TB62261FTAG [TOSHIBA]
Stepping Motor Driver ICs;
| 型号： | TB62261FTAG |
| 厂家： | 
TOSHIBA |
| 描述： | Stepping Motor Driver ICs 电动机控制 CD |
| 文件： | 总23页 (文件大小：643K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB62261FTAG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB62261FTAG
PHASE-in controlled Bipolar Stepping Motor Driver
The TB62261FTAG is a two-phase bipolar stepping motor driver
using a PWM chopper. An interface is PHASE in control.
Fabricated with the BiCD process, rating is 40 V/1.5 A .
FTAG
Features
・BiCD process integrated monolithic IC.
・Capable of controlling 1 bipolar stepping motor.
・PWM controlled constant-current drive.
・Allows full, half, quarter step operation.
・Low on-resistance (High + Low side = 0.8 Ω (typ)) MOSFET
output stage.
P-WQFN36-0606-0.50-002
Weight: 0.10 g (typ.)
・High efficiency motor current control mechanism (Advanced
Dynamic Mixed Decay)
・High voltage and current (For specification, please refer to absolute
maximum ratings and operation ranges)
・Error detection (TSD/ISD) signal output function
・Built-in error detection circuits (Thermal shutdown (TSD), over-current
shutdown (ISD), and power-on reset (POR))
・Built-in VCC regulator for internal circuit use.
・Chopping frequency of a motor can be customized by external resistance
and capacitor.
・Package
TB62261FTAG: P-WQFN36-0606-0.50-002
Note: Please be careful about thermal conditions during use.
©2015 TOSHIBA CORPORATION
1
2015-6-26
TB62261FTAG
Pin assignment (TB62261FTAG)
(Top View)
27 26
23
20
19
21
25
22
24
GND
18
17
NC
28
29
30
31
32
33
34
35
36
OUT_B1-
GND
VREF_B
VREF_A
OSCM
16
15
14
OUT_B2-
GND
TB62261FTAG
NC
13 GND
IN_A1
IN_A2
12 OUT_A2-
11 OUT_A1-
PHASE_A
PHASE_B
10
GND
3
6
9
1
2
4
5
7
8
Please mount the four corner pins of the QFN package and the exposed pad to the GND area of the PCB.
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TB62261FTAG
TB62261FTAG Block diagram
OSCM
IN_A1
IN_A2
Motor
Oscillator
OSC-Clock
Converter
VCC
VM
VCC
Regulator
System
Oscillator
Standby
Control
+
Phase/Step
Selector
+
IN_B1
IN_B2
Power-on
Reset
PHASE_A
PHASE_B
Signal Decode
Logic
VREF_A
VREF_B
Current
Reference
Setting
Current
Level
Set
STANDBY
Current
Comp
Motor Control Logic
Current
Comp
Predriver
TSD
ISD
Predriver
RS_A
RS_B
GND
OUT_A
OUT_A-
OUT_B
OUT_B-
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.
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TB62261FTAG
Notes
All the grounding wires of the TB62261FTAG must run on the solder mask on the PCB and be externally
terminated at only one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VDD(VM) and GND traces, to avoid short circuits
across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently
damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired
incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current
running through the IC that is larger than the specified current.
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TB62261FTAG
Pin explanations
Pin No.
Pin Name
Function
1
IN_B1
IN_B2
Bch step resolution control 1
Bch step resolution control 2
Standby set pin
2
3
STANDBY
GND
4
Ground pin
5
NC
Non-connection pin
6
RS_A1 (*)
RS_A2 (*)
OUT_A1 (*)
OUT_A2 (*)
GND
Motor Ach current sense pin
Motor Ach current sense pin
Motor Ach (+) output pin
Motor Ach (+) output pin
Ground pin
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
OUT_A1－(*) Motor Ach (-) output pin
OUT_A2－(*) Motor Ach (-) output pin
GND
NC
Ground pin
Non-connection pin
Ground pin
GND
OUT_B2－(*) Motor Bch (-) output pin
OUT_B1－(*) Motor Bch (-) output pin
GND
OUT_B2(*)
OUT_B1(*)
RS_B2(*)
RS_B1(*)
VM
Ground pin
Motor Bch (+) output pin
Motor Bch (+) output pin
Motor Bch current sense pin
Motor Bch current sense pin
VM power supply pin
NC
Non-connection pin
VCC
Internal VCC regulator monitor pin
Non-connection pin
NC
NC
Non-connection pin
NC
Non-connection pin
GND
Ground pin
VREF_B
VREF_A
OSCM
IN_A1
Motor Bch current threshold set pin
Motor Ach current threshold set pin
Internal Oscillator frequency set pin
Ach step resolution control 1
Ach step resolution control 2
Ach phase set pin
IN_A2
PHASE_A
PHASE_B
Bch phase set pin
・Please do not run patterns under NC pins.
*: Please connect the pins with the same pin name, while using the TB62261FTAG.
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TB62261FTAG
Equivalent circuit
TB62261FTAG (QFN36)
6, 7
21, 22
1 kΩ
1, 2, 3,
33, 34, 35, 36
8, 9
11, 12
16, 17
19, 20
GND
GND
25
1 kΩ
1 kΩ
30, 31
32
GND
GND
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
Pin No
Pin name
IN_B1
1
IN_B2
2
STANDBY
RS_A
3
6,7
8,9
OUT_A+
11, 12
16, 17
OUT_A－
OUT_B－
OUT_B＋
19, 20
21, 22
RS_B
23
25
VM
VCC
VREF_B
VREF_A
OSCM
30
31
32
33
34
35
36
IN_A1
IN_A2
PHASE_A
PHASE_B
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TB62261FTAG
Function explanation (Stepping motor)
Motor output current (Iout): The flow from OUT+ to OUT- is plus current. The flow from OUT- to OUT+ is minus current.
<Full step resolution>
Ach
Bch
Input
Output
Iout(A)
+100%
-100%
-100%
+100%
Input
Output
Iout(B)
+100%
+100%
-100%
-100%
PHASE_A
IN_A1
IN_A2
PHASE_B
IN_B1
IN_B2
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
L
H
L
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
<Half step resolution>
Ach
Bch
Input
Output
Iout(A)
+100%
0%
Input
Output
Iout(B)
+100%
+100%
+100%
0%
PHASE_A
IN_A1
IN_A2
PHASE_B
IN_B1
IN_B2
H
X
L
H
L
H
L
H
H
H
X
L
H
H
H
L
H
H
H
L
H
H
H
L
H
H
H
L
-100%
-100%
-100%
0%
L
L
H
H
H
L
H
H
H
L
-100%
-100%
-100%
0%
X
H
H
L
H
H
H
H
+100%
+100%
L
X
X : Don't care
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TB62261FTAG
<Quarter step resolution>
Ach
Bch
Input
Output
Iout(A)
+71%
+38%
0%
Input
Output
PHASE_A
IN_A1
H
L
IN_A2
L
PHASE_B
IN_B1
H
H
H
H
H
L
IN_B2
L
Iout(B)
+71%
+100%
+100%
+100%
+71%
+38%
0%
H
H
X
L
H
H
H
H
H
H
X
L
H
L
H
H
H
L
L
L
H
L
-38%
L
H
H
H
H
H
L
-71%
L
H
H
H
L
-100%
-100%
-100%
-71%
H
L
L
L
L
L
H
L
-38%
L
L
H
H
H
H
H
L
-71%
L
H
L
-38%
L
H
H
H
L
-100%
-100%
-100%
-71%
X
H
H
H
H
H
L
0%
L
L
H
L
+38%
+71%
+100%
+100%
+100%
L
H
H
H
H
L
H
H
H
L
H
L
-38%
X
H
L
0%
L
H
+38%
X : Don't care
Others
Pin Name
H
L
Notes
IN_A1, IN_A2
IN_B1, IN_B2
The current value of each ch is set up with 2 Please refer to the above-mentioned current value
input 4 value.
setting table.
PHASE_A
PHASE_B
OUT+: H
OUT-: L
OUT+: L
OUT-: H
In PHASE=H, Charge current flows in the direction
of OUT- from OUT+.
In STANDBY= L, an internal oscillating circuit and a
motor output part are stopped. (The drive of a motor
cannot be performed.)
Standby mode
STANDBY
Standby release
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TB62261FTAG
Current phasor (Full step resolution)
100%
A
D
CCW
CW
-100%
100%
0%
C
B
-100%
Bch current[%]
A B
C D A B C D
A B
A B C D
100%
0%
Iout(A)
-100%
100%
Iout(B)
0%
-100%
H
PHASE_A
IN_A1
L
H
L
H
IN_A2
L
H
PHASE_B
L
H
L
IN_B1
IN_B2
H
L
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
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TB62261FTAG
Current phasor (Half step resolution)
G
100%
A
H
CCW
CW
F
B
-100%
0%
100%
C
E
D
Bch current [%]
-100%
A B
G H
C D E F G H
E
A B C D
100%
0%
Iout(A)
-100%
100%
0%
Iout(B)
-100%
H
L
PHASE_A
IN_A1
H
L
H
IN_A2
PHASE_B
IN_B1
L
H
L
H
L
H
L
IN_B2
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
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TB62261FTAG
Current phasor (Quarter step resolution)
N
O
P
100%
A
M
71%
L
CCW
38%
B
C
D
CW
0%
K
71%
-71% -38%
38%
-100%
100%
-38%
J
-71%
I
E
-100%
H
G
F
Bch current [%]
N O P A B C D E F G H I J K L M N O A B C D E F G H I J K L M N O
P
P A
100%
71%
38%
0%
Iout(A)
Iout(B)
-38%
-71%
-100%
100%
71%
38%
0%
-38%
-71%
-100%
H
L
PHASE_A
IN_A1
H
L
H
IN_A2
PHASE_B
IN_B1
L
H
L
H
L
H
L
IN_B2
CCW
CW
Timing charts may be simplified for explanatory purpose.
Please set IN_A1, IN_A2, IN_B1, and IN_B2 to Low until VM power supply reaches the proper operating range.
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TB62261FTAG
Mixed Decay Mode /Detecting zero point
f
CR pin
chop
Internal CLK
waveform
DECAY MODE 1
Setting current
NF
37.5%
MIXED
DECAY
MODE
MDT
CHARGE MODE → NF: Reach setting current → SLOW MODE
→ MIXED DECAY TIMMING → FAST MODE → Monitoring current
→ (In case setting current > Outputting current) CHARGE MODE
RNF
Fast
Charge
Slow
Charge
Slow
Fast
Note
Iout = 0
Hi-Z
Note: When the motor current reaches the 0 A level, the output transistor will turn to “Hi-Z” status.
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TB62261FTAG
Output transistor function mode
VM
VM
VM
RRS
RRS
RRS
RSpin
RSpin
RSpin
U1
U2
U1
U2
U1
U2
OFF
OFF
OFF
OFF
ON
ON
Load
Load
Load
L1
L2
L1
L2
L1
L2
OFF
ON
ON
ON
ON
OFF
PGND
Charge mode
PGND
Slow mode
A current circulates around the
motor coil and this device.
PGND
Fast mode
The energy of the motor coil
is fed back to the power
A current flows into the motor coil.
Output transistor function
MODE
U1
U2
OFF
L1
L2
CHARGE
SLOW
ON
OFF
OFF
OFF
ON
ON
ON
OFF
ON
FAST
ON
OFF
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.
If the current flows in the opposite direction, refer to the following table.
MODE
U1
U2
L1
L2
CHARGE
SLOW
OFF
OFF
ON
ON
OFF
OFF
ON
ON
OFF
ON
FAST
OFF
ON
This IC controls the motor current to be constant by 3 modes listed above.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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TB62261FTAG
Calculation of the Predefined Output Current
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.
The peak output current (Setting current value) can be set via the current-sensing resistor (RS) and the reference
voltage (Vref), as follows:
Vref(V)
Iout(max) = Vref(gain)
×
RRS(Ω)
Vref(gain) : the Vref decay rate is 1/ 5.0 (typ.)
For example: In the case of a 100% setup
when Vref = 3.0 V, Torque = 100%, RS = 0.51 Ω, the motor constant current (Setting current value) will be
calculated as:
I
= 3.0 V / 5.0 / 0.51 Ω= 1.18 A
out
Calculation of the OSCM oscillation frequency (chopper reference frequency)
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)
can be calculated by the following expressions.
fOSCM = 1/[0.56x{Cx(R1+500)}]
………C,R1: External components for OSCM (C = 270 pF , R1 = 3.6 kΩ => fOSCM = 1.6 MHz (Typ.))
fchop = fOSCM / 16
………fOSCM = 1.6 MHz => fchop = About 100 kHz
If chopping frequency is raised, Rippl of current will become small and wave-like reproducibility will improve. However, the
gate loss inside IC goes up and generation of heat becomes large.
By lowering chopping frequency, reduction in generation of heat is expectable. However, Rippl of current may become
large. It is a standard about about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.
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TB62261FTAG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Remarks
Motor power supply
Motor output voltage
-
VM
Vout
Iout
40
40
V
V
A
V
V
-
Motor output current
1.5
6.0
6.0
(Note 1)
Internal Logic power supply
When externally applied.
-
VCC
VIN(H)
Logic input voltage
VIN(L)
Vref
-0.4
5.0
V
V
-
-
Vref reference voltage
Power dissipation
WQFN36
PD
Topr
1.3
W
°C
°C
°C
(Note 2)
-
Operating temperature
Storage temperature
Junction temperature
-20 to 85
-55 to 150
150
-
-
Tstg
Tj(max)
Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for
a standard on thermal rating. The maximum output current may be further limited in view of thermal
considerations, depending on ambient temperature and board conditions.
Note 2: Device alone (Ta = 25°C)
When Ta exceeds 25°C, it is necessary to do the derating with 10.4 mW/°C.
Ta: Ambient temperature
Topr: Ambient temperature while the IC is active
Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal
shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the
maximum junction temperature, Tj (MAX), will not exceed 120°C.
Caution) Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even
for a moment. Do not exceed any of these ratings.
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by
explosion or combustion.
The value of even one parameter of the absolute maximum ratings should not be exceeded under any
circumstances. The TB62261FTAG does not have overvoltage detection circuit. Therefore, the device is
damaged if a voltage exceeding its rated maximum is applied.
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations
described later should also be referred to.
(For reference) PD-Ta graph
PD - Ta
Mounted to board
Device alone
Board condition
4 layer glass epoxy board
Cu thickness: 1 layer and 4 layer: 55μm, 2 layer and 3 layer: 35μm
Board size: 100 mm ×110 mm ×1.6 mm
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TB62261FTAG
Operation Ranges (Ta = -20 to 85°C)
Characteristics
Symbol
Min
Typ.
Max
Unit
Remarks
Motor power supply
Motor output current
-
VM
10
-
24
35
V
A
(Note 1)
Iout
0.8
1.2
VIN(H)
VIN(L)
2.0
0
-
-
5.5
0.8
V
V
Logic input High Level
Logic input Low Level
Logic input voltage
Phase input frequency
Chopper frequency
fPHASE
fchop(range)
Vref
-
-
400
150
3.6
kHz
kHz
V
-
-
40
70
2.0
-
Vref input voltage
GND
Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).
Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
HIGH
LOW
VIN(H)
VIN(L)
VIN(HYS)
IIN(H)
Logic input (Note)
Logic input (Note)
Logic input (Note)
VIN(H) = 3.3 V
VIN(L) = 0 V
2.0
-
-
5.5
0.8
300
-
V
Logic input voltage
0
V
Logic input hysteresis voltage
100
-
mV
µA
µA
mA
mA
HIGH
Logic input current
LOW
-
-
-
33
-
IIN(L)
1
Output pins = open
STANDBY = L
Output pins = open
STANDBY = H
IM1
2.5
4.0
3.5
5.5
Power consumption
IM2
-
Output pins = open
Full step resolution
5
7
mA
IM3
IOH
-
-
High-side
Output leakage current
Low-side
VRS = VM = 40 V, Vout = 0 V
VRS = VM = Vout = 40 V
Current differential between Ch
Iout = 1.0 A
-
-
1
-
µA
µA
%
IOL
1
Motor current channel differential
Motor current setting accuracy
RS pin current
ΔIout1
ΔIout2
IRS
-5
-5
0
0
0
-
5
5
%
VRS = VM = 24 V
27
µA
Ω
Tj = 25°C, Forward direction
Motor output ON-resistance
(High-side + Low-side)
Ron(H+L)
－
0.8
1.2
(High-side + Low-side)
Note: VIN(H) is defined as the VIN voltage that causes the outputs (OUT_A, OUT_B) to change when a pin under
test is gradually raised from 0 V. VIN(L) is defined as the VIN voltage that causes the outputs (OUT_A, OUT_B) to
change when the pin is then gradually lowered from 5 V. The difference between VIN(H) and VIN(L) is defined as
the VIN(HYS).
Note: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is
designed not to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and
the VM voltage reaches the proper operating range.
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TB62261FTAG
Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Vref input current
VCC voltage
Iref
VCC
VREF = 2.0 V
ICC = 5.0 mA
VCC = 5.0 V
VREF = 2.0 V
－
-
0
1
μA
V
4.75
-
5.0
5.25
5
VCC current
ICC
2.5
mA
－
Vref gain rate
Thermal shutdown(TSD)
threshold (Note1)
Vref(gain)
TjTSD
1/5.2
145
1/5.0
160
1/4.8
175
°C
VM recovery voltage
Over-current detection (ISD)
threshold (Note2)
VMR
ISD
－
－
7.0
2.1
8.0
3.0
9.0
4.0
V
A
Note1: About TSD
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset circuit
then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is
triggered, the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the
DMODE pins to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not
recommended to be used aggressively.
Note2: About ISD
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output
transistors. Once the ISD circuit is triggered, the device keeps the output off until power-on reset (POR), is reasserted or the device is
set to standby mode by DMODE pins. For fail-safe, please insert a fuse to avoid secondary trouble.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the
motor current recirculates back to the power supply due to the effect of the motor back-EMF.
If the power supply does not have enough sink capability, the power supply and output pins of the device might
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor
characteristics.
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuit; they do not necessarily guarantee the complete IC safety.
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device
may be damaged due to an output short-circuit.
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a
condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be
removed immediately by external hardware.
IC Mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
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AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 Ω)
Characteristics
Symbol
Test condition
Min
100
50
Typ.
-
Max
-
Unit
ns
fPHASE(min)
－
-
-
-
-
Minimum PHASE pulse width
twp
－
twn
－
50
tr
－
150
100
250
250
200
150
750
750
250
200
tf
－
Output transistor
switching specific
ns
tpLH(PHASE)
tpHL(PHASE)
PHASE - Output
PHASE - Output
1200
1200
VM = 24 V, Iout = 1.0 A
Analog tblank
Analog noise blanking time
AtBLK
fOSCM
fchop
ns
450
1200
-
700
1600
100
950
2000
-
Oscillator reference
frequency
C
OSC = 270 pF, ROSC = 3.6 kΩ
kHz
kHz
Output: Active(IOUT = 1.0 A),
Chopping frequency
fOSCM = 1600 kHz
AC Electrical Specification Timing chart
1/fPHASE
twn
50%
50%
50%
twp
PHASE
tpHL(PHASE)
tpLH(PHASE)
90%
90%
50%
50%
OUT
10%
tr
10%
tf
Timing charts may be simplified for explanatory purpose.
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Example Application Circuits
The values shown in the following figure are typical values. For input conditions, see the Operating Ranges.
24 V
0.1 µF
0.1 µF
100 µF
0.51 Ω
GND
GND
OUT_B1-
0.1 µF
GND
Vref_B
OUT_B2-
GND
Vref_A
OSCM
M
3.6 kΩ
GND
270 pF
5 V
OUT_A2-
3.3 V
IN_A1
IN_A2
0 V
0 V
5 V
3.3 V
OUT_A1-
GND
5 V
3.3 V
0 V
0 V
PHASE_A
PHASE_B
5 V
3.3 V
0.51 Ω
5 V
3.3 V 3.3 V
0 V 0 V
5 V
5 V
3.3 V
0 V
Note: I will recommend the addition of a capacitor if necessary. The GND wiring must become one point as much as
possible-earth.
The example of an applied circuit is for reference, and enough evaluation should be done before the
mass-production design.
Moreover, it is not the one to permit the use of the industrial property.
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Package Dimensions
P-WQFN36-0606-0.50-002
(unit: mm)
Weight: 0.10 g (typ.)
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Notes on Contents
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
Timing Charts
Timing charts may be simplified for explanatory purposes.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass-production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application
equipment.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device
breakdown, damage or deterioration, and may result in injury by explosion or combustion.
(2) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in
injury by explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is
applied even just once.
(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the
case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit
location, are required.
(4)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in
protection functions. If the power supply is unstable, the protection function may not operate, causing
IC breakdown. IC breakdown may cause injury, smoke or ignition.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
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(BTL) connection-type IC that inputs output DC voltage to a speaker directly.
Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status
immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
thermal shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take
into consideration the effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power
supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s
motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To
avoid this problem, take the effect of back-EMF into consideration in system design.
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RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
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OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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