UESD6V8V4A_15 [UNIONSEMI]
Quad Channel Low Capacitance ESD Protection Array;
| 型号： | UESD6V8V4A_15 |
| 厂家： | 
Union Semiconductor, Inc. |
| 描述： | Quad Channel Low Capacitance ESD Protection Array |
| 文件： | 总8页 (文件大小：259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Quad Channel Low Capacitance ESD Protection Array
UESD6V8V4A SC70-6/SC88/SOT363
UESD6V8V4B SC89-6/SOT563/SOT666
UESD6V8V4C TSOP-6/SOT23-6
General Description
UESD6V8V4X are surge rated diode arrays designed to protect high speed data interfaces. This series
has been specifically designed to protect sensitive components which are connected to data and
transmission lines from over-voltage caused by ESD (electrostatic discharge).
The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a
single package. During transient conditions, the steering diodes direct the transient to either the
positive side of the power supply line or to ground. The internal TVS diode prevents over-voltage on
the power line, protecting any downstream components.
The low capacitance array configuration allows the user to protect four high-speed data or
transmission lines. The low inductance construction minimizes voltage overshoot during high current
surges. This device is optimized for ESD protection of portable electronics. They may be used to meet
the ESD immunity requirements of IEC 61000-4-2, Level 4 (± 15kV air, ± 8kV contact discharge).
Applications
Features
USB 2.0
USB OTG
Monitors and Flat Panel
Displays Digital Visual Interface (DVI)
High-Definition Multimedia Interface
(HDMI)
Transient Protection for High-Speed Data Lines
to IEC 61000-4-2 (ESD) ± 15kV (Air), ± 8kV
(Contact)
Array of Surge Rated Diodes with Internal TVS
Diode
Protects up to Four I/O Lines & Power Lines
Low Capacitance for High-Speed Interfaces
Low Leakage Current and Clamping Voltage
Low Operating Voltage: 5.0V
SIM Ports IEEE 1394 Firewire Ports
Solid-State Silicon-Avalanche Technology
Pin Configurations
Top View
M: Month Code
UESD6V8V4A
SC70-6/SC88/SOT363
XX: Week Code
UESD6V8V4C
TSOP-6/SOT23-6
M: Month Code
UESD6V8V4B
SC89-6/SOT563/SOT666
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Ordering Information
Working
Part Number
Marking
Shipping Qty
Code
Packaging Type
Channel
Voltage
UESD6V8V4A
UESD6V8V4B
UESD6V8V4C
SC70-6/ SC88/ SOT363
SC89-6/SOT563/SOT666
TSOP-6/SOT23-6
UAF
3000pcs/7Inch
UBF
5.0V
4
Tape & Reel
UCE
Absolute Maximum Ratings
RATING
SYMBOL
VALUE
UNITS
Watts
A
Peak Pulse Power (tp = 8/20µs)
Peak Pulse Current (tp = 8/20µs )
Ppk
IPP
150
6
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
15
8
VESD
kV
Operating Temperature
Storage Temperature
TJ
-55 to +125
-55 to +150
°C
°C
TSTG
Electrical Characteristics
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNIT
Reverse Stand-Off
Voltage
Reverse Breakdown
Voltage
Reverse Leakage
Current
VRWM
VBR
IR
5.0
V
V
It = 1mA, Pin 5 to 2
6.0
VRWM = 5V, T=25°C
Pin 5 to 2
2
15
25
2
µA
V
IPP = 1A, 8/20µs
Any pin to pin 2
IPP = 6A, 8/20µs
Any pin to pin 2
VR = 0V, f = 1MHz
Any I/O pin to pin 2
VR = 0V, f = 1MHz
Between I/O pins
Clamping Voltage
Clamping Voltage
VC
VC
V
pF
pF
Junction Capacitance
Cj
1
Note 1: I/O pins are pin 1, 3, 4, and 6
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Typical Operating Characteristics
Forward Voltage vs. Forward Current
Clamping Voltage vs. Peak Pulse Current
8
6
28
24
Waveform
Parameters:
tr=8μs
td=20μs
Waveform
Parameters:
tr=8μs
Pin 1, 3, 4, 6 to Pin 2
td=20μs
20
16
4
2
12
8
Pin 5 to Pin 2
2
0
0
1
2
3
4
5
6
0
1
3
4
5
6
Forward Current – IF (A)
Peak Pulse Current – Ipp (A)
Power Derating Curve
Pulse Waveform
110
100
90
80
70
60
50
40
30
20
10
0
110
100
90
80
70
60
50
40
30
20
10
0
Waveform
Parameters:
tr=8μs
td=20μs
e-t
td=IPP/2
0
5
10
15
20
25
30
0
25
50
75
100
125
150
Time (µs)
Ambient Temperature - TA(
)
℃
Junction Capacitance vs. Reverse Voltage
Non-Repetitive Peak Pulse Power vs. Pulse Time
6.0
5.5
10
f=1MHz
5.0
4.5
4.0
1
Any I/O Pin to Pin2
0.1
3.5
3.0
0
0.01
1
2
3
4
5
10
0.1
1
100
1000
Reverse Voltage – VR (V)
Pulse Duration – tp (µs)
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Application Information
Device Connection Options for Protection of Four High-Speed Data Lines
This device is designed to protect data lines by clamping them to a fixed reference. When the voltage
on the protected line exceeds the reference voltage the steering diodes are forward biased, conducting
the transient current away from the sensitive circuitry. Data lines are connected at pins 1, 3, 4 and 6.
Pin 2 should be connected directly to a ground plane. The path length is kept as short as possible to
minimize parasitic inductance. The positive reference is connected at pin 5. The options for
connecting the positive reference are as follows:
1. To protect data lines and the power line, connect pin 5 directly to the positive supply rail (VCC). In
this configuration the data lines are referenced to the supply voltage. The internal TVS diode prevents
over-voltage on the supply rail.
2. In applications where the supply rail does not exit the system, the internal TVS may be used as the
reference. In this case, pin 5 is not connected. The steering diodes will begin to conduct when the
voltage on the protected line exceeds the working voltage of the TVS (plus one diode drop).
3. In applications where complete supply isolation is desired, the internal TVS is again used as the
reference and
VCC is connected to one of the I/O inputs. An example of this configuration is the protection of a
SIM port. The
Clock, Reset, I/O, and VCC lines are connected at pins 1, 3, 4, and 6. Pin 2 is connected to ground
and pin 5 is not connected.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin
finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small
compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile
will be determined by the requirements of the solder paste. Therefore, these devices are compatible
with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions,
matte tin does not have any added alloys that can cause degradation of the solder joint.
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Package Information
UESD6V8V4A SC70-6/SC88/SOT363
Outline Drawing
DIMENSIONS
D
MILLIMETERS
INCHES
Min
e1
e
θ
Symbol
Min
Max
1.100
0.100
1.000
0.350
0.150
2.200
1.350
2.450
Max
0.043
0.004
0.039
0.014
0.006
0.087
0.053
0.096
A
A1
A2
b
0.900
0.000
0.900
0.150
0.080
2.000
1.150
2.150
0.035
0.000
0.035
0.006
0.003
0.079
0.045
0.085
5
2
4
3
6
1
c
D
20
c
b
E
Top View
End View
E1
e
0.650REF
0.026REF
e1
L
1.200
1.400
0.047
0.055
0.525REF
0.021REF
L1
θ
0.260
0°
0.460
8°
0.010
0°
0.018
8°
Side View
Land Pattern
1.30
NOTES:
1. Compound dimension: 2.10×1.25;
2. Unit: mm;
3.General tolerance ±0.05mm unless otherwise
specified;
0.35
4. The layout is just for reference.
Tape and Reel Orientation
UAF
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UESD6V8V4B SC89-6/SOT563/SOT666
Outline Drawing
DIMENSIONS
MILLIMETERS
INCHES
Min
Symbol
Min
Max
0.600
0.050
0.300
0.180
1.700
1.300
1.700
0.550
0.300
Max
0.024
0.002
0.012
0.007
0.067
0.051
0.067
0.022
0.012
A
A1
b
c
D
E
E1
e
L
0.525
0.000
0.150
0.090
1.500
1.100
1.500
0.450
0.100
0.021
0.000
0.006
0.004
0.059
0.043
0.059
0.018
0.004
θ
7°REF
7°REF
Land Pattern
NOTES:
1. Compound dimension: 1.60×1.20;
2. Unit: mm;
3.General tolerance ±0.05mm unless otherwise
specified;
4. The layout is just for reference.
Tape and Reel Orientation
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UESD6V8V4C TSOP-6/SOT23-6
Outline Drawing
DIMENSIONS
MILLIMETERS
INCHES
Min Max
D
Symbol
θ
b
Min
Max
1.250
0.100
1.150
0.500
0.200
3.020
1.700
2.950
A
A1
A2
b
c
D
E
E1
e
1.050
0.000
1.050
0.300
0.100
2.820
1.500
2.650
0.041 0.049
0.000 0.004
0.041 0.045
0.012 0.020
0.004 0.008
0.111 0.119
0.059 0.067
0.104 0.116
0.037REF
6
1
5
2
4
3
e
c
20
e1
Top View
End View
0.950REF
e1
L
1.800
2.000
0.071 0.079
0.023REF
0.600REF
L1
θ
0.300
0°
0.600
8°
0.012 0.024
Side View
0°
8°
Land Pattern
0.7
NOTES:
1. Compound dimension: 2.92×1.60；
2. Unit: mm;
3. General tolerance ±0.05mm unless otherwise
specified;
0.95
0.95
4. The layout is just for reference.
Tape and Reel Orientation
UCE
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GREEN COMPLIANCE
Union Semiconductor is committed to environmental excellence in all aspects of its
operations including meeting or exceeding regulatory requirements with respect to the use of
hazardous substances. Numerous successful programs have been implemented to reduce the
use of hazardous substances and/or emissions.
All Union components are compliant with the RoHS directive, which helps to support
customers in their compliance with environmental directives. For more green compliance
information, please visit:
http://www.union-ic.com/index.aspx?cat_code=RoHSDeclaration
IMPORTANT NOTICE
The information in this document has been carefully reviewed and is believed to be accurate.
Nonetheless, this document is subject to change without notice. Union assumes no
responsibility for any inaccuracies that may be contained in this document, and makes no
commitment to update or to keep current the contained information, or to notify a person or
organization of any update. Union reserves the right to make changes, at any time, in order to
improve reliability, function or design and to attempt to supply the best product possible.
Union Semiconductor, Inc
Add: Unit 606, No.570 Shengxia Road, Shanghai 201210
Tel: 021-51093966
Fax: 021-51026018
Website: www.union-ic.com
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