TB62215AFNG [TOSHIBA]

Stepping Motor Driver ICs, TB62215AFNG;
TB62215AFNG
型号: TB62215AFNG
厂家: TOSHIBA    TOSHIBA
描述:

Stepping Motor Driver ICs, TB62215AFNG

电动机控制 CD 光电二极管
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中文:  中文翻译
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TB62215AFG/FTG/FNG/HQ  
TOSHIBA BiCD Integrated Circuit Silicon Monolithic  
TB62215AFG, TB62215AFTG  
TB62215AFNG, TB62215AHQ  
CLOCK-in controlled Bipolar Stepping Motor Driver  
The TB62215A is a two-phase bipolar stepping motor driver  
using a PWM chopper. The clock in decoder is built in.  
Fabricated with the BiCD process, rating is 40 V/3.0 A .  
FG  
Features  
BiCD process integrated monolithic IC.  
Capable of controlling 1 bipolar stepping motor.  
PWM controlled constant-current drive.Allows full, half, quarter  
step operation.  
HSOP28-P-0450-0.80  
Weight 0.79g (Typ.)  
Low on-resistance (High + Low side=0.6Ω(typ.)) MOSFET  
output stage.  
FTG  
FNG  
HQ  
High voltage and current (For specification, please refer to absolute  
maximum ratings and operation ranges)  
Built-in error detection circuits (Thermal shutdown (TSD), over-current  
shutdown (ISD), and power-on reset (POR))  
Built-in VCC regulator for internal circuit use.  
Chopping frequency of a motor can be customized by external resistance  
and capacitor.  
QFN48-P-0707-0.50  
Weight 0.14g(Typ.)  
Multi package lineup  
TB62215AFG: HSOP28-P-0450-0.80  
TB62215AFTG: QFN48-P-0707-0.50  
TB62215AFNG: HTSSOP48-P-300-0.50  
TB62215AHQ: HZIP25-P-1.00F  
Note) Please be careful about thermal conditions during use.  
HTSSOP48-P-300-0.50  
Weight 0.20g (Typ.)  
HZIP25-P-1.00F  
Weight 7.6g (Typ.)  
2015-9-24  
©2015 TOSHIBA CORPORATION  
1
TB62215AFG/FTG/FNG/HQ  
Pin assignment (TB62215A)  
(Top View)  
CW/CCW  
MO  
1
28  
27  
26  
25  
24  
23  
22  
OSCM  
VREFA  
2
3
4
VREFB  
NC  
NC  
DMODE1  
DMODE2  
CLK  
ENABLE  
5
6
VCC  
VM  
RESET  
7
FIN(GND)  
FIN(GND)  
FG  
RSA  
NC  
OUTA+  
NC  
8
9
21  
20  
19  
18  
17  
RSB  
NC  
10  
11  
OUTB+  
NC  
GND  
12  
13  
14  
GND  
OUTA-  
GND  
16  
15  
OUTB-  
GND  
Please mount the FIN of the HSOP package to the GND area of the PCB.  
(Top View)  
34  
31  
28  
30 29 27 26 25  
33 32  
36  
35  
24 NC  
37  
38  
39  
NC  
NC  
NC  
23  
22  
NC  
GND  
21 OUTB-  
20  
40  
41  
42  
43  
44  
GND  
VREFB  
VREFA  
OSCM  
OUTB-  
FTG  
19 GND  
18 GND  
17  
16  
15  
OUTA-  
OUTA-  
GND  
CW/CCW  
MO 45  
46  
DMODE2 47  
48  
DMODE1  
14 NC  
13  
NC  
NC  
3
6
9
12  
10 11  
1
2
4
5
7
8
Please mount the four corner pins of the QFN package and the exposed pad to the GND area of the PCB.  
2015-9-24  
2
TB62215AFG/FTG/FNG/HQ  
(Top View)  
OSCM  
NC  
1
48  
VREFA  
VREFB  
GND  
NC  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
2
3
4
CW/CCW  
MO  
DMODE1  
NC  
NC  
5
6
NC  
DMODE2  
CLK  
NC  
VCC  
NC  
7
8
ENABLE  
9
VM  
10  
11  
12  
13  
RESET  
GND  
NC  
NC  
RSA  
NC  
RSB  
RSB  
NC  
FNG  
RSA  
NC  
OUTA+  
OUTA+  
14  
15  
16  
35  
34  
33  
OUTB+  
17  
18  
19  
20  
21  
22  
23  
32  
31  
30  
29  
28  
27  
26  
25  
OUTB+  
NC  
NC  
NC  
NC  
GND  
GND  
NC  
OUTA-  
NC  
OUTB-  
OUTA-  
GND  
OUTB-  
GND  
24  
Please mount the exposed pad of the HTSSOP package to the GND area of the PCB.  
2
6
8
10  
12  
14  
16  
18  
20  
22  
24  
4
HQ  
1
3
5
7
9
11  
13  
15  
17  
19  
21  
23  
25  
2015-9-24  
3
TB62215AFG/FTG/FNG/HQ  
TB62215A Block diagram  
OSCM  
Motor  
Oscillator  
OSC-Clock  
Converter  
Standby  
DMODE1  
DMODE2  
Control  
+
Step  
Resolution  
Selector  
VCC  
VCC  
Regulator  
System  
Oscillator  
VM  
Power-on  
Reset  
Signal  
Decode  
Logic  
CW/CCW  
CLK  
VREFA  
Current  
Current  
Level  
Set  
Reference  
VREFB  
RESET  
Setting  
ENABLE  
MO  
Angle monitor  
Current  
Comp  
Motor Control Logic  
Current  
Comp  
TSD  
ISD  
Predriver  
Predriver  
RSA  
RSB  
GND  
OUTA+  
OUTA-  
OUTB+  
OUTB-  
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.  
2015-9-24  
4
TB62215AFG/FTG/FNG/HQ  
Notes  
All the grounding wires of the TB62215A must run on the solder mask on the PCB and be externally terminated at  
only one point. Also, a grounding method should be considered for efficient heat dissipation.  
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across  
output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently  
damaged.  
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power  
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired  
incorrectly, an operation error may occur or the device may be destroyed.  
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current  
running through the IC that is larger than the specified current.  
2015-9-24  
5
TB62215AFG/FTG/FNG/HQ  
Pin explanations  
TB62215AFG (HSOP28)  
Pin No.1 – 28  
Pin No.  
Pin Name  
Function  
1
CW/CCW  
MO  
Motor rotation direction set pin  
Electric angle monitor pin  
Step resolution set pin no.1  
Step resolution set pin no.2  
CLK signal input pin  
2
3
DMODE1  
DMODE2  
CLK  
4
5
6
ENABLE  
RESET  
RSA  
Ach/Bch output stage ON/OFF control pin  
Electric angle reset pin  
7
8
Motor Ach current sense pin  
9
NC  
Non-connection pin  
Motor Ach (+) output pin  
Non-connection pin  
Ground pin  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
OUTA+  
NC  
GND  
OUTA-  
GND  
Motor Ach (-) output pin  
Ground pin  
Ground pin  
GND  
OUTB-  
GND  
Motor Bch (-) output pin  
Ground pin  
NC  
Non-connection pin  
Motor Bch (+) output pin  
Non-connection pin  
OUTB+  
NC  
RSB  
Motor Bch current sense pin  
Motor power supply pin  
Internal VCC regulator monitor pin  
Non-connection pin  
VM  
VCC  
NC  
Non-connection pin  
NC  
VREFB  
VREFA  
OSCM  
Motor Bch output set pin  
Motor Ach output set pin  
Oscillating circuit frequency for chopping set pin  
Please do not run patterns under NC pins.  
2015-9-24  
6
TB62215AFG/FTG/FNG/HQ  
Pin explanations  
TB62215AFTG (QFN48)  
Pin No.1 – 28  
Pin No.  
Pin Name  
Function  
1
NC  
CLK  
Non-connection pin  
2
CLK signal input pin  
3
ENABLE  
RESET  
GND  
Ach/Bch output stage ON/OFF control pin  
Electric angle reset pin  
4
5
Ground pin  
6
NC  
Non-connection pin  
Motor Ach current sense pin  
7
RSA(*)  
RSA(*)  
NC  
Motor Ach current sense pin  
8
9
Non-connection pin  
Motor Ach (+) output pin  
Motor Ach (+) output pin  
Non-connection pin  
Non-connection pin  
Non-connection pin  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
OUTA+(*)  
OUTA+(*)  
NC  
NC  
NC  
GND  
Ground pin  
Motor Ach (-) output pin  
Motor Ach (-) output pin  
Ground pin  
OUTA-(*)  
OUTA-(*)  
GND  
Ground pin  
GND  
Motor Bch (-) output pin  
OUTB-(*)  
OUTB-(*)  
GND  
Motor Bch (-) output pin  
Ground pin  
Non-connection pin  
Non-connection pin  
Non-connection pin  
Motor Bch (+) output pin  
NC  
NC  
NC  
OUTB+(*)  
OUTB+(*)  
NC  
Motor Bch (+) output pin  
Non-connection pin  
2015-9-24  
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TB62215AFG/FTG/FNG/HQ  
Pin No.29 – 48  
Pin No.  
Pin Name  
Function  
Motor Bch current sense pin  
Motor Bch current sense pin  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
RSB(*)  
RSB(*)  
NC  
Non-connection pin  
VM  
Motor power supply pin  
Non-connection pin  
NC  
VCC  
NC  
Internal VCC regulator monitor pin  
Non-connection pin  
Non-connection pin  
NC  
Non-connection pin  
NC  
Non-connection pin  
NC  
Non-connection pin  
NC  
GND  
VREFB  
VREFA  
OSCM  
CW/CCW  
Ground pin  
Motor Bch output set pin  
Motor Ach output set pin  
Oscillating circuit frequency for chopping set pin  
Motor rotation direction set pin  
45  
46  
47  
48  
MO  
DMODE1  
DMODE2  
NC  
Electric angle monitor pin  
Step resolution set pin no.1  
Step resolution set pin no.2  
Non-connection pin  
(*) Note:  
Please do not run patterns under NC pins.  
Please connect the pins with the same pin name, while using the TB62215A.  
2015-9-24  
8
TB62215AFG/FTG/FNG/HQ  
Pin explanations  
TB62215AFNG (HTSSOP48)  
Pin No.1 – 28  
Pin No.  
Pin Name  
Function  
1
OSCM  
NC  
Oscillating circuit frequency for chopping set pin  
Non-connection pin  
2
3
CW/CCW  
MO  
Motor rotation direction set pin  
Electric angle monitor pin  
4
5
DMODE1  
NC  
Step resolution set pin no.1  
Non-connection pin  
6
7
DMODE2  
CLK  
Step resolution set pin no.2  
CLK signal input pin  
8
9
ENABLE  
RESET  
GND  
Ach/Bch output stage ON/OFF control pin  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
Electric angle reset pin  
Ground pin  
NC  
Non-connection pin  
Motor Ach current sense pin  
Motor Ach current sense pin  
RSA(*)  
RSA(*)  
NC  
Non-connection pin  
Motor Ach (+) output pin  
Motor Ach (+) output pin  
Non-connection pin  
OUTA+(*)  
OUTA+(*)  
NC  
Non-connection pin  
NC  
GND  
Ground pin  
NC  
Non-connection pin  
Motor Ach (-) output pin  
Motor Ach (-) output pin  
Ground pin  
OUTA-(*)  
OUTA-(*)  
GND  
Ground pin  
GND  
Motor Bch (-) output pin  
Motor Bch (-) output pin  
OUTB-(*)  
OUTB-(*)  
NC  
Non-connection pin  
2015-9-24  
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TB62215AFG/FTG/FNG/HQ  
Pin No.29 – 48  
Pin No.  
Pin Name  
Function  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
GND  
NC  
Ground pin  
Non-connection pin  
Non-connection pin  
Motor Bch (+) output pin  
Motor Bch (+) output pin  
NC  
OUTB+(*)  
OUTB+(*)  
NC  
Non-connection pin  
Motor Bch current sense pin  
Motor Bch current sense pin  
Non-connection pin  
RSB(*)  
RSB(*)  
NC  
Non-connection pin  
NC  
VM  
Motor power supply pin  
Non-connection pin  
NC  
VCC  
NC  
Internal VCC regulator monitor pin  
Non-connection pin  
Non-connection pin  
NC  
Non-connection pin  
NC  
Non-connection pin  
45  
46  
47  
48  
NC  
GND  
Ground pin  
VREFB  
VREFA  
Motor Bch output set pin  
Motor Ach output set pin  
(*) Note:  
Please do not run patterns under NC pins.  
Please connect the pins with the same pin name, while using the TB62215A.  
2015-9-24  
10  
TB62215AFG/FTG/FNG/HQ  
Pin explanations  
TB62215AHQ (HZIP25)  
Pin No.  
機能  
Pin Name  
1
CW/CCW  
MO  
Motor rotation direction set pin  
Electric angle monitor pin  
Step resolution set pin no.1  
Step resolution set pin no.2  
CLK signal input pin  
2
3
DMODE1  
DMODE2  
CLK  
4
5
6
ENABLE  
RESET  
GND  
Ach/Bch output stage ON/OFF control pin  
Electric angle reset pin  
Ground pin  
7
8
9
RSA  
Motor Ach current sense pin  
Motor Ach (+) output pin  
Ground pin  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
OUTA+  
GND  
OUTA-  
GND  
Motor Ach (-) output pin  
Ground pin  
OUTB-  
GND  
Motor Bch (-) output pin  
Ground pin  
OUTB+  
RSB  
Motor Bch (+) output pin  
Motor Bch current sense pin  
Non-connection pin  
NC  
VM  
Motor power supply pin  
Non-connection pin  
NC  
NC  
Non-connection pin  
VCC  
Internal VCC regulator monitor pin  
Ground pin  
GND  
VREF  
OSCM  
Motor output set pin  
Oscillating circuit frequency for chopping set pin  
2015-9-24  
11  
TB62215AFG/FTG/FNG/HQ  
INPUT/OUTPUT equivalent circuit (TB62215A)  
Pin name  
IN/OUT signal  
Equivalent circuit  
150Ω  
Logic  
Input  
Pin  
DMODE1  
DMODE2  
CLK  
Digital Input (VIH/VIL)  
ENABLE  
RESET  
VIH: 2.0V(min) to 5.5V(max)  
VIL : 0V(min) to 0.8V(max)  
CW/CCW  
GND  
Logic  
Output  
Pin  
Digital Output (VOH/VOL)  
VOH: 2.0V(min) to 5.5V(max)  
VOL: 0V(min) to 0.8V(max)  
(Pull-up resistor :10k to 100kΩ)  
MO  
GND  
VCC  
VCC  
VCC voltage range  
1kΩ  
4.75V(min) to 5.0V(typ.) to 5.25V(max)  
VREF  
VREFA  
VREFB  
VREF voltage range  
0V to 3.6V  
GND  
1kΩ  
OSCM  
OSCM frequency setting range  
OSCM  
0.64MHz(min)  
2.4MHz(max)  
to  
1.6MHz(typ.)  
to  
GND  
RS  
OUTA+  
OUTA-  
OUTB+  
OUTB-  
RSA  
VM power supply voltage range  
10V(min) to 38V(max)  
OUT-  
OUT+  
OUTPUT pin voltage  
10V(min) to 38V(max)  
RSB  
GND  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.  
2015-9-24  
12  
TB62215AFG/FTG/FNG/HQ  
Function explanation (Stepping motor)  
1.CLK Function  
Each up-edge of the CLK signal will shift the motor’s electrical angle per step.  
Function  
CLK input  
Shifts the electrical angle per step.  
(State of the electrical angle does not change.)  
2. ENABLE function  
The ENABLE pin controls the ON and OFF of the corresponding output stage. This pin serves to select if the motor is  
stopped in Off (High impedance) mode or activated. Please set the ENABLE pin to ‘L’ during VM power-on and  
power-off sequence.  
Function  
ENABLE input  
H
L
Output stage=‘ON’ (Normal operation mode)  
Output stage=’OFF’ (High impedance mode)  
3. CW/CCW function and the output pin function (Output logic at the time of a charge start)  
The CW/CCW pin controls the rotation direction of the motor. When set to ‘Clockwise’, the current of OUTA is output  
first, with a phase difference of 90 deg. When set to ‘Counter clockwise”, the current of OUTB is output first with a  
phase difference of 90 deg.  
CW/CCW input  
OUT (+)  
OUT (-)  
H : Clockwise  
operation(CW)  
H
L
L
L : Counter clockwise  
operation(CCW)  
H
4. Step resolution select function  
Function  
DMODE1  
L
DMODE2  
L
Standby mode  
(the OSCM is disabled and the output stage is set to ‘OFF’ status)  
L
H
H
H
L
Full step resolution  
Half step resolution  
Quarter step resolution  
H
When switching the DMODE1,2; setting the RESET signal to Low (will set the electrical angle to the  
initial status:MO=Low), is recommended.  
2015-9-24  
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TB62215AFG/FTG/FNG/HQ  
Step resolution setting and initial angle  
[Full step resolution]  
H
CLK  
L
H
MO  
L
+100%  
IOUT(A)  
0%  
-100%  
+100%  
0%  
IOUT(B)  
-100%  
CCW  
CW  
[Half step resolution ]  
H
CLK  
L
H
MO  
L
+100%  
IOUT(A)  
0%  
-100%  
+100%  
0%  
IOUT(B)  
-100%  
CCW  
CW  
MO output shown in the timing chart is when the MO pin is pulled up.  
Timing charts may be simplified for explanatory purpose.  
2015-9-24  
14  
TB62215AFG/FTG/FNG/HQ  
[Quarter step resolution]  
H
CLK  
L
H
MO  
L
+100%  
+71%  
+38%  
IOUT(A)  
0%  
-38%  
-71%  
-100%  
+100%  
+71%  
+38%  
0%  
-38%  
-71%  
IOUT(B)  
-100%  
CCW  
CW  
MO output shown in the timing chart is when the MO pin is pulled up.  
Timing charts may be simplified for explanatory purpose.  
Step setting and current percentage  
Current  
±100%  
±71%  
±38%  
0%  
Full  
Half  
○○○  
Quarter  
○○○  
5. RESET function  
RESET Input  
H
Function  
Sets the electrical angle to the initial condition.  
Normal operation mode  
L
The current for each channel (while RESET is applied) is shown in the table below. MO will show ‘L’ at this time.  
Step resolution setting  
Full step  
Ach current setting  
100%  
Bch current setting  
100%  
Default electrical angle  
45°  
100%  
71%  
100%  
71%  
45°  
45°  
Half step  
Quarter step  
2015-9-24  
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TB62215AFG/FTG/FNG/HQ  
6. Decay function  
Mixed Decay Mode  
f
CR pin  
chop  
Internal CLK  
waveform  
DECAY MODE 1  
Setting current  
NF  
37.5%  
MIXED  
DECAY  
MODE  
MDT  
CHARGE MODE NF: Reach setting current SLOW MODE  
MIXED DECAY TIMMING FAST MODE Monitoring current  
(In case setting current > Outputting current) CHARGE MODE  
RNF  
Fast  
Charge  
Slow  
2015-9-24  
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TB62215AFG/FTG/FNG/HQ  
7Output transistor function mode  
VM  
VM  
VM  
RRS  
RRS  
RRS  
RSpin  
RSpin  
RSpin  
U1  
U2  
U1  
U2  
U1  
U2  
OFF  
OFF  
OFF  
OFF  
ON  
ON  
Load  
Load  
Load  
L1  
L2  
L1  
L2  
L1  
L2  
OFF  
ON  
ON  
ON  
ON  
OFF  
PGND  
Charge mode  
PGND  
Slow mode  
A current circulates around the  
motor coil and this device.  
PGND  
Fast mode  
The energy of the motor coil  
is fed back to the power  
A current flows into the motor coil.  
Output transistor function  
MODE  
U1  
U2  
OFF  
L1  
L2  
CHARGE  
SLOW  
ON  
OFF  
OFF  
OFF  
ON  
ON  
ON  
OFF  
ON  
FAST  
ON  
OFF  
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.  
If the current flows in the opposite direction, refer to the following table.  
MODE  
U1  
U2  
L1  
L2  
CHARGE  
SLOW  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
FAST  
OFF  
ON  
This IC controls the motor current to be constant by 3 modes listed above.  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.  
2015-9-24  
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TB62215AFG/FTG/FNG/HQ  
8Calculation of the Predefined Output Current  
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.  
The peak output current (Peak current) can be set via the current-sensing resistor (RS) and the reference voltage  
(Vref), as follows:  
Vref(V)  
IOUT(max) = Vref(gain)  
×
RRS(Ω)  
Vref(gain) : the Vref decay rate is 1/ 5.0 (typ.)  
For example : In the case of a 100% setup  
when Vref = 3.0 V, Torque=100%,RS=0.51Ω, the motor constant current (Peak current) will be  
calculated as:  
IOUT = 3.0V / 5.0 / 0.51Ω= 1.18 A  
9. Calculation of the OSCM oscillation frequency (chopper reference frequency)  
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)  
can be calculated by the following expressions.  
fOSCM = 1/[0.56x{Cx(R1+500)}]  
………C,R1: External components for OSCM (C = 270 pF, R1 = 3.6 k=> fOSCM = 1.6 MHz (Typ.))  
fchop = fOSCM / 16  
………fOSCM = 1.6 MHz => fchop = About 100 kHz  
If chopping frequency is raised, Rippl of current will become small and wave-like reproducibility will improve. However, the  
gate loss inside IC goes up and generation of heat becomes large.  
By lowering chopping frequency, reduction in generation of heat is expectable. However, Rippl of current may become large.  
It is a standard about about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.  
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Absolute Maximum Ratings (Ta = 25°C)  
Symbol  
Rating  
Unit  
Remarks  
Characteristics  
Motor power supply  
Motor output voltage  
VM  
Vout  
IOUT  
VCC  
VIN(H)  
VIN(L)  
VMO  
IMO  
40  
40  
V
V
Motor output current  
3.0  
A
Note1  
Internal Logic power supply  
6.0  
V
When externally applied.  
6.0  
V
-
Logic input voltage  
-0.4  
V
-
MO output voltage  
MO Inflow current  
QFN48  
6.0  
V
-
30  
mA  
W
W
W
W
°C  
°C  
°C  
-
PD  
1.3  
Note2  
HTSSOP48  
HSOP28  
HZIP25  
PD  
1.3  
Note2  
Power  
dissipation  
PD  
1.15  
3.2  
Note2  
PD  
Note2  
Operating temperature  
TOPR  
TSTR  
Tj(max)  
-20 to 85  
-55 to 150  
150  
-
-
-
Storage temperature  
Junction temperature  
Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for a  
standard on thermal rating. The maximum output current may be further limited in view of thermal  
considerations, depending on ambient temperature and board conditions. ( It will depend on the heat  
generation.)  
Note 2: Device alone (Ta =25°C)  
Ta: Ambient temperature  
Topr: Ambient temperature while the IC is active  
Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal  
shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the  
maximum junction temperature, Tj (max), will not exceed 120°C.  
CautionAbsolute maximum ratings  
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for  
a moment. Do not exceed any of these ratings.  
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by  
explosion or combustion.  
The value of even one parameter of the absolute maximum ratings should not be exceeded under any  
circumstances. The TB62215A does not have overvoltage detection circuit. Therefore, the device is damaged if a  
voltage exceeding its rated maximum is applied.  
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations  
described later should also be referred to.  
Operation Ranges (Ta=-20 to 85°C)  
Min  
Typ.  
Max  
Unit  
Remarks  
Note1  
Characteristics  
Symbol  
Motor power supply  
Motor output current  
VM  
10  
-
24  
38  
V
A
1.8  
3.0  
IOUT  
VIN(H)  
VIN(L)  
VMO  
2.0  
0
-
-
5.5  
0.8  
5.0  
100  
V
Logic input High Level  
Logic input Low Level  
Logic input voltage  
V
MO output pin voltage  
Clock input frequency  
-
3.3  
-
V
fCLK  
-
kHz  
Chopper frequency  
Vref input voltage  
fchop(range)  
Vref  
40  
100  
2.0  
150  
3.6  
kHz  
V
GND  
Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions  
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).  
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Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)  
Characteristics  
Symbol  
Test condition  
Min  
Typ.  
Max  
Unit  
HIGH  
LOW  
VIN(H)  
VIN(L)  
Logic input pin (Note)  
Logic input pin (Note)  
Logic input pin (Note)  
Logic input voltage=5V  
Logic input voltage=0V  
2.0  
0
-
-
5.5  
0.8  
300  
75  
V
V
Logic input voltage  
Logic input hysteresis voltage  
VIN(HYS)  
IIN(H)  
100  
35  
-
-
mV  
µA  
µA  
V
HIGH  
50  
-
Logic input current  
LOW  
LOW  
IIN(L)  
1
MO output pin voltage  
VOL(MO)  
IOL=24mA, output=Low  
Output pins=open  
Standby mode  
Output pins=open  
Standby release, ENABLE=Low  
-
0.2  
0.5  
IM1  
IM2  
-
-
2.0  
3.5  
3.0  
5.0  
mA  
mA  
Power consumption  
Output pins=open  
IM3  
IOH  
-
-
5.0  
-
7.0  
1
mA  
µA  
Full step resolution  
VRS=VM=40V,Vout=0V  
VRS=VM=Vout=40V  
Current differential between Ch  
IOUT=1.5A  
High-side  
Low-side  
output leakage current  
IOL  
ΔIOUT1  
ΔIOUT2  
IRS  
1
-5  
-5  
0
-
0
0
-
-
5
µA  
%
Motor current channel differential  
Motor current setting accuracy  
RS pin current  
5
%
VRS=VM=24V  
10  
µA  
Tj=25°C, Forward direction  
Motor output ON-resistance  
(High-side+Low-side)  
Ω
Ron(H+L)  
-
0.6  
0.8  
(High-side+Low-side)  
Note: VIN (H) is defined as the VIN voltage that causes the outputs (OUTA,OUTB) to change when a pin under test is  
gradually raised from 0 V. VIN (L) is defined as the VIN voltage that causes the outputs (OUTA, OUTB) to change  
when the pin is then gradually lowered from 5 V. The difference between VIN (H) and VIN (L) is defined as the VIN  
(HYS).  
Note: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is designed  
not to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and the VM  
voltage reaches the proper operating range.  
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Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)  
Characteristics  
Symbol  
Test condition  
Min  
Typ.  
Max  
Unit  
Vref input current  
VCC voltage  
Iref  
VCC  
Vref=2.0V  
ICC=5.0mA  
VCC=5.0V  
Vref=2.0V  
-
0
1
μA  
V
4.75  
-
5.0  
5.25  
5
VCC current  
ICC  
2.5  
mA  
Vref gain rate  
Thermal shutdown(TSD)  
threshold (Note1)  
Vref(gain)  
TjTSD  
1/5.2  
140  
1/5.0  
150  
1/4.8  
170  
°C  
VM recovery voltage  
Over-current detection (ISD)  
threshold (Note2)  
VMR  
ISD  
7.0  
3.0  
8.0  
4.0  
9.0  
5.0  
V
A
Note1: About TSD  
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset circuit  
then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is triggered,  
the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the DMODE pins  
to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be used  
aggressively.  
Note2: About ISD  
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output transistors.  
In order to avoid malfunction due to the switching, IC have a dead time. Once the ISD circuit is triggered, the device keeps  
the output off until power-on reset (POR), is reasserted or the device is set to standby mode by DMODE pins. For fail-safe, please insert  
a fuse to avoid secondary trouble.  
Back-EMF  
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the  
motor current recirculates back to the power supply due to the effect of the motor back-EMF.  
If the power supply does not have enough sink capability, the power supply and output pins of the device might  
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor  
characteristics. It must be fully verified that there is no risk that the TB62215A or other components will  
be damaged or fail due to the motor back-EMF.  
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)  
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an  
output short-circuit; they do not necessarily guarantee the complete IC safety.  
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device  
may be damaged due to an output short-circuit.  
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a  
condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be  
removed immediately by external hardware.  
IC Mounting  
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or  
deterioration of the device.  
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AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω)  
Characteristics  
Symbol  
tCLK(H)  
Test condition  
Min  
300  
Typ.  
-
Max  
-
Unit  
ns  
Inside filter of CLK input minimum  
High width  
The CLK(H) minimum pulse  
width  
Inside filter of CLK input minimum  
Low width  
The CLK(L) minimum pulse  
width  
tCLK(L)  
250  
-
-
ns  
0.15  
0.20  
0.15  
1000  
1500  
0.25  
tr  
-
μs  
μs  
ns  
ns  
0.10  
0.20  
tf  
-
Output transistor  
switching specific  
tpLH(CLK)  
tpHL(CLK)  
CLK-Output  
-
-
-
-
CLK-Output  
VM=24V,IOUT=1.5A  
Analog tblank  
Analog noise blanking time  
AtBLK  
300  
400  
500  
ns  
1200 1600 2000  
Oscillator reference frequency  
Chopping frequency  
fOSCM  
fchop  
COSC=270pF, ROSC=3.6kΩ  
kHz  
kHz  
Output:Active(IOUT =1.5 A),  
fOSC = 1600 kHz  
-
100  
-
AC Electrical Specification Timing chart  
1/fCLK  
tCLK(L)  
50%  
50%  
50%  
tCLK(H)  
CLK  
tpHL(CLK)  
tpLH(CLK)  
90%  
90%  
50%  
50%  
OUT  
10%  
10%  
tf  
tr  
Timing charts may be simplified for explanatory purpose.  
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Package Dimensions  
HSOP28-P-0450-0.80  
(unit :mm)  
Specific figure of pins  
Weight: 0.79g (typ.)  
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QFN48-P-0707-0.50  
(unit :mm)  
Weight: 0.14g (typ.)  
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HTSSOP48-P-300-0.50  
(unit :mm)  
Weight: 0.20g (typ.)  
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TB62215AFG/FTG/FNG/HQ  
HZIP25-P-1.00F  
(unit :mm)  
Weight: 7.6g (typ.)  
NoteThe tightening torque for the mounting bracket should be controlled between 0.4Nm to 0.6Nm.  
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TB62215AFG/FTG/FNG/HQ  
Notes on Contents  
1.Block Diagrams  
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory  
purposes.  
2.Equivalent Circuits  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.  
3.Timing Charts  
Timing charts may be simplified for explanatory purposes.  
4.Application Circuits  
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is  
required, especially at the mass-production design stage.  
Toshiba does not grant any license to any industrial property rights by providing these examples of application  
circuits.  
5.Test Circuits  
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and  
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.  
IC Usage Considerations  
Notes on handling of ICs  
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,  
even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device  
breakdown, damage or deterioration, and may result in injury by explosion or combustion.  
(2)  
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the  
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that  
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse  
noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can  
lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown,  
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.  
(3)  
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the  
design to prevent device malfunction or breakdown caused by the current resulting from the inrush  
current at power ON or the negative current resulting from the back electromotive force at power OFF.  
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in  
protection functions. If the power supply is unstable, the protection function may not operate, causing IC  
breakdown. IC breakdown may cause injury, smoke or ignition.  
(4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative  
terminals of power supplies are connected properly.  
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding  
the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by  
explosion or combustion.  
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is  
applied even just once.  
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load  
components (such as speakers), for example, power amp and regulator.  
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC  
output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand  
voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or  
ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)  
connection-type IC that inputs output DC voltage to a speaker directly.  
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TB62215AFG/FTG/FNG/HQ  
Points to remember on handling of ICs  
Overcurrent detection Circuit  
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all  
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status  
immediately.  
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the  
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,  
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation,  
the IC may generate heat resulting in breakdown.  
Thermal Shutdown Circuit  
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits  
operate against the over-temperature, clear the heat generation status immediately.  
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal  
shutdown circuit to operate improperly or IC breakdown to occur before operation.  
Heat Radiation Design  
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is  
appropriately radiated, in order not to exceed the specified junction temperature (Tj) at any time or under any  
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to  
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take  
into consideration the effect of IC heat radiation with peripheral components.  
Back-EMF  
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power  
supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor  
power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this  
problem, take the effect of back-EMF into consideration in system design.  
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TB62215AFG/FTG/FNG/HQ  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in  
this document, and related hardware, software and systems (collectively "Product") without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's  
written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury  
or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or  
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TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product  
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the  
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or  
applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)  
evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,  
sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and  
applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE  
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applicable export laws and regulations.  
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AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.  
2015-9-24  
29  

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