TLP719(TP,F) [TOSHIBA]
IC IRED PHOTOCOUPLER 6SMD;
| 型号： | TLP719(TP,F) |
| 厂家： | 
TOSHIBA |
| 描述： | IC IRED PHOTOCOUPLER 6SMD 输出元件 光电 |
| 文件： | 总7页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP719
TOSHIBA PHOTOCOUPLER GaAℓAs IRED + PHOTO−IC
TLP719
Unit: mm
Digital logic ground isolation
Line receivers
4.58±0.25
6 5 4
Microprocessor system interfaces
Switching power supply feedback control
Industrial invertors
The TOSHIBA TLP719 consists of a GaAℓAs high-output light-emitting diode and a
high-speed detector.
1
2 3
This unit is a 6-lead SDIP. The TLP719 is 50% smaller than the 8-pin DIP and
meets the reinforced insulation class requirements of international safety standards.
Therefore the mounting area can be reduced in equipment requiring safety standard
certification.
7.62±0.25
The TLP719 has a Faraday shield integrated on the photodetector chip to provide
an effective common mode noise transient immunity. Therefore this product is
suitable for application in noisy environmental conditions.
1.27±0.2
0.4±0.1
1.25±0.25
9.7±0.3
•
•
Open collector
Package type
Isolation voltage
11-5J1
: SDIP6
TOSHIBA
11-5J1
•
•
•
: 5000 Vrms (min)
Weight: 0.26 g (typ.)
Common mode transient immunity : ±10 kV/μs (min) @VCM = 400 Vp-p
Switching speed
: t
t LH = 0.8 μs (max)
/ p
HL
p
@ IF = 16 mA, VCC = 5 V,
RL = 1.9 kΩ, Ta = 25 °C
PIN CONFIGURATION (Top View)
•
•
TTL compatible
Construction mechanical rating
1 : ANODE
1
6
7.62-mm pitch
standard type
10.16-mm pitch
TLPXXXF type
2 : N.C.
3 : CATHODE
5
4
Creepage Distance
Clearance
Insulation Thickness
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
2
3
4 : EMITTER (GND)
5 : COLLECTOR (OUTPUT)
6 : V
CC
SHIELD
•
•
UL recognized
: UL1577, File No. E67349
:CSA Component Acceptance Service
No. 5A, File No.E67349
cUL approved
•
Option (D4)
VDE approved: DIN EN60747-5-5 ,EN60065,EN60950-1 (Note1)
EN62368-1(Pending) (Note1)
Note 1: When a VDE approved type is needed,
please designate the “Option(D4)”
SCHEMATIC
IF
ICC
1
VCC
6
IO
VO
5
VF
3
GND
4
SHIELD
A 0.1-μF bypass capacitor must be
connected between pins 4 and 6.
Start of commercial production
2007-09
1
2017-09-26
TLP719
Absolute Maximum Ratings (Ta = 25 °C)
Characteristic
Symbol
Rating
Unit
mA
Forward current
I
25
-0.45
50
F
Forward current derating (Ta ≥ 70 °C)
Pulse forward current
IF/ Ta
mA / °C
mA
A
(Note 1)
(Note 2)
I
FP
Peak transient forward current
Reverse voltage
I
1
FPT
V
P
5
V
R
D
Diode power dissipation
Junction temperature
(Note 3)
45
mW
°C
T
j
125
Output current
I
8
mA
mA
V
O
Peak output current
I
16
OP
Output voltage
V
−0.5 to 20
−0.5 to 30
100
O
Supply voltage
V
V
CC
Output power dissipation
Output power dissipation derating (Ta ≥ 70 °C)
Junction Temperature
P
mW
mW / °C
°C
O
Po / Ta
－1.8
125
T
j
Operating temperature range
Storage temperature range
Lead soldering temperature (10 s)
Isolation voltage (AC, 60 s, R.H.≤ 60 %)
T
−55 to 100
−55 to 125
260
°C
opr
T
T
°C
stg
sol
°C
(Note 4)
BV
5000
Vrms
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note : A ceramic capacitor (0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the
high-gain linear amplifier. Failure to provide the bypassing may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Note 1: 50% duty cycle, 1 ms pulse width.
Derate 0.9 mA / °C above 70 °C.
Note 2: Pulse width ≤ 1 μs, 300 pps.
Note 3: Derate 0.8 mW / °C above 70 °C.
Note 4: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively.
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2017-09-26
TLP719
Electrical Characteristics (Ta = 25 °C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Forward voltage
V
I
I
= 16 mA
= 16 mA
―
―
1.65
1.85
V
F
F
F
Forward voltage
Temperature coefficient
ΔV / ΔTa
−2
―
mV / °C
F
Reverse current
I
V
V
= 5 V
―
―
―
―
45
3
10
―
μA
pF
nA
R
R
F
C
= 0 V, f = 1 MHz
Capacitance between terminals
T
I
I
I
I
= 0 mA, V
= 0 mA, V
= V = 5.5 V
O
500
OH (1)
OH (2)
F
F
CC
CC
= 30 V
―
―
―
―
5
HIGH-level output current
V
= 20 V
O
μA
I
= 0 mA, V
CC
= 30 V
F
I
50
OH
V
= 20 V, Ta = 70 °C
O
HIGH-level supply current
Supply voltage
I
I
I
I
= 0 mA, V
= 30 V
―
30
20
0.01
―
1
μA
V
CCH
F
CC
= 0.01 mA
V
―
―
CC
CC
Output voltage
V
= 0.5 mA
O
―
V
O
Coupled Electrical Characteristics (Ta = 25 °C)
Characteristic
Current transfer ratio
LOW-level output voltage
Symbol
Test Condition
Min
20
Typ.
―
Max
―
Unit
%
I
= 16 mA, V
= 4.5 V
= 4.5 V
F
CC
CC
I
/ I
F
O
V
V
= 0.4 V
O
I
I
= 16 mA, V
= 2.4 mA
F
―
―
0.4
V
OL
O
Isolation Characteristics (Ta = 25 °C)
Characteristic
Symbol
Test Condition
Min
Typ.
0.8
Max
Unit
Capacitance input to output
Isolation resistance
C
R
V = 0 V, f = 1 MHz
(Note 1)
―
―
―
―
―
―
pF
S
12
14
R.H. ≤ 60%,V = 500 V
(Note 1) 1×10
10
Ω
S
S
AC, 60 s
5000
―
―
V
rms
Isolation voltage
BV
AC, 1 s, in oil
DC, 60 s, in oil
10000
10000
S
―
Vdc
Note 1: Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively.
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2017-09-26
TLP719
Switching Characteristics (Ta = 25 °C, VCC = 5 V)
Test
Cir-
cuit
Characteristic
Symbol
Test Condition
= 0→ 16 mA
Min
Typ.
Max
Unit
I
F
Propagation delay time
Propagation delay time
(H→ L)
(L→ H)
t
t
―
―
―
―
0.8
0.8
μs
μs
pHL
pLH
R = 1.9kΩ
L
Fig1
Fig2
I
= 16→ 0 mA
F
R = 1.9kΩ
L
I
= 0 mA
F
Common mode transient
immunity at logic HIGH output
V
= 400 Vp−p
CM
10000
―
―
―
―
V / μs
V / μs
CM
R = 1.9kΩ
H
(Note 1)
L
I
= 16 mA
F
Common mode transient
immunity at logic LOW output
V
= 400 Vp−p
CM
−10000
CM
R = 1.9 kΩ
L
(Note 1)
L
Note 1 : CM is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic LOW
L
state (V < 0.8 V).
O
CM is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic HIGH
H
state (V >2.0 V).
O
Figure 1. Switching Time Test Circuit
V
= 5 V
CC
IF
→
1
2
3
6
5
4
PULSE INPUT
( PW = 100 μs
R
L
I
F
Duty = 10%)
V
O
tp
HL
tp
MONITORING NODE
LH
V
O
0.1 μF
5V
SHIELD
IF MONITORING NODE
1.5V
V
OL
Figure 2. Common Mode Noise Immunity Test Circuit.
400 V
90%
VCC=5V
1
6
5
4
IF
→
RL=1.9kΩ
10%
0 V
SW
A
2
3
VCM
VOH
SW:B (IF= 0 mA)
B
tr
tf
VO
0.1μF
CM
H
320 (V)
tr (μs)
SHIELD
CMH =
2 V
0.8 V
CM
320 (V)
tf (μs)
VOL
CML = −
L
−
+
SW:A (IF = 16 mA)
VCM
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2017-09-26
TLP719
I
– V
∆V / ∆Ta – I
F F
F
F
100
−2.6
−2.4
−2.2
−2.0
−1.8
−1.6
−1.4
Ta = 25°C
50
30
10
5
3
1
0.5
0.3
0.1
0.05
0.03
0.01
1.0
0.3 0.5
1
3
5
10
30
1.2
1.4
1.6
1.8
2.0
0.1
Forward voltage
V
(V)
Forward current
I
(mA)
F
F
I
– Ta
I – I
O F
OH(1)
300
100
10
V
V
= 5 V
CC
5
3
= 0.4 V
O
Ta = 25°C
50
30
1
0.5
0.3
10
5
3
0.1
0.05
0.03
1
0.01
0.1
0
40
80
120
160
0.3
100
300
1
3
10
30
Ambient temperature Ta (°C)
Forward current
I
(mA)
F
I
/ I – I
F
I / I – Ta
O F
O
F
100
1.2
1.0
0.8
0.6
0.4
0.2
0
V
V
= 5 V
CC
= 0.4 V
O
50
30
Ta = -25°C
10
25°C
100°C
5
3
I
= 16 mA
F
V
V
= 4.5 V
CC
= 0.4 V
O
1
0.3 0.5
1
3
5
10
30 50
-40
20
40
60
80
100
-20
0
Forward current
I
(mA)
F
Ambient temperature Ta (°C)
5
2017-09-26
TLP719
I
– V
V – I
O F
O
O
5
4
3
2
1
0
V
= 5 V
CC
30mA
25mA
10
8
V
= 5V
CC
I
F
Ta = 25°C
R
L
V
o
20mA
15mA
6
Ta = 25°C
4
10mA
R
L
= 2 kΩ
3.9 kΩ
10 kΩ
2
I
= 5mA
F
0
0
3
4
5
6
7
0
12
16
20
24
1
2
4
8
Output voltage
V
(V)
Forward current
I
(mA)
O
F
tpHL , tpLH - Ta
tpHL, tpLH - RL
5
5
I
=16mA
IF=16mA
VCC=5V
F
3
3
VCC=5V
tpLH
Ta=25℃
RL=1.9kΩ
1
1
0.5
0.3
0.5
0.3
tpHL
tpLH
tpHL
0.1
0.1
-40
-20
0
20
40
60
80
100
1
30 50
10
3
5
100
Load resistanceꢀRLꢀ（ｋΩ）
Ambient temperatureꢀTaꢀ（℃）
6
2017-09-26
TLP719
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
•
•
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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2017-09-26
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