IRFZ48_11 [VISHAY]

Power MOSFET; 功率MOSFET
IRFZ48_11
型号: IRFZ48_11
厂家: VISHAY    VISHAY
描述:

Power MOSFET
功率MOSFET

文件: 总9页 (文件大小:1520K)
中文:  中文翻译
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IRFZ48, SiHFZ48  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
60  
Available  
• Repetitive Avalanche Rated  
• Ultra Low On-Resistance  
• Very Low Thermal Resistance  
• 175 °C Operating Temperature  
• Fast Switching  
RDS(on) (Ω)  
VGS = 10 V  
0.018  
RoHS*  
COMPLIANT  
Qg (Max.) (nC)  
110  
29  
Q
Q
gs (nC)  
gd (nC)  
36  
Configuration  
Single  
• Ease of Paralleling  
• Compliant to RoHS Directive 2002/95/EC  
D
DESCRIPTION  
TO-220AB  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The TO-220AB package is universally preferred for all  
commercial-industrial applications at power dissipation  
levels to approximately 50 W. The low thermal resistance  
and low package cost of the TO-220AB contribute to its  
wide acceptance throughout the industry.  
S
D
G
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
TO-220AB  
IRFZ48PbF  
SiHFZ48-E3  
IRFZ48  
Lead (Pb)-free  
SnPb  
SiHFZ48  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
VDS  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
60  
V
VGS  
20  
TC = 25 °C  
C = 100 °C  
50  
Continuous Drain Currente  
VGS at 10 V  
ID  
T
50  
A
Pulsed Drain Currenta  
IDM  
290  
Linear Derating Factor  
1.3  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Avalanche Currenta  
EAS  
IAR  
100  
50  
Repetitive Avalanche Energya  
EAR  
19  
mJ  
W
Maximum Power Dissipation  
T
C = 25 °C  
PD  
190  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
4.5  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d  
- 55 to + 175  
°C  
for 10 s  
6-32 or M3 screw  
300  
10  
lbf · in  
N · m  
Mounting Torque  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 22 μH, Rg = 25 Ω IAS = 72 A (see fig. 12).  
c. ISD 72 A, dI/dt 200 A/μs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case  
e. Current limited by the package, (die current = 72 A).  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91294  
S11-0518-Rev. B, 21-Mar-11  
www.vishay.com  
1
This datasheet is subject to change without notice.  
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
IRFZ48, SiHFZ48  
Vishay Siliconix  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
TYP.  
MAX.  
62  
UNIT  
Maximum Junction-to-Ambient  
Case-to-Sink, Flat, Greased Surface  
Maximum Junction-to-Case (Drain)  
RthJA  
RthCS  
RthJC  
-
0.50  
-
-
°C/W  
0.80  
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Static  
Drain-Source Breakdown Voltage  
VDS  
ΔVDS/TJ  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 μA  
Reference to 25 °C, ID = 1 mA  
VDS = VGS, ID = 250 μA  
VGS = ± ±20  
60  
-
-
-
-
V
V/°C  
V
VDS Temperature Coefficient  
0.060  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
2.0  
-
-
-
-
-
-
-
4.0  
100  
25  
nA  
VDS = 60 V, VGS = 0 V  
-
Zero Gate Voltage Drain Current  
IDSS  
μA  
V
DS = 48 V, VGS = 0 V, TJ = 150 °C  
VGS = 10 V  
ID = 43 Ab  
VDS = 25 V, ID = 43 Ab  
-
250  
0.018  
-
Drain-Source On-State Resistance  
Forward Transconductance  
Dynamic  
RDS(on)  
gfs  
-
Ω
27  
S
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Ciss  
Coss  
Crss  
Qg  
-
-
-
-
-
-
-
-
-
-
2400  
1300  
190  
-
-
-
VGS = 0 V,  
VDS = 25 V,  
pF  
f = 1.0 MHz, see fig. 5  
-
110  
29  
36  
-
ID = 72 A, VDS = 48 V,  
see fig. 6 and 13b  
Qgs  
Qgd  
td(on)  
tr  
VGS = 10 V  
-
nC  
-
8.1  
250  
210  
250  
-
V
DD = 30 V, ID = 72 A,  
ns  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
Rg = 9.1 Ω, RD = 0.34±Ω, see fig. 10b  
-
-
D
Between lead,  
Internal Drain Inductance  
LD  
LS  
-
-
4.5  
7.5  
-
-
6 mm (0.25") from  
package and center of  
die contact  
nH  
G
Internal Source Inductance  
S
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
MOSFET symbol  
showing the  
integral reverse  
p - n junction diode  
50c  
290  
D
IS  
-
-
-
-
A
G
Pulsed Diode Forward Currenta  
ISM  
S
Body Diode Voltage  
VSD  
trr  
TJ = 25 °C, IS = 72 A, VGS = 0 Vb  
-
-
-
-
2.0  
180  
0.80  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Forward Turn-On Time  
120  
0.50  
ns  
μC  
TJ = 25 °C, IF = 72 A, dI/dt = 100 A/μsb  
Qrr  
ton  
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Pulse width 300 μs; duty cycle 2 %.  
c. Current limited by the package, (die current = 72 A).  
www.vishay.com  
2
Document Number: 91294  
S11-0518-Rev. B, 21-Mar-11  
This datasheet is subject to change without notice.  
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
IRFZ48, SiHFZ48  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)  
Fig. 1 - Typical Output Characteristics, TC = 25 °C  
Fig. 3 - Typical Transfer Characteristics  
Fig. 2 - Typical Output Characteristics, TC = 175 °C  
Fig. 4 - Normalized On-Resistance vs. Temperature  
Document Number: 91294  
S11-0518-Rev. B, 21-Mar-11  
www.vishay.com  
3
This datasheet is subject to change without notice.  
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
IRFZ48, SiHFZ48  
Vishay Siliconix  
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage  
Fig. 7 - Typical Source-Drain Diode Forward Voltage  
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage  
Fig. 8 - Maximum Safe Operating Area  
www.vishay.com  
4
Document Number: 91294  
S11-0518-Rev. B, 21-Mar-11  
This datasheet is subject to change without notice.  
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
IRFZ48, SiHFZ48  
Vishay Siliconix  
RD  
VDS  
VGS  
D.U.T.  
RG  
+
V
-
DD  
10 V  
Pulse width 1 µs  
Duty factor 0.1 %  
Fig. 10a - Switching Time Test Circuit  
VDS  
90 %  
10 %  
VGS  
td(on) tr  
td(off) tf  
Fig. 9 - Maximum Drain Current vs. Case Temperature  
Fig. 10b - Switching Time Waveforms  
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case  
Document Number: 91294  
S11-0518-Rev. B, 21-Mar-11  
www.vishay.com  
5
This datasheet is subject to change without notice.  
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
IRFZ48, SiHFZ48  
Vishay Siliconix  
L
VDS  
Vary tp to obtain  
required IAS  
VDS  
tp  
VDD  
D.U.T.  
RG  
+
-
VDD  
VDS  
IAS  
10 V  
0.01 Ω  
tp  
IAS  
Fig. 12a - Unclamped Inductive Test Circuit  
Fig. 12b - Unclamped Inductive Waveforms  
Fig. 12c - Maximum Avalanche Energy vs. Drain Current  
Current regulator  
Same type as D.U.T.  
50 kΩ  
QG  
10 V  
12 V  
0.2 µF  
0.3 µF  
+
-
QGS  
QGD  
VDS  
D.U.T.  
VG  
VGS  
3 mA  
Charge  
IG  
ID  
Current sampling resistors  
Fig. 13b - Gate Charge Test Circuit  
Fig. 13a - Basic Gate Charge Waveform  
www.vishay.com  
6
Document Number: 91294  
S11-0518-Rev. B, 21-Mar-11  
This datasheet is subject to change without notice.  
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
IRFZ48, SiHFZ48  
Vishay Siliconix  
Peak Diode Recovery dV/dt Test Circuit  
+
Circuit layout considerations  
Low stray inductance  
Ground plane  
D.U.T.  
Low leakage inductance  
current transformer  
-
+
-
-
+
Rg  
dV/dt controlled by Rg  
+
Driver same type as D.U.T.  
ISD controlled by duty factor “D”  
D.U.T. - device under test  
VDD  
-
Driver gate drive  
P.W.  
P.W.  
D =  
Period  
Period  
V
GS = 10 Va  
D.U.T. lSD waveform  
D.U.T. VDS waveform  
Reverse  
recovery  
current  
Body diode forward  
current  
dI/dt  
Diode recovery  
dV/dt  
VDD  
Re-applied  
voltage  
Body diode forward drop  
Inductor current  
ISD  
Ripple 5 %  
Note  
a. VGS = 5 V for logic level devices  
Fig. 14 - For N-Channel  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see www.vishay.com/ppg?91294.  
Document Number: 91294  
S11-0518-Rev. B, 21-Mar-11  
www.vishay.com  
7
This datasheet is subject to change without notice.  
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Package Information  
Vishay Siliconix  
TO-220AB  
A
MILLIMETERS  
MIN.  
INCHES  
MAX.  
E
DIM.  
A
MAX.  
4.65  
1.01  
1.73  
0.61  
15.49  
10.51  
2.67  
5.28  
1.40  
6.48  
2.92  
14.02  
3.82  
3.94  
3.00  
MIN.  
0.167  
0.027  
0.047  
0.014  
0.585  
0.395  
0.095  
0.192  
0.045  
0.240  
0.095  
0.526  
0.131  
0.139  
0.102  
F
4.25  
0.69  
1.20  
0.36  
14.85  
10.04  
2.41  
4.88  
1.14  
6.09  
2.41  
13.35  
3.32  
3.54  
2.60  
0.183  
0.040  
0.068  
0.024  
0.610  
0.414  
0.105  
0.208  
0.055  
0.255  
0.115  
0.552  
0.150  
0.155  
0.118  
Ø P  
b
b(1)  
c
D
E
e
e(1)  
F
H(1)  
J(1)  
L
1
3
2
L(1)  
Ø P  
Q
* M  
ECN: X10-0416-Rev. M, 01-Nov-10  
DWG: 5471  
b(1)  
Note  
* M = 1.32 mm to 1.62 mm (dimension including protrusion)  
Heatsink hole for HVM  
C
b
e
J(1)  
e(1)  
Document Number: 71195  
Revison: 01-Nov-10  
www.vishay.com  
1
Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical  
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements  
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular  
product with the properties described in the product specification is suitable for use in a particular application. Parameters  
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All  
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree  
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and  
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay  
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to  
obtain written terms and conditions regarding products designed for such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by  
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 11-Mar-11  
www.vishay.com  
1

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