HN2D03F [TOSHIBA]
High Speed Switching Application; 高速开关应用![HN2D03F](http://pdffile.icpdf.com/pdf1/p00113/img/icpdf/HN2D03F_618051_icpdf.jpg)
型号: | HN2D03F |
厂家: | ![]() |
描述: | High Speed Switching Application |
文件: | 总4页 (文件大小:217K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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HN2D03F
TOSHIBA Diode Silicon Epitaxial Planar Type
HN2D03F
High Speed Switching Application
Unit in mm
z Small package
z Low forward voltage
z Small total capacitance
: V
= 0.94V (typ.)
F (2)
: C = 2.5pF (typ.)
T
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Maximum (peak) reverse voltage
Reverse voltage
V
420
400
V
V
RM
V
R
Maximum (peak) forward current
Average forward current
Surge current (10ms)
Power dissipation
I
300*
100*
2*
mA
mA
A
FM
I
O
I
FSM
P
1.CATHODE(C1)
300**
150
mW
°C
°C
2.CATHODE(C2)
3.CATHODE(C3)
4.ANODE (A3)
5.ANODE (A2)
6.ANODE (A1)
Junction temperature
T
j
Storage temperature
T
−55~150
stg
―
―
JEDEC
JEITA
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum
ratings.
1-3K1C
TOSHIBA
Weight: 0.015mg(typ.)
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
*: Absolute Maximum Ratings per each one of Q1,Q2 or Q3. In case of simultaneous use, the Absolute Maximum
Ratings per diode shall be derated to 75%.
**: Total rating
Electrical Characteristics (Q1, Q2, Q3, Common, Ta = 25°C)
Test
Circuit
Characteristic
Symbol
Test Condition
= 10mA
Min
Typ.
Max
Unit
V
V
V
―
I
I
―
―
―
―
―
―
0.8
1.0
―
―
1.3
0.1
1.0
―
F (1)
F (2)
R (1)
R (2)
F
F
Forward voltage
―
= 100mA
I
I
―
V
V
V
= 300V
R
R
R
Reverse current
μA
―
= 400V
―
Total capacitance
C
T
―
= 0, f = 1MHz
2.5
0.5
pF
us
Reverse recovery time
t
―
I
= 10mA (fig.1)
F
―
rr
1
2007-11-22
HN2D03F
Pin Assignment (Top View)
Marking
6
5
4
A7
Q3
Q2
Q1
1
2
3
Fig.1 Reverse Recovery Time (t ) Test Circuit
rr
10ns
2
2007-11-22
HN2D03F
P * – Ta
C
500
400
300
200
100
0
0
25
50
75
100
125
150
175
AMBIENT TEMPERATURE Ta (°C)
*Total Rating.
3
2007-11-22
HN2D03F
RESTRICTIONS ON PRODUCT USE
20070701-EN GENERAL
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
4
2007-11-22
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