IRFZ48RS [VISHAY]

Power MOSFET; 功率MOSFET
IRFZ48RS
型号: IRFZ48RS
厂家: VISHAY    VISHAY
描述:

Power MOSFET
功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
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IRFZ48RS, IRFZ48RL, SiHFZ48RS, SiHFZ48RL  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Advanced Process Technology  
PRODUCT SUMMARY  
VDS (V)  
60  
Available  
• Dynamic dV/dt  
RDS(on) (Ω)  
VGS = 10 V  
0.018  
RoHS*  
• 175 °C Operating Temperature  
• Fast Switching  
COMPLIANT  
Qg (Max.) (nC)  
110  
29  
Q
Q
gs (nC)  
gd (nC)  
• Fully Avalanche Rated  
36  
• Drop in Replacement of the IRFZ48/SiHFZ48 for  
Linear/Audio Applications  
Configuration  
Single  
• Lead (Pb)-free Available  
D
D2PAK (TO-263)  
I2PAK (TO-262)  
DESCRIPTION  
Advanced Power MOSFETs from Vishay utilize advanced  
processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
The D2PAK is a surface mount power package capable of  
accommodating die sizes up to HEX-4. It provides the  
highest power capability and the lowest possible  
on-resistance in any existing surface mount package. The  
D2PAK is suitable for high current applications because of its  
low internal connection resistance and can dissipate up to  
2 W in a typical surface mount application.  
G
G
D
S
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
IRFZ48RSPbF  
SiHFZ48RS-E3  
IRFZ48RS  
I2PAK (TO-262)  
IRFZ48RLPbF  
Lead (Pb)-free  
SnPb  
SiHFZ48RL-E3  
-
-
SiHFZ48RS  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
60  
20  
V
VGS  
TC = 25 °C  
TC =100°C  
50  
Continuous Drain Currente  
VGS at 10 V  
ID  
50  
A
Pulsed Drain Currenta, e  
IDM  
290  
Linear Derating Factor  
1.3  
W/°C  
mJ  
Single Pulse Avalanche Energyb, e  
Maximum Power Dissipation  
EAS  
PD  
100  
T
C = 25 °C  
190  
W
Peak Diode Recovery dV/dtc, e  
dV/dt  
TJ, Tstg  
4.5  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d  
- 55 to + 175  
300d  
°C  
for 10 s  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91296  
S-Pending-Rev. A, 22-Jul-08  
www.vishay.com  
1
WORK-IN-PROGRESS  
IRFZ48RS, IRFZ48RL, SiHFZ48RS, SiHFZ48RL  
Vishay Siliconix  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
10  
UNIT  
lbf · in  
N · m  
Mounting Torque  
6-32 or M3 screw  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, Starting TJ = 25 °C, L = 22 µH, RG = 25 Ω, IAS = 72 A (see fig. 12).  
c. ISD 72 A, dI/dt 200 A/µs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. Current limited by the package, (Die Current = 72 A).  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
TYP.  
MAX.  
62  
UNIT  
Maximum Junction-to-Ambient  
Case-to-Sink, Flat, Greased Surface  
Maximum Junction-to-Case (Drain)  
RthJA  
-
0.50  
-
RthCS  
-
°C/W  
RthJC  
0.8  
SPECIFICATIONS TJ = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Static  
Drain-Source Breakdown Voltage  
VDS  
ΔVDS/TJ  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
Reference to 25 °C, ID = 1 mAc  
VDS = VGS, ID = 250 µA  
60  
-
-
-
V
V/°C  
V
V
DS Temperature Coefficient  
-
2.0  
-
0.60  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
-
-
-
-
-
-
4.0  
100  
25  
VGS  
VDS = 60 V, VGS = 0 V  
DS = 48 V, VGS = 0 V, TJ = 150 °C  
VGS = 10 V  
ID = 43 Ab  
VDS = 25 V, ID = 43 Ab  
=
20 V  
nA  
-
Zero Gate Voltage Drain Current  
IDSS  
µA  
V
-
250  
0.018  
-
Drain-Source On-State Resistance  
Forward Transconductance  
Dynamic  
RDS(on)  
gfs  
-
Ω
27  
S
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Ciss  
Coss  
Crss  
Qg  
-
-
-
-
-
-
-
-
-
-
2400  
1300  
190  
-
-
VGS = 0 V,  
DS = 25 V,  
f = 1.0 MHz, see fig. 5c  
V
-
pF  
nC  
-
110  
29  
36  
-
ID = 72 A, VDS = 48 V,  
see fig. 6 and 13b, c  
Qgs  
Qgd  
td(on)  
tr  
VGS = 10 V  
-
-
8.1  
250  
210  
250  
-
V
DD = 30 V, ID = 72 A,  
ns  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
R
G = 9.1 Ω, RD = 0.34 Ω, see fig. 10b, c  
-
-
D
Between lead,  
Internal Drain Inductance  
Internal Source Inductance  
LD  
LS  
-
-
4.5  
7.5  
-
-
6 mm (0.25") from  
package and center of  
die contact  
nH  
G
S
www.vishay.com  
2
Document Number: 91296  
S-Pending-Rev. A, 22-Jul-08  
IRFZ48RS, IRFZ48RL, SiHFZ48RS, SiHFZ48RL  
Vishay Siliconix  
SPECIFICATIONS TJ = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Drain-Source Body Diode Characteristics  
D
MOSFET symbol  
showing the  
integral reverse  
p - n junction diode  
Continuous Source-Drain Diode Current  
Pulsed Diode Forward Currenta  
IS  
-
-
-
-
50c  
A
G
ISM  
290  
S
Body Diode Voltage  
VSD  
trr  
TJ = 25 °C, IS = 72 A, VGS = 0 Vb  
-
-
-
-
2.0  
180  
0.80  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Forward Turn-On Time  
120  
0.50  
ns  
µC  
TJ = 25 °C, IF = 72 A, dI/dt = 100 A/µsb, c  
Qrr  
ton  
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Pulse width 300 µs; duty cycle 2 %.  
c. Current limited by the package, (Die Current = 72 A).  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
Fig. 1 - Typical Output Characteristics  
Fig. 2 - Typical Output Characteristics  
Document Number: 91296  
S-Pending-Rev. A, 22-Jul-08  
www.vishay.com  
3
IRFZ48RS, IRFZ48RL, SiHFZ48RS, SiHFZ48RL  
Vishay Siliconix  
Fig. 3 - Typical Transfer Characteristics  
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
72A  
I =  
D
V
=10V  
GS  
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
°
T , Junction Temperature ( C)  
J
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage  
Fig. 4 - Normalized On-Resistance vs. Temperature  
www.vishay.com  
4
Document Number: 91296  
S-Pending-Rev. A, 22-Jul-08  
IRFZ48RS, IRFZ48RL, SiHFZ48RS, SiHFZ48RL  
Vishay Siliconix  
80  
LIMITED BY PACKAGE  
60  
40  
20  
0
25  
50  
75  
100  
125  
150  
175  
°
T , Case Temperature( C)  
C
Fig. 9 - Maximum Drain Current vs. Case Temperature  
Fig. 7 - Typical Source-Drain Diode Forward Voltage  
RD  
1000  
VDS  
OPERATION IN THIS AREA LIMITED  
BY R  
VGS  
DS(on)  
D.U.T.  
10us  
RG  
+
V
-
DD  
100  
100us  
10 V  
Pulse width 1 µs  
Duty factor 0.1 %  
1ms  
Fig. 10a - Switching Time Test Circuit  
10  
10ms  
VDS  
90 %  
°
T = 25 C  
J
C
°
T = 175 C  
Single Pulse  
1
0.1  
1
10  
100  
1000  
10 %  
VGS  
V
, Drain-to-Source Voltage (V)  
DS  
Fig. 8 - Maximum Safe Operating Area  
td(on) tr  
td(off) tf  
Fig. 10b - Switching Time Waveforms  
Document Number: 91296  
S-Pending-Rev. A, 22-Jul-08  
www.vishay.com  
5
IRFZ48RS, IRFZ48RL, SiHFZ48RS, SiHFZ48RL  
Vishay Siliconix  
1
D = 0.50  
0.20  
0.1  
0.10  
0.05  
P
2
DM  
t
1
0.02  
0.01  
t
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D = t / t  
1
2. Peak T =P  
J
x Z  
+ T  
C
DM  
thJC  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t , Rectangular Pulse Duration (sec)  
1
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case  
VDS  
15 V  
tp  
Driver  
L
VDS  
D.U.T.  
IAS  
RG  
+
-
V
A
DD  
IAS  
20 V  
0.01 Ω  
tp  
Fig. 12a - Unclamped Inductive Test Circuit  
Fig. 12b - Unclamped Inductive Waveforms  
250  
I
D
TOP  
29A  
51A  
200  
150  
100  
50  
BOTTOM 72A  
0
25  
50  
75  
100  
125  
150  
175  
°
Starting T , Junction Temperature ( C)  
J
Fig. 12c - Maximum Avalanche Energy vs. Drain Current  
www.vishay.com  
6
Document Number: 91296  
S-Pending-Rev. A, 22-Jul-08  
IRFZ48RS, IRFZ48RL, SiHFZ48RS, SiHFZ48RL  
Vishay Siliconix  
Current regulator  
Same type as D.U.T.  
50 kΩ  
QG  
10 V  
12 V  
0.2 µF  
0.3 µF  
QGS  
QGD  
+
-
VDS  
D.U.T.  
VG  
VGS  
3 mA  
Charge  
IG  
ID  
Current sampling resistors  
Fig. 13a - Maximum Avalanche Energy vs. Drain Current  
Fig. 13b - Gate Charge Test Circuit  
Peak Diode Recovery dV/dt Test Circuit  
+
-
Circuit layout considerations  
D.U.T.  
Low stray inductance  
Ground plane  
Low leakage inductance  
current transformer  
+
-
-
+
RG  
dV/dt controlled by RG  
+
Driver same type as D.U.T.  
ISD controlled by duty factor "D"  
D.U.T. - device under test  
VDD  
-
Driver gate drive  
P.W.  
P.W.  
D =  
Period  
Period  
V
= 10 V*  
GS  
D.U.T. I waveform  
SD  
Reverse  
recovery  
current  
Body diode forward  
current  
dI/dt  
D.U.T. V waveform  
DS  
Diode recovery  
dV/dt  
V
DD  
Re-applied  
voltage  
Body diode forward drop  
Ripple 5 %  
Inductor current  
I
SD  
* VGS = 5 V for logic level devices  
Fig. 14 - For N-Channel  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see http://www.vishay.com/ppg?91296.  
Document Number: 91296  
S-Pending-Rev. A, 22-Jul-08  
www.vishay.com  
7
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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