TB62215AFNG [TOSHIBA]
Stepping Motor Driver ICs, TB62215AFNG;型号: | TB62215AFNG |
厂家: | TOSHIBA |
描述: | Stepping Motor Driver ICs, TB62215AFNG 电动机控制 CD 光电二极管 |
文件: | 总29页 (文件大小:828K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TB62215AFG/FTG/FNG/HQ
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB62215AFG, TB62215AFTG
TB62215AFNG, TB62215AHQ
CLOCK-in controlled Bipolar Stepping Motor Driver
The TB62215A is a two-phase bipolar stepping motor driver
using a PWM chopper. The clock in decoder is built in.
Fabricated with the BiCD process, rating is 40 V/3.0 A .
FG
Features
・BiCD process integrated monolithic IC.
・Capable of controlling 1 bipolar stepping motor.
・PWM controlled constant-current drive.Allows full, half, quarter
step operation.
HSOP28-P-0450-0.80
Weight 0.79g (Typ.)
・Low on-resistance (High + Low side=0.6Ω(typ.)) MOSFET
output stage.
FTG
FNG
HQ
・High voltage and current (For specification, please refer to absolute
maximum ratings and operation ranges)
・Built-in error detection circuits (Thermal shutdown (TSD), over-current
shutdown (ISD), and power-on reset (POR))
・Built-in VCC regulator for internal circuit use.
・Chopping frequency of a motor can be customized by external resistance
and capacitor.
QFN48-P-0707-0.50
Weight 0.14g(Typ.)
・Multi package lineup
TB62215AFG: HSOP28-P-0450-0.80
TB62215AFTG: QFN48-P-0707-0.50
TB62215AFNG: HTSSOP48-P-300-0.50
TB62215AHQ: HZIP25-P-1.00F
Note) Please be careful about thermal conditions during use.
HTSSOP48-P-300-0.50
Weight 0.20g (Typ.)
HZIP25-P-1.00F
Weight 7.6g (Typ.)
2015-9-24
©2015 TOSHIBA CORPORATION
1
TB62215AFG/FTG/FNG/HQ
Pin assignment (TB62215A)
(Top View)
CW/CCW
MO
1
28
27
26
25
24
23
22
OSCM
VREFA
2
3
4
VREFB
NC
NC
DMODE1
DMODE2
CLK
ENABLE
5
6
VCC
VM
RESET
7
FIN(GND)
FIN(GND)
FG
RSA
NC
OUTA+
NC
8
9
21
20
19
18
17
RSB
NC
10
11
OUTB+
NC
GND
12
13
14
GND
OUTA-
GND
16
15
OUTB-
GND
Please mount the FIN of the HSOP package to the GND area of the PCB.
(Top View)
34
31
28
30 29 27 26 25
33 32
36
35
24 NC
37
38
39
NC
NC
NC
23
22
NC
GND
21 OUTB-
20
40
41
42
43
44
GND
VREFB
VREFA
OSCM
OUTB-
FTG
19 GND
18 GND
17
16
15
OUTA-
OUTA-
GND
CW/CCW
MO 45
46
DMODE2 47
48
DMODE1
14 NC
13
NC
NC
3
6
9
12
10 11
1
2
4
5
7
8
Please mount the four corner pins of the QFN package and the exposed pad to the GND area of the PCB.
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TB62215AFG/FTG/FNG/HQ
(Top View)
OSCM
NC
1
48
VREFA
VREFB
GND
NC
47
46
45
44
43
42
41
40
39
38
37
36
2
3
4
CW/CCW
MO
DMODE1
NC
NC
5
6
NC
DMODE2
CLK
NC
VCC
NC
7
8
ENABLE
9
VM
10
11
12
13
RESET
GND
NC
NC
RSA
NC
RSB
RSB
NC
FNG
RSA
NC
OUTA+
OUTA+
14
15
16
35
34
33
OUTB+
17
18
19
20
21
22
23
32
31
30
29
28
27
26
25
OUTB+
NC
NC
NC
NC
GND
GND
NC
OUTA-
NC
OUTB-
OUTA-
GND
OUTB-
GND
24
Please mount the exposed pad of the HTSSOP package to the GND area of the PCB.
2
6
8
10
12
14
16
18
20
22
24
4
HQ
1
3
5
7
9
11
13
15
17
19
21
23
25
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TB62215AFG/FTG/FNG/HQ
TB62215A Block diagram
OSCM
Motor
Oscillator
OSC-Clock
Converter
Standby
DMODE1
DMODE2
Control
+
Step
Resolution
Selector
VCC
VCC
Regulator
System
Oscillator
VM
Power-on
Reset
Signal
Decode
Logic
CW/CCW
CLK
VREFA
Current
Current
Level
Set
Reference
VREFB
RESET
Setting
ENABLE
MO
Angle monitor
Current
Comp
Motor Control Logic
Current
Comp
TSD
ISD
Predriver
Predriver
RSA
RSB
GND
OUTA+
OUTA-
OUTB+
OUTB-
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
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TB62215AFG/FTG/FNG/HQ
Notes
All the grounding wires of the TB62215A must run on the solder mask on the PCB and be externally terminated at
only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across
output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently
damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired
incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current
running through the IC that is larger than the specified current.
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TB62215AFG/FTG/FNG/HQ
Pin explanations
TB62215AFG (HSOP28)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
CW/CCW
MO
Motor rotation direction set pin
Electric angle monitor pin
Step resolution set pin no.1
Step resolution set pin no.2
CLK signal input pin
2
3
DMODE1
DMODE2
CLK
4
5
6
ENABLE
RESET
RSA
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
7
8
Motor Ach current sense pin
9
NC
Non-connection pin
Motor Ach (+) output pin
Non-connection pin
Ground pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
OUTA+
NC
GND
OUTA-
GND
Motor Ach (-) output pin
Ground pin
Ground pin
GND
OUTB-
GND
Motor Bch (-) output pin
Ground pin
NC
Non-connection pin
Motor Bch (+) output pin
Non-connection pin
OUTB+
NC
RSB
Motor Bch current sense pin
Motor power supply pin
Internal VCC regulator monitor pin
Non-connection pin
VM
VCC
NC
Non-connection pin
NC
VREFB
VREFA
OSCM
Motor Bch output set pin
Motor Ach output set pin
Oscillating circuit frequency for chopping set pin
Please do not run patterns under NC pins.
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TB62215AFG/FTG/FNG/HQ
Pin explanations
TB62215AFTG (QFN48)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
NC
CLK
Non-connection pin
2
CLK signal input pin
3
ENABLE
RESET
GND
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
4
5
Ground pin
6
NC
Non-connection pin
Motor Ach current sense pin
7
RSA(*)
RSA(*)
NC
Motor Ach current sense pin
8
9
Non-connection pin
Motor Ach (+) output pin
Motor Ach (+) output pin
Non-connection pin
Non-connection pin
Non-connection pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
OUTA+(*)
OUTA+(*)
NC
NC
NC
GND
Ground pin
Motor Ach (-) output pin
Motor Ach (-) output pin
Ground pin
OUTA-(*)
OUTA-(*)
GND
Ground pin
GND
Motor Bch (-) output pin
OUTB-(*)
OUTB-(*)
GND
Motor Bch (-) output pin
Ground pin
Non-connection pin
Non-connection pin
Non-connection pin
Motor Bch (+) output pin
NC
NC
NC
OUTB+(*)
OUTB+(*)
NC
Motor Bch (+) output pin
Non-connection pin
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TB62215AFG/FTG/FNG/HQ
Pin No.29 – 48
Pin No.
Pin Name
Function
Motor Bch current sense pin
Motor Bch current sense pin
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
RSB(*)
RSB(*)
NC
Non-connection pin
VM
Motor power supply pin
Non-connection pin
NC
VCC
NC
Internal VCC regulator monitor pin
Non-connection pin
Non-connection pin
NC
Non-connection pin
NC
Non-connection pin
NC
Non-connection pin
NC
GND
VREFB
VREFA
OSCM
CW/CCW
Ground pin
Motor Bch output set pin
Motor Ach output set pin
Oscillating circuit frequency for chopping set pin
Motor rotation direction set pin
45
46
47
48
MO
DMODE1
DMODE2
NC
Electric angle monitor pin
Step resolution set pin no.1
Step resolution set pin no.2
Non-connection pin
(*) Note:
・Please do not run patterns under NC pins.
・Please connect the pins with the same pin name, while using the TB62215A.
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TB62215AFG/FTG/FNG/HQ
Pin explanations
TB62215AFNG (HTSSOP48)
Pin No.1 – 28
Pin No.
Pin Name
Function
1
OSCM
NC
Oscillating circuit frequency for chopping set pin
Non-connection pin
2
3
CW/CCW
MO
Motor rotation direction set pin
Electric angle monitor pin
4
5
DMODE1
NC
Step resolution set pin no.1
Non-connection pin
6
7
DMODE2
CLK
Step resolution set pin no.2
CLK signal input pin
8
9
ENABLE
RESET
GND
Ach/Bch output stage ON/OFF control pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Electric angle reset pin
Ground pin
NC
Non-connection pin
Motor Ach current sense pin
Motor Ach current sense pin
RSA(*)
RSA(*)
NC
Non-connection pin
Motor Ach (+) output pin
Motor Ach (+) output pin
Non-connection pin
OUTA+(*)
OUTA+(*)
NC
Non-connection pin
NC
GND
Ground pin
NC
Non-connection pin
Motor Ach (-) output pin
Motor Ach (-) output pin
Ground pin
OUTA-(*)
OUTA-(*)
GND
Ground pin
GND
Motor Bch (-) output pin
Motor Bch (-) output pin
OUTB-(*)
OUTB-(*)
NC
Non-connection pin
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TB62215AFG/FTG/FNG/HQ
Pin No.29 – 48
Pin No.
Pin Name
Function
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
GND
NC
Ground pin
Non-connection pin
Non-connection pin
Motor Bch (+) output pin
Motor Bch (+) output pin
NC
OUTB+(*)
OUTB+(*)
NC
Non-connection pin
Motor Bch current sense pin
Motor Bch current sense pin
Non-connection pin
RSB(*)
RSB(*)
NC
Non-connection pin
NC
VM
Motor power supply pin
Non-connection pin
NC
VCC
NC
Internal VCC regulator monitor pin
Non-connection pin
Non-connection pin
NC
Non-connection pin
NC
Non-connection pin
45
46
47
48
NC
GND
Ground pin
VREFB
VREFA
Motor Bch output set pin
Motor Ach output set pin
(*) Note:
・Please do not run patterns under NC pins.
・Please connect the pins with the same pin name, while using the TB62215A.
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TB62215AFG/FTG/FNG/HQ
Pin explanations
TB62215AHQ (HZIP25)
Pin No.
機能
Pin Name
1
CW/CCW
MO
Motor rotation direction set pin
Electric angle monitor pin
Step resolution set pin no.1
Step resolution set pin no.2
CLK signal input pin
2
3
DMODE1
DMODE2
CLK
4
5
6
ENABLE
RESET
GND
Ach/Bch output stage ON/OFF control pin
Electric angle reset pin
Ground pin
7
8
9
RSA
Motor Ach current sense pin
Motor Ach (+) output pin
Ground pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
OUTA+
GND
OUTA-
GND
Motor Ach (-) output pin
Ground pin
OUTB-
GND
Motor Bch (-) output pin
Ground pin
OUTB+
RSB
Motor Bch (+) output pin
Motor Bch current sense pin
Non-connection pin
NC
VM
Motor power supply pin
Non-connection pin
NC
NC
Non-connection pin
VCC
Internal VCC regulator monitor pin
Ground pin
GND
VREF
OSCM
Motor output set pin
Oscillating circuit frequency for chopping set pin
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TB62215AFG/FTG/FNG/HQ
INPUT/OUTPUT equivalent circuit (TB62215A)
Pin name
IN/OUT signal
Equivalent circuit
150Ω
Logic
Input
Pin
DMODE1
DMODE2
CLK
Digital Input (VIH/VIL)
ENABLE
RESET
VIH: 2.0V(min) to 5.5V(max)
VIL : 0V(min) to 0.8V(max)
CW/CCW
GND
Logic
Output
Pin
Digital Output (VOH/VOL)
VOH: 2.0V(min) to 5.5V(max)
VOL: 0V(min) to 0.8V(max)
(Pull-up resistor :10k to 100kΩ)
MO
GND
VCC
VCC
VCC voltage range
1kΩ
4.75V(min) to 5.0V(typ.) to 5.25V(max)
VREF
VREFA
VREFB
VREF voltage range
0V to 3.6V
GND
1kΩ
OSCM
OSCM frequency setting range
OSCM
0.64MHz(min)
2.4MHz(max)
to
1.6MHz(typ.)
to
GND
RS
OUTA+
OUTA-
OUTB+
OUTB-
RSA
VM power supply voltage range
10V(min) to 38V(max)
OUT-
OUT+
OUTPUT pin voltage
10V(min) to 38V(max)
RSB
GND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB62215AFG/FTG/FNG/HQ
Function explanation (Stepping motor)
1.CLK Function
Each up-edge of the CLK signal will shift the motor’s electrical angle per step.
Function
CLK input
↑
↓
Shifts the electrical angle per step.
(State of the electrical angle does not change.)
2. ENABLE function
The ENABLE pin controls the ON and OFF of the corresponding output stage. This pin serves to select if the motor is
stopped in Off (High impedance) mode or activated. Please set the ENABLE pin to ‘L’ during VM power-on and
power-off sequence.
Function
ENABLE input
H
L
Output stage=‘ON’ (Normal operation mode)
Output stage=’OFF’ (High impedance mode)
3. CW/CCW function and the output pin function (Output logic at the time of a charge start)
The CW/CCW pin controls the rotation direction of the motor. When set to ‘Clockwise’, the current of OUTA is output
first, with a phase difference of 90 deg. When set to ‘Counter clockwise”, the current of OUTB is output first with a
phase difference of 90 deg.
CW/CCW input
OUT (+)
OUT (-)
H : Clockwise
operation(CW)
H
L
L
L : Counter clockwise
operation(CCW)
H
4. Step resolution select function
Function
DMODE1
L
DMODE2
L
Standby mode
(the OSCM is disabled and the output stage is set to ‘OFF’ status)
L
H
H
H
L
Full step resolution
Half step resolution
Quarter step resolution
H
When switching the DMODE1,2; setting the RESET signal to Low (will set the electrical angle to the
initial status:MO=Low), is recommended.
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TB62215AFG/FTG/FNG/HQ
Step resolution setting and initial angle
[Full step resolution]
H
CLK
L
H
MO
L
+100%
IOUT(A)
0%
-100%
+100%
0%
IOUT(B)
-100%
CCW
CW
[Half step resolution ]
H
CLK
L
H
MO
L
+100%
IOUT(A)
0%
-100%
+100%
0%
IOUT(B)
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
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TB62215AFG/FTG/FNG/HQ
[Quarter step resolution]
H
CLK
L
H
MO
L
+100%
+71%
+38%
IOUT(A)
0%
-38%
-71%
-100%
+100%
+71%
+38%
0%
-38%
-71%
IOUT(B)
-100%
CCW
CW
MO output shown in the timing chart is when the MO pin is pulled up.
Timing charts may be simplified for explanatory purpose.
Step setting and current percentage
Current
±100%
±71%
±38%
0%
Full
○
Half
○○○
Quarter
○○○
○
○
○
○
5. RESET function
RESET Input
H
Function
Sets the electrical angle to the initial condition.
Normal operation mode
L
The current for each channel (while RESET is applied) is shown in the table below. MO will show ‘L’ at this time.
Step resolution setting
Full step
Ach current setting
100%
Bch current setting
100%
Default electrical angle
45°
100%
71%
100%
71%
45°
45°
Half step
Quarter step
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TB62215AFG/FTG/FNG/HQ
6. Decay function
Mixed Decay Mode
f
CR pin
chop
Internal CLK
waveform
DECAY MODE 1
Setting current
NF
37.5%
MIXED
DECAY
MODE
MDT
CHARGE MODE → NF: Reach setting current → SLOW MODE
→ MIXED DECAY TIMMING → FAST MODE → Monitoring current
→ (In case setting current > Outputting current) CHARGE MODE
RNF
Fast
Charge
Slow
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TB62215AFG/FTG/FNG/HQ
7.Output transistor function mode
VM
VM
VM
RRS
RRS
RRS
RSpin
RSpin
RSpin
U1
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
ON
Load
Load
Load
L1
L2
L1
L2
L1
L2
OFF
ON
ON
ON
ON
OFF
PGND
Charge mode
PGND
Slow mode
A current circulates around the
motor coil and this device.
PGND
Fast mode
The energy of the motor coil
is fed back to the power
A current flows into the motor coil.
Output transistor function
MODE
U1
U2
OFF
L1
L2
CHARGE
SLOW
ON
OFF
OFF
OFF
ON
ON
ON
OFF
ON
FAST
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.
If the current flows in the opposite direction, refer to the following table.
MODE
U1
U2
L1
L2
CHARGE
SLOW
OFF
OFF
ON
ON
OFF
OFF
ON
ON
OFF
ON
FAST
OFF
ON
This IC controls the motor current to be constant by 3 modes listed above.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB62215AFG/FTG/FNG/HQ
8.Calculation of the Predefined Output Current
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.
The peak output current (Peak current) can be set via the current-sensing resistor (RS) and the reference voltage
(Vref), as follows:
Vref(V)
IOUT(max) = Vref(gain)
×
RRS(Ω)
Vref(gain) : the Vref decay rate is 1/ 5.0 (typ.)
For example : In the case of a 100% setup
when Vref = 3.0 V, Torque=100%,RS=0.51Ω, the motor constant current (Peak current) will be
calculated as:
IOUT = 3.0V / 5.0 / 0.51Ω= 1.18 A
9. Calculation of the OSCM oscillation frequency (chopper reference frequency)
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)
can be calculated by the following expressions.
fOSCM = 1/[0.56x{Cx(R1+500)}]
………C,R1: External components for OSCM (C = 270 pF, R1 = 3.6 kΩ => fOSCM = 1.6 MHz (Typ.))
fchop = fOSCM / 16
………fOSCM = 1.6 MHz => fchop = About 100 kHz
If chopping frequency is raised, Rippl of current will become small and wave-like reproducibility will improve. However, the
gate loss inside IC goes up and generation of heat becomes large.
By lowering chopping frequency, reduction in generation of heat is expectable. However, Rippl of current may become large.
It is a standard about about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.
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TB62215AFG/FTG/FNG/HQ
Absolute Maximum Ratings (Ta = 25°C)
Symbol
Rating
Unit
Remarks
Characteristics
Motor power supply
Motor output voltage
VM
Vout
IOUT
VCC
VIN(H)
VIN(L)
VMO
IMO
40
40
V
V
Motor output current
3.0
A
Note1
Internal Logic power supply
6.0
V
When externally applied.
6.0
V
-
Logic input voltage
-0.4
V
-
MO output voltage
MO Inflow current
QFN48
6.0
V
-
30
mA
W
W
W
W
°C
°C
°C
-
PD
1.3
Note2
HTSSOP48
HSOP28
HZIP25
PD
1.3
Note2
Power
dissipation
PD
1.15
3.2
Note2
PD
Note2
Operating temperature
TOPR
TSTR
Tj(max)
-20 to 85
-55 to 150
150
-
-
-
Storage temperature
Junction temperature
Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for a
standard on thermal rating. The maximum output current may be further limited in view of thermal
considerations, depending on ambient temperature and board conditions. ( It will depend on the heat
generation.)
Note 2: Device alone (Ta =25°C)
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal
shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the
maximum junction temperature, Tj (max), will not exceed 120°C.
Caution)Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for
a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any
circumstances. The TB62215A does not have overvoltage detection circuit. Therefore, the device is damaged if a
voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations
described later should also be referred to.
Operation Ranges (Ta=-20 to 85°C)
Min
Typ.
Max
Unit
Remarks
Note1
Characteristics
Symbol
Motor power supply
Motor output current
VM
10
-
24
38
V
A
1.8
3.0
IOUT
VIN(H)
VIN(L)
VMO
2.0
0
-
-
5.5
0.8
5.0
100
V
Logic input High Level
Logic input Low Level
Logic input voltage
V
MO output pin voltage
Clock input frequency
-
3.3
-
V
fCLK
-
kHz
Chopper frequency
Vref input voltage
fchop(range)
Vref
40
100
2.0
150
3.6
kHz
V
GND
Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).
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Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
HIGH
LOW
VIN(H)
VIN(L)
Logic input pin (Note)
Logic input pin (Note)
Logic input pin (Note)
Logic input voltage=5V
Logic input voltage=0V
2.0
0
-
-
5.5
0.8
300
75
V
V
Logic input voltage
Logic input hysteresis voltage
VIN(HYS)
IIN(H)
100
35
-
-
mV
µA
µA
V
HIGH
50
-
Logic input current
LOW
LOW
IIN(L)
1
MO output pin voltage
VOL(MO)
IOL=24mA, output=Low
Output pins=open
Standby mode
Output pins=open
Standby release, ENABLE=Low
-
0.2
0.5
IM1
IM2
-
-
2.0
3.5
3.0
5.0
mA
mA
Power consumption
Output pins=open
IM3
IOH
-
-
5.0
-
7.0
1
mA
µA
Full step resolution
VRS=VM=40V,Vout=0V
VRS=VM=Vout=40V
Current differential between Ch
IOUT=1.5A
High-side
Low-side
output leakage current
IOL
ΔIOUT1
ΔIOUT2
IRS
1
-5
-5
0
-
0
0
-
-
5
µA
%
Motor current channel differential
Motor current setting accuracy
RS pin current
5
%
VRS=VM=24V
10
µA
Tj=25°C, Forward direction
Motor output ON-resistance
(High-side+Low-side)
Ω
Ron(H+L)
-
0.6
0.8
(High-side+Low-side)
Note: VIN (H) is defined as the VIN voltage that causes the outputs (OUTA,OUTB) to change when a pin under test is
gradually raised from 0 V. VIN (L) is defined as the VIN voltage that causes the outputs (OUTA, OUTB) to change
when the pin is then gradually lowered from 5 V. The difference between VIN (H) and VIN (L) is defined as the VIN
(HYS).
Note: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is designed
not to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and the VM
voltage reaches the proper operating range.
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Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Vref input current
VCC voltage
Iref
VCC
Vref=2.0V
ICC=5.0mA
VCC=5.0V
Vref=2.0V
-
-
0
1
μA
V
4.75
-
5.0
5.25
5
VCC current
ICC
2.5
mA
-
Vref gain rate
Thermal shutdown(TSD)
threshold (Note1)
Vref(gain)
TjTSD
1/5.2
140
1/5.0
150
1/4.8
170
°C
VM recovery voltage
Over-current detection (ISD)
threshold (Note2)
VMR
ISD
-
-
7.0
3.0
8.0
4.0
9.0
5.0
V
A
Note1: About TSD
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset circuit
then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is triggered,
the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the DMODE pins
to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be used
aggressively.
Note2: About ISD
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output transistors.
In order to avoid malfunction due to the switching, IC have a dead time. Once the ISD circuit is triggered, the device keeps
the output off until power-on reset (POR), is reasserted or the device is set to standby mode by DMODE pins. For fail-safe, please insert
a fuse to avoid secondary trouble.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics. It must be fully verified that there is no risk that the TB62215A or other components will
be damaged or fail due to the motor back-EMF.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a
condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be
removed immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω)
Characteristics
Symbol
tCLK(H)
Test condition
Min
300
Typ.
-
Max
-
Unit
ns
Inside filter of CLK input minimum
High width
The CLK(H) minimum pulse
width
Inside filter of CLK input minimum
Low width
The CLK(L) minimum pulse
width
tCLK(L)
250
-
-
ns
0.15
0.20
0.15
1000
1500
0.25
tr
-
μs
μs
ns
ns
0.10
0.20
tf
-
Output transistor
switching specific
tpLH(CLK)
tpHL(CLK)
CLK-Output
-
-
-
-
CLK-Output
VM=24V,IOUT=1.5A
Analog tblank
Analog noise blanking time
AtBLK
300
400
500
ns
1200 1600 2000
Oscillator reference frequency
Chopping frequency
fOSCM
fchop
COSC=270pF, ROSC=3.6kΩ
kHz
kHz
Output:Active(IOUT =1.5 A),
fOSC = 1600 kHz
-
100
-
AC Electrical Specification Timing chart
1/fCLK
tCLK(L)
50%
50%
50%
tCLK(H)
CLK
tpHL(CLK)
tpLH(CLK)
90%
90%
50%
50%
OUT
10%
10%
tf
tr
Timing charts may be simplified for explanatory purpose.
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Package Dimensions
HSOP28-P-0450-0.80
(unit :mm)
Specific figure of pins
Weight: 0.79g (typ.)
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TB62215AFG/FTG/FNG/HQ
QFN48-P-0707-0.50
(unit :mm)
Weight: 0.14g (typ.)
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TB62215AFG/FTG/FNG/HQ
HTSSOP48-P-300-0.50
(unit :mm)
Weight: 0.20g (typ.)
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TB62215AFG/FTG/FNG/HQ
HZIP25-P-1.00F
(unit :mm)
Weight: 7.6g (typ.)
Note:The tightening torque for the mounting bracket should be controlled between 0.4N・m to 0.6N・m.
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Notes on Contents
1.Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
2.Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3.Timing Charts
Timing charts may be simplified for explanatory purposes.
4.Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5.Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device
breakdown, damage or deterioration, and may result in injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse
noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in
protection functions. If the power supply is unstable, the protection function may not operate, causing IC
breakdown. IC breakdown may cause injury, smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is
applied even just once.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand
voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or
ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)
connection-type IC that inputs output DC voltage to a speaker directly.
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TB62215AFG/FTG/FNG/HQ
Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status
immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation,
the IC may generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal
shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (Tj) at any time or under any
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take
into consideration the effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power
supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor
power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this
problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in
this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury
or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or
applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)
evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,
sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and
applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
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INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
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(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
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PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
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products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws
and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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