UESD6V8L5B [UNIONSEMI]
Low Capacitance TVS Diode Array for ESD Protection;型号: | UESD6V8L5B |
厂家: | Union Semiconductor, Inc. |
描述: | Low Capacitance TVS Diode Array for ESD Protection 电视 |
文件: | 总9页 (文件大小:319K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Low Capacitance TVS Diode Array for ESD Protection
UESD6V8L4A SC70-5/SC88A/SOT353
UESD6V8L4B SC89-5/SOT553/SOT665
UESD6V8L5A6 SC70-6/SC88/SOT363
UESD6V8L5B SC89-6/SOT563/SOT666
General Description
The UESD6V8Lxx of TVS diode array is designed to protect sensitive electronics from damage
or latch-up due to ESD, for use in applications where board space is at a premium. It is
unidirectional device and may be used on lines where the signal polarities are above ground.
UESD6V8L4A and UESD6V8L4B protect up to four lines while UESD6V8L5A6 and
UESD6V8L5B will protect up to five lines. TVS diodes are solid-state devices feature large
cross-sectional area junctions for conducting high transient currents, specifically for transient
suppression. It offers desirable characteristics for board level protection including fast response
time, low operating, low clamping voltage, and no device degradation. The UESD6V8Lxx may be
used to meet the immunity requirements of IEC 61000-4-2, level 4. The small package makes
them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and
digital cameras. The UESD6V8Lxx is fabricated using dual diffusion technology, offer low
junction capacitance (20pF), which is required in high speed signal protection application.
.
Applications
Features
Transient Protection for Data Lines to IEC
61000-4-2 (ESD) ±15kV (Air), ±8kV
(Contact)
Ultra-Small Package
Working Voltages: 5V
Low Leakage Current
Low Clamping Voltage
Solid-State Silicon Avalanche Technology
Cellular Handsets & Accessories
Cordless Phones
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Ordering Information
Working
Voltage
Marking
Code
Part Number
Packaging Type
Channel
Shipping Qty
UESD6V8L4A
UESD6V8L4B
UESD6V8L5A6
UESD6V8L5B
SC70-5/SC88A/SOT353
SC89-5/SOT553/SOT665
SC70-6/SC88/SOT363
SC89-6/SOT563/SOT666
UKA
4
USB
U6A
UB
3000pcs/7Inch
Tape & Reel
5.0V
5
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014 1/9
Pin Configurations
1
2
3
6
5
4
1
2
3
5
4
1
2
3
6
5
4
1
2
3
5
4
UESD6V8L4B
SC89-5/SOT553/SOT665
UESD6V8L5B
SC89-6/SOT563/SOT666
UESD6V8L4A
SC70-5/SC88A/SOT353
UESD6V8L5A6
SC70-6/SC88/SOT363
Top View
M: Month Code
UESD6V8L5B
SC89-6/SOT563/SOT666
M: Month Code
UESD6V8L4A
SC70-5/SC88A/SOT353
M: Month Code
UESD6V8L4B
SC89-5/SOT553/SOT665
M: Month Code
UESD6V8L5A6
SC70-6/SC88/SOT363
Absolute Maximum Ratings
Rating
Symbol
Value
Unit
Watts
°C
Peak Pulse Power (tp = 8/20μs)
Lead Soldering Temperature
Operating Temperature
Storage Temperature
PPK
55
TL
TJ
260(10 sec.)
-55 to +125
-55 to +125
°C
TSTG
°C
Maximum Junction Temperature
TJMAX
150
°C
Electrical Characteristics
Parameter
Symbol
VRWM
VBR
Conditions
Min Typ Max Unit
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
5
V
V
It = 1mA
6
6.8
7.2
IR
VRWM = 5V, T=25°C
IPP =1A, tp = 8/20μs
IPP =2A, tp = 8/20μs
IPP =5A, tp = 8/20μs
0.005 0.1
μA
6
8
Clamping Voltage
VC
V
10.8
Pin 1,3,4,5,6 to 2
VR = 0V, f = 1MHz
Pin 1,3,4,5,6 to 2
Junction Capacitance
Junction Capacitance
CJ
CJ
20
12
25
17
pF
pF
VR = 2.5V, f = 1MHz
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014 2/9
Typical Operating Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Clamping Voltage vs. Peak Pulse Current
10
11
10
9
1
8
0.1
Waveform
parameters:
tr=8uS
7
td=20uS
6
0.01
0.1
0
1
2
3
4
5
1
10
100
1000
Peak Pulse Current - Ipp (A)
Pulse Duration - tp(uS)
Forward Voltage vs. Forward Current
Junction Capacitance vs. Reverse Voltage
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
25
20
15
10
5
0
1
2
3
4
5
6
0
0
1
2
3
4
5
Forward Current-If(A)
Revers Voltage-Vr(V)
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014 3/9
Application Information
UESD6V8Lxx can use as unidirectional lines or bidirectional lines protector. For example,
UESD6V8L4B can use as a four unidirectional lines protector, and also can use as a three
bidirectional lines protector (as figure1 shows). For bidirectional applications, the junction
capacitance between I/O ports and ground is half of the single TVS’s junction capacitance, that is
to say the typical value of the junction capacitance between I/O ports and ground is 6pF. The
break down voltage of these two series connection TVS is a forwards voltage (about 0.7V) higher
than a single TVS’s.
PIN1
PIN3
PIN4
NC
PIN2
PIN5
Figure1: UESD6V8L4B use as three bidirectional lines protector
Circuit Board Layout Recommendations for Suppression of ESD
Good circuit board layout is critical for the suppression of ESD induced transients. The following
guidelines are recommended:
1. Place the TVS near the input terminals or connectors to restrict transient coupling.
2. Minimize the path length between the TVS and the protected line.
3. Minimize all conductive loops including power and ground loops.
4. The ESD transient return path to ground should be kept as short as possible.
5. Never run critical signals near board edges.
6. Use ground planes whenever possible. For multilayer printed-circuit boards, use ground
vias.
7. Keep parallel signal paths to a minimum.
8. Avoid running protection conductors in parallel with unprotected conductor.
9. Minimize all printed-circuit board conductive loops including power and ground loops.
10. Avoid using shared transient return paths to a common ground point.
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014
4/9
Package Information
UESD6V8L4A SC70-5/SC88A/SOT353
Outline Drawing
DIMENSIONS
MILLIMETERS
INCHES
Min
D
Symbol
e1
θ
Min
Max
1.100
0.100
1.000
0.350
0.220
2.200
1.350
2.450
Max
0.043
0.004
0.039
0.014
0.009
0.087
0.053
0.096
A
A1
A2
b
0.900
0.000
0.877
0.150
0.080
1.800
1.150
2.000
0.035
0.000
0.035
0.006
0.003
0.071
0.045
0.079
5
1
4
3
2
c
D
20
c
b
e
E
Top View
End View
E1
e
0.650REF
0.026REF
e1
L
1.200
1.400
0.047
0.055
0.488REF
0.020REF
Side View
L1
θ
0.260
0°
0.460
8°
0.010
0°
0.018
8°
Land Pattern
1.30
NOTES:
1. Compound dimension: 2.00×1.25;
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
0.35
Tape and Reel Orientation
UKA
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014 5/9
UESD6V8L4B SC89-5/SOT553/SOT665
Outline Drawing
DIMENSIONS
MILLIMETERS
INCHES
Min
Symbol
Min
Max
0.620
0.050
0.300
0.180
1.700
1.300
1.700
0.550
0.300
Max
0.024
0.002
0.012
0.007
0.067
0.051
0.067
0.022
0.012
A
A1
b
c
D
E
E1
e
L
0.525
0.000
0.150
0.090
1.500
1.100
1.500
0.450
0.100
0.021
0.000
0.006
0.004
0.059
0.043
0.059
0.018
0.004
θ
7°REF
7°REF
*: The maximum length is 0.10mm.
Land Pattern
NOTES:
1. Compound dimension: 1.60×1.20;
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
Tape and Reel Orientation
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014 6/9
UESD6V8L5A6 SC70-6/SC88/SOT363
Outline Drawing
DIMENSIONS
D
MILLIMETERS
INCHES
Min
e1
e
θ
Symbol
Min
Max
1.100
0.100
1.000
0.350
0.150
2.200
1.350
2.450
Max
0.043
0.004
0.039
0.014
0.006
0.087
0.053
0.096
A
A1
A2
b
0.900
0.000
0.900
0.150
0.080
2.000
1.150
2.150
0.035
0.000
0.035
0.006
0.003
0.079
0.045
0.085
5
2
4
3
6
1
c
D
20
c
b
E
Top View
End View
E1
e
0.650REF
0.026REF
e1
L
1.200
1.400
0.047
0.055
0.525REF
0.021REF
L1
θ
0.260
0°
0.460
8°
0.010
0°
0.018
8°
Side View
Land Pattern
1.30
NOTES:
1. Compound dimension: 2.10×1.25;
2. Unit: mm;
3.General tolerance ±0.05mm unless otherwise
specified;
0.35
4. The layout is just for reference.
Tape and Reel Orientation
U6A
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014 7/9
UESD6V8L5B SC89-6/SOT563/SOT666
Outline Drawing
DIMENSIONS
MILLIMETERS
INCHES
Min
Symbol
Min
Max
0.600
0.050
0.300
0.180
1.700
1.300
1.700
0.550
0.300
Max
0.024
0.002
0.012
0.007
0.067
0.051
0.067
0.022
0.012
A
A1
b
c
D
E
E1
e
L
0.525
0.000
0.150
0.090
1.500
1.100
1.500
0.450
0.100
0.021
0.000
0.006
0.004
0.059
0.043
0.059
0.018
0.004
θ
7°REF
7°REF
Land Pattern
NOTES:
1. Compound dimension: 1.60×1.20;
2. Unit: mm;
3.General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
Tape and Reel Orientation
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014 8/9
IMPORTANT NOTICE
The information in this document has been carefully reviewed and is believed to be
accurate. Nonetheless, this document is subject to change without notice. Union assumes
no responsibility for any inaccuracies that may be contained in this document, and makes
no commitment to update or to keep current the contained information, or to notify a
person or organization of any update. Union reserves the right to make changes, at any
time, in order to improve reliability, function or design and to attempt to supply the best
product possible.
Union Semiconductor, Inc
Add: Unit 606, No.570 Shengxia Road, Shanghai 201210
Tel: 021-51093966
Fax: 021-51026018
Website: www.union-ic.com
________________________________________________________________________
http://www.union-ic.com Rev.03 Nov.2014
9/9
相关型号:
©2020 ICPDF网 联系我们和版权申明