UCC39151DP [ETC]
Power Control/Management ; 电源控制/管理\n
| 型号： | UCC39151DP |
| 厂家： | 
ETC |
| 描述： | Power Control/Management
|
| 文件： | 总6页 (文件大小：229K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UCC39151
15V Programmable Hot Swap Power Manager
FEATURES
DESCRIPTION
• Integrated 0.15Ω Power MOSFET
The UCC39151 Programmable Hot Swap Power Manager provides com-
plete power management, hot swap capability, and circuit breaker func-
tions. The only external component required to operate the device, other
• 7V to 15V Operation
than power supply bypassing, is the fault timing capacitor, C . All control
• Digital Programmable Current Limit
T
from 0A to 3A
and housekeeping functions are integrated, and externally programmable.
These include the fault current level, maximum output sourcing current,
maximum fault time, and startup delay. In the event of a constant fault, the
Internal fixed 2% duty cycle ratio limits average output power.
• Programmable ON Time
• Programmable Start Delay
• Fixed 2% Duty Cycle
• Thermal Shutdown
The internal 4 bit DAC allows programming of the fault level current from
0A to 3A with 0.25A resolution. The IMAX control pin sets the maximum
sourcing current to 1A above the trip level or to a full 4A of output current
for fast output capacitor charging.
• Fault Output Indicator
When the output current is below the fault level, the output MOSFET is
switched ON with a nominal ON resistance of 0.15Ω. When the output cur-
rent exceeds the fault level, but is less than the maximum sourcing level,
the output remains switched ON, but the fault timer starts, charging CT.
Once CT charges to a preset threshold, the switch is turned OFF, and re-
mains OFF for 50 times the programmed fault time. When the output cur-
rent reaches the maximum sourcing level, the MOSFET transitions from a
switch to a constant current source.
• Maximum Output Current can be set
to 1A above the Programmed Fault
Level or to a full 4A
• Power SOIC and TSSOP, Low
Thermal Resistance Packaging
(continued)
BLOCK DIAGRAM
Note: Pin numbers refer to DIL-16 and SOIC-16 packages.
UDG-94136-3
02/99
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UCC39151
ABSOLUTE MAXIMUM RATINGS
DESCRIPTION (cont.)
VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15.5 Volts
VOUT VIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.3V
FAULT Sink Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
FAULT Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 to 8V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting
TTL Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 to VIN
Storage Temperature . . . . . . . . . . . . . . . . . . . 65 C to +150 C
Junction Temperature. . . . . . . . . . . . . . . . . . . 55 C to +150 C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300 C
The UCC39151 can be put into sleep mode, drawing
only 20mA of supply current. Other features include an
open drain Fault Output Indicator, Thermal Shutdown,
Undervoltage Lockout, 7V to 15V operation, and low
thermal resistance SOIC and TSSOP Power Packages.
Currents are positive into, negative out of the specified termi-
nal. Consult Packaging Section of Databook for thermal limita-
tions and considerations of packages.
CONNECTION DIAGRAMS
DIL-16, SOIC-16 (Top View)
N, DP Package
PWP-24 (Top View)
TSSOP Package
SHTDWN
VIN
1
2
3
4
5
6
7
8
9
24 FAULT
23 VOUT
22 VOUT
21 N/C
SHTDWN
VIN
1
2
3
4
5
6
7
8
16 FAULT
15 VOUT
14 VOUT
13 GND*
12 GND*
11 CT
VIN
VIN
N/C
GND*
GND*
GND*
GND*
EGND*
20 GND*
19 GND*
18 GND*
17 GND*
16 N/C
GND*
EGND*
B3
B2
10 IMAX
B3 10
B2 11
B1 12
15 CT
B1
9
B0
14 IMAX
13 B0
*Pin 5 serves as lowest impedance to the electrical ground;
Pins 4, 12, and 13 serve as heat sink/ground. These pins
should be connected to large etch areas to help dissipate heat.
For N Package, pins 4, 12, and 13 are N/C.
*Pin 9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins should
be connected to large etch areas to help dissipate heat.
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = 0°C to 70°C for the
UCC39151, VIN = 12V, IMAX = 0.4V, SHTDWN = 2.4V, TA = TJ.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
Supply Section
Voltage Input Range
Supply Current
7.0
15.0
2.0
150
20
V
1.0
mA
µA
mA
Sleep Mode Current
Output Leakage
Output Section
Voltage Drop
SHTDWN = 0.2V, No load
SHTDWN = 0.2V
100
IOUT = 1A (10V to 12V)
0.15
0.3
0.3
0.6
0.9
0.4
0.8
1.2
V
V
V
V
V
V
IOUT = 2A (10V to 12V)
IOUT = 3A (10V to 12V)
0.45
0.2
IOUT = 1A, VIN = 7V and 15V
IOUT = 2A, VIN = 7V and 15V
IOUT = 3A, VIN = 7V, 12V Max.
0.4
0.6
2
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UCC39151
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = 0°C to 70°C for the
UCC39151, VIN = 12V, IMAX = 0.4V, SHTDWN = 2.4V, TA = TJ.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
Output Section (continued)
Initial Startup Time
Short Circuit Response
DAC Section
(Note 2)
(Note 2)
100
100
µs
ns
Trip Current
Code = 0000-0011 (Device Off)
Code = 0100
0.07
0.32
0.50
0.75
1.0
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.0
0.45
0.7
A
A
A
A
A
A
A
A
A
A
A
A
A
Code = 0101
Code = 0110
0.98
1.3
Code = 0111
Code = 1000
1.6
Code = 1001
1.25
1.5
1.85
2.15
2.4
Code = 1010
Code = 1011
1.70
1.90
2.1
Code = 1100
2.7
Code = 1101
2.95
3.25
3.5
Code = 1110
2.30
2.50
0.35
Code = 1111
Max Output Current Over Trip (Current Source
Mode)
Code = 0100 to 1111, IMAX = 0V
1.0
1.65
Max Output Current (Current Source Mode)
Fault Output Section
CT Charge Current
Code = 0100 to 1111, IMAX = 2.4V
3.0
4.0
5.2
A
VCT = 1.0V
VCT = 1.0V
VOUT = 0V
83
0.8
1.0
1.2
0.4
–62
1.2
1.9
1.5
0.5
47
1.8
3.3
1.7
0.6
µA
µA
%
V
CT Discharge Current
Output Duty Cycle
CT Fault Threshold
CT Reset Threshold
V
Shutdown Section
Shutdown Threshold
1.1
1.5
150
100
1.9
V
Shutdown Hysteresis
mV
nA
Input Current
500
Open Drain Output Section
High Level Output Current
Low Level Output Voltage
TTL Input DC Characteristics Section
TTL Input Voltage High
TTL Input Voltage Low
TTL Input High Current
TTL Input Low Current
FAULT = 5V
IOUT = 5mA
250
0.8
µA
0.2
V
2.0
V
V
0.8
10
1
VIH = 2.4V
3
µA
µA
VIL = 0.4V
Note 1: All voltages are with respect to Ground. Current is positive into and negative out of the specified terminal.
Note 2: Guaranteed by design. Not 100% tested in production.
3
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UCC39151
PIN DESCRIPTIONS
B0, B1, B2, B3: These pins provide digital input to the IMAX: When this pin is set to a logic low, the maximum
DAC, which sets the fault current threshold. They can be sourcing current will always be 1A above the pro-
used to provide a digital soft-start and adaptive current grammed fault level. When set to a logic high, the maxi-
limiting.
mum sourcing current will be a constant 4A for
applications which require fast charging of load capaci-
tance.
CT: A capacitor connected to ground sets the maximum
fault time. The maximum fault time must be more than
the time required to charge the external capacitance in SHTDWN: When this pin is brought to a logic low, the IC
one cycle. The maximum fault time is defined as:
is put into a sleep mode drawing typically less than
100µA of I (with V unloaded). The input threshold
is hysteretic, allowing the user to program a startup delay
TFAULT =16.1• 103 • CT .
CC
OUT
Once the fault time is reached the output will shutdown with an external RC circuit.
for a time given by:
VIN: Input voltage to the UCC39151. The recommended
voltage range is 7V to 15V. Both VIN pins should be con-
nected together and connected to power source.
TSD =833 • 103 • CT ,
this equates to a 1.9% duty cycle.
VOUT: Output voltage from the UCC39151. Both VOUT
pins should be connected together and connected to the
load. When switched:
FAULT: Open drain output, which pulls low upon any
fault or interrupt condition, Fault, or Thermal Shutdown.
(
)
VOUT ≈VIN − 0.15Ω• IOUT
VOUT must not exceed VIN by more than 0.3V.
APPLICATIONS INFORMATION
HEATSINK GROUND PINS
4
12
13
5
V
IN
GND
GND
GND
GND
2
3
VIN
VIN
+5V
VOUT 14
C
IN
R
C
OUT
L
15
R1
UCC39151
R
SD
LED
V
IN
16 FAULT
11 CT
SHTDWN
1
S6
C
SD
B0
9
B1
8
B2
7
B3
6
IMAX
10
C
T
V
IN
S1
S2
S3
S4
S5
DIP SWITCH
UDG-98176
Figure 1. Evaluation circuit.
4
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UCC39151
APPLICATION INFORMATION (cont.)
UDG-94138
Estimating Maximum Load Capacitance
For hot swap applications, the rate at which the total Where V
output capacitance can be charged depends on the
is the output voltage.
OUT
For a resistive load of value R , the value of C
I
OUT(max)
maximum output current available and the nature of the
load. For a constant-current, current-limited application,
the output will come up if the load asks for less than the
maximum available short-circuit current.
can be estimated from:
To guarantee recovery of a duty-cycle from a short-
circuited load condition, there is a maximum total output
capacitance which can be charged for a given unit ON
time (Fault time). The design value of ON or Fault time
16.1• 103 • CT
COUT (max)
≈
1
VOUT
RL •
n
can be adjusted by changing the timing capacitor C .
T
1−
For worst-case constant-current load of value just less
IMAX • RL
than the trip limit; C
can be estimated from:
OUT(max)
Long C times must consider the maximum tempera-
ture. Thermal shutdown protection may be the limiting
Fault time.
T
16.1• 103 • CT
(
)
COUT (max) ≈ IMAX −ILOAD
•
VOUT
Figure 2. Load current, timing capacitor voltage, and output voltage of the UCC39151 under fault conditions.
SAFETY RECOMMENDATIONS
Although the UCC39151 is designed to provide system
protection for all fault conditions, all integrated circuits
can ultimately fail short. For this reason, if the
UCC39151 is intended for use in safety critical applica-
tions where UL or some other safety rating is required, a
redundant safety device such as a fuse should be placed
in series with the device. The UCC39151 will prevent the
fuse from blowing for virtually all fault conditions, in-
creasing system reliability and reducing maintenance
cost, in addition to providing the hot swap benefits of the
device.
UNITRODE CORPORATION
7 CONTINENTAL BLVD ( MERRIMACK, NH 03054
TEL (603) 424-2410 ( FAX (603) 424-3460
5
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IMPORTANT NOTICE
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pertaining to warranty, patent infringement, and limitation of liability.
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accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
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DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
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Copyright 1999, Texas Instruments Incorporated
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