishay.com  
5
New Product  
SUD50N06-36  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
1
Duty Cycle = 0.5  
0.2  
Notes:  
0.1  
0.1  
P
DM  
t
1
0.05  
0.02  
t
2
t
t
1
1. Duty Cycle, D =  
2
2. Per Unit Base = R  
= 52 °C/W  
thJA  
(t)  
3. T - T = P  
Z
JM  
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
10  
100  
1000  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
Single Pulse  
0.02  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Case  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see http://www.vishay.com/ppg?70437.  
www.vishay.com  
6
Document Number: 70437  
S-72510-Rev. A, 03-Dec-07  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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