TXS0108EGXYR [TI]
SPECIALTY INTERFACE CIRCUIT, PBGA20, PLASTIC, BGA-20;
| 型号： | TXS0108EGXYR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SPECIALTY INTERFACE CIRCUIT, PBGA20, PLASTIC, BGA-20 |
| 文件： | 总23页 (文件大小：676K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008
8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
1
FEATURES
•
No Direction-Control Signal Needed
•
IEC 61000-4-2 ESD (B Port)
•
Max Data Rates
–
–
±8-kV Contact Discharge
±6-kV Air-Gap Discharge
–
–
60 Mbps (Push Pull)
2 Mbps (Open Drain)
ZXY PACKAGE
(BOTTOM VIEW)
•
•
•
•
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on
B Port (VCCA ≤ VCCB
)
1
2
3
4
5
No Power-Supply Sequencing Required –
Either VCCA or VCCB Can Be Ramped First
D
C
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
B
A
ESD Protection Exceeds JESD 22 (A Port)
–
–
–
2000-V Human-Body Model (A114-B)
150-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
TERMINAL ASSIGNMENTS
1
2
3
4
5
B8
D
VCCB
B1
B2
B3
A3
A2
B4
B5
A5
A4
B6
B7
A7
A6
C
B
A
GND
OE
A8
A1
VCCA
PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
A1
B1
V
20
19
18
17
16
15
14
13
12
11
1
V
1
20
2
CCA
A2
V
V
2
3
4
5
6
7
8
9
19
18
17
16
15
14
13
12
CCA
CCB
B2
B2
3
A2
A3
A4
A5
A6
A7
A8
A3
A4
A5
A6
A7
A8
OE
B3
4
B3
B4
B5
B6
B7
B8
5
B4
Exposed
Center
Pad
6
B5
7
B6
8
B7
9
B8
10
11
10
GND
The exposed center pad, if used, must be
connected as a secondary ground or left
electrically open.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TXS0108E
SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
DESCRIPTION/ORDERING INFORMATION
This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for low-voltage bidirectional translation between any
of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TXS0108ERGYR
TOP-SIDE MARKING
YF08E
QFN – RGY
Reel of 1000
Reel of 2000
Reel of 2500
–40°C to 85°C TSSOP – PW
UFBGA – ZXY
TXS0108EPWR
YF08E
YF08E
TXS0108EZXYR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
V
V
CCB
CCA
OE
TXS0108E
1.8-V
System
Controller
3.3-V
System
A1
A2
B1
B2
A3
A4
A5
A6
A7
A8
B3
B4
B5
B6
B7
B8
Data
Data
2
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
MAX
4.6
UNIT
V
VCCA
VCCB
Supply voltage range
Input voltage range(2)
5.5
V
A port
B port
A port
B port
A port
B port
VI < 0
VO < 0
4.6
VI
V
V
V
6.5
4.6
Voltage range applied to any output
VO
VO
in the high-impedance or power-off state(2)
6.5
VCCA + 0.5
VCCB + 0.5
–50
Voltage range applied to any output in the high or low state(2)(3)
IIK
IOK
IO
Input clamp current
mA
mA
mA
mA
°C
Output clamp current
–50
Continuous output current
Continuous current through VCCA, VCCB, or GND
Storage temperature range
±50
±100
150
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.
THERMAL IMPEDANCE RATINGS
UNIT
PW package(1)
RGY package(2)
ZXY package(1)
70
80.9
47
θJA
Package thermal impedance
°C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-5.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright © 2007–2008, Texas Instruments Incorporated
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TXS0108E
SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
RECOMMENDED OPERATING CONDITIONS(1)(2)
VCCA
VCCB
MIN
MAX
3.6
UNIT
VCCA
VCCB
1.2
Supply voltage(3)
V
1.65
5.5
1.2 V to 1.95 V
1.95 V to 3.6 V
VCCI – 0.2
VCCI
A-Port I/Os
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
VCCI – 0.4
VCCI
VIH
High-level input voltage
V
V
B-Port I/Os
OE
VCCI – 0.4
VCCI
1.2 V to 3.6 V
VCCA × 0.65
5.5
1.2 V to 1.95 V
1.95 V to 3.6 V
0
0
0
0
0.15
A-Port I/Os
0.15
VIL
Low-level input voltage
B-Port I/Os
OE
0.15
1.2 V to 3.6 V
VCCA × 0.35
A-Port I/Os
push-pull driving
Input transition rise or fall
rate
Δt/Δv
B-Port I/Os
push-pull driving
1.2 V to 3.6 V
1.65 V to 5.5 V
10
85
ns/V
°C
Control input
Operating free-air
temperature
TA
–40
(1) VCCI is the VCC associated with the data input port.
(2) VCCO is the VCC associated with the output port.
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
4
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Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008
ELECTRICAL CHARACTERISTICS(1)(2)(3)
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
TYP
–40°C to 85°C
MIN MAX
TEST
CONDITIONS
PARAMETER
VCCA
VCCB
UNIT
MIN
MAX
1.2 V
VCCA × 0.67
IOH = –20 µA,
VIB ≥ VCCB – 0.4 V
VOHA
1.65 V to 5.5 V
V
1.4 V to 3.6 V
VCCA × 0.67
IOL = 135 µA,
VIB ≤ 0.15 V
1.2 V
1.4 V
1.65 V
2.3 V
3 V
0.25
IOL = 180 µA,
VIB ≤ 0.15 V
0.4
0.4
IOL = 220 µA,
VIB ≤ 0.15 V
VOLA
1.65 V to 5.5 V
V
IOL = 300 µA,
VIB ≤ 0.15 V
0.4
IOL = 400 µA,
VIB ≤ 0.15 V
0.55
1.2 V
IOH = –20 µA,
VIA ≥ VCCA – 0.2 V
VOHB
1.65 V to 5.5 V
V
V
1.4 V to 3.6 V
VCCB × 0.67
IOL = 220 µA,
VIA ≤ 0.15 V
1.65 V
2.3 V
3 V
0.4
IOL = 300 µA,
VIA ≤ 0.15 V
0.4
VOLB
1.2 V to 3.6 V
IOL = 400 µA,
VIA ≤ 0.15 V
0.55
IOL = 620 µA,
VIA ≤ 0.15 V
4.5 V
0.55
2
II
OE
VI = VCCI or GND
1.2 V
1.2 V
1.65 V to 5.5 V
1.65 V to 5.5 V
±1
±1
µA
µA
A or
B port
IOZ
±2
1.2 V
1.4 V to 3.6 V
3.6 V
1.65 V to 5.5 V
2.3 V to 5.5 V
0 V
1.5
1.5
±2
2
VI = VO = Open,
IO = 0
ICCA
µA
µA
2
0 V
5.5 V
–1
1.2 V
1.65 V to 5.5 V
2.3 V to 5.5 V
0 V
1.4 V to 3.6 V
3.6 V
6
–1
1
VI = VO = Open,
IO = 0
ICCB
0 V
5.5 V
1.2 V
3
0.05
4
VI = VCCI or GND,
IO = 0
ICCA + ICCB
2.3 V to 5.5 V
1.65 V to 5.5 V
µA
µA
1.4 V to 3.6 V
1.2 V
8
2
VI = VO = Open,
IO = 0, OE = GND
ICCZA
1.4 V to 3.6 V
1.2 V
VI = VO = Open,
IO = 0, OE = GND
ICCZB
1.65 V to 5.5 V
3.3 V
µA
pF
pF
1.4 V to 3.6 V
3.3 V
6
5.5
7
Ci
OE
4.5
6
A port
B port
Cio
3.3 V
3.3 V
5.5
6
(1) VCCO is the VCC associated with the output port.
(2) VCCI is the VCC associated with the input port.
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Copyright © 2007–2008, Texas Instruments Incorporated
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TXS0108E
SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
TIMING REQUIREMENTS
TA=25°C, VCCA = 1.2 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
UNIT
Mbps
ns
TYP
20
TYP
20
TYP
20
TYP
20
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data rate
2
2
2
2
50
50
50
50
tw
Pulse duration
Data inputs
500
500
500
500
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB= 3.3 V
± 0.3 V
VCCB= 5 V
± 0.5 V
UNIT
MIN
MAX
40
MIN
MAX
60
MIN
MAX
MIN
MAX
Data rate
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
60
2
50
2
Mbps
ns
2
2
tw
25
16.7
500
16.7
500
20
Pulse duration
Data inputs
500
500
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB= 3.3 V
± 0.3 V
VCCB= 5 V
± 0.5 V
UNIT
MIN
MAX
MIN MAX
MIN MAX
MIN
MAX
60
Data rate
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
40
2
60
60
Mbps
ns
2
2
2
tw
25
16.7
16.7
16.7
500
Pulse duration
Data inputs
500
500
500
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
60
MIN
MAX
MIN
MAX
60
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
60
2
Data rate
Mbps
ns
2
2
16.7
500
16.7
500
16.7
500
tw
Pulse duration
Data inputs
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
60
2
60
2
Data rate
Mbps
ns
16.7
500
16.7
500
tw
Pulse duration
Data inputs
6
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.2 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
PARAMETER
UNIT
TYP
6.5
11.9
7.1
293
6.4
8.5
5.6
312
200
16.8
7.9
296
6.3
236
5.8
5.9
4.6
4.5
1
TYP
5.9
11.1
6.3
236
6
TYP
5.7
11.0
6.2
197
5.8
6.2
3.6
192
200
13.2
6.5
185
1.8
115
4.3
4.1
2.2
2.2
1
TYP
5.5
11.1
6.6
152
5.6
5.9
3.2
132
200
13.5
6.4
127
1.5
60
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
tPHL
tPLH
tPHL
tPLH
A
B
B
A
ns
6.8
4.1
248
200
13.9
6.7
238
3.3
164
4.8
4.7
2.8
2.7
1
ns
ten
OE
OE
A or B
A or B
ns
ns
Push-pull driving
tdis
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
trA
trB
tfA
A-port rise time
ns
ns
B-port rise time
A-port fall time
B-port fall time
3.8
3.5
1.9
1.9
1
ns
tfB
Channel-to-channel
skew
tSK(O)
Push-pull driving
ns
Push-pull driving
20
2
20
2
20
2
20
2
Max data rate
A or B
Mbps
Open-drain driving
Copyright © 2007–2008, Texas Instruments Incorporated
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Product Folder Link(s): TXS0108E
TXS0108E
SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT) (OUTPUT)
TO
TEST
CONDITIONS
PARAMETER
UNIT
MIN
MAX
MIN
MAX
9.2
12.8
10
MIN
MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
11
14.4
12
8.6
12.2
9.8
473
11
8.6
tPHL
tPLH
tPHL
tPLH
4
3.6
3.5
3.5
12
A
B
B
A
ns
9.7
182
3.4
186
720
12.7
13.2
9.5
143
3.1
554
11.1
9.6
6.2
603
200
22
114
2.8
81 384
12
8.5
5.1
519
200
20.1
9
2.5
7.5
1.6
ns
745
200
28.1
13.1
982
11.4
1020
9.9
147
118
84 407
200 ns
ten
OE
OE
A or B
A or B
Push-pull driving
tdis
19.6 ns
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
3.5
147
2.9
135
2.3
2.4
2
3
115
1.9
91
9.8
716
7.4
756
7.7
7.9
5.5
8.6
1
3.1
92
0.9
58
1.6
1.7
0.9
1
3.2
8.3
ns
trA
trB
tfA
A-port rise time
B-port rise time
A-port fall time
B-port fall time
592
4.7
653
6.8
7
66 481
0.7
2.6
ns
20 370
1.7
2.1
1.3
1.3
1
1.7
1.5
0.8
0.5
6
6.2
3.1
7.7
1
10
ns
ns
8.7
3.8
9.6
1.1
tfB
1.2
11.5
1
Channel-to-channel
skew
tSK(O)
Push-pull driving
Push-pull driving
40
2
60
2
60
2
50
2
Mbp
s
Max data rate
A or B
Open-drain driving
8
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V(unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
PARAMETER
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN MA
X
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
8.2
11.4
9
6.4
9.9
2.1
584
8
5.7
9.3
6.5
466
7.4
7.3
5.8
459
200
16.5
7.8
508
5.2
546
5.7
5.8
3.9
9.6
1
5.6
3.1 8.9
6.3
tPHL
tPLH
tPHL
tPLH
3.6
194
3.4
3.2
155
2.8
3.1
126
2.5
A
B
B
A
ns
729
9.8
90 346
7
12.1
10.2
733
200
25.1
11.9
996
10.5
1001
8.8
8.5
7
2.1 6.2
5
ns
197
159
578
200
18.8
8.6
691
7.2
677
6.6
6.7
5.4
10.7
1
129
93 323
200
ten
OE
OE
A or B
A or B
ns
ns
Push-pull driving
tdis
15.3
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
3.1
155
2.8
132
2.1
2.2
2
2.6
124
1.8
106
1.6
1.7
1.3
0.7
2.7
100
1.2
73
2.8 7.2
72 350
0.7 2.7
32 323
1.4 4.9
1.2 5.2
trA
trB
tfA
A-port rise time
ns
ns
B-port rise time
A-port fall time
B-port fall time
1.4
1.4
0.9
1
9
ns
8.3
0.7
3
tfB
0.8
10.5
1
0.6 7.8
tSK(O)
Channel-to-channel skew Push-pull driving
1
ns
Push-pull driving
A or B
40
2
60
2
60
2
60
2
Max data rate
Mbps
Open-drain driving
Copyright © 2007–2008, Texas Instruments Incorporated
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Product Folder Link(s): TXS0108E
TXS0108E
SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
PARAMETER
UNIT
MIN MAX
MIN
MAX
MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
5
4
6.3
4.3
488
4.7
6
3.7
tPHL
tPLH
tPHL
tPLH
2.4
149
2.5
6.9
5.2
2.3
2.2
93
5.8
3.9
368
4.2
4.9
3.5
345
200
11.2
5.8
369
3.4
304
3.8
4
A
B
B
A
ns
592
5.4
125
2.2
7.3
1.8
94
ns
5.9
4.4
481
200
12.9
6.4
529
5.1
483
4.7
4.7
4.1
19.4
1.2
150
595
200
15.7
7.3
126
ten
OE
OE
A or B
A or B
ns
ns
Push-pull driving
tdis
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
Open-drain driving
2
110
1.8
107
1.5
1.5
1.4
2.1
93
2.2
68
trA
trB
tfA
A-port rise time
ns
ns
692
6.5
1.3
79
0.7
41
B-port rise time
A-port fall time
693
5.7
1.2
1.2
0.9
0.5
1.3
1.1
0.7
0.4
5.6
ns
5.4
3
tfB
B-port fall time
Channel-to-channel skew
A or B
0.4 14.2
3
tSK(O)
1
1
ns
60
2
60
2
60
2
Max data rate
Mbps
10
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
PARAMETER
UNIT
MIN
MAX
MIN
1.9
87
MAX
Push-pull driving
3.8
5.3
3.9
439
4.2
5.5
3.8
449
200
11.9
5.7
446
5
3.1
4.8
3.5
352
3.8
4.5
4.3
339
200
9.8
5
tPHL
tPLH
tPHL
tPLH
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
2
A
B
B
A
ns
111
2.1
112
1.7
86
ns
ten
OE
OE
A or B
A or B
ns
ns
Push-pull driving
tdis
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
Open-drain driving
1.8
75
1.5
72
1.2
1.1
1.1
1
1.9
57
1
trA
trB
tfA
A-port rise time
ns
ns
337
3.6
290
3.5
3.7
3.1
3.1
1
B-port rise time
A-port fall time
427
4.5
4.4
4.2
4.2
1
40
1.1
1
ns
0.8
0.8
tfB
B-port fall time
Channel-to-channel skew
A or B
tSK(O)
ns
60
2
60
2
Max data rate
Mbps
OPERATING CHARACTERISTICS
TA=25°C
VCCA
1.8 V
VCCB
1.8 V
1.2 V
1.2 V
1.8 V
1.5 V
2.5 V
2.5 V
3.3 V
PARAMETER
TEST CONDITIONS
UNIT
5 V
TYP
1.8 V
TYP
2.5 V
TYP
5 V
TYP
3.3 V to 5 V
TYP
TYP
TYP
A-port input,
B-port output
5.9
10.2
29.9
22.9
0.01
0.06
0.06
0.06
5.7
10.3
22.2
16.7
0.01
0.01
0.01
0.01
5.9
9.9
5.9
6.7
9.7
6.9
9.4
8
9.8
CpdA
CpdB
CpdA
CpdB
B-port input,
A-port output
CL = 0, f = 10 MHz,
tr= tf= 1ns,
OE = VCCA
9.7
20.8
16.8
0.01
0.01
0.01
0.01
pF
A-port input,
B-port output
21.5
16.7
0.01
0.01
0.01
0.01
21
23.4
20.8
0.01
0.01
0.03
0.03
23
(outputs enabled)
B-port input,
A-port output
17.8
0.01
0.01
0.01
0.01
20.9
0.01
0.01
0.02
0.02
A-port input,
B-port output
B-port input,
A-port output
CL = 0, f = 10 MHz,
tr= tf= 1ns,
OE = GND
pF
A-port input,
B-port output
(outputs disabled)
B-port input,
A-port output
Copyright © 2007–2008, Texas Instruments Incorporated
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11
Product Folder Link(s): TXS0108E
TXS0108E
SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
PRINCIPLES OF OPERATION
Applications
The TXS0108E can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another. The TXS0108E is ideal for use in applications where an open-drain
driver is connected to the data I/Os. The TXS0108E can also be used in applications where a push-pull driver is
connected to the data I/Os, but the TXB0104 might be a better option for such push-pull applications. The
TXS0108E device is a semi-buffered auto-direction-sensing voltage translator design is optimized for translation
applications (e.g. MMC Card Interfaces) that require the system to start out in a low-speed open-drain mode and
then switch to a higher speed push-pull mode.
Architecture
To address these application requirements, a semi-buffered architecture design is used and is illustrated below
(see Figure 1). Edge-rate accelerator circuitry (for both the high-to-low and low-to-high edges), a High-Ron
n-channel pass-gate transistor (on the order of 300 Ω to 500 Ω) and pull-up resistors (to provide DC-bias and
drive capabilities) are included to realize this solution. A direction-control signal (to control the direction of data
flow from A to B or from B to A) is not needed. The resulting implementation supports both low-speed open-drain
operation as well as high-speed push-pull operation.
V
V
CCB
CCA
OS3
One-Shot
P2
N2
Rpua
Rpub
Translator
T1
OS4
One-Shot
Bias
R1
A
B
R2
Npass
OS1
One-Shot
P1
N1
Translator
T2
OS2
One-Shot
Figure 1. Architecture of a TXS01xx Cell
When transmitting data from A to B ports, during a rising edge the One-Shot (OS3) turns on the PMOS transistor
(P2) for a short-duration and this speeds up the low-to-high transition. Similarly, during a falling edge, when
transmitting data from A to B, the One-Shot (OS4) turns on NMOS transistor (N2) for a short-duration and this
speeds up the high-to-low transition. The B-port edge-rate accelerator consists of one-shots OS3 and OS4,
Transistors P2 and N2 and serves to rapidly force the B port high or low when a corresponding transition is
detected on the A port.
When transmitting data from B to A ports, during a rising edge the One-Shot (OS1) turns on the PMOS transistor
12
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Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008
(P1) for a short-duration and this speeds up the low-to-high transition. Similarly, during a falling edge, when
transmitting data from B to A, the One-Shot (OS2) turns on NMOS transistor (N1) for a short-duration and this
speeds up the high-to-low transition. The A-port edge-rate accelerator consists of one-shots OS1 and OS2,
Transistors P1 and N1 components and form the edge-rate accelerator and serves to rapidly force the A port
high or low when a corresponding transition is detected on the B port.
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first.
Enable and Disable
The TXS0108E has an OE input that is used to disable the device by setting OE low, which places all I/Os in the
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
Each A-port I/O has a pull-up resistor (Rpua) to VCCA and each B-port I/O has a pull-up resistor (Rpub) to VCCB
.
Rpua and Rpub have a value of 40 kΩ when the output is driving low. Rpua and Rpub have a value of 4 kΩ when the
output is driving high. Rpua and Rpub are disabled when OE = Low.
Copyright © 2007–2008, Texas Instruments Incorporated
Submit Documentation Feedback
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Product Folder Link(s): TXS0108E
TXS0108E
SCES642B–DECEMBER 2007–REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
V
CCI
V
CCO
V
CCI
V
CCO
DUT
DUT
IN
IN
OUT
OUT
1 MW
1 MW
15 pF
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × V
CCO
S1
50 kW
Open
From Output
Under Test
15 pF
50 kW
TEST
/t
S1
2 × V
t
PZL PLZ
CCO
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
t
/t
Open
PHZ PZH
t
w
V
CCI
V
CCA
V
/2
V
/2
Output
Control
(low-level
enabling)
Input
CCI
CCI
V /2
CCA
V /2
CCA
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
0 V
t
PLZ
t
PZL
V
V
CCO
Output
Waveform 1
V
CCI
V
V
/2
CCO
Input
V
/2
/2
V
/2
CCI
CCI
0.1 y V
CCO
S1 at 2 × V
CCO
OL
0 V
(see Note B)
t
PHZ
t
t
t
PLH
PHL
PZH
Output
Waveform 2
S1 at GND
V
OH
0.9 y V
V
OH
CCO
0.9 y V
CCO
/2
Output
V
CCO
V
CCO
/2
CCO
(see Note B)
0.1 y V
CCO
0 V
V
OL
t
f
t
r
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A.
C
L
includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
H.
I.
t
t
t
V
V
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
pd
PHL
is the V associated with the input port.
CC
CCI
is the V associated with the output port.
CCO
CC
J. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
14
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Product Folder Link(s): TXS0108E
PACKAGE OPTION ADDENDUM
www.ti.com
31-Mar-2010
PACKAGING INFORMATION
Orderable Device
TXS0108EPWR
TXS0108EPWRG4
TXS0108ERGYR
TXS0108EZXYR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
VQFN
PW
RGY
ZXY
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TXS0108EPWR
TXS0108ERGYR
TXS0108EZXYR
TSSOP
VQFN
PW
RGY
ZXY
20
20
20
2000
3000
2500
330.0
330.0
330.0
16.4
12.4
12.4
6.95
3.8
7.1
4.8
3.3
1.6
1.6
1.0
8.0
8.0
4.0
16.0
12.0
12.0
Q1
Q1
Q2
BGA MI
CROSTA
R JUNI
OR
2.8
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TXS0108EPWR
TXS0108ERGYR
TXS0108EZXYR
TSSOP
VQFN
PW
RGY
ZXY
20
20
20
2000
3000
2500
346.0
346.0
340.5
346.0
346.0
338.1
33.0
29.0
20.6
BGA MICROSTAR
JUNIOR
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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