TLP170AM(E_技术文档

TLP170AM

Photocouplers Photorelay

TLP170AM

1. Applications

•

Security Systems

Factory Automation (FA)

Measuring Instruments

I/O Interface Boards

Programmable Logic Controllers (PLCs)

Mechanical relay replacements

2. General

The Toshiba TLP170AM consists of an infrared LED coupled to a photo-MOSFET in a 4-pin SO6 package. This

photorelay has higher output current rating than phototransistor-type photocoupler; hence, it is suitable for use

as On/Off control for high current.

3. Features

(1) Halogen-free

For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet.

(2) Normally opened (1-Form-A)

(3) OFF-state output terminal voltage: 60 V (min)

(4) Trigger LED current: 1 mA (max)

(5) ON-state current: 700 mA (max)

(6) ON-state resistance: 0.3 Ω (max)

(7) Isolation voltage: 3750 Vrms (min)

(8) Safety standards

UL-recognized: UL 1577, File No.E67349

cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349

VDE-approved: EN 60747-5-5 (Note 1)

Note 1: When a VDE approved type is needed, please designate the Option (V4).

Table 3.1 Mechanical Parameters

Characteristics

Creepage distances

TLP170AM

Unit

mm

5.0 (min)

0.2 (min)

Clearance distances

Internal isolation thickness

Start of commercial production

2020-05

Toshiba Electronic Devices & Storage Corporation

2020-05-07

Rev.1.0

1

TLP170AM

4. Packaging and Pin Assignment

1: Anode

3: Cathode

4: Drain

6: Drain

11-4M1S

5. Internal Circuit

2020-05-07

Rev.1.0

2

Toshiba Electronic Devices & Storage Corporation

TLP170AM

6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )

Characteristics

Symbol

Note

Rating

Unit

LED

Input forward current

IF

∆IF/∆Ta

IFP

30

-0.3

1

mA

mA/

A

Input forward current derating

Input forward current (pulsed)

Input reverse voltage

(Ta ≥ 25 )

(100 µs pulse, 100 pps)

VR

6

V

Input power dissipation

PD

50

mW

mW/



Input power dissipation derating

Junction temperature

(Ta ≥ 25 )

∆PD/∆Ta

Tj

-0.5

125

Detector OFF-state output terminal voltage

ON-state current

VOFF

ION

60

V

700

mA

ON-state current derating

ON-state current (pulsed)

Output power dissipation

Output power dissipation derating

Junction temperature

(Ta ≥ 50 )

∆ION/∆Ta

IONP

PO

-8.3

2.1

mA/

A

(t = 100 ms, duty = 1/10)

300

mW

mW/



(Ta ≥ 50 )

∆PO/∆Ta

Tj

-4.0

125

Common Storage temperature

Operating temperature

Tstg

-55 to 125

-40 to 85

260

Topr

Lead soldering temperature

Isolation voltage

(10 s)

Tsol

(AC, 60 s, R.H. ≤ 60 %)

BVS

(Note 1)

3750

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are

shorted together.

7. Recommended Operating Conditions (Note)

Characteristics

Symbol Note

Min

Typ.

Max

Unit

Supply voltage

VDD

IF



2

48

25

V

Input forward current

ON-state current

mA

ION

Topr



700

85

Operating temperature

-40



Note: The recommended operating conditions are given as a design guide necessary to obtain the intended

performance of the device. Each parameter is an independent value. When creating a system design using

this device, the electrical characteristics specified in this data sheet should also be considered.

8. Electrical Characteristics (Unless otherwise specified, Ta = 25 )

Characteristics

Symbol

Note

Test Condition

IF = 10 mA

Min

Typ.

Max

Unit

LED

Input forward voltage

Input reverse current

Input capacitance

VF

IR

1.1



1.27



1.4

10



1

V

VR = 5 V

µA

pF

µA

pF

Ct

V = 0 V, f = 1 MHz

VOFF = 60 V

30

Detector OFF-state current

Output capacitance

IOFF

COFF

0.002

100

V = 0 V, f = 1 MHz



Toshiba Electronic Devices & Storage Corporation

2020-05-07

Rev.1.0

3

TLP170AM

9. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 )

Characteristics

Trigger LED current

Symbol

Test Condition

ION = 700 mA

Min

Typ.

Max

Unit

IFT

IFC



0.1

1

mA

Return LED current

ON-state resistance

IOFF = 10 µA

0.01



RON

ION = 700 mA, IF = 2 mA



0.15

0.30

Ω

10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )

Characteristics

Symbol

Note

Test Condition

Min

Typ.

Max

Unit

Total capacitance (input to output)

Isolation resistance

CS

RS

(Note 1) VS = 0 V, f = 1 MHz

(Note 1) VS = 500 V, R.H. ≤ 60 %

(Note 1) AC, 60 s



0.8

1014



pF

Ω

5 × 1010

3750

Isolation voltage

BVS

Vrms

Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4 and 6 are

shorted together.

11. Switching Characteristics (Unless otherwise specified, Ta = 25 )

Characteristics

Symbol

Note

Test Condition

Min

Typ.

Max

Unit

ms

Turn-on time

Turn-off time

tON

See Fig. 11.1

RL = 200 Ω, VDD = 20 V, IF = 2 mA



3

6

1

tOFF

0.4

Fig. 11.1 Switching Time Test Circuit and Waveform

Toshiba Electronic Devices & Storage Corporation

2020-05-07

Rev.1.0

4

TLP170AM

12. Characteristics Curves and Circuit Connections

12.1. Characteristics Curves (Note)

Fig. 12.1.1 IF - Ta

Fig. 12.1.3 IF - VF

Fig. 12.1.5 RON - Ta

Fig. 12.1.2 ION - Ta

Fig. 12.1.4 ION - VON

Fig. 12.1.6 IFT - Ta

2020-05-07

Rev.1.0

5

Toshiba Electronic Devices & Storage Corporation

TLP170AM

Fig. 12.1.7 tON, tOFF - IF

Fig. 12.1.8 tON, tOFF - Ta

Fig. 12.1.9 IOFF - Ta

Fig. 12.1.10 IOFF - VOFF

Fig. 12.1.11 COFF/COFF(0V) - VOFF

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

Toshiba Electronic Devices & Storage Corporation

2020-05-07

Rev.1.0

6

TLP170AM

13. Soldering and Storage

13.1. Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

•

When using soldering reflow.

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used

•

When using soldering flow

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260  within 10 seconds is recommended.

Flow soldering must be performed once.

When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not

exceeding 350 

Heating by soldering iron must be done only once per lead.

13.2. Precautions for General Storage

•

Avoid storage locations where devices may be exposed to moisture or direct sunlight.

Follow the precautions printed on the packing label of the device for transportation and storage.

Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %,

respectively.

•

Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

•

When restoring devices after removal from their packing, use anti-static containers.

Do not allow loads to be applied directly to devices while they are in storage.

If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

Toshiba Electronic Devices & Storage Corporation

2020-05-07

Rev.1.0

7

TLP170AM

14. Ordering Information

When placing an order, please specify the part number, tape type and quantity as shown in the following example.

Example) TLP170AM(TPL,E 3000 pcs

Part number: TLP170AM

Tape type: TPL

[[G]]/RoHS COMPATIBLE: E (Note 1)

Quantity (must be a multiple of 3000): 3000 pcs

Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronic equipment.

15. Ordering Information (Example of Item Name)

Item Name

TLP170AM(E

Packaging (Note 1)

VDE Option

Packing (MOQ)

SMD

Magazine (125 pcs)

TLP170AM(TPL,E

TLP170AM(TPR,E

TLP170AM(V4,E

Tape and reel (3000 pcs)

Magazine (125 pcs)

EN 60747-5-5

TLP170AM(V4TPL,E

TLP170AM(V4TPR,E

EN 60747-5-5

Tape and reel (3000 pcs)

Note 1: SMD: Surface Mount Device

Toshiba Electronic Devices & Storage Corporation

2020-05-07

Rev.1.0

8

TLP170AM

16. Devices in Halogen-Free Resin Packages

This product is Halogen-Free

Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor

product" as a semiconductor product in which:

(1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony

(Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an

aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or

(2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine,

chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain

chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in

printed circuit boards.

For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make

any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following

elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At).

In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of

the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product

other than the encapsulating resins and the resin portion(s) in printed circuit boards.

The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and

belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and

belief on information provided by third parties, and Toshiba makes no representation or warranty as to the

accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide

accurate information to its customers, but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals.

Toshiba Electronic Devices & Storage Corporation

2020-05-07

Rev.1.0

9

TLP170AM

Package Dimensions

Unit: mm

Weight: 0.1 g (typ.)

Package Name(s)

TOSHIBA: 11-4M1S

Toshiba Electronic Devices & Storage Corporation

2020-05-07

Rev.1.0

10

TLP170AM

RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".

Hardware, software and systems described in this document are collectively referred to as "Product".

•

TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

•

ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

•

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE").

Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in

nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, and devices related to power plant.

IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.

For details, please contact your TOSHIBA sales representative or contact us via our website.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and

regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all

applicable export laws and regulations.

•

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

https://toshiba.semicon-storage.com/

2020-05-07

Rev.1.0

11

Toshiba Electronic Devices & Storage Corporation


型号：	TLP170AM(E
厂家：	TOSHIBA
描述：	Solid State Relay
文件：	总11页 (文件大小：299K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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