TXS0206 [TI]
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER WITH ESD PROTECTION AND EMI FILTERING; MMC卡，SD卡，记忆棒™电压转换带ESD保护和EMI滤波收发器
| 型号： | TXS0206 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER WITH ESD PROTECTION AND EMI FILTERING |
| 文件： | 总30页 (文件大小：496K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TXS0206
www.ti.com
SCES697C –AUGUST 2009–REVISED JANUARY 2010
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
WITH ESD PROTECTION AND EMI FILTERING
Check for Samples: TXS0206
1
FEATURES
YFP PACKAGE
(TOP VIEW)
2
•
Level Translator
–
–
VCCA and VCCB Range of 1.1 V to 3.6 V
1 2
3
4
Fast Propagation Delay (4 ns Max When
Translating Between 1.8 V and 3 V)
A
B
C
D
E
•
•
Integrated EMI Filtering and ESD Protection
Circuitry
ESD Protection Exceeds JESD 22 (A Port)
–
–
–
2500-V Human-Body Model (A114-B)
250-V Machine Model (A115-A)
TERMINAL ASSIGNMENTS
1
2
3
4
1500-V Charged-Device Model (C101)
A
B
C
D
E
DAT2A
DAT3A
CMDA
DAT0A
DAT1A
VCCA
CD
WP
DAT2B
DAT3B
CMDB
DAT0B
DAT1B
•
±8-kV Contact Discharge IEC 61000-4-2 ESD
(B-port)
VCCB
GND
CLKB
EN
GND
CLKA
CLK-f
DESCRIPTION/ORDERING INFORMATION
The TXS0206 is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD)
cards, and Memory Stick™ cards. It includes a high-speed level translator along with ESD protection and EMI
filtering circuitry.
The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full
range of 1.1 V to 3.6 V. The TXS0206 enables system designers to easily interface applications processors or
digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory
card. To meet this need, the TXS0206 incorporates ±8-kV Contact Discharge protection on the card side.
The TXS0206 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of
1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used
in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static
power consumption and small package size make the TXS0206 an ideal choice for these applications.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
–40°C to 85°C
WCSP – YFP (Pb-free) Tape and reel
TXS0206YFPR
_ _ _3T_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
TXS0206
SCES697C –AUGUST 2009–REVISED JANUARY 2010
www.ti.com
REFERENCE DESIGN
V
CCA
V
CCB
V
CCB
C3
0.1 µF
C4
0.1 µF
C1
0.1 µF
J1
U1A
U2
A2
D1
DAT2B
DAT3B
CMDB
0
1
B3
D4
DAT2
DAT3
CMD
VSS1
VDD
VDDA
DAT0
DAT1
DAT2
DAT3
CMD
CLK
VCCA
VCCB
DAT0B
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
CLKA
CLK-f
GND
2
DAT0B
E1
A1
B1
3
4
E4 DAT1B
A4 DAT2B
B4 DAT3B
DAT1B
DAT2B
DAT3B
5
CLKB
CLK
6
VSS2
DAT0
DAT1
C1
DAT0B
DAT1B
7
D2
E2
C2
8
C4 CMDB
CMDB
CLKB
9
CLKB
D3
WP/CD (Physical)
CD (Physical)
GND
CLKin
GND
WP
10
11
12
13
CD
A3
B2
WP
CD
WP
CD
C3
GND
GND
WP
WP (Physical)
CD
54794-0978
SD/SDIO Card
Connector
Processor
SD/SDIO MMC
TXS0206
Figure 1. Interfacing With SD/SDIO Card
2
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TXS0206
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
V
CCA
V
CCB
V
CCB
C3
0.1 µF
C4
0.1 µF
C1
0.1 µF
U1A
U2
A2
D1
1
B3
D4
VCCA
VCCB
VSS
VDDA
DAT0
DAT1
DAT2
DAT3
CMD
CLK
CMDB
DAT1B
DAT0B
DAT2B
2
3
4
5
DAT0B
BS
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
CLKA
CLK-f
GND
DAT0B
E1
A1
B1
DATA1 (see Note)
DATA0/SDIO (see Note)
DATA2 (see Note)
INS
E4 DAT1B
A4 DAT2B
B4 DAT3B
DAT1B
DAT2B
DAT3B
C1
CD
6
7
D2
E2
C2
C4 CMDB
DAT3B
CMDB
CLKB
DATA3 (see Note)
SCLK
CLKB
D3
CLKin
GND
CLKB
8
9
VCC
C3
CD
B2
GND
10
CD
VSS
CD
Memory Stick™
Controller
TXS0206
Memory Stick™
Connector
NOTE: The TXS0206 has integrated pullup resistor values that dynamically change value depending on whether a low or
high signal is being transmitted through the device. When the output is low, the TXS0206 internal pullup value is
40 kΩ, and when the output is high, the internal pullup value change to a value of 4 kΩ. For MSA and MSH Memory
Stick™ memory cards, to ensure that a valid VIH (i.e., receiver input voltage high) is achieved, the internal pulldown
resistors for these memory cards are not smaller than a 10-kΩ value. See the Application Information section of this
data sheet, which explains the impact of adding too heavy (i.e., <10-kΩ value) of a pulldown resistor to the data lines
of the TXS0206 device and the resulting 4-kΩ pullup/10-kΩ pulldown voltage divider network, which has a direct
impact on the VIH of the signal being sent into the Memory Stick™.
Figure 2. Interfacing With Memory Stick™ Card
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TXS0206
SCES697C –AUGUST 2009–REVISED JANUARY 2010
www.ti.com
ESD – 8-kV Contact Discharge
ESD – 2 kV
1.8 V
A Side
B Side
2.9 V
CLK
CLK
CMD
Feedback CLK
CMD
Data 0–3
Level-Shifter
Integrated
ASIP
CPU
Antenna
Pins 10, 11
Data 0–3
EN
MMC, SD Card,
or MS Card
WP, CD
WP, CD 1.8-V Pullup
WP, CD
Integrated Pullup/Pulldown Resistors
Figure 3. Typical Application Circuit
LOGIC TABLE
TRANSLATOR I/Os
EN
L
Disabled, pulled to VCCA, VCCB through 40 kΩ
Active
H
4
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TXS0206
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
TERMINAL FUNCTIONS
TERMINAL
TYPE
DESCRIPTION
NO.
A1
NAME
DAT2A
VCCA
I/O
Data bit 2 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
A2
Pwr A-port supply voltage. VCCA powers all A-port I/Os and control inputs.
Connected to write protect on the mechanical connector. The WP pin has an internal 100-kΩ pullup
A3
WP
O
resistor to VCCA
Data bit 2 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB
Data bit 3 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA
Connected to card detect on the mechanical connector. The CD pin has an internal 100-kΩ pullup resistor
to VCCA
.
A4
B1
DAT2B
DAT3A
I/O
I/O
.
.
B2
CD
O
.
B3
B4
VCCB
DAT3B
CMDA
GND
Pwr B-port supply voltage. VCCB powers all B-port I/Os.
I/O
I/O
Data bit 3 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB.
C1
Command bit connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
C2, C3
C4
Ground
CMDB
DAT0A
CLKA
CLKB
DAT0B
DAT1A
CLK-f
EN
I/O
I/O
I
Command bit connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB
Data bit 0 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA
Clock signal connected to host. Referenced to VCCA
Clock signal connected to memory card. Referenced to VCCB
Data bit 0 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB
Data bit 1 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA
Clock feedback to host for resynchronizing data to a processor. Leave unconnected if not used.
Enable/disable control. Pull EN low to place all outputs in Hi-Z state. Referenced to VCCA
Data bit 1 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB
.
D1
.
D2
.
D3
O
.
D4
I/O
I/O
O
.
.
E1
.
E2
E3
I
.
E4
DAT1B
I/O
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TXS0206
SCES697C –AUGUST 2009–REVISED JANUARY 2010
www.ti.com
VCCA
VCCB
EN
CLKA
CLK-f
CLKB
VCCA
VCCA
VCCA
VCCA
VCCA
VCCB
VCCB
VCCB
VCCB
VCCB
One-Shot
One-Shot
R1
R1
R1
R1
R1
R2
R2
R2
R2
R2
Translator
Gate Control
CMDA
CMDB
One-Shot
One-Shot
Translator
One-Shot
One-Shot
Translator
Gate Control
DAT0A
DAT1A
DAT2A
DAT3A
DAT0B
DAT1B
DAT2B
DAT3B
One-Shot
One-Shot
Translator
One-Shot
One-Shot
Translator
Gate Control
One-Shot
One-Shot
Translator
One-Shot
One-Shot
Translator
Gate Control
One-Shot
One-Shot
Translator
One-Shot
One-Shot
Translator
Gate Control
One-Shot
One-Shot
Translator
VCCA
100 kW
100 kW
WP
CD
Figure 4. Logic Diagram
6
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Product Folder Link(s): TXS0206
TXS0206
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
V
CCB
R7 R8 R9 R10 R11
HOST
CLK
CARD
R1
CLKB
R2
R4
R6
CMD
Data0
Data1
Data2
Data3
CMDB
DAT0B
DAT1B
DAT2B
DAT3B
R3
R5
GND
GND
RESISTORS
R1, R2, R3, R4, R5, R6
Tolerance
BIDIRECTIONAL ZENER DIODES
40 Ω
20ꢀ
Vbr min
14 V at 1 mA
<20 pF
Line capacitance
R7, R8, R9, R10, R11
Tolerance
40 kΩ
30ꢀ
Figure 5. ASIP Block Diagram
V
CCA
R
R
WP
CD
WP
CD
RESISTORS
R
, R
100 kΩ
30%
WP CD
Tolerance
Figure 6. WP, CD Pullup Resistors
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
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ABSOLUTE MAXIMUM RATINGS(1)
Level Translator
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
MAX
4.6
UNIT
V
VCCA
VCCB
Supply voltage range
Supply voltage range
4.6
V
I/O ports (A port)
I/O ports (B port)
Control inputs
A port
4.6
VI
Input voltage range
4.6
V
4.6
4.6
Voltage range applied to any output in the high-impedance or power-off
state
VO
VO
V
V
B port
4.6
A port
4.6
Voltage range applied to any output in the high or low state
B port
4.6
IIK
IOK
IO
Input clamp current
VI < 0
–50
–50
±50
±100
150
mA
mA
mA
mA
°C
Output clamp current
VO < 0
Continuous output current
Continuous current through VCCA or GND
Storage temperature range
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS
UNIT
θJA
Package thermal impedance(1)
117
°C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
8
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
RECOMMENDED OPERATING CONDITIONS(1)
Level Translator
VCCA
VCCB
MIN
1.1
MAX
3.6
UNIT
V
VCCA
VCCB
Supply voltage
Supply voltage
1.1
3.6
V
A-Port CMD and
DATA I/Os
B-Port CMD and
DATA I/Os
1.1 V to 1.95 V
1.95 V to 3.6 V
1.1 V to 1.95 V
1.95 V to 3.6 V
VCCI – 0.2
VCCI x 0.65
0
VCCI
VCCI
0.15
High-level input
voltage
VIH
V
V
EN and CLKA
1.1 V to 3.6 V
1.1 V to 1.95 V
1.1 V to 3.6 V
1.1 V to 1.95 V
A-Port CMD and
DATA I/Os
B-Port CMD and
DATA I/Os
Low-level input
voltage
VIL
1.95 V to 3.6 V
1.1 V to 3.6 V
1.95 V to 3.6 V
1.1 V to 3.6 V
EN and CLKA
Active state
3-state
0
0
0
VCCI x 0.35
VCCO
3.6
–100
–0.5
–1
–2
–4
–8
100
0.5
1
VO
Output voltage
V
1.1 V to 3.6 V
1.1 V to 1.3 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
μA
IOH
IOL
IOH
IOL
High-level output current (CLK-f output)
Low-level output current (CLK-f output)
High-level output current (CLK output)
Low-level output current (CLK output)
1.1 V to 3.6 V
mA
μA
1.1 V to 3.6 V
1.1 V to 1.3 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
1.1 V to 3.6 V
2
mA
μA
4
8
1.1 V to 3.6 V
1.1 V to 1.3 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
–100
–0.5
–1
–2
–4
–8
100
0.5
1
1.1 V to 3.6 V
mA
μA
1.1 V to 3.6 V
1.1 V to 1.3 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
1.1 V to 3.6 V
2
mA
4
8
Δt/Δv
Input transition rise or fall rate
Operating free-air temperature
5
ns/V
°C
TA
–40
85
(1) All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
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MAX UNIT
V
ELECTRICAL CHARACTERISTICS
Level Translator
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 μA
VCCA
1.1 V to 3.6 V
1.1 V
VCCB
MIN
VCCA * 0.8
0.8
TYP(1)
IOH = –0.5 mA
IOH = –1 mA
IOH = –2 mA
IOH = –4 mA
IOH = –8 mA
1.4 V
1.05
A port
(CLK-f output)
1.65 V
2.3 V
1.2
VOH
1.1 V to 3.6 V
1.75
3 V
2.3
A port
(DAT and CMD IOH = –20 μA
1.1 V to 3.6 V
VCCA × 0.8
outputs)
IOL = 100 μA
1.1 V to 3.6 V
1.1 V
VCCA × 0.8
IOL = 0.5 mA
0.35
0.35
0.45
0.55
0.7
IOL = 1 mA
IOL = 2 mA
IOL = 4 mA
IOL = 8 mA
IOL = 135 μA
IOL = 180 μA
1.4 V
A port
(CLK-f output)
1.1 V to 3.6 V
V
V
1.65 V
2.3 V
VOL
3 V
0.4
0.4
A port
(DAT and CMD IOL = 220 μA
1.1 V to 3.6 V
0.4
outputs)
IOL = 300 μA
0.4
IOL = 400 μA
IOH = –100 μA
IOH = –0.5 mA
0.55
1.1 V to 3.6 V
1.1 V
VCCA × 0.8
0.8
IOH = –1 mA
IOH = –2 mA
IOH = –4 mA
IOH = –8 mA
1.4 V
1.05
B port
(CLK output)
1.65 V
2.3 V
1.2
VOH
1.1 V to 3.6 V
V
1.75
3 V
2.3
B port
(DAT output)
IOH = –20 μA
1.1 V to 3.6 V
VCCA × 0.8
(1) All typical values are at TA = 25°C.
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
ELECTRICAL CHARACTERISTICS
Level Translator (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOL = 100 μA
VCCA
VCCB
1.1 V to 3.6 V
1.1 V
MIN
TYP(1)
MAX UNIT
VCCA × 0.8
IOL = 0.5 mA
IOL = 1 mA
0.35
0.35
0.45
0.55
0.7
0.4
0.4
0.4
0.4
0.55
±1
1.4 V
B port
1.1 V to 3.6 V
V
IOL = 2 mA
1.65 V
IOL = 4 mA
2.3 V
VOL
IOL = 8 mA
3 V
IOL = 135 μA
IOL = 180 μA
IOL = 220 μA
IOL = 300 μA
IOL = 400 μA
VI = VCCA or GND
VI = VCCI or GND,
VI = VCCI or GND,
1.1 V to 3.6 V
1.4 V
B port
(DAT output)
1.1 V to 3.6 V
1.65 V
V
2.3 V
3 V
II
Control inputs
1.1 V to 3.6 V
μA
μA
μA
ICCA
ICCB
IO = 0
IO = 0
1.1 V to 3.6 V 1.1 V to 3.6 V
1.1 V to 3.6 V 1.1 V to 3.6 V
6
5
A port
5.5
15
3.5
3
6.5
17.5
4.5
4
Cio
Ci
pF
pF
B port
Control inputs
Clock input
VI = VCCA or GND
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TIMING REQUIREMENTS
VCCA = 1.2 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V VCCB = 3.3 V
± 0.2 V
± 0.3 V
UNIT
MIN
MAX MIN
MAX MIN
MAX
MIN MAX
MIN MAX
Push-pull driving
30
0.9
30
40
1
40
1
40
40
Command
Mbps
Open-drain driving
1
1
Data rate
Clock
Data
40
40
50
40
60
60
MHz
Mbps
ns
Push-pull driving
30
40
40
Push-pull driving
33
1
25
1
25
1
25
1
25
1
Command
Open-drain driving
μs
Pulse
tW
duration
Clock
Data
16.7
33
12.5
25
10
25
8.3
25
8.3
25
ns
Push-pull driving
ns
TIMING REQUIREMENTS
VCCA = 1.5 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V VCCB = 3.3 V
± 0.2 V
± 0.3 V
UNIT
MIN
MAX MIN
MAX MIN
MAX
MIN MAX
MIN MAX
Push-pull driving
30
1
60
1
60
1
60
60
Command
Mbps
Open-drain driving
1
1
Data rate
Clock
Data
50
30
60
60
60
60
60
60
MHz
Mbps
ns
Push-pull driving
60
60
Push-pull driving
33
1
17
1
17
1
17
1
17
1
Command
Open-drain driving
μs
Pulse
tW
duration
Clock
Data
10
33
8.3
17
8.3
17
8.3
17
8.3
17
ns
Push-pull driving
ns
TIMING REQUIREMENTS
VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V VCCB = 3.3 V
± 0.2 V
± 0.3 V
UNIT
MIN
MAX MIN
MAX MIN
MAX
MIN MAX
MIN MAX
Push-pull driving
30
1
60
1
60
1
60
60
Command
Mbps
Open-drain driving
1
1
Data rate
Clock
Data
50
30
60
60
60
60
60
60
MHz
Mbps
ns
Push-pull driving
60
60
Push-pull driving
33
1
17
1
17
1
17
1
17
1
Command
Open-drain driving
μs
Pulse
tW
duration
Clock
Data
10
33
8.3
17
8.3
17
8.3
17
8.3
17
ns
Push-pull driving
ns
12
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Copyright © 2009–2010, Texas Instruments Incorporated
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TXS0206
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
TIMING REQUIREMENTS
VCCA = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V VCCB = 3.3 V
± 0.2 V
± 0.3 V
UNIT
MIN
MAX MIN
MAX MIN
MAX
MIN MAX
MIN MAX
Push-pull driving
30
1
60
1
60
1
60
60
Command
Mbps
Open-drain driving
1
1
Data rate
Clock
Data
60
30
60
60
60
60
60
60
MHz
Mbps
ns
Push-pull driving
60
60
Push-pull driving
33
1
17
1
17
1
17
1
17
1
Command
Open-drain driving
μs
Pulse
tW
duration
Clock
Data
8.3
33
8.3
17
8.3
17
8.3
17
8.3
17
ns
Push-pull driving
ns
TIMING REQUIREMENTS
VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V VCCB = 3.3 V
± 0.2 V
± 0.3 V
UNIT
MIN
MAX MIN
MAX MIN
MAX
MIN MAX
MIN MAX
Push-pull driving
30
0.9
55
60
1
60
1
60
60
Command
Mbps
Open-drain driving
1
1
Data rate
Clock
Data
55
60
55
60
55
55
MHz
Mbps
ns
Push-pull driving
30
60
60
Push-pull driving
33
1
17
1
17
1
17
1
17
1
Command
Open-drain driving
μs
Pulse
tW
duration
Clock
Data
9
9
9
9
9
ns
Push-pull driving
33
17
17
17
17
ns
Copyright © 2009–2010, Texas Instruments Incorporated
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
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SWITCHING CHARACTERISTICS
VCCA = 1.2 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB
VCCB
VCCB
VCCB
VCCB
= 1.2 V
± 0.1 V
= 1.5 V
± 0.1 V
= 1.8 V
± 0.15 V
= 2.5 V
± 0.2 V
= 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
MIN MAX
MIN MAX
MIN
MAX
MIN MAX
MIN
MAX
Push-pull driving
15.3
12.2
10.8
11.5
10.4
10.8
10.3
Open-drain driving
(H-to-L)
4.1
16.6
3.7
12.6
3.4
3.3
95
10.6
3.2
71
CMDA
CMDB
CMDB
CMDA
Open-drain driving
(L-to-H)
204
308
19.7
19.4
164
256
15.1
12.4
133
224
13.4
10.5
175
12
147
11.2
9.4
Push-pull driving
Open-drain driving
(H-to-L)
4.7
3.8
3.4
3.1
9.2
2.9
77
tpd
ns
Open-drain driving
(L-to-H)
211
353
170
304
139
282
101
243
204
CLKA
DATxA
DATxB
CLKA
EN
CLKB
DATxB
DATxA
CLK-f
Push-pull driving
15.6
15.9
18.2
37.9
1
12.3
12.6
14.3
30.7
1
11.5
11.2
12.8
26.8
1
10.9
10.7
11.5
24.7
1
11.7
11.1
10.6
24.2
1
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Open-drain driving
B-port
A-port
B-port
A-port
ten
μs
EN
1
1
1
1
1
EN
68
55
46
40
38
tdis
ns
EN
62
56
48
40
37
1.7
170
0.6
1.7
1.9
175
1
14.1
260
10.6
13.7
12.4
300
7.7
11.8
8
1.5
128
0.6
1.5
2.3
145
0.8
2.3
1
13
1.5
96
12.7
171
12
1.6
57
0.6
1.6
1.8
86
1.7
0.9
1
12.2
120
12.3
11.6
6.7
214
4.8
4.7
3.9
3.9
3.8
3.9
4.5
4.3
4
1.9
32
0.6
1.9
1.7
66
1.7
0.4
0.8
1.6
1
11.9
91
CMDA rise time
205
10.9
12.6
9.2
261
7.1
8.9
5.4
4.9
4.6
5.4
5.2
5.9
5.4
6.4
trA
trB
tfA
ns
ns
ns
ns
CLK-f rise time
DATxA rise time
0.6
1.5
1.9
118
0.8
1.9
1
12.7
11.5
3.9
181
4.3
6.8
4
Push-pull driving
12
Push-pull driving
7.3
245
6.2
7.4
4.5
4.4
4.1
4.5
4.6
5.1
4.5
5
CMDB rise time
Open-drain driving
CLKB rise time
DATxB rise time
Push-pull driving
2.9
1
Push-pull driving
CMDA fall time
Open-drain driving
2.3
1
8.3
5.8
8
1.9
1
1.7
1
1.6
1
3.7
4
CLK-f fall time
DATxA fall time
Push-pull driving
1.8
2.1
1.9
2
1.3
1.8
1.5
1.8
1.1
1
1
1
3.8
4.3
4.2
3.9
4.8
Push-pull driving
7.9
8.3
7.1
8.5
1.7
1.3
1.8
0.9
1.6
1.1
1.7
1
1.5
1
CMDB fall time
Open-drain driving
tfB
CLKB fall time
DATxB fall time
1.6
1.1
Push-pull driving
Push-pull driving
2.1
3.9
Channel-to-channel
skew
tSK(O)
1
1
1
1
1
ns
Push-pull driving
30
0.9
30
40
1
40
1
40
1
40
1
Command
Mbps
Open-drain driving
Max data rate
Clock
Data
40
40
50
40
60
40
60
40
MHz
Push-pull driving
30
Mbps
14
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Copyright © 2009–2010, Texas Instruments Incorporated
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TXS0206
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
SWITCHING CHARACTERISTICS
VCCA = 1.5 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB
VCCB
VCCB
VCCB
VCCB
= 1.2 V
± 0.1 V
= 1.5 V
± 0.1 V
= 1.8 V
± 0.15 V
= 2.5 V
± 0.2 V
= 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
MIN MAX
MIN MAX
MIN
MAX
MIN MAX
MIN
MAX
Push-pull driving
12
8.6
6.9
7.6
6.1
6
Open-drain driving
(H-to-L)
3.7
12.8
3.2
8.7
2.9
2.7
6.6
2.7
83
6.5
CMDA
CMDB
CMDB
CMDA
Open-drain driving
(L-to-H)
192
297
15.2
20.4
191
295
9.8
157
252
8
112
180
6.8
7.3
138
6.3
6.6
Push-pull driving
Open-drain driving
(H-to-L)
3.7
2.9
11.8
2.5
9.4
2.2
2.1
87
tpd
ns
Open-drain driving
(L-to-H)
199
337
196
316
162
282
117
214
177
CLKA
DATxA
DATxB
CLKA
EN
CLKB
DATxB
DATxA
CLK-f
Push-pull driving
12.3
12.5
13.9
29
8.7
8.9
9.2
20
7.7
7.2
7.6
16
1
6.1
6.2
6.5
13
6.2
6.1
6.1
12
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Open-drain driving
B-port
A-port
B-port
A-port
1
1
1
1
ten
μs
EN
1
1
1
1
1
EN
57
53
46
46
8.9
203
6.2
8.9
6.5
253
5.9
6.9
2.9
4.2
4
39
37
tdis
ns
EN
58
54
38
35
1.6
166
0.5
2
10.5
254
5.5
10.3
11.2
273
7.5
10.9
5.5
8
0.4
157
0.5
0.7
2
9.5
247
5.5
9.4
8
0.2
121
0.5
0.5
1.9
135
0.4
1.7
0.9
1.8
0.4
0.1
1.5
1.2
1.8
1.2
0.4
74
8.3
127
7
1
44
7.9
85
CMDA rise time
trA
trB
tfA
ns
ns
ns
ns
CLK-f rise time
DATxA rise time
0.5
0.6
0.5
96
0.5
0.7
0.5
71
7.2
8.3
3.1
165
4.3
4
Push-pull driving
8.4
5.6
196
4.9
5
Push-pull driving
1.9
157
1.3
2.2
1.5
2.3
0.4
0.8
1
CMDB rise time
Open-drain driving
163
0.6
2
264
6.7
8.4
3.8
4.8
3.7
4.8
7.1
3.8
8.8
7.7
CLKB rise time
DATxB rise time
1.5
0.8
0.8
1.7
0.4
0.1
1.4
1
1.9
0.6
0.8
1.6
0.4
0.1
1.6
0.9
1.6
2.5
Push-pull driving
Push-pull driving
1.3
2
2.3
3.7
3.7
3.8
5.4
2.3
4.1
4.3
2.3
3.5
6.8
3.8
3.6
2.3
3.9
4.2
CMDA fall time
Open-drain driving
CLK-f fall time
DATxA fall time
3.9
6
0.4
0.6
1.5
1.5
1
Push-pull driving
4.1
5.8
3
Push-pull driving
11.6
5.2
10.8
13.3
CMDB fall time
Open-drain driving
1.7
1.1
1.1
tfB
CLKB fall time
DATxB fall time
6
1.7
2.3
Push-pull driving
Push-pull driving
1.2
6.5
Channel-to-channel
skew
tSK(O)
1
1
1
1
1
ns
Push-pull driving
30
1
60
1
60
1
60
1
60
1
Command
Mbps
Open-drain driving
Max data rate
Clock
Data
50
30
60
60
60
60
60
60
60
60
MHz
Push-pull driving
Mbps
Copyright © 2009–2010, Texas Instruments Incorporated
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Product Folder Link(s): TXS0206
TXS0206
SCES697C –AUGUST 2009–REVISED JANUARY 2010
www.ti.com
SWITCHING CHARACTERISTICS
VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB
VCCB
VCCB
VCCB
VCCB
= 1.2 V
± 0.1 V
= 1.5 V
± 0.1 V
= 1.8 V
± 0.15 V
= 2.5 V
± 0.2 V
= 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
MIN MAX
MIN MAX
MIN
MAX
MIN MAX
MIN
MAX
Push-pull driving
11.3
7.3
5.7
6.5
4.6
4.4
5.1
Open-drain driving
(H-to-L)
3.4
11.8
2.9
7.6
2.7
2.5
5.5
2.4
89
CMDA
CMDB
CMDB
CMDA
Open-drain driving
(L-to-H)
179
286
13.2
19.7
183
288
8.3
168
286
6.5
8.6
121
201
5.2
6.4
151
4.8
5.7
Push-pull driving
Open-drain driving
(H-to-L)
3.5
2.8
11.1
2.4
2.1
2
tpd
ns
Open-drain driving
(L-to-H)
186
323
190
304
173
303
125
215
93
166
CLKA
DATxA
DATxB
CLKA
EN
CLKB
DATxB
DATxA
CLK-f
Push-pull driving
11.6
11.7
12.1
25.1
1
7.7
7.5
7.9
16.5
1
6.2
5.8
6.3
12
4.7
4.7
5
4.5
4.4
4.6
7.9
1
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Open-drain driving
8.9
1
B-port
A-port
B-port
A-port
1
ten
μs
EN
1
1
1
1
1
EN
39
37
37
35
35
35
5.8
99
4.1
6.1
3.1
142
4.3
5
tdis
ns
EN
49
47
47
38
1.8
154
0.4
1.9
1.8
137
1.5
2.3
0.6
2.3
0.1
1
8.4
246
4
1.2
155
0.4
1.2
2
6.8
262
4.3
7.1
7.7
245
6.6
8
1.1
135
0.4
0.9
1.7
141
0.4
1.5
0.2
1.8
0.7
1
5.9
238
4.7
6.8
6.5
251
5.9
6.8
3.3
4.2
1.6
2.7
5.4
2.6
6.3
6.3
1.1
85
5.9
150
4.5
6.3
5.2
184
4.9
5.2
2.9
3.7
1.5
2.7
5
1.6
52
CMDA rise time
trA
trB
tfA
ns
ns
ns
ns
CLK-f rise time
DATxA rise time
0.4
1
0.4
1.3
1.7
73
Push-pull driving
8.6
10.2
251
7.3
10.3
4.5
7.9
2
Push-pull driving
1
CMDB rise time
Open-drain driving
148
0.7
1.8
0.4
2
100
1.5
0.9
0.2
1.7
0.7
0.1
1.6
0.9
1.8
1.6
CLKB rise time
DATxB rise time
1.9
0.2
0.2
1.6
0.1
0.2
1.6
0.8
1.7
0.8
Push-pull driving
Push-pull driving
3.8
4.8
2.2
3.6
6.8
3
3.1
3.5
3
CMDA fall time
Open-drain driving
CLK-f fall time
DATxA fall time
0.2
0.8
1.4
1.3
1
Push-pull driving
4.3
10.3
4
2.6
3.6
1.8
4
Push-pull driving
1
1.8
1.2
1.4
1.2
CMDB fall time
Open-drain driving
1.4
1.1
1
1.9
4.2
4.9
tfB
CLKB fall time
DATxB fall time
10.8
11.8
10.3
7
Push-pull driving
Push-pull driving
15
3.6
Channel-to-channel
skew
tSK(O)
1
1
1
1
1
ns
Push-pull driving
30
1
60
1
60
1
60
1
60
1
Command
Mbps
Open-drain driving
Max data rate
Clock
Data
50
30
60
60
60
60
60
60
60
60
MHz
Push-pull driving
Mbps
16
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TXS0206
TXS0206
www.ti.com
SCES697C –AUGUST 2009–REVISED JANUARY 2010
SWITCHING CHARACTERISTICS
VCCA = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB
VCCB
VCCB
VCCB
VCCB
= 1.2 V
± 0.1 V
= 1.5 V
± 0.1 V
= 1.8 V
± 0.15 V
= 2.5 V
± 0.2 V
= 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
MIN MAX
MIN MAX
MIN
MAX
MIN MAX
MIN
MAX
Push-pull driving
10.6
6.5
4.9
5.5
3.7
3.3
4.1
Open-drain driving
(H-to-L)
3.2
10.9
2.7
6.7
2.4
2.2
4.4
2.1
98
CMDA
CMDB
CMDB
CMDA
Open-drain driving
(L-to-H)
156
253
12.5
19.2
162
258
7.4
149
261
5.6
7.9
126
249
4.1
5.7
190
3.6
4.8
Push-pull driving
Open-drain driving
(H-to-L)
3.5
2.7
10.5
2.3
2
1.9
99
tpd
ns
Open-drain driving
(L-to-H)
163
295
169
273
158
274
131
261
202
CLKA
DATxA
DATxB
CLKA
EN
CLKB
DATxB
DATxA
CLK-f
Push-pull driving
10.8
10.9
11.5
23.7
1
6.8
6.7
7.1
14.9
1
5.4
5
3.7
3.7
3.9
6.8
1
3.4
3.3
3.5
5.7
1
Push-pull driving
5.4
10.2
1
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Open-drain driving
B-port
A-port
B-port
A-port
ten
μs
EN
1
1
1
1
1
EN
48
45
45
38
36
tdis
ns
EN
45
38
38
38
35
1.9
135
0.8
1.9
1.7
102
1.6
2.2
0.4
2.2
0.3
0.4
1
4.7
216
1.6
6.1
10.8
205
7.3
10.3
2.4
7.6
2.2
4
1.7
136
0.3
1.8
2.9
116
0.5
1.9
0.4
1.9
0.3
0.4
1.8
1
4.4
237
1.9
4.5
7.6
197
6.8
7.9
1.6
4.8
2.7
3.6
7.2
1.7
11.3
9
1.7
121
0.6
1.7
1.8
112
0.4
1.8
0.4
1.8
0.3
0.4
1.7
1
3.8
228
1.8
4.1
6.6
207
5.8
6.6
1.5
4.2
2.6
3.2
6.3
1.7
8.7
7
1.9
96
3.2
201
1.5
4
2.3
62
3.3
141
1.3
4.2
3.8
165
4.4
4.4
1.4
3.5
2.8
2.6
3.7
1.4
4.1
4
CMDA rise time
trA
trB
tfA
ns
ns
ns
ns
CLK-f rise time
DATxA rise time
0.7
1.9
1.5
101
1.6
1.4
0.5
1.7
0.3
0.5
1.6
1
0.7
1.8
1.5
76
Push-pull driving
Push-pull driving
5.2
214
5
CMDB rise time
Open-drain driving
CLKB rise time
DATxB rise time
1.7
0.9
0.3
1.6
0.3
0.3
1.6
0.8
1.7
0.2
Push-pull driving
5.3
1.5
3.7
2.4
2.9
5.6
1.6
4.5
4.9
Push-pull driving
CMDA fall time
Open-drain driving
CLK-f fall time
DATxA fall time
Push-pull driving
Push-pull driving
13.4
2.3
12.7
16
CMDB fall time
Open-drain driving
1
tfB
CLKB fall time
DATxB fall time
1.1
1
1
0.9
08
1.8
0.8
Push-pull driving
Push-pull driving
0.7
Channel-to-channel
skew
tSK(O)
1
1
1
1
1
ns
Push-pull driving
30
1
60
1
60
1
60
1
60
1
Command
Mbps
Open-drain driving
Max data rate
Clock
Data
50
30
60
60
60
60
60
60
60
60
MHz
Push-pull driving
Mbps
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SWITCHING CHARACTERISTICS
VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB
VCCB
VCCB
VCCB
VCCB
= 1.2 V
± 0.1 V
= 1.5 V
± 0.1 V
= 1.8 V
± 0.15 V
= 2.5 V
± 0.2 V
= 3.3 V
± 0.3 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
MIN MAX
MIN MAX
MIN
MAX
MIN MAX
MIN
MAX
Push-pull driving
12.5
7.2
5.3
5.2
3.8
3.2
3.7
Open-drain driving
(H-to-L)
3.2
10.6
2.7
6.4
2.4
2.1
4.1
2
CMDA
CMDB
CMDB
CMDA
Open-drain driving
(L-to-H)
136
212
10.7
16.4
141
235
6.6
8.7
129
235
5.1
6.6
112
233
3.4
4.6
101
201
3
Push-pull driving
Open-drain driving
(H-to-L)
4.3
3.3
2.8
2.4
2.2
3.6
tpd
ns
Open-drain driving
(L-to-H)
142
273
148
246
139
248
122
248
105
212
CLKA
DATxA
DATxB
CLKA
EN
CLKB
DATxB
DATxA
CLK-f
Push-pull driving
10.8
11.5
23.6
17.1
1
6.5
6.9
14.4
9.1
1
4.8
5.1
9.6
6.8
1
3.5
3.7
6.2
4.8
1
3.1
3.2
5.1
4.2
1
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Push-pull driving
Open-drain driving
B-port
A-port
B-port
A-port
ten
μs
EN
1
1
1
1
1
EN
38
34
34
34
34
35
4.2
155
1.4
3
tdis
ns
EN
45
37
36
36
0.7
117
0.7
0.9
1.7
69
1
5.6
178
1.5
5
0.7
118
0.5
1.1
2.3
84
5
0.7
104
0.7
1.3
2.2
83
4.2
206
1.5
3.4
6.4
167
5.9
6.6
2
0.8
85
4.1
194
1.4
3.3
5
1
74
0.7
1.1
1.9
79
1.9
1
CMDA rise time
213
1.7
3.9
7.4
156
7.1
7.9
2.4
5
trA
trB
tfA
ns
ns
ns
ns
CLK-f rise time
DATxA rise time
0.7
1.4
2
Push-pull driving
Push-pull driving
10.8
167
7.7
10.5
2.8
7.6
1.3
2.7
13.3
1.5
15.5
15
4
CMDB rise time
Open-drain driving
79
185
5.1
5.3
2
166
4.4
14
2.3
3.7
1.3
1.7
5
CLKB rise time
DATxB rise time
0.3
2
0.5
2
1.6
1.8
0.4
1.6
0.6
0.4
0.8
0.9
0.9
0.8
Push-pull driving
2.1
0.3
2
Push-pull driving
0.4
1.8
0.6
0.4
0.7
0.7
1
0.4
1.7
0.6
0.4
0.9
0.8
0.9
0.9
1
CMDA fall time
Open-drain driving
4.4
1.3
1.4
6.2
1.4
7.8
6.8
3.9
1.3
1.8
6.3
1.3
5.1
6.9
1.6
0.6
0.5
1
CLK-f fall time
DATxA fall time
0.6
0.3
1
1.3
2.3
7.9
1.4
9.1
6.8
Push-pull driving
Push-pull driving
CMDB fall time
Open-drain driving
0.7
1
0.9
0.9
0.8
1.3
4.3
5
tfB
CLKB fall time
DATxB fall time
Push-pull driving
Push-pull driving
1
0.9
Channel-to-channel
skew
tSK(O)
1
1
1
1
1
ns
Push-pull driving
30
0.9
55
60
1
60
1
60
1
60
1
Command
Mbps
Open-drain driving
Max data rate
Clock
Data
55
60
55
60
55
60
55
60
MHz
Push-pull driving
30
Mbps
18
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.2 V
1.5 V
1.8 V
2.5 V
3 V
3.3 V
CLK
Enabled
15
15
14.9
14.9
15
15
A-port input,
B-port
output
DATA
Enabled
6.3
6.4
6.5
6.5
6.5
12
6.5
B-port input,
A-port
output
DATA
Enabled
12.5
12.3
12.3
12.1
11.9
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdA
pF
CLK
Disabled
0.2
1.2
0.2
1.2
0.2
1.2
0.3
1.2
0.3
1.2
0.3
1.2
A-port input,
B-port
output
DATA
Disabled
B-port input,
A-port
output
DATA
Disabled
0.2
0.2
0.2
0.3
0.3
30
0.3
A-port input,
B-port
output
DATA
Enabled
26.2
27.3
28.2
29.7
31.2
CLK
Enabled
25.7
13.7
25.6
12.2
25.6
11.4
26.4
12
27
28.1
12.9
B-port input,
A-port
output
DATA
Enabled
12.5
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdB
pF
A-port input,
B-port
output
DATA
Disabled
0.6
0.5
0.5
0.5
0.5
0.6
CLK
Disabled
0.6
1.2
0.5
1.2
0.5
1.2
0.5
1
0.5
1
0.6
0.9
B-port input,
A-port
output
DATA
Disabled
(1) Power dissipation capacitance per transceiver
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 1.5 V
VCCB TYP
TEST
PARAMETER
UNIT
CONDITIONS
1.2 V
1.5 V
1.8 V
2.5 V
3 V
3.3 V
CLK
15
15
15
14.9
14.9
14.9
A-port input,
Enabled
B-port
DATA
output
6.4
6.3
6.2
6
6
6
Enabled
B-port input,
A-port
output
DATA
Enabled
13.2
12.3
12.2
12
12
11.9
CL = 0,
(1)
CpdA
f = 10 MHz,
tr = tf = 1 ns
pF
CLK
Disabled
0.1
1.2
0.1
1.2
0.1
1.2
0.1
1.2
0.1
1.2
0.1
1.2
A-port input,
B-port
output
DATA
Disabled
B-port input,
A-port
output
DATA
Disabled
0.1
0.1
0.1
0.1
0.1
0.1
(1) Power dissipation capacitance per transceiver
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OPERATING CHARACTERISTICS (continued)
TA = 25°C, VCCA = 1.5 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.2 V
1.5 V
1.8 V
2.5 V
3 V
3.3 V
A-port input,
B-port
output
DATA
Enabled
25.8
26.3
27.3
29.2
29.2
30.6
CLK
Enabled
25.8
13.7
25.6
12.3
25.6
11.4
26.2
12
26.2
12
27.2
12.8
B-port input,
A-port
output
DATA
Enabled
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdB
pF
A-port input,
B-port
output
DATA
Disabled
0.1
0.1
0.1
0.1
0.1
0.1
CLK
Disabled
0.1
1.2
0.1
1.2
0.1
1.1
0.1
1
0.1
1
0.1
0.9
B-port input,
A-port
output
DATA
Disabled
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 1.8 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.2 V
1.5 V
1.8 V
2.5 V
3 V
3.3 V
CLK
Enabled
15.2
15.1
15.1
15
15
15
A-port input,
B-port
output
DATA
Enabled
6.7
6.2
5.8
5.4
5.4
12
5.3
B-port input,
A-port
output
DATA
Enabled
13.9
13.1
12.4
12.1
11.9
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdA
pF
CLK
Disabled
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
A-port input,
B-port
output
DATA
Disabled
B-port input,
A-port
output
DATA
Disabled
0.1
0.1
0.1
0.1
0.1
0.1
A-port input,
B-port
output
DATA
Enabled
25.9
26.1
26.7
28.8
28.8
30.3
CLK
Enabled
25.8
13.6
25.6
12.2
25.6
11.5
26.2
12.1
26.2
12.1
27
B-port input,
A-port
output
DATA
Enabled
12.9
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdB
pF
A-port input,
B-port
output
DATA
Disabled
0.2
0.1
0.1
0.1
0.1
0.1
CLK
Disabled
0.2
1.2
0.1
1.2
0.1
1.1
0.1
1
0.1
1
0.1
0.8
B-port input,
A-port
output
DATA
Disabled
(1) Power dissipation capacitance per transceiver
20
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 2.5 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.2 V
1.5 V
1.8 V
2.5 V
3 V
3.3 V
CLK
Enabled
16.2
16
15.9
15.8
15.8
15.7
A-port input,
B-port
output
DATA
Enabled
7.3
6.5
5.9
14
5.5
13
5.4
5.3
B-port input,
A-port
output
DATA
Enabled
15.3
14.6
12.8
12.5
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdA
pF
CLK
Disabled
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
A-port input,
B-port
output
DATA
Disabled
B-port input,
A-port
output
DATA
Disabled
0.1
0.1
0.1
0.1
0.1
29
0.1
A-port input,
B-port
output
DATA
Enabled
25.6
25.8
26.2
27.6
29.5
CLK
Enabled
25.9
13.6
25.7
12.2
25.7
11.5
26.2
12.3
26.5
12.7
26.9
13.2
B-port input,
A-port
output
DATA
Enabled
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdB
pF
A-port input,
B-port
output
DATA
Disabled
0.3
0.1
0.1
0.1
0.1
0.1
CLK
Disabled
0.3
1.2
0.1
1.2
0.1
1.1
0.1
1
0.1
0.9
0.1
0.8
B-port input,
A-port
output
DATA
Disabled
(1) Power dissipation capacitance per transceiver
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 3.3 V
VCCB TYP
TEST
PARAMETER
UNIT
CONDITIONS
1.2 V
1.5 V
1.8 V
2.5 V
3 V
3.3 V
CLK
18.3
17.7
17.5
17.3
17.2
17.1
A-port input,
Enabled
B-port
DATA
output
8.1
17
7
6.2
5.7
5.6
5.6
14
Enabled
B-port input,
A-port
output
DATA
Enabled
16.1
15.6
14.8
14.4
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdA
pF
CLK
Disabled
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
0.1
1.3
A-port input,
B-port
output
DATA
Disabled
B-port input,
A-port
output
DATA
Disabled
0.1
0.1
0.1
0.1
0.1
0.1
(1) Power dissipation capacitance per transceiver
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OPERATING CHARACTERISTICS (continued)
TA = 25°C, VCCA = 3.3 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.2 V
1.5 V
1.8 V
2.5 V
3 V
3.3 V
A-port input,
B-port
output
DATA
Enabled
25.2
25.6
26
27.1
28
28.5
CLK
Enabled
26
25.8
12.1
25.8
11.4
26.3
12.2
26.8
12.7
27
B-port input,
A-port
output
DATA
Enabled
13.7
13.2
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdB
pF
A-port input,
B-port
output
DATA
Disabled
0.3
0.1
0.1
0.1
0.1
0.1
CLK
Disabled
0.3
1.2
0.1
1.2
0.1
1.1
0.1
1
0.1
0.9
0.1
0.8
B-port input,
A-port
output
DATA
Disabled
Frequency (Hz)
Figure 7. Typical ASIP EMI Filter Frequency Response
22
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TXS0206
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
PARAMETER MEASUREMENT INFORMATION
V
CCI
V
CCO
V
CCI
V
CCO
DUT
DUT
IN
IN
OUT
OUT
1 MW
1 MW
15 pF
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × V
CCO
S1
50 kW
Open
From Output
Under Test
15 pF
50 kW
TEST
/t
S1
2 × V
t
PZL PLZ
CCO
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
t
/t
Open
PHZ PZH
t
w
V
CCI
V
CCA
V
/2
V
/2
Output
Control
(low-level
enabling)
Input
CCI
CCI
V /2
CCA
V /2
CCA
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
0 V
t
PLZ
t
PZL
V
V
CCO
Output
Waveform 1
V
CCI
V
V
/2
CCO
Input
V
/2
V
/2
CCI
CCI
0.1 y V
CCO
S1 at 2 × V
CCO
OL
0 V
(see Note B)
t
PHZ
t
t
t
PLH
PHL
PZH
Output
Waveform 2
S1 at GND
V
OH
0.9 y V
V
OH
CCO
0.9 y V
CCO
/2
Output
V
CCO
/2
V
CCO
/2
CCO
(see Note B)
0.1 y V
CCO
0 V
V
OL
t
f
t
r
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
H.
I.
t
t
t
V
V
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
pd
PHL
is the V associated with the input port.
CC
CCI
is the V associated with the output port.
CCO
CC
J. All parameters and waveforms are not applicable to all devices.
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PARAMETER MEASUREMENT INFORMATION (continued)
Figure 8. Load Circuit and Voltage Waveforms
24
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TXS0206
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SCES697C –AUGUST 2009–REVISED JANUARY 2010
APPLICATION INFORMATION
The TXS0206 has integrated pullup resistors on the data and command ports and their values dynamically
change. When the port is in a low signal state, there is a nominal pullup resistor value of 40 kΩ, and power
consumption is minimized. When the port is in a high signal state, the nominal pullup resistor value changes to 4
kΩ, and simultaneous switching performance is improved as a result. The threshold at which the resistance
changes is approximately VCCx/2.
When using the TXS0206 device with MMCs, SD, and Memory Stick™ to ensure that a valid receiver input
voltage high (VIH) is achieved, the value of any pulldown resistors (external or internal to a memory card) must
not be smaller than a 10-kΩ value. The impact of adding too heavy (i.e., <10-kΩ value) a pulldown resistor to the
data and command lines of the TXS0206 device and the resulting 4-kΩ pullup / 10-kΩ pulldown voltage divider
network has a direct impact on the VIH of the signal being sent into the memory card and its associated logic.
The resulting VIH voltage for the 10-kΩ pulldown resistor value would be:
VCC × 10 kΩ / (10 kΩ+ 4 kΩ) = 0.714 × VCC
This is marginally above a valid input high voltage for a 1.8-V signal (i.e., 0.65 × VCC).
The resulting VIH voltage for 20-kΩ pulldown resistor value would be:
VCC × 20 kΩ / (20 kΩ + 4 kΩ) = 0.833 × VCC
Which is above the valid input high voltage for a 1.8-V signal of 0.65 × VCC
.
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PACKAGE OPTION ADDENDUM
www.ti.com
29-Jun-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TXS0206YFPR
ACTIVE
DSBGA
YFP
20
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jun-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TXS0206YFPR
DSBGA
YFP
20
3000
180.0
8.4
1.65
2.05
0.6
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jun-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
DSBGA YFP 20
SPQ
Length (mm) Width (mm) Height (mm)
220.0 220.0 34.0
TXS0206YFPR
3000
Pack Materials-Page 2
D: Max = 1588 µm, Min = 1527 µm
E: Max = 1988 µm, Min = 1928 µm
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