TXS0202YZPR [TI]
A Inter Chip-USB Voltage Level Translator Small Packages: WCSP; 国米芯片的USB电压电平转换小型封装： WCSP
| 型号： | TXS0202YZPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | A Inter Chip-USB Voltage Level Translator Small Packages: WCSP |
| 文件： | 总9页 (文件大小：167K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TXS0202
www.ti.com
SCES711A –JUNE 2011–REVISED JUNE 2011
A Inter Chip-USB Voltage Level Translator
Check for Samples: TXS0202
1
FEATURES
1
2
•
•
•
No Direction Control Signal Required
VCCA, VCCB Supply Voltage: 1.65 V to 3.6 V
Meets All Requirements of the IC-USB
Standard
A
B
C
D
•
•
Small Packages: WCSP
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
•
Ioff Supports Partial-Power-Down Mode
Operation
ESD Performance
Table 1. YZP TERMINAL ASSIGNMENTS
(Top Through View)
–
A port (Host-Side)
1
2
–
–
–
2000-V Human-Body Model
100-V Machine Model
500-V Charged-Device Model
A
B
C
D
D+(B)
GND
VCCA
D+(A)
D–(B)
VCCB
OE
–
B port (Peripheral-Side)
>4kV HBM
D–(A)
–
DESCRIPTION
The TXS0202 is a 2-bit voltage level translator optimized for use in Interchip USB (IC-USB) applications. VCCA
and VCCB can each operate over the full range of 1.65 V to 3.6 V. The device has been designed to maintain
cross-over skew to be less than 1 ns. The device has integrated pull-ups and pull-down resistors to aid in the
protocol communication between a host and a peripheral. The translator is a buffered auto-direction sensing type
translator. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down. To ensure the
high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor;
the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
WSCP – YZP Tape and reel
TXS0202YZPR
_ _ _ 7PS _(3)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TXS0202
SCES711A –JUNE 2011–REVISED JUNE 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TYPICAL APPLICATION BLOCK DIAGRAM
1.8 V
3 V
V
V
CCB
CCA
D+
D–
D+
D–
D+(A)
D+(B)
D–(B)
GND
Application
Processor
MM SIM Card
D–(A)
OE
TXS0202
PIN FUNCTIONS
PIN
DESCRIPTION
WSCP (YFP)
BALL NO.
NAME
A1
A2
B1
B2
C1
C2
D1
D2
D+(B)
D–(B)
GND
VCCB
VCCA
OE
USB data signal connected to peripheral
USB data signal connected to peripheral
Ground
B-side supply voltage (1.65 V to 3.6 V)
A-side supply voltage (1.65 V to 3.6 V)
Output enable input control
D+(A)
D–(A)
USB data signal connected to host
USB data signal connected to host
FUNCTIONAL TABLE
CONTROL INPUT
OUTPUT CIRCUIT
OPERATION
OE
L
B PORT
Hi-Z
Isolation
Bi-directional communications between host and peripheral
H
Enabled
2
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TXS0202
TXS0202
www.ti.com
SCES711A –JUNE 2011–REVISED JUNE 2011
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX UNIT
VCCA
Supply voltage rang
VCCB
4.6
VCCx + 0.5
VCCx + 0.5
V
V
V
VI
Input voltage range
A port, B port, control inputs
A port, B port
Voltage range applied to any output
in the high-impedance or power-off state
VO
IIK
Input clamp current
Output clamp current
VI < 0
–50
–50
mA
mA
IOK
VO < 0
ICC
IGND
Continuous current through VCCA, VCCB, or GND
Storage temperature range
±100
mA
Tstg
–65
150
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TXS0202
THERMAL METRIC(1)
YZP
8 PINS
102
UNITS
θJA
Junction-to-ambient thermal resistance
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
1.65
MAX
UNIT
VCCA, VCCB
Supply voltage
3.6
V
A port I/Os
B port I/Os
OE
V
CCA – 0.2
VCCA
VIH
High-level input voltage
VCCB – 0.2
VCCB
V
V
VCCA × 0.65
3.6
A port I/Os
B port I/Os
OE
0
0
0
0.15
VIL
Low-level input voltage
0.15
VCCA × 0.35
Δt/Δv
Input transition rise or fall rate
Operating free-air temperature
10
85
ns/V
TA
–40
°C
Copyright © 2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TXS0202
TXS0202
SCES711A –JUNE 2011–REVISED JUNE 2011
www.ti.com
D+
D+
D-
3K
600K
150K
3K
150K
150K
150K
150K
Host
150K
150K
150K
Host
150K
Peripheral
D-
Peripheral
150K
150K
150K
150K
2. Attach Mode
1. Power Up
600K
600K
D+
150K
High-Z
D+
D-
600K
600K
L
3K
Peripheral
150K
3K/600K
3K/600K
Host
150K
D-
Host
Peripheral
150K
150K
150K
High-Z
150K
3. Acknowledge Mode
4. Ready Mode
Figure 1. Block Diagram Showing Different Modes in the TXS0202
4
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TXS0202
TXS0202
www.ti.com
SCES711A –JUNE 2011–REVISED JUNE 2011
ELECTRICAL CHARACTERISTICS
TA = 25°C TA = –40°C to 85°C
PARAMETER
TEST CONDITIONS
VCCA
VCCBx
UNIT
TYP
MIN MAX
VCCO × 0.67
1.65 V
2.3 V
3.3 V
1.65 V
2.3 V
3.3 V
1.65 V
2.3 V
3.3 V
1.65 V
2.3 V
3.3 V
1.65 V
2.3 V
3.3 V
1.65 V
2.3 V
3.3 V
1.65 V
2.3 V
3.3 V
1.65 V
2.3 V
3.3 V
IOH = –20 μA,
VIx ≥ VCCx – 0.2 V
VOH(D–) (D– A or B port)
VCCO × 0.67
VCCO × 0.67
V
V
V
V
IOL = 220 μA, VIx ≤ 0.15 V
IOL = 180 μA, VIx ≤ 0.15 V
IOL = 220 μA, VIx ≤ 0.15 V
0.45
0.55
0.7
VOL(D–) (D– A or B port)
VOH(D+) (D+ A or B port)
VOL(D+) (D– A or B port)
VCCO × 0.67
VCCO × 0.67
VCCO × 0.67
IOH = –20 μA,
VIx ≥ VCCx – 0.2 V
IOL = 220 μA, VIx ≤ 0.15 V
IOL = 300 μA, VIx ≤ 0.15 V
IOL = 620 μA, VIx ≤ 0.15 V
OE
0.45
0.55
0.7
±2
±2
±2
1.65 V to 3.6 V 1.65 V to 3.6 V
D–/D+ A or B port, OE =
OPEN
±2
II
μA
IBOFF, D+, D– B port
IAOFF, D+, D– A port
1.65 V to 3.6 V
0 V
0 V
±2
±2
1.65 V to 3.6 V
1.65 V to 3.6 V 1.65 V to 3.6 V
2.2
2.3
12
VI = VO = Open,
OE = High
ICCA
3.6 V
0 V
0 V
12
μA
μA
3.6 V
0.026
2.7
–1
1.65 V to 3.6 V 1.65 V to 3.6 V
24
VI = VO = Open,
OE = High
ICCB
3.6 V
0 V
0 V
0.031
2.7
–12
24
3.6 V
3.6 V
Ci
OE
3.6 V
2.5
3.5
7.5
10
pF
pF
A port
B port
7
Cio
3.6 V
3.6 V
9.5
Copyright © 2011, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TXS0202
TXS0202
SCES711A –JUNE 2011–REVISED JUNE 2011
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V ± 0.15 V
VCCB = 3.3 V ± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
5
TYP
5
A
B
B
A
tpd
ns
5
5
trA
tfA
trB
tfB
A port rise times
2
2
ns
ns
A port fall times
B port rise times
B port fall times
2
2
2
2
ns
2
2
ns
tsk(o)
Channel-to-channel
0.5
15
0.5
15
ns
Max data rate
Mbps
PARAMETER MEASUREMENT INFORMATION
V
CCI
V
CCI
V
CCO
Input
V
CCI
/2
V
CCI
/2
0 V
DUT
t
t
PLH
PHL
IN
OUT
V
OH
0.9
0.1
V
CCO
18 pF
Output
V /2
CCO
V
CCO
/2
V
CCO
V
OL
t
f
t
r
DATA RATE, SKEW, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A. CL includes probe and jig capacitance.
B. The outputs are measured one at a time, with one transition per measurement.
C. tPLH and tPHL are the same as tpd
.
6
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TXS0202
PACKAGE OPTION ADDENDUM
www.ti.com
2-Jul-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TXS0202YZPR
ACTIVE
DSBGA
YZP
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
RFID
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号：
TXS0206
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER WITH ESD PROTECTION AND EMI FILTERING
TI
TXS0206-29
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER AND LDO VOLTAGE REGULATOR WITH ESD PROTECTION AND EMI FILTERING
TI
TXS0206-29YFPR
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER AND LDO VOLTAGE REGULATOR WITH ESD PROTECTION AND EMI FILTERING
TI
TXS0206-29_0912
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER AND LDO VOLTAGE REGULATOR WITH ESD PROTECTION AND EMI FILTERING
TI
TXS0206-29_1007
MMC, SD CARD, Memory Stick VOLTAGE-TRANSLATION TRANSCEIVER AND LDO VOLTAGE REGULATOR WITH ESD PROTECTION AND EMI FILTERING
TI
TXS0206YFPR
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER WITH ESD PROTECTION AND EMI FILTERING
TI
TXS0206_10
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER WITH ESD PROTECTION AND EMI FILTERING
TI
©2020 ICPDF网 联系我们和版权申明