TXS0206AYFPR [TI]
SD CARD VOLTAGE-TRANSLATION TRANSCEIVER; SD卡电压转换收发器型号: | TXS0206AYFPR |
厂家: | TEXAS INSTRUMENTS |
描述: | SD CARD VOLTAGE-TRANSLATION TRANSCEIVER |
文件: | 总23页 (文件大小:1011K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
SD CARD VOLTAGE-TRANSLATION TRANSCEIVER
Check for Samples: TXS0206A
1
FEATURES
YFP PACKAGE
(TOP VIEW)
•
Level Translator
–
–
VCCA and VCCB Range of 1.1 V to 3.6 V
1 2
3
4
Fast Propagation Delay (4.4 ns Max When
Translating Between 1.8 V and 3 V)
A
B
C
D
E
•
ESD Protection Exceeds JESD 22
–
–
–
2500-V Human-Body Model (A114-B)
250-V Machine Model (A115-A)
1500-V Charged-Device Model (C101)
TERMINAL ASSIGNMENTS
1
2
3
4
A
B
C
D
E
DAT2A
DAT3A
CMDA
DAT0A
DAT1A
VCCA
CD
WP
DAT2B
DAT3B
CMDB
DAT0B
DAT1B
VCCB
GND
CLKB
EN
GND
CLKA
CLK-f
DESCRIPTION/ORDERING INFORMATION
The TXS0206A is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital
(SD) cards, and Memory Stick™ cards.
The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full
range of 1.1 V to 3.6 V. The TXS0206A enables system designers to easily interface applications processors or
digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.
The TXS0206A is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96
mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in
mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power
consumption and small package size make the TXS0206A an ideal choice for these applications.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
BTR
–40°C to 85°C
WCSP – YFP (Pb-free) Tape and reel
TXS0206AYFPR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2011–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TXS0206A
SCES833A –NOVEMBER 2011–REVISED MAY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
REFERENCE CIRCUIT
V
CCA
V
CCB
V
CCB
C3
0.1 µF
C4
0.1 µF
C1
0.1 µF
J1
U1A
U2
A2
D1
DAT2B
DAT3B
CMDB
0
1
2
3
4
5
6
7
8
B3
D4
DAT2
DAT3
CMD
VSS1
VDD
VDDA
DAT0
DAT1
DAT2
DAT3
CMD
CLK
VCCA
VCCB
DAT0B
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
CLKA
CLK-f
DAT0B
E1
A1
B1
E4 DAT1B
A4 DAT2B
B4 DAT3B
DAT1B
DAT2B
DAT3B
CLKB
CLK
VSS2
DAT0
DAT1
C1
DAT0B
DAT1B
D2
E2
C2
C4 CMDB
CMDB
CLKB
CLKB
D3
CLKin
10
11
12
CD
CD (Physical)
GND
GND
GND
CD
GND
C3
B2 CD
GND
CD
54794-0978
Micro SD
Processor
TXS0206A
SD/SDIO MMC
Figure 1. Interfacing With SD/SDIO Card
V
CCA
V
CCB
V
CCB
C3
0.1 µF
C4
0.1 µF
C1
0.1 µF
J1
U1A
U2
A2
D1
DAT2B
DAT3B
CMDB
0
1
2
3
4
5
6
7
8
B3
D4
DAT2
DAT3
CMD
VSS1
VDD
VDDA
VCCA
VCCB
DAT0B
DAT0
DAT1
DAT2
DAT3
CMD
CLK
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
CLKA
CLK-f
DAT0B
E1
A1
B1
E4 DAT1B
A4 DAT2B
B4 DAT3B
DAT1B
DAT2B
DAT3B
CLKB
CLK
VSS2
DAT0
DAT1
C1
DAT0B
DAT1B
D2
E2
C2
C4 CMDB
CMDB
CLKB
CLKB
D3
CLKin
10
11
12
CD
CD (Physical)
GND
GND
GND
CD
GND
C3
B2 CD
GND
CD
14
WP (Physical)
WP
Standard SD Card
Processor
SD/SDIO MMC
TXS0206A
VCCA
Figure 2. Interfacing With Seperate WP and CD Pin
2
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXS0206A
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
V
CCA
V
CCB
V
CCB
C3
0.1 µF
C4
0.1 µF
C1
0.1 µF
U1A
U2
A2
D1
1
B3
D4
VCCA
VCCB
VSS
VDDA
DAT0
DAT1
DAT2
DAT3
CMD
CLK
CMDB
DAT1B
DAT0B
DAT2B
2
3
4
5
DAT0B
BS
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
CLKA
CLK-f
GND
DAT0B
E1
A1
B1
DATA1 (see Note)
DATA0/SDIO (see Note)
DATA2 (see Note)
INS
E4 DAT1B
A4 DAT2B
B4 DAT3B
DAT1B
DAT2B
DAT3B
C1
CD
6
7
D2
E2
C2
C4 CMDB
DAT3B
CMDB
CLKB
DATA3 (see Note)
SCLK
CLKB
D3
CLKin
GND
CLKB
8
9
VCC
C3
CD
B2
GND
10
CD
VSS
CD
Memory Stick™
Controller
TXS0206
Memory Stick™
Connector
NOTE: The TXS0206A has integrated pullup resistor values that dynamically change value depending on whether a low or
high signal is being transmitted through the device. When the output is low, the TXS0206A internal pullup value is
40 kΩ, and when the output is high, the internal pullup value change to a value of 4 kΩ. For MSA and MSH Memory
Stick™ memory cards, to ensure that a valid VIH (i.e., receiver input voltage high) is achieved, the internal pulldown
resistors for these memory cards are not smaller than a 10-kΩ value. See the Application Information section of this
data sheet, which explains the impact of adding too heavy (i.e., <10-kΩ value) of a pulldown resistor to the data lines
of the TXS0206A device and the resulting 4-kΩ pullup/10-kΩ pulldown voltage divider network, which has a direct
impact on the VIH of the signal being sent into the Memory Stick™.
Figure 3. Interfacing With Memory Stick™ Card
1.8 V
A Side
B Side
2.9 V
CLK
CLK
CMD
Feedback CLK
CMD
Data 0–3
Level-Shifter
CPU
Antenna
Pins 10, 11
Data 0–3
EN
MMC, SD Card,
or MS Card
WP, CD
WP, CD 1.8-V Pullup
WP, CD
Integrated Pullup/Pulldown Resistors
Figure 4. Typical Application Circuit
Copyright © 2011–2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TXS0206A
TXS0206A
SCES833A –NOVEMBER 2011–REVISED MAY 2012
www.ti.com
LOGIC TABLE
EN
L
TRANSLATOR I/Os
Disabled, pulled to VCCA, VCCB through 40 kΩ
H
Active
TERMINAL FUNCTIONS
DESCRIPTION
TERMINAL
TYPE
NO.
A1
NAME
DAT2A
VCCA
I/O
Data bit 2 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
A2
Pwr A-port supply voltage. VCCA powers all A-port I/Os and control inputs.
Connected to write protect on the mechanical connector. The WP pin has an internal 100-kΩ pullup
resistor to VCCA
A3
WP
O
.
A4
B1
DAT2B
DAT3A
I/O
I/O
Data bit 2 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB
Data bit 3 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA
Connected to card detect on the mechanical connector. The CD pin has an internal 100-kΩ pullup resistor
to VCCA
.
.
B2
CD
O
.
B3
B4
VCCB
DAT3B
CMDA
GND
Pwr B-port supply voltage. VCCB powers all B-port I/Os.
I/O
I/O
Data bit 3 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB.
C1
Command bit connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
C2, C3
C4
Ground
CMDB
DAT0A
CLKA
CLKB
DAT0B
DAT1A
CLK-f
EN
I/O
I/O
I
Command bit connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB
Data bit 0 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA
Clock signal connected to host. Referenced to VCCA
Clock signal connected to memory card. Referenced to VCCB
Data bit 0 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB
Data bit 1 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA
Clock feedback to host for resynchronizing data to a processor. Leave unconnected if not used.
Enable/disable control. Pull EN low to place all outputs in Hi-Z state. Referenced to VCCA
Data bit 1 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB
.
D1
.
D2
.
D3
O
.
D4
I/O
I/O
O
.
.
E1
.
E2
E3
I
.
E4
DAT1B
I/O
4
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXS0206A
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
VCCA
VCCB
EN
CLKA
CLK-f
CLKB
VCCA
VCCA
VCCA
VCCA
VCCA
VCCB
VCCB
VCCB
VCCB
VCCB
One-Shot
One-Shot
R1
R1
R1
R1
R1
R2
R2
R2
R2
R2
Translator
Gate Control
CMDA
CMDB
One-Shot
One-Shot
Translator
One-Shot
One-Shot
Translator
Gate Control
DAT0A
DAT1A
DAT2A
DAT3A
DAT0B
DAT1B
DAT2B
DAT3B
One-Shot
One-Shot
Translator
One-Shot
One-Shot
Translator
Gate Control
One-Shot
One-Shot
Translator
One-Shot
One-Shot
Translator
Gate Control
One-Shot
One-Shot
Translator
One-Shot
One-Shot
Translator
Gate Control
One-Shot
One-Shot
Translator
VCCA
100 kW
100 kW
WP
CD
Figure 5. Logic Diagram
Copyright © 2011–2012, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TXS0206A
TXS0206A
SCES833A –NOVEMBER 2011–REVISED MAY 2012
www.ti.com
V
CCA
R
R
WP
CD
WP
CD
RESISTORS
R
, R
100 kΩ
30%
WP CD
Tolerance
Figure 6. WP, CD Pullup Resistors
ABSOLUTE MAXIMUM RATINGS(1)
Level Translator
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
MAX
4.6
UNIT
V
VCCA
VCCB
Supply voltage range
Supply voltage range
4.6
V
I/O ports (A port)
I/O ports (B port)
Control inputs
A port
4.6
VI
Input voltage range
4.6
V
4.6
4.6
Voltage range applied to any output in the high-impedance or power-off
state
VO
VO
V
V
B port
4.6
A port
4.6
Voltage range applied to any output in the high or low state
B port
4.6
IIK
IOK
IO
Input clamp current
VI < 0
–50
–50
±50
±100
150
mA
mA
mA
mA
°C
Output clamp current
VO < 0
Continuous output current
Continuous current through VCCA or GND
Storage temperature range
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS
UNIT
θJA
Package thermal impedance(1)
117
°C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
6
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXS0206A
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
RECOMMENDED OPERATING CONDITIONS(1)
Level Translator
VCCA
VCCB
MIN
1.1
MAX
3.6
UNIT
V
VCCA
VCCB
Supply voltage
Supply voltage
1.1
3.6
V
A-Port CMD and
DATA I/Os
B-Port CMD and
DATA I/Os
1.1 V to 1.95 V
1.95 V to 3.6 V
1.1 V to 1.95 V
1.95 V to 3.6 V
VCCI – 0.2
VCCI x 0.65
0
VCCI
VCCI
0.15
High-level input
voltage
VIH
V
V
EN and CLKA
1.1 V to 3.6 V
1.1 V to 1.95 V
1.1 V to 3.6 V
1.1 V to 1.95 V
A-Port CMD and
DATA I/Os
B-Port CMD and
DATA I/Os
Low-level input
voltage
VIL
1.95 V to 3.6 V
1.1 V to 3.6 V
1.95 V to 3.6 V
1.1 V to 3.6 V
EN and CLKA
Active state
3-state
0
0
0
VCCI x 0.35
VCCO
3.6
–100
–0.5
–1
–2
–4
–8
100
0.5
1
VO
Output voltage
V
1.1 V to 3.6 V
1.1 V to 1.3 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
μA
IOH
IOL
IOH
IOL
High-level output current (CLK-f output)
Low-level output current (CLK-f output)
High-level output current (CLK output)
Low-level output current (CLK output)
1.1 V to 3.6 V
mA
μA
1.1 V to 3.6 V
1.1 V to 1.3 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
1.1 V to 3.6 V
2
mA
μA
4
8
1.1 V to 3.6 V
1.1 V to 1.3 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
–100
–0.5
–1
–2
–4
–8
100
0.5
1
1.1 V to 3.6 V
mA
μA
1.1 V to 3.6 V
1.1 V to 1.3 V
1.4 V to 1.6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
3 V to 3.6 V
1.1 V to 3.6 V
2
mA
4
8
Δt/Δv
Input transition rise or fall rate
Operating free-air temperature
5
ns/V
°C
TA
–40
85
(1) All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright © 2011–2012, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TXS0206A
TXS0206A
SCES833A –NOVEMBER 2011–REVISED MAY 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
Level Translator
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 μA
VCCA
1.1 V to 3.6 V
1.1 V
VCCB
MIN
VCCA * 0.8
0.8
TYP(1)
MAX UNIT
IOH = –0.5 mA
IOH = –1 mA
IOH = –2 mA
IOH = –4 mA
IOH = –8 mA
1.4 V
1.05
A port
(CLK-f output)
1.65 V
2.3 V
1.2
VOH
1.65 V to 3.6 V
V
1.75
3 V
2.3
A port
(DAT and CMD IOH = –20 μA
1.1 V to 3.6 V
VCCA × 0.8
outputs)
IOL = 100 μA
1.1 V to 3.6 V
1.1 V
VCCA × 0.2
IOL = 0.5 mA
0.35
0.35
0.45
0.55
0.7
IOL = 1 mA
IOL = 2 mA
IOL = 4 mA
IOL = 8 mA
IOL = 135 μA
IOL = 180 μA
1.4 V
A port
(CLK-f output)
1.65 V to 3.6 V
V
1.65 V
2.3 V
VOL
3 V
1.1 V
0.4
1.4 V
0.4
A port
(DAT and CMD IOL = 220 μA
1.65 V
2.3 V
1.65 V to 3.6 V
0.4
V
V
outputs)
IOL = 300 μA
0.4
IOL = 400 μA
3 V
0.55
IOH = –100 μA
1.65 V to 3.6 V
1.65 V
VCCB × 0.8
1.2
IOH = –2 mA
IOH = –4 mA
IOH = –8 mA
B port
(CLK output)
2.3 V
1.75
VOH
1.1 V to 3.6 V
3 V
2.3
B port
(DAT output)
IOH = –20 μA
1.65 V to 3.6 V
VCCB × 0.8
(1) All typical values are at TA = 25°C.
8
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXS0206A
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
ELECTRICAL CHARACTERISTICS
Level Translator (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOL = 100 μA
VCCA
VCCB
1.65 V to 3.6 V
1.65 V
MIN
TYP(1)
MAX UNIT
VCCB × 0.2
IOL = 2 mA
0.45
0.55
0.7
0.4
0.4
0.4
0.55
±1
B port
1.1 V to 3.6 V
V
IOL = 4 mA
2.3 V
IOL = 8 mA
3 V
VOL
IOL = 135 μA
IOL = 220 μA
IOL = 300 μA
IOL = 300 μA
VI = VCCA or GND
VI = VCCI
1.65 V to 3.6 V
1.65 V
B port
(DAT output)
1.1 V to 3.6 V
V
2.3 V
3 V
II
Control inputs
1.65 V to 3.6 V
μA
μA
μA
ICCA
ICCB
IO = 0
IO = 0
1.1 V to 3.6 V 1.65 V to 3.6 V
1.1 V to 3.6 V 1.65 V to 3.6 V
7
VI = VCCI
11
A port
5.5
7
6.5
9.5
4.5
4
Cio
Ci
pF
pF
B port
Control inputs
Clock input
3.5
3
VI = VCCA or GND
TIMING REQUIREMENTS
VCCA = 1.2 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 3.3 V
± 0.3 V
UNIT
MIN
MAX
40
1
MIN
MAX
40
1
Push-pull driving
Command
Open-drain driving
Data rate
Mbps
Clock
40
40
40
40
MHz
Mbps
ns
Push-pull driving
Data
Push-pull driving
25
1
25
1
Command
Open-drain driving
μs
Pulse
tW
duration
Clock
Data
10
25
8.3
25
ns
Push-pull driving
ns
TIMING REQUIREMENTS
VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 3.3 V
± 0.3 V
UNIT
MIN
MAX
60
1
MIN
MAX
60
1
Push-pull driving
Command
Open-drain driving
Data rate
Mbps
Clock
60
60
60
60
MHz
Mbps
ns
Push-pull driving
Data
Push-pull driving
17
1
17
1
Command
Open-drain driving
μs
Pulse
tW
duration
Clock
Data
8.3
17
8.3
17
ns
Push-pull driving
ns
Copyright © 2011–2012, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): TXS0206A
TXS0206A
SCES833A –NOVEMBER 2011–REVISED MAY 2012
www.ti.com
TIMING REQUIREMENTS
VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 3.3 V
± 0.3 V
UNIT
MIN
MAX
60
1
MIN
MAX
60
1
Push-pull driving
Command
Open-drain driving
Data rate
Mbps
Clock
55
60
55
60
MHz
Mbps
ns
Push-pull driving
Data
Push-pull driving
17
1
17
1
Command
Open-drain driving
μs
Pulse
tW
duration
Clock
Data
9
9
ns
Push-pull driving
17
17
ns
10
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXS0206A
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
SWITCHING CHARACTERISTICS
VCCA = 1.2 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB
VCCB
= 1.8 V
± 0.15 V
= 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
5.7
6.7
6.2
7.6
6.3
12
MIN
MAX
4.4
5.8
4.5
7.5
4.6
7.9
1
CMDA
CMDB
CLKA
DATxA
DATxB
CLKA
EN
CMDB
CMDA
CLKB
DATxB
DATxA
CLK-f
tpd
ns
B-port
A-port
B-port
A-port
1
ten
μs
EN
1
1
EN
412
423
8.4
4.7
8.4
6.5
5.9
10.9
5.7
2.5
5.7
5.4
6.3
6.3
363
422
8.1
4.1
8.1
3.1
4.3
5
tdis
ns
EN
CMDA rise time
3.5
1
3.4
1
trA
trB
tfA
CLK-f rise time
DATxA rise time
CMDB rise time
CLKB rise time
DATxB rise time
CMDA fall time
CLK-f fall time
DATxA fall time
CMDB fall time
CLKB fall time
DATxB fall time
ns
ns
ns
ns
3.5
1.4
0.6
1.4
2.4
0.8
2.4
1.2
0.6
0.6
3.4
0.6
0.5
0.6
2
5.1
3
0.8
1.9
0.6
0.5
0.5
5.1
3.6
4
tfB
3.6
Channel-to-channel
skew
tSK(O)
1
1
ns
Push-pull driving
Open-drain driving
Clock
Data
40
1
40
1
Command
Mbps
Max data rate
40
40
60
40
MHz
Mbps
Copyright © 2011–2012, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): TXS0206A
TXS0206A
SCES833A –NOVEMBER 2011–REVISED MAY 2012
www.ti.com
SWITCHING CHARACTERISTICS
VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB
VCCB
= 1.8 V
± 0.15 V
= 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
4.9
5.6
5.4
5
MIN
MAX
3.3
3.6
3.4
4.4
3.5
5.7
1
CMDA
CMDB
CLKA
DATxA
DATxB
CLKA
EN
CMDB
CMDA
CLKB
DATxB
DATxA
CLK-f
tpd
ns
5.4
10.2
1
B-port
A-port
B-port
A-port
ten
μs
EN
1
1
EN
411
413
4.5
2.5
4.5
6.6
5.8
10.8
3.4
2.8
3.4
6.3
8.7
7
411
361
4.1
2.3
4.2
3.8
4.4
8
tdis
ns
EN
CMDA rise time
2.1
0.6
1.8
1.4
0.5
1.4
0.4
0.3
0.4
1.1
0.6
1.2
2.1
0.6
1.8
0.7
0.5
0.7
0.3
0.3
0.3
0.6
0.5
0.2
trA
trB
tfA
CLK-f rise time
DATxA rise time
CMDB rise time
CLKB rise time
DATxB rise time
CMDA fall time
CLK-f fall time
DATxA fall time
CMDB fall time
CLKB fall time
DATxB fall time
ns
ns
ns
ns
2.9
2.8
2.9
3.7
4.1
4
tfB
Channel-to-channel
skew
tSK(O)
1
1
ns
Push-pull driving
Open-drain driving
Clock
Data
60
1
60
1
Command
Mbps
Max data rate
60
60
60
60
MHz
Mbps
12
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXS0206A
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
SWITCHING CHARACTERISTICS
VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB
VCCB
= 1.8 V
± 0.15 V
= 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
5.3
5.1
4.8
5.1
9.6
6.8
1
MIN
MAX
3.2
3
tpd
CMDA
CMDB
CLKA
DATxA
DATxB
CLKA
EN
CMDB
CMDA
CLKB
DATxB
DATxA
CLK-f
ns
3.1
3.2
5.1
4.2
1
ten
tdis
trA
B-port
A-port
B-port
A-port
μs
ns
ns
EN
1
1
EN
410
396
4.2
1.5
3.4
6.4
5.9
14
364
398
4.2
1.4
3
EN
CMDA rise time
1.4
0.5
1.4
1.4
0.6
1.4
0.8
0.4
0.8
0.8
0.6
0.7
1.4
0.5
1.3
0.9
0.5
0.9
0.8
0.4
0.7
0.8
0.5
0.6
CLK-f rise time
DATxA rise time
CMDB rise time
CLKB rise time
DATxB rise time
CMDA fall time
CLK-f fall time
DATxA fall time
CMDB fall time
CLKB fall time
DATxB fall time
trB
tfA
tfB
4
ns
ns
ns
4.4
14
2.3
1.3
2
2.3
1.3
2.2
6.2
7.8
6.8
5
4.3
5
Channel-to-channel
skew
tSK(O)
1
1
ns
Push-pull driving
Open-drain driving
Clock
Data
60
1
60
1
Command
Mbps
Max data rate
55
60
55
60
MHz
Mbps
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.8 V
15.1
9.26
3.3 V
CLK Enabled
15
A-port input,
B-port output
DATA Enabled
9.19
B-port input,
A-port output
DATA Enabled
12.4
11.9
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdA
pF
CLK Disabled
0.1
1.3
0.1
1.3
A-port input,
B-port output
DATA Disabled
B-port input,
A-port output
DATA Disabled
0.1
0.1
(1) Power dissipation capacitance per transceiver
Copyright © 2011–2012, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Link(s): TXS0206A
TXS0206A
SCES833A –NOVEMBER 2011–REVISED MAY 2012
www.ti.com
OPERATING CHARACTERISTICS (continued)
TA = 25°C, VCCA = 1.2 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.8 V
3.3 V
A-port input,
DATA Enabled
B-port output
26.7
30.3
CLK Enabled
25.6
27
B-port input,
A-port output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
DATA Enabled
16.38
19.91
(1)
CpdB
pF
A-port input,
B-port output
DATA Disabled
0.1
0.1
CLK Disabled
0.1
1.1
0.1
0.8
B-port input,
A-port output
DATA Disabled
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 1.8 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.8 V
17.5
9.96
3.3 V
17.1
9.82
CLK Enabled
A-port input,
B-port output
DATA Enabled
B-port input,
A-port output
DATA Enabled
15.6
14
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdA
pF
CLK Disabled
0.1
1.3
0.1
1.3
A-port input,
B-port output
DATA Disabled
B-port input,
A-port output
DATA Disabled
DATA Enabled
0.1
26
0.1
A-port input,
B-port output
28.5
CLK Enabled
25.8
27
B-port input,
A-port output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
DATA Enabled
16.69
19.60
(1)
CpdB
pF
A-port input,
B-port output
DATA Disabled
0.1
0.1
CLK Disabled
0.1
1.1
0.1
0.8
B-port input,
A-port output
DATA Disabled
(1) Power dissipation capacitance per transceiver
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 3.3 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.8 V
17.5
3.3 V
17.1
CLK Enabled
A-port input,
B-port output
DATA Enabled
12.50
13.29
B-port input,
A-port output
DATA Enabled
15.6
14
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
(1)
CpdA
pF
CLK Disabled
0.1
1.3
0.1
1.3
A-port input,
B-port output
DATA Disabled
B-port input,
A-port output
DATA Disabled
0.1
0.1
(1) Power dissipation capacitance per transceiver
14 Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXS0206A
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
OPERATING CHARACTERISTICS (continued)
TA = 25°C, VCCA = 3.3 V
VCCB TYP
TEST
CONDITIONS
PARAMETER
UNIT
1.8 V
3.3 V
A-port input,
DATA Enabled
B-port output
26
28.5
CLK Enabled
25.8
27
B-port input,
A-port output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
DATA Enabled
16.67
19.92
(1)
CpdB
pF
A-port input,
B-port output
DATA Disabled
0.1
0.1
CLK Disabled
0.1
1.1
0.1
0.8
B-port input,
A-port output
DATA Disabled
Copyright © 2011–2012, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Link(s): TXS0206A
TXS0206A
SCES833A –NOVEMBER 2011–REVISED MAY 2012
www.ti.com
PARAMETER MEASUREMENT INFORMATION
V
CCI
V
CCO
V
CCI
V
CCO
DUT
DUT
IN
IN
OUT
OUT
1 MW
1 MW
15 pF
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × V
CCO
S1
50 kW
Open
From Output
Under Test
15 pF
50 kW
TEST
/t
S1
2 × V
t
PZL PLZ
CCO
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
t
/t
Open
PHZ PZH
t
w
V
CCI
V
CCA
V
/2
V
/2
Output
Control
(low-level
enabling)
Input
CCI
CCI
V /2
CCA
V /2
CCA
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
0 V
t
PLZ
t
PZL
V
V
CCO
Output
Waveform 1
V
CCI
V
V
/2
CCO
Input
V
/2
/2
V
/2
CCI
CCI
0.1 y V
CCO
S1 at 2 × V
CCO
OL
0 V
(see Note B)
t
PHZ
t
t
t
PLH
PHL
PZH
Output
Waveform 2
S1 at GND
V
OH
0.9 y V
V
OH
CCO
0.9 y V
CCO
/2
Output
V
CCO
V
CCO
/2
CCO
(see Note B)
0.1 y V
CCO
0 V
V
OL
t
f
t
r
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A.
C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
H.
I.
t
t
t
V
V
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
pd
PHL
is the V associated with the input port.
CC
CCI
is the V associated with the output port.
CCO
CC
J. All parameters and waveforms are not applicable to all devices.
Figure 7. Load Circuit and Voltage Waveforms
16
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TXS0206A
TXS0206A
www.ti.com
SCES833A –NOVEMBER 2011–REVISED MAY 2012
APPLICATION INFORMATION
The TXS0206A has integrated pullup resistors on the data and command ports and their values dynamically
change. When the port is in a low signal state, there is a nominal pullup resistor value of 40 kΩ, and power
consumption is minimized. When the port is in a high signal state, the nominal pullup resistor value changes to 4
kΩ, and simultaneous switching performance is improved as a result. The threshold at which the resistance
changes is approximately VCCx/2.
When using the TXS0206A device with MMCs, SD, and Memory Stick™ to ensure that a valid receiver input
voltage high (VIH) is achieved, the value of any pulldown resistors (external or internal to a memory card) must
not be smaller than a 10-kΩ value. The impact of adding too heavy (i.e., <10-kΩ value) a pulldown resistor to the
data and command lines of the TXS0206A device and the resulting 4-kΩ pullup / 10-kΩ pulldown voltage divider
network has a direct impact on the VIH of the signal being sent into the memory card and its associated logic.
The resulting VIH voltage for the 10-kΩ pulldown resistor value would be:
VCC × 10 kΩ / (10 kΩ+ 4 kΩ) = 0.714 × VCC
This is marginally above a valid input high voltage for a 1.8-V signal (i.e., 0.65 × VCC).
The resulting VIH voltage for 20-kΩ pulldown resistor value would be:
VCC × 20 kΩ / (20 kΩ + 4 kΩ) = 0.833 × VCC
Which is above the valid input high voltage for a 1.8-V signal of 0.65 × VCC
.
Copyright © 2011–2012, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Link(s): TXS0206A
D: Max = 1.988 mm, Min = 1.928 mm
E: Max = 1.588 mm, Min = 1.527 mm
PACKAGE OPTION ADDENDUM
www.ti.com
31-May-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TXS0206AYFPR
ACTIVE
DSBGA
YFP
20
3000
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Apr-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TXS0206AYFPR
DSBGA
YFP
20
3000
180.0
8.4
1.66
2.06
0.56
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Apr-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
DSBGA YFP 20
SPQ
Length (mm) Width (mm) Height (mm)
210.0 185.0 35.0
TXS0206AYFPR
3000
Pack Materials-Page 2
D: Max = 1.988 mm, Min =1.928 mm
E: Max = 1.588 mm, Min =1.527 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号:
TXS0206YFPR
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER WITH ESD PROTECTION AND EMI FILTERING
TI
TXS0206_10
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER WITH ESD PROTECTION AND EMI FILTERING
TI
TXS02326
DUAL-SUPPLY 2:1 SIM CARD MULTIPLEXER/TRANSLATOR WITH AUTOMATIC DETECTION AND SLOT DEDICATED DUAL LDO
TI
TXS02326MRGER
DUAL-SUPPLY 2:1 SIM CARD MULTIPLEXER/TRANSLATOR WITH AUTOMATIC DETECTION AND SLOT DEDICATED DUAL LDO
TI
TXS02326RGER
DUAL-SUPPLY 2:1 SIM CARD MULTIPLEXER/TRANSLATOR WITH AUTOMATIC DETECTION AND SLOT DEDICATED DUAL LDO
TI
©2020 ICPDF网 联系我们和版权申明