UCC3913DG4 [TI]

Negative Floating Single, Hot-Swap IC Commercial Temp. 8-SOIC 0 to 70;


型号：	UCC3913DG4
厂家：	TEXAS INSTRUMENTS
描述：	Negative Floating Single, Hot-Swap IC Commercial Temp. 8-SOIC 0 to 70 信息通信管理光电二极管
文件：	总21页 (文件大小：708K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

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FEATURES

DESCRIPTION

Precision Fault Threshold

The UCCx913 family of negative voltage circuit

breakers provides complete power management,

hot-swap, and fault handling capability. The

device is referenced to the negative input voltage

and is driven through an external resistor

connected to ground, which is essentially a

current drive as opposed to the traditional voltage

drive. The on-board 10-V shunt regulator protects

the device from excess voltage and serves as a

reference for programming the maximum

allowable output sourcing current during a fault. In

the event of a constant fault, the internal timer

limits the on-time from less than 0.1% to a

maximum of 3%. The duty cycle modulates

depending on the current into the PL pin, which is

a function of the voltage across the FET, and limits

average power dissipation in the FET. The fault

level is fixed at 50 mV across the current-sense

resistor to minimize total dropout. The fault current

level is set with an external current sense resistor.

The maximum allowable sourcing current is

programmed with a voltage divider from VDD to

generate a fixed voltage on the IMAX pin. The

current level, when the output appears as a

Programmable Average Power Limiting

Programmable Linear Current Control

Programmable Overcurrent Limit

Programmable Fault Time

Fault Output Indicator

Shutdown Control

Undervoltage Lockout

8-Pin SOIC

APPLICATIONS

–48-V Distributed Power Systems

Central Office Switching

Wireless Base Stations

SIMPLIFIED APPLICATION DIAGRAM

VDD

DC/DC

Converter

or Load

current source, is equal to V

. If

IMAX SENSE

desired, a controlled current startup can be

programmed with a capacitor on the IMAX pin.

Power

Limiting

When the output current is below the fault level,

the output device is switched on. When the output

current exceeds the fault level, but is less than the

maximum sourcing level programmed by the

IMAX pin, the output remains switched on, and the

fault timer starts charging CT. Once CT charges to

2.5 V, the output device is turned off and performs

a retry some time later. When the output current

reaches the maximum sourcing current level, the

output appears as a current source, limiting the

output current to the set value defined by IMAX.

Current

Control

Fault

Protection

and

Timer

VDD

UCC3913

Other features of the UCCx913 family include

undervoltage lockout, and 8-pin small outline

(SOIC) and dual-in-line (DIP) packages.

UDG–03059

–VIN

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

(1)

PACKAGE

PART NUMBER

UCC2913N

UCC2913D

UCC3913N

UCC3913D

PDIP (N)

SOIC (D)

PDIP (N)

SOIC (D)

–40°C to 85°C

–0°C to 70°C

(1)

The N and D packaged are also available taped and reeled.

Add an R suffix to the device type (i.e., UCC2913NR).

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted

(1)

UCC2923

UCC3913

UNIT

Input voltage

IMAX

VDD

limited to VDD

SHUTDOWN

Input current

Operating junction temperature range, T

–55 to 150

–65 to 150

300

Storage temperature, T

stg

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to

VSS (the most negative voltage). All currents are positive into and negative out of the specified terminal.

RECOMMENDED OPERATING CONDITIONS

MIN NOM MAX UNIT

20 mA

Input current, I

VDD

N PACKAGE

(TOP VIEW)

D PACKAGE

(TOP VIEW)

SD/FLT

IMAX

VDD

SD/FLT

IMAX

VDD

OUT

SENSE

VSS

OUT

SENSE

VSS

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

ELECTRICAL CHARACTERISTICS

= –40°C to 85°C for UCC2913, T = 0°C to 70°C for UCC3913, T = T = 2 mA, CT = 4.7 pF, T = T (unless otherwise noted)

A, VDD A J

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

INPUT SUPPLY

Minimum input current, VDD

Regulator voltage

9.5

10.5

2 mA≤ I

SOURCE

≤ 10 mA

8.5

Undervoltage lockout off-voltage

FAULT TIMING

T = 25 °C

47.5

46.0

50.0

53.0

53.5

500

–50

Overcurrent threshold voltage

Overcurrent input bias

Over temperature

= 1.0 V,

= 0 A

–22

–36

µA

Timing capacitance charge current

Overload condition,

–0.7

–1.2

–1.7

– V

IMAX

= 300 mV

SENSE

= 1.0 V,

Timing capacitance discharge current

Timing capacitance fault threshold voltage

Timing capacitance reset threshold voltage

Output duty cycle

= 0 A

0.6

2.2

1.0

2.4

1.5

2.6

µA

0.32

1.7%

0.50

2.7%

0.62

3.7%

Fault condition,

OUTPUT

= 0 A

8.5

OUT

High-level output voltage

Low-level output voltage

= –1 A

= 0 A,

0.01

0.6

– V

= 100mV

SENSE

IMAX

= 2 A,

OUT

0.2

– V

SENSE

LINEAR AMPLIFIER

= 100 mV

= 400 mV

100

400

115

430

500

IMAX

Sense control voltage

370

IMAX

Input bias

SHUTDOWN/FAULT

Shutdown threshold voltage

Input current

1.4

1.7

2.0

= 5 V

µA

SD/FLT

High-level output voltage

Low-level output voltage

Delay-to-output time

POWER LIMITING

PL regulator voltage

6.0

7.5

9.0

0.01

300

150

= 64 µA

4.35

0.6%

4.85

1.2%

0.1%

5.35

1.7%

= 64 µA

Duty cycle control

= 1 mA

0.045%

0.17%

OVERLOAD

Delay-to-output time

Output sink current

Overload threshold voltage

300

100

200

500

260

– V

= 300mV

SENSE

IMAX

Relataive to I

140

IMAX

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

A capacitor is connected to this pin in order to set the maximum fault time.

This pin programs the maximum allowable sourcing current.

Output drive to the MOSFET pass element.

IMAX

OUT

This feature ensures that the average MOSFET power dissipation is controlled.

Input voltage from the current sense resistor.

SENSE

SD/FLT

VDD

This pin provides fault output indication and shutdown control.

Current driven with a resistor to a voltage at least 10V more positive than VSS.

Ground reference for the device and the most negative voltage available.

VSS

DETAILED PIN DESCRIPTIONS

A capacitor connected to this pin allows setting of the maximum fault time. The maximum fault time must be

more than the time to charge external load capacitance. The maximum fault time is defined as:

ǒ_{2 C}_TǓ

FAULT

(1)

(2)

where

+ 36 mA ) I

and I is the current into the power limit pin. Once the fault time is reached the output shuts down for a time

given by:

+ 2 10 C

(3)

IMAX

This pin programs the maximum allowable sourcing current. Since V

is a regulated voltage, a voltage divider

can be derived from V

to generate the program level for the IMAX pin. The current level at which the output

appears as a current source is equal to the voltage on the IMAX pin over the current sense resistor. If desired,

a controlled current startup can be programmed with a capacitor on the IMAX pin, and a programmed start delay

can be achieved by driving the shutdown with an open collector/drain device into an R-C network.

This pin’s feature ensures that the average MOSFET power dissipation is controlled. A resistor is connected

from this pin to the drain of the N-channel MOSFET pass element. When the voltage across the N-channel

MOSFET exceeds 5 V, current flows into the PL pin which adds to the fault timer charge current, reducing the

duty cycle from the 3% level. When I is much greater 36 µA, then the average MOSFET power dissipation

is given by:

+ IMAX 1 10

FET(avg)

(4)

SENSE

Input voltage from the current sense resistor. When there is greater than 50 mV across this pin with respect to

VSS, a fault is sensed, and C starts to charge.

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

DETAILED PIN DESCRIPTIONS (continued)

SD/FLT

This pin provides fault output indication and shutdown control. Interface into and out of this pin is usually

performed through level shift transistors. When 20 µA is sourced into this pin, shutdown drives high causing the

output to disable the N-channel MOSFET pass device. When opened, and under a non-fault condition, the

SD/FLT pin pulls to a low state. When a fault is detected by the fault timer, or undervoltage lockout, this pin drives

to a high state, indicating the output MOSFET is off.

VDD

Current driven with a resistor to a voltage at least 10-V more positive than VSS. Typically a resistor is connected

to ground. The 10-V shunt regulator clamps VDD at 10 V above the VSS pin, and is also used as an output

reference to program the maximum allowable sourcing current.

BLOCK DIAGRAM

VDD

IMAX

UVLO

1= UNDERVOLTAGE

LOGIC

SUPPLY

5.0V

REF

–

9.5-V SHUNT

REGULATOR

0.2 V

5.0 V

–

OUT

–

LINEAR

CURRENT

AMPLIFIER

OVERLOAD COMPARATOR

DISABLE

SD/FLT

SENSE

VSS

ON–TIME

CONTROL

50 mV

SOURCE

ONLY

–

20 µA

OVERCURRENT

COMPARATOR

UDG–99001

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

APPLICATION INFORMATION

Typical Fault Mode

Figure 1 shows the detailed circuitry for the fault timing function of the UCCx913. This initial discussion of the

typical fault mode ignores the overload comparator, and current source I3. Once the voltage across the current

sense resistor, R , exceeds 50 mV, a fault has occurred. This causes the timing capacitor to charge with a

combination of 36 µA plus the current from the power limiting amplifier. The PL amplifier is designed to source

current into the CT pin only and to begin sourcing current once the voltage across the output FET exceeds 5 V.

The current I is related to the voltage across the FET with the following expression:

* 5 V

FET

(5)

where V

is the voltage across the N-channel MOSFET pass device.

FET

(How this feature limits average power dissipation in the pass device is described in further detail in the following

sections). Note that under a condition where the output current is more than the fault level, but less than the

maximum level, V

≈ V (input voltage), I = 0, the C charging current is 36 µA.

OUT

LOAD

0.2 V

OVERLOAD COMPARATOR

IMAX

–

SENSE

36 µA

–

1mA

5.0 V

TO OUTPUT

DRIVE

OUTPUT

OVERCURRENT

COMPARATOR

H=OFF

SENSE

2.5 V

H=CLOSE

–

50 mV

–

H=CLOSE

VSS

1 µA

–

0.5 V

VSS

INPUT VOLTAGE

FAULT TIMING CIRCUITRY

UDG–99004

VSS

Figure 1. Fault Timing Circuitry Including Power Limit and Overload Comparator

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

APPLICATION INFORMATION

During a fault, C charges at a rate determined by the internal charging current and the external timing capacitor.

Once C charges to 2.5 V, the fault comparator switches and sets the fault latch. Setting of the fault latch causes

both the output to switch off and the charging switch to open. C must now discharge with the 1-µA current

source, I2, until 0.5 V is reached. Once the voltage at CT reaches 0.5 V, the fault latch resets, which re-enables

the output and allows the fault circuitry to regain control of the charging switch. If a fault is still present, the fault

comparator closes the charging switch causing the cycle to begin. Under a constant fault, the duty cycle is given

by:

1 mA

) 36 mA

Duty Cycle +

(6)

Average power dissipation in the pass element is given by:

1 mA

) 36 mA

ǒ Ǔ

+ V

IMAX

FET

FET(avg)

(7)

(8)

(9)

Where VFET >> 5 V I can be approximated as :

FET

and where I >> 36 µA, the duty cycle can be approximated as :

1 mA R

Duty Cycle +

FET

Therefore, the maximum average power dissipation in the MOSFET can be approximated by:

1 mA R

ǒ Ǔ_{+ IMAX 1 mA R}

+ V

IMAX

FET

FET(avg)

FET

(10)

Notice that in the approximation, V

MOSFET pass element.

cancels. therefore, average power dissipation is limited in the N-channel

FET

Overload Comparator

The linear amplifier in the UCCx913 ensures that the output N-channel MOSFET does not pass more than I

MAX

(which is V

/R ). In the event the output current exceeds the programmed IMAX by 0.2 V/R which can only

IMAX

S S(

occur if the output MOSFET is not responding to a command from the device) the CT pin begins charging with

I3, 1 mA, and continue to charge to approximately 8 V. This allows a constant fault to show up on the SD/FLT

pin, and also since the voltage on CT charges past 2.5 V only in an overload fault mode, it can be used for

detection of output FET failure or to build in redundancy in the system.

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

APPLICATION INFORMATION

Determining External Component Values (See FIgure 2)

To set R

the following must be achieved:

VDD

IN(min)

10 V

) 2 mA

(

)

R1 ) R2

VDD

(11)

In order to estimate the minimum timing capacitor, C , several things must be taken into account. For example,

given the schematic below as a possible (and at this point, a standard) application, certain external component

values must be known in order to estimate C

T(min)

Then use the given the values of C

IMAX pin, to calculate the approximate startup time of the node V

, Load, R

, VSS, and the resistors determining the voltage on the

OUT

SENSE

. This startup time must be faster than the

OUT

time it takes for CT to charge to 2.5 V (relative to VSS), and is the basis for estimating the minimum value of

CT. In order to determine the value of the sense resistor, R , assuming the user has determined the fault

SENSE

current, R

can be calculated by:

SENSE

50 mV

SENSE

FAULT

(12)

is the maximum current that the device allows through the transistor, M1,

Next, calculate the variable I

. I

MAX MAX

and during startup with an output capacitor the power MOSFET, M1, can be modeled as a constant current

source of value I

where:

MAX

IMAX

MAX

SENSE

(13)

where V

= voltage on IMAX pin.

IMAX

VDD

OUT

IMAX

SENSE

LOAD

SENSE

VSS

UCC3913

VSS

Note: LOAD = I

LOAD

For Current Source Load

For Resistive Load

LOAD = R

OUT

UDG–03045

Figure 2. External Component Connections

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

APPLICATION INFORMATION

TIMING DIAGRAM

OUT

MAX

FAULT

Output

Current

Io(nom)

VCT

2.5V

Voltage

(w/respect to VSS)

0.5V

OUT

Output

Voltage

(w/respect to GND)

VSS

t9 t10

TIME

DESCRIPTION

Safe condition. Output current is nominal, output voltage is at the negative rail, VSS.

Fault control reached. Output current reaches the programmed fault value. CT begins to charge at approximately

36-µA.

Maximum current reached. Output current reaches the programmed maximum level and becomes a constant current

with value IMAX.

Fault occurs. CT has charged to 2.5V. Fault output goes high. The FET turns off allowing no output current to flow.

VOUT floats up to ground.

Retry. CT has discharged to 0.5 V, but fault current is still exceeded, CT begins charging again, FET is on, V

down to VSS.

pulled

OUT

t5 = t3. Illustrates 3% duty cycle.

t6 = t4

Output short circuit. If V

OUT

is short circuited to ground, CT charges at a higher rate depending upon the values for

VSS and R

Fault occurs. Output is still short circuited, but the occurrence of a fault turns the FET off so no current is conducted.

t9 = t4. Output short circuit released, still in fault mode.

t10

t10 = t0. Fault released. Safe condition. Return to normal operaton of the circuit breaker.

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

APPLICATION INFORMATION

VDD

VSS

VDD

IMAX

OUTPUT

UVLO

1 = UNDERVOLTAGE

LOGIC

SUPPLY

5.0 V

REF

–

9.5 SHUNT

REGULATOR

OUT

–

LINEAR

CURRENT

AMPLIFIER

–

50 Ω

DISABLE

SD/FLT

SENSE

VSS

ON–TIME

CONTROL

SOURCE

ONLY

–

FAULT=

50 mV

20 µA

VSS

UDG–99002

Figure 3. Typical Application Diagram

To calculate the startup time using the current source load.

|VSS|

OUT

START

* I

MAX

LOAD

(14)

(15)

To calculate the startup time using the resistive load.

MAX

OUT

_lnǒ

+ C

OUT OUT

START

* |VSS|

MAX

OUT

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

APPLICATION INFORMATION

Once t

is calculated, the power limit feature of the UCCx913 must be addressed and component values

START

derived. Assuming the designer chooses to limit the maximum allowable average power that is associated with

the circuit breaker, the power limiting resistor, R , can be easily determined by the following:

FET(avg)

1 mA I

MAX

(16)

(17)

where a minimum R exists defined by

|VSS|

PL(min)

10mA

Finally, after computing the aforementioned variables, the minimum timing capacitor can be derived for a current

source load with the following equation.

ǒ_{98 mA R ) |VSS| * 10 V}Ǔ

START

T(min)

4 V R

(18)

(19)

The minimum timing capacitor can be derived for a resistive load with the following equation.

T(min)

ǒ_{49 mA R}

_OUTǓ _) R

OUT

) |VSS| * 5 V * I

|VSS|

OUT

START

MAX

2 V R

AVERAGE POWER DISSIPATION

MOSFET VOLTAGE

25.0

= 4 A

MAX

= ∞

22.5

UCC2913

UCC3913

LOCAL VDD

20.0

17.5

SHUTDOWN

FAULT OUT

= 10 MΩ

15.0

12.5

10.0

= 500 kΩ

= 5 MΩ

LOCAL GND

= 200 kΩ

LEVEL SHIFT

SD/FLT

7.5

= 2 MΩ

= 1 MΩ

5.0

2.5

VSS

UDG–99003

100 125 150 175 200

FET

– MOSFET Voltage– V

Figure 5

Figure 4. Possible Level Shift Circuitry Interface

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SLUS274A – JANUARY 1999 – REVISED APRIL 2003

SAFETY RECOMMENDATION

Although the UCC3913 is designed to provide system protection for all fault conditions, all integrated circuits

can ultimately fail short. For this reason, if the UCC3913 is intended for use in safety critical applications where

UL or some other safety rating is required, a redundant safety device such as a fuse should be placed in series

with the device. The UCC3913 will prevent the fuse from blowing for virtually all fault conditions, increasing

system reliability and reducing maintenance cost, in addition to providing the hot swap benefits of the device.

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PACKAGE OPTION ADDENDUM

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17-May-2014

PACKAGING INFORMATION

Orderable Device

UCC2913D

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 85

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

UCC2913

UCC2913DG4

UCC2913DTR

UCC2913DTRG4

ACTIVE

Green (RoHS

& no Sb/Br)

-40 to 85

UCC2913

2500

Green (RoHS

& no Sb/Br)

-40 to 85

Green (RoHS

& no Sb/Br)

-40 to 85

UCC2913J

UCC2913N

UCC2913NG4

UCC3913D

OBSOLETE

ACTIVE

CDIP

PDIP

SOIC

TBD

Call TI

-40 to 85

0 to 70

UCC2913N

Call TI

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

UCC3913

UCC3913N

UCC3913DG4

UCC3913DTR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

2500

Green (RoHS

& no Sb/Br)

UCC3913DTRG4

Green (RoHS

& no Sb/Br)

UCC3913N

OBSOLETE

PDIP

TBD

Call TI

0 to 70

UCC3913NG4

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

17-May-2014

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

UCC2913DTR

UCC3913DTR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

UCC2913DTR

UCC3913DTR

SOIC

2500

367.0

35.0

Pack Materials-Page 2

MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUARY 1997

JG (R-GDIP-T8)

CERAMIC DUAL-IN-LINE

0.400 (10,16)

0.355 (9,00)

0.280 (7,11)

0.245 (6,22)

0.065 (1,65)

0.045 (1,14)

0.310 (7,87)

0.290 (7,37)

0.063 (1,60)

0.015 (0,38)

0.020 (0,51) MIN

0.200 (5,08) MAX

0.130 (3,30) MIN

Seating Plane

0.023 (0,58)

0.015 (0,38)

0°–15°

0.100 (2,54)

0.014 (0,36)

0.008 (0,20)

4040107/C 08/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP1-T8

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UCC3913DG4 [TI]

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