10-EY122PA008ME-LU38F08T [VINCOTECH]

High Blocking Voltage with low drain source on state resistance;High speed SiC-MOSFET technology;Resistant to Latch-up;
10-EY122PA008ME-LU38F08T
型号: 10-EY122PA008ME-LU38F08T
厂家: VINCOTECH    VINCOTECH
描述:

High Blocking Voltage with low drain source on state resistance;High speed SiC-MOSFET technology;Resistant to Latch-up

文件: 总16页 (文件大小:6945K)
中文:  中文翻译
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10-EY122PA008ME-LU38F08T  
datasheet  
flowDual E2 SiC  
1200 V / 8 mΩ  
Features  
flow E2 12 mm housing  
● C3M™ SiC MOSFET technology  
● Standard industrial housing  
● Low inductive design  
● Optimized Rth(j-s) with Phase Change Material  
● Built-in NTC  
Schematic  
Target applications  
● Charging Stations  
● Energy Storage Systems  
● Power Supply  
● Solar Inverters  
● Welding & Cutting  
Types  
● 10-EY122PA008ME-LU38F08T  
Copyright Vincotech  
1
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Half-Bridge Switch  
VDSS  
Drain-source voltage  
1200  
148  
V
A
ID  
Drain current (DC current)  
Peak drain current  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IDM  
tp limited by Tjmax  
Tj = Tjmax  
480  
A
Ptot  
Total power dissipation  
260  
W
-4 / 15  
-8 / 19  
175  
VGSS  
Gate-source voltage  
V
dynamic  
Tjmax  
Maximum Junction Temperature  
°C  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching  
condition  
-40…+(Tjmax - 25)  
Isolation Properties  
Isolation voltage  
Isolation voltage  
Creepage distance  
Clearance  
Visol  
Visol  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
>12,7  
9,34  
V
tp = 1 min  
V
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
≥ 600  
Copyright Vincotech  
2
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Half-Bridge Switch  
Static  
25  
5,6  
1,8  
9
10,4(1)  
rDS(on)  
Drain-source on-state resistance  
15  
160  
125  
150  
11  
12  
mΩ  
VGS(th)  
IGSS  
IDSS  
rg  
Gate-source threshold voltage  
Gate to Source Leakage Current  
Zero Gate Voltage Drain Current  
Internal gate resistance  
Gate charge  
0
0,046  
25  
25  
25  
2,5  
40  
3,6  
1000  
76  
V
15  
0
0
nA  
µA  
1200  
4
0,425  
472  
13428  
516  
32  
Qg  
-4/15  
800  
160  
25  
25  
25  
nC  
Ciss  
Coss  
Crss  
VSD  
Short-circuit input capacitance  
Short-circuit output capacitance  
Reverse transfer capacitance  
Diode forward voltage  
f = 100 kHz  
0
0
1000  
0
pF  
V
80  
4,6  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
0,37  
K/W  
Copyright Vincotech  
3
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Dynamic  
25  
74,24  
65,6  
td(on)  
Turn-on delay time  
125  
150  
25  
ns  
ns  
64,64  
40  
tr  
td(off)  
tf  
Rise time  
125  
150  
25  
34,56  
33,92  
162,24  
179,52  
184,64  
16,92  
17,26  
17,77  
5,64  
Rgon = 8 Ω  
Rgoff = 8 Ω  
Turn-off delay time  
125  
150  
25  
ns  
Fall time  
125  
150  
25  
ns  
QrFWD=0,828 µC  
QrFWD=2,16 µC  
QrFWD=2,64 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
Peak recovery current  
Reverse recovery time  
Recovered charge  
125  
150  
25  
5,67  
mWs  
mWs  
A
5,78  
3,06  
Eoff  
-4/15  
600  
160  
125  
150  
25  
2,99  
3
48,54  
82,05  
94,28  
22,84  
45,41  
45,5  
IRRM  
125  
150  
25  
trr  
125  
150  
25  
ns  
0,828  
2,16  
di/dt=4859 A/µs  
di/dt=5582 A/µs  
di/dt=5668 A/µs  
Qr  
125  
150  
25  
μC  
2,64  
0,188  
0,536  
0,679  
5861  
4376  
4597  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
4
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Thermistor  
Static  
R
ΔR/R  
P
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
25  
5
kΩ  
%
R100 = 493 Ω  
100  
-5  
5
245  
1,4  
mW  
mW/K  
K
d
25  
B(25/50)  
Tol. ±2 %  
Tol. ±2 %  
3375  
3437  
B(25/100)  
B-value  
K
Vincotech Thermistor Reference  
K
(1)  
Value at chip level  
(2)  
Only valid with pre-applied Vincotech thermal interface material.  
Copyright Vincotech  
5
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Half-Bridge Switch Characteristics  
figure 1.  
MOSFET  
figure 2.  
MOSFET  
Typical output characteristics  
Typical output characteristics  
ID = f(VDS  
)
ID = f(VDS)  
300  
300  
250  
200  
150  
100  
50  
VGS  
:
-4 V  
-2 V  
0 V  
250  
200  
150  
100  
50  
2 V  
4 V  
6 V  
8 V  
10 V  
12 V  
14 V  
16 V  
18 V  
20 V  
0
-50  
-100  
-150  
-200  
-250  
-300  
0
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
4,5  
DS(V)  
-10,0 -7,5  
-5,0 -2,5  
0,0  
2,5  
5,0  
7,5  
10,0 12,5  
V
VDS(V)  
tp  
=
tp  
=
250  
14  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGS  
=
Tj =  
125 °C  
150 °C  
Tj:  
VGS from -4 V to 20 V in steps of 2 V  
figure 3.  
MOSFET  
figure 4.  
MOSFET  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
ID = f(VGS  
)
Zth(j-s) = f(tp)  
0
350  
10  
300  
250  
200  
150  
100  
50  
-1  
10  
-2  
10  
0,5  
0,2  
-3  
10  
0,1  
0,05  
0,02  
0,01  
0,005  
0
-4  
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
10  
0
2
4
6
8
10  
10  
V
GS(V)  
tp(s)  
tp  
=
=
250  
10  
μs  
V
D =  
tp / T  
0,366  
25 °C  
VDS  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
MOSFET thermal model values  
R (K/W)  
τ (s)  
3,20E-02  
5,74E-02  
1,72E-01  
7,47E-02  
2,94E-02  
3,90E+00  
6,37E-01  
6,78E-02  
1,17E-02  
1,26E-03  
Copyright Vincotech  
6
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Thermistor Characteristics  
figure 5.  
Thermistor  
Typical NTC characteristic as function of temperature  
RT = f(T)  
6000  
5000  
4000  
3000  
2000  
1000  
0
20  
40  
60  
80  
100  
120  
140  
T(°C)  
Copyright Vincotech  
7
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Half-Bridge Switching Characteristics  
figure 6.  
MOSFET  
figure 7.  
MOSFET  
Typical switching energy losses as a function of drain current  
Typical switching energy losses as a function of gate resistor  
E = f(ID)  
E = f(Rg)  
12,5  
10,0  
7,5  
12,5  
10,0  
7,5  
Eon  
Eon  
Eon  
Eon  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
5,0  
5,0  
2,5  
2,5  
0,0  
0,0  
0,0  
0
50  
100  
150  
200  
250  
300  
350  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-4/15  
8
V
125 °C  
150 °C  
600  
-4/15  
160  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
V
A
Rgon  
Rgoff  
Ω
Ω
8
figure 8.  
MOSFET  
figure 9.  
MOSFET  
Typical reverse recovered energy loss as a function of drain current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(ID)  
Erec = f(Rg)  
1,2  
1,0  
0,8  
0,6  
0,4  
0,2  
0,0  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
50  
100  
150  
200  
250  
300  
350  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-4/15  
8
V
V
Ω
125 °C  
150 °C  
600  
-4/15  
160  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Rgon  
Copyright Vincotech  
8
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Half-Bridge Switching Characteristics  
figure 10.  
MOSFET  
figure 11.  
MOSFET  
Typical switching times as a function of drain current  
Typical switching times as a function of gate resistor  
t = f(ID)  
t = f(Rg)  
0
10  
0
10  
td(off)  
td(off)  
td(on)  
tr  
-1  
10  
-1  
10  
td(on)  
tr  
tf  
tf  
-2  
10  
-2  
10  
0
50  
100  
150  
200  
250  
300  
350  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
600  
-4/15  
8
°C  
150  
600  
°C  
VDS  
=
=
=
=
VDS  
=
=
=
V
V
Ω
Ω
V
V
A
VGS  
Rgon  
Rgoff  
VGS  
ID  
-4/15  
160  
8
figure 12.  
MOSFET  
figure 13.  
MOSFET  
Typical reverse recovery time as a function of drain current  
Typical reverse recovery time as a function of turn on gate resistor  
trr = f(ID)  
trr = f(Rgon)  
0,07  
0,06  
0,05  
0,04  
0,03  
0,02  
0,01  
0,00  
0,09  
0,08  
0,07  
0,06  
0,05  
0,04  
0,03  
0,02  
0,01  
0,00  
trr  
trr  
trr  
trr  
trr  
trr  
0
50  
100  
150  
200  
250  
300  
350  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-4/15  
8
V
At  
600  
-4/15  
160  
V
25 °C  
25 °C  
V
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Ω
Copyright Vincotech  
9
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Half-Bridge Switching Characteristics  
figure 14.  
MOSFET  
figure 15.  
MOSFET  
Typical recovered charge as a function of drain current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(ID)  
Qr = f(Rgon)  
4,5  
4,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
4,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
50  
100  
150  
200  
250  
300  
350  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-4/15  
8
V
V
Ω
At  
600  
-4/15  
160  
V
25 °C  
25 °C  
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
figure 16.  
MOSFET  
figure 17.  
MOSFET  
Typical peak reverse recovery current as a function of drain current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(ID)  
IRM = f(Rgon)  
150  
125  
100  
75  
300  
250  
200  
150  
100  
50  
IRM  
IRM  
IRM  
50  
IRM  
IRM  
IRM  
25  
0
0
0,0  
0
50  
100  
150  
200  
250  
300  
350  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-4/15  
8
V
At  
600  
-4/15  
160  
V
25 °C  
25 °C  
V
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Ω
Copyright Vincotech  
10  
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Half-Bridge Switching Characteristics  
figure 18.  
MOSFET  
figure 19.  
MOSFET  
Typical rate of fall of forward and reverse recovery current as a function of drain current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(ID)  
diF/dt, dirr/dt = f(Rgon)  
9000  
60000  
50000  
40000  
30000  
20000  
10000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
8000  
dirr/dt ──────  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
0
50  
100  
150  
200  
250  
300  
350  
ID(A)  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
R
gon(Ω)  
VDS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-4/15  
8
V
V
At  
600  
V
V
A
25 °C  
25 °C  
VGS  
125 °C  
150 °C  
-4/15  
160  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Ω
figure 20.  
MOSFET  
Reverse bias safe operating area  
ID = f(VDS  
)
350  
ID MAX  
300  
250  
200  
150  
100  
50  
0
0
250  
500  
750  
1000  
1250  
1500  
V
DS(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
8
8
Ω
Copyright Vincotech  
11  
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Half-Bridge Switching Definitions  
figure 21.  
MOSFET  
figure 22.  
MOSFET  
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon  
)
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
figure 23.  
MOSFET  
figure 24.  
MOSFET  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
ID  
IC  
VCE  
tr  
VDS  
tf  
Copyright Vincotech  
12  
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Half-Bridge Switching Definitions  
figure 25.  
FWD  
figure 26.  
FWD  
Turn-off Switching Waveforms & definition of ttrr  
Turn-on Switching Waveforms & definition of tQrr (tQrr = integrating time for Qrr)  
Qr  
IF  
IF  
fitted  
VF  
figure 27.  
FWD  
Turn-on Switching Waveforms & definition of tErec (tErec = integrating time for Erec  
)
%
Erec  
tErec  
Prec  
3.01  
3.1  
3.19  
3.28  
3.37  
3.46  
t (µs)  
Copyright Vincotech  
13  
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Ordering Code  
Marking  
Version  
Ordering Code  
Without thermal paste  
With thermal paste  
10-EY122PA008ME-LU38F08T  
10-EY122PA008ME-LU38F08T-/3/  
Name  
Date code  
UL & VIN  
Lot  
Serial  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
Outline  
Pin table [mm]  
Pin  
1
X
Y
Function  
Ph1  
25,6  
28,8  
32  
48  
48  
2
Ph1  
3
48  
Ph1  
4
28,8  
32  
44,8  
44,8  
35,2  
35,2  
28,8  
25,6  
12,8  
12,8  
3,2  
3,2  
0
Ph1  
5
Ph1  
6
28,8  
32  
S11  
7
G11  
Therm1  
Therm2  
S11  
8
32  
9
32  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
28,8  
32  
G11  
Ph1  
28,8  
32  
Ph1  
32  
Ph1  
28,8  
25,6  
19,2  
16  
0
Ph1  
0
Ph1  
6,4  
9,6  
16  
DC-  
DC-  
16  
DC-  
16  
19,2  
19,2  
28,8  
28,8  
41,6  
48  
DC-  
19,2  
16  
DC-  
DC-  
19,2  
19,2  
12,8  
9,6  
6,4  
3,2  
6,4  
3,2  
12,8  
9,6  
0
DC-  
DC-  
DC+  
DC+  
DC+  
DC+  
DC+  
DC+  
DC+  
DC+  
S12  
48  
35,2  
35,2  
12,8  
12,8  
0
0
0
0
3,2  
44,8  
48  
G12  
G12  
S12  
0
0
Copyright Vincotech  
14  
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Pinout  
25-32  
DC+  
T12  
T11  
G12  
34,35  
S12  
33,36  
Ph1  
1-5,12-16  
G11  
7,11  
S11  
6,10  
Rt  
DC-  
17-24  
Therm1  
8
Therm2  
9
Identification  
Component  
Voltage  
Current  
Function  
Comment  
ID  
T11, T12  
Rt  
MOSFET  
1200 V  
8 mΩ  
Half-Bridge Switch  
Thermistor  
Thermistor  
Copyright Vincotech  
15  
22 Dec. 2020 / Revision 1  
10-EY122PA008ME-LU38F08T  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 100  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow E2 packages see vincotech.com website.  
Package data  
Package data for flow E2 packages see vincotech.com website.  
Vincotech thermistor reference  
See Vincotech thermistor reference table at vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
10-EY122PA008ME-LU38F08T-D1-14  
22 Dec. 2020  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
16  
22 Dec. 2020 / Revision 1  

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