TPS92612 [TI]

150mA 单通道 LED 线性驱动器;


型号：	TPS92612
厂家：	TEXAS INSTRUMENTS
描述：	150mA 单通道 LED 线性驱动器驱动驱动器
文件：	总23页 (文件大小：1543K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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TPS92612

ZHCSL42 –APRIL 2020

具有保护功能的 TPS92612 40V、150mA 单通道线性 LED 驱动器（恒流

源）

1 特性

3 说明

•

单通道高精度电流源：

随着 LED 光源的广泛应用，简单的 LED 驱动器越来

越受欢迎。与分立式解决方案相比，低成本单片解决方

案可降低系统级组件数量，并显著提高电流精度和可靠

性。

–

在 –40°C 至 +125°C 范围内电流精度为 ±4.6%

可通过外部感应电阻器调节电流

最大电流高达 150mA

•

宽输入电压范围：4.5V 至 40V

TPS92612 器件是一款单通道高侧线性 LED 驱动器，

具有宽电源电压范围。这是一种简单而巧妙的解决方

案，能够为单个 LED 灯串提供恒定电流。它支持通过

长电缆连接非板载 LED。TPS92612 器件也可在其他

应用中用作一般恒流源或限流器。

通过输入 PWM 占空比进行亮度控制

低压降电压（包含电流感应压降）

–

最大压降：10mA 时为 150mV

最大压降：70mA 时为 400mV

最大压降：150mA 时为 700mV

器件信息⁽¹⁾

•

低静态电流：典型值 200µA

器件号

TPS92612

封装

SOT-23 (5)

封装尺寸（标称值）

保护：

2.9mm × 1.6mm

–

LED 短路保护，具有自动恢复功能

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

热关断

•

与外部电阻器实现热共享

典型应用图

工作结温范围：–40°C 至 +150°C

4.5 œ 40V

2 应用

•

LED 驱动器、恒流源或限流器，可用于：

R_(SNS)

TPS92612

–

洗衣机和烘干机

冰箱和冷冻柜

气体检测仪

SUPPLY

PWM

C_(SUPPLY)

PWM

C_(OUT)

工厂自动化和控制

楼宇自动化

OUT

GND

医疗

本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确

性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLVSFG3

TPS92612

ZHCSL42 –APRIL 2020

www.ti.com.cn

7.3 Feature Description................................................... 8

7.4 Device Functional Modes.......................................... 9

Application and Implementation ........................ 10

8.1 Application Information............................................ 10

8.2 Typical Application .................................................. 10

Power Supply Recommendations...................... 14

特性.......................................................................... 1

应用.......................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

Pin Configuration and Functions......................... 3

Specifications......................................................... 3

6.1 Absolute Maximum Ratings ...................................... 3

6.2 ESD Ratings.............................................................. 3

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics........................................... 4

6.6 Timing Requirements................................................ 4

6.7 Typical Characteristics.............................................. 5

Detailed Description .............................................. 8

7.1 Overview ................................................................... 8

7.2 Functional Block Diagram ......................................... 8

10 Layout................................................................... 15

10.1 Layout Guidelines ................................................. 15

10.2 Layout Example .................................................... 15

11 器件和文档支持 ..................................................... 16

11.1 接收文档更新通知 ................................................. 16

11.2 支持资源................................................................ 16

11.3 商标....................................................................... 16

11.4 静电放电警告......................................................... 16

11.5 Glossary................................................................ 16

12 机械、封装和可订购信息....................................... 16

4 修订历史记录

日期

修订版本

说明

2020 年 4 月

初始发行版。

TPS92612

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ZHCSL42 –APRIL 2020

5 Pin Configuration and Functions

TPS92612 DBV Package

5-Pin SOT-23

Top View

GND

PWM

OUT

SUPPLY

Not to scale

Pin Functions

NO.

I/O

DESCRIPTION

NAME

GND

TPS92612

—

Ground

Current input

OUT

Constant-current output

PWM input

PWM

SUPPLY

Device supply voltage

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

–40

MAX

UNIT

High-voltage input

IN, PWM, SUPPLY

OUT

High-voltage output

IN to OUT

V_(IN)– V_(OUT)

V_(SUPPLY)– V_(IN)

SUPPLY to IN

Operating junction temperature, T_J

Storage temperature, T_stg

150

°C

–40

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC

JS-001⁽¹⁾

All pins

±2000

V_(ESD)

Electrostatic discharge

All pins

±500

±750

Charged-device model (CDM), per JEDEC

specification JESD22-C101⁽²⁾

Corner pins (3, 4, and 5)

(1) JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

TPS92612

ZHCSL42 –APRIL 2020

www.ti.com.cn

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

4.5

4.4

NOM

MAX

UNIT

SUPPLY

Device supply voltage

Sense voltage

PWM inputs

PWM

OUT

Driver output

Operating ambient temperature, T_A

–40

125

°C

6.4 Thermal Information

TPS92612

THERMAL METRIC

DBV (SOT23)

5 PINS

200.7

UNIT

R_θJA

R_θJC(top)

R_θJB

ψ_JT

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

°C/W

104.4

Junction-to-board thermal resistance

45.6

Junction-to-top characterization parameter

Junction-to-board characterization parameter

17.5

ψ_JB

45.2

6.5 Electrical Characteristics

V_(SUPPLY)= 5 V to 40 V, T_J= –40°C to +150°C unless otherwise noted

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

BIAS

V_{(POR_rising)}

V_{(POR_falling)}

I_(Quiescent)

Supply voltage POR rising threshold

Supply voltage POR falling threshold

Device standby current

3.2

2.2

0.1

PWM = HIGH

0.2

0.25

LOGIC INPUTS (PWM)

V_IL(PWM)Input logic-low voltage, PWM

V_IH(PWM)Input logic-high voltage, PWM

CONSTANT-CURRENT DRIVER

1.045

1.16

1.1

1.2

1.155

1.24

I_(OUT)

Device output-current range

100% duty cycle

150

102

T_A= 25°C, V_(SUPPLY)= 4.5 V to 18 V

V_{(CS_REG)}

R_{(CS_REG)}

Sense-resistor regulation voltage

Sense-resistor value

T_A= –40°C to +125°C, V_(SUPPLY)= 4.5 V to 18 V

93.5

0.66

102.5

24.5

150

V_{(CS_REG)}voltage included, current setting of 10 mA

V_{(CS_REG)}voltage included, current setting of 70 mA

120

250

400

V_(DROPOUT)

Voltage dropout from SUPPLY to OUT

V_{(CS_REG)}voltage included, current setting of 150

430

700

DIAGNOSTICS

Channel output V_(OUT)short-to-ground

rising threshold

V_{(SG_th_rising)}

1.14

0.82

0.64

1.2

0.865

1.08

1.26

0.91

Channel output V_(OUT)short-to-ground

falling threshold

V_{(SG_th_falling)}

I_(Retry)

Channel output V_(OUT)short-to-ground

retry current

1.528

THERMAL PROTECTION

Thermal shutdown junction temperature

threshold

T_(TSD)

157

172

187

°C

Thermal shutdown junction temperature

hysteresis

T_{(TSD_HYS)}

6.6 Timing Requirements

MIN NOM MAX UNIT

10 17 25 µs

PWM rising edge delay, 50% PWM voltage to 10% of output current closed loop, t2 - t1 as shown

in Figure 1

t_{(PWM_delay_rising)}

TPS92612

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ZHCSL42 –APRIL 2020

Timing Requirements (continued)

MIN NOM MAX UNIT

PWM falling edge delay, 50% PWM voltage to 90% of output current open loop, t5 - t4 as shown

in Figure 1

t_{(PWM_delay_falling)}

t_{(DEVICE_STARTUP)}

µs

SUPPLY rising edge to 10% output current at 50-mA set current, t8 - t7 as shown

in Figure 1

100

150

175

t_{(SG_deg)}

Output short-to-ground detection deglitch time

Thermal over temperature deglitch timer

Fault recovery deglitch timer

125

µs

t_{(TSD_deg)}

t_{(Recover_deg)}

8.5

SUPPLY

PWM

I_OUT

Input duty-cycle

90%

Output duty-cycle

10%

图 1. Output Timing Diagram

6.7 Typical Characteristics

250

200

I_(OUT)setting = 10 mA

I_(OUT)setting = 70 mA

I_(OUT)setting = 150 mA

100

200

150

100

Supply Voltage (V)

0.6

6 7 8 10

R_(SNS)(W)

D001

T_A= 25 °C

图 2. Output Current vs Supply Voltage

图 3. Output Current vs Current-Sense Resistor

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Typical Characteristics (接下页)

240

180

150

120

I_(OUT)setting = 10 mA

I_(OUT)setting = 70 mA

I_(OUT)setting = 150 mA

200

160

120

-40èC

25èC

125èC

0.5

Dropout Voltage (V)

1.5

0.5

Dropout Voltage (V)

1.5

D002

D003

T_A= 25 °C

图 4. Output Current vs Dropout Voltage

I_(OUT)setting = 150 mA

图 5. Output Current vs Dropout Voltage

250

200

150

100

100%

10%

0.5%

-40

-20

100 120 140

10%

PWM Duty Cycle

100%

Temperature (^oC)

D005

I_(OUT)setting = 150 mA

V_(SUPPLY)-V_(OUT)= 2 V

f_(PWM)= 200 Hz

图 7. PWM Output Duty Cycle vs Input Duty Cycle

图 6. Output Current vs Temperature

Ch. 1 = SUPPLY

f_(PWM)= 200 Hz

Ch. 2 = V_(PWM)

Ch. 4 = I_(OUT)

Ch. 1 = SUPPLY

f_(PWM)= 2 kHz

Ch. 2 = V_(PWM)

Ch. 4 = I_(OUT)

Duty-cycle = 50%

图 8. PWM Dimming at 200 Hz

图 9. PWM Dimming at 2 kHz

TPS92612

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ZHCSL42 –APRIL 2020

Typical Characteristics (接下页)

Ch. 1 = SUPPLY

Ch. 2 = V_(OUT)

Ch. 4 = I_(OUT)

Ch. 1 = SUPPLY

Ch. 2 = V_(OUT)

Ch. 4 = I_(OUT)

图 10. LED Open-Circuit and Recovery

图 11. LED Short-Circuit Protection and Recovery

TPS92612

ZHCSL42 –APRIL 2020

www.ti.com.cn

7 Detailed Description

7.1 Overview

The TPS92612 device is a single-channel linear LED driver providing a simple current source with protection.

The output current at OUT pin can be set by an external R_(SNS)resistor. Current flows from the supply through

the R_(SNS)resistor into the integrated current regulation circuit and to the output through OUT pin. Brightness can

be controlled by PWM pin.

7.2 Functional Block Diagram

4.5 œ 40V

TPS92612

R_(SNS)

SUPPLY

Supply

and

Control

PWM

Output Driver

OUT

GND

7.3 Feature Description

7.3.1 Device Bias

7.3.1.1 Power-On Reset (POR)

The TPS92612 device has an internal power-on-reset (POR) function. When power is applied to the SUPPLY

pin, the internal POR holds the device in the reset condition until V_(SUPPLY)reaches V_{(POR_rising)}

7.3.2 Constant-Current Driver

The TPS92612 device is a high-side constant-current driver. The device controls the output current through

regulating the voltage drop on an external high-side current-sense resistor, R_(SNS). An integrated error amplifier

drives an internal power transistor to maintain the voltage drop on the current-sense resistor R_(SNS)to V_{(CS_REG)}

and therefore regulates the current output to target value. When the output current is in regulation, the current

value can be calculated by using 公式 1.

(CS _REG)

I_(OUT)

R_(SNS)

where

•

V_{(CS_REG)}= 98 mV (typical)

(1)

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ZHCSL42 –APRIL 2020

Feature Description (接下页)

When the SUPPLY-to-OUT voltage difference is below the required dropout voltage, V_(DROPOUT), at a given

output current, the TPS92612 is not able to deliver enough current output as set by the value of R_(SNS), and the

voltage across the current-sense resistor R_(SNS)is less than V_{(CS_REG)}

7.3.3 PWM Control

The pulse width modulation (PWM) input of the TPS92612 functions as enable for the output current. When the

voltage applied on the PWM pin is higher than V_IH(PWM), the output current is enabled. When the voltage applied

on PWM pin is lower than V_IL(PWM), the output current is disabled. Besides output current enable and disable

function, the PWM input of TPS92612 also supports adjustment of the average current for LED brightness

control. TI recommends a 200 Hz – 2 kHz PWM signal for brightness control, which is out of visible frequency

range of human eyes.

7.3.4 Protection

7.3.4.1 Short-to-GND Protection

The TPS92612 device has OUT short-to-GND protection. The device monitors the V_(OUT)voltage when the

output current is enabled and compares it with the internal reference voltage to detect a short-to-GND failure. If

V_(OUT)falls below V_{(SG_th_falling)}longer than the deglitch time of t_{(SG_deg)}, the device asserts the short-to-GND fault.

During the deglitching time period, if V_(OUT)rises above V_{(SG_th_rising)}, the timer is reset.

Once the device has detected a short-to-GND fault, the device turns off the output channel and retries

automatically by sourcing a small current I_(retry)from IN to OUT to pull up the loads continuously, regardless of

the state of the PWM input. Once auto retry detects output voltage rising above V_{(SG_th_rising)}, the device clears

the short-to-GND fault and resumes normal operation.

7.3.4.2 Over Temperature Protection

The TPS92612 device monitors device junction temperature. When the junction temperature reaches thermal

shutdown threshold T_(TSD), the output shuts down. Once the junction temperature falls below T_(TSD)– T_{(TSD_HYS)}

the device recovers to normal operation.

7.4 Device Functional Modes

7.4.1 Undervoltage Lockout, V_(SUPPLY)< V_{(POR_rising)}

When the TPS92612 device is in undervoltage lockout mode, the device disables all functions until the supply

rises above the V_{(POR_rising)}threshold.

7.4.2 Normal State, V_(SUPPLY)≥ 4.5 V

The device regulates output current in normal state. With enough voltage drop across SUPPLY and OUT, the

device is able to drive the output in constant-current mode.

TPS92612

ZHCSL42 –APRIL 2020

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8 Application and Implementation

注

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPS92612 device is a constant-current regulator which can be used as a LED driver, general constant-

current source or current limiter in industrial applications.

Thermal performance is one of the design challenges for linear devices. To increase current-driving capability,

the device supports heat sharing using an external parallel resistor, as shown in 图 15. This technique provides

the low-cost solution of using external resistors to minimize thermal accumulation on the device itself, and still

keeps high accuracy of the total current output.

8.2 Typical Application

8.2.1 Single LED Driver

The TPS92612 offers a cost-effective and easy-to-use solution for LED driver applications. PWM input can be

adopted for LED brightness adjust and LED ON/OFF control. The device also supports off-board LED connection

with long cables.

5 V

R_(SNS)

TPS92612

SUPPLY

PWM

C_(SUPPLY)

PWM

Long wire impedence

C_(OUT)

OUT

GND

图 12. Typical Application Diagram

8.2.1.1 Design Requirements

The input voltage is 5 V ± 5%. LED maximum forward voltage V_{F_MAX}= 2.5 V, minimum forward voltage V_{F_MIN}

1.9 V, current I_(LED)= 150 mA. LED is connected to device OUT pin through a 1-m long wire.

8.2.1.2 Detailed Design Procedure

STEP 1: Determine the current setting resistor, R_(SNS)value by using 公式 2.

(CS _REG)

R_(SNS)

= 0.653W

I_(LED)

where

•

V_{(CS_REG)}= 98 mV (typical)

I_(LED)= 150 mA

(2)

STEP 2: Power consumption analysis for the worst application conditions.

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ZHCSL42 –APRIL 2020

Typical Application (接下页)

Normally the thermal analysis is necessary for linear LED-driver applications to ensure that the operation junction

temperature of TPS92612 is well managed. The total power consumption on the TPS92612 itself is one

important factor determining operation junction temperature, and it can be calculated by using 公式 3. Based on

the worst-case analysis for maximum power consumption on device, consider either optimizing PCB layout for

better power dissipation as Layout describes or adding an extra heat-sharing resistor as described in Single-

Channel LED Driver With Heat Sharing.

P_DEV= V

- V _{CS _REG}- V _OUTìI

₎+ V₍_SUPPLYìI₍_Quiescent

) )

(

)

SUPPLY

LED

(

)

(

)

(

)

(

)

(

P_{DEV _MAX}= 5.25 - 0.098 -1.9 ì0.15 + 5.25ì0.00025 = 0.489W

(

)

(

)

where

•

V_{(CS_REG)}= 98 mV (typical)

I_(Quiescent)= 250 µA (maximum)

(3)

In this application, the calculated result for maximum power consumption on the TPS92612 is 0.489 W at

V_(SUPPLY)= 5.25 V and I_(LED)= 150 mA conditions.

TI recommends to add capacitors C_(SUPPLY)at SUPPLY and C_(OUT)at OUT. TI recommends one 1-μF capacitor

plus one 100-nF decoupling ceramic capacitor close to the SUPPLY pin for C_(SUPPLY)and a 10-nF ceramic

capacitor close to the OUT pin for C_(OUT). The larger capacitor for C_(SUPPLY)or C_(OUT)is helpful for EMI and ESD

immunity; however, large C_(OUT)takes a longer time to charge up the capacitor and may affect PWM dimming

performance.

8.2.1.3 Application Curve

A 1-μH inductor is connected between OUT and the LED to simulate the 1-m long cable.

Ch. 1 = V_(SUPPLY)

Ch. 3 = V_(OUT)

Ch. 2 = V_(PWM)

Ch. 4 = I_(OUT)

Ch. 1 = V_(SUPPLY)

Ch. 3 = V_(OUT)

Ch. 2 = V_(PWM)

Ch. 4 = I_(OUT)

图 14. Output Current With PWM Input

图 13. Output Current With PWM Input

8.2.2 Single-Channel LED Driver With Heat Sharing

Using parallel resistors, thermal performance can be improved by balancing current between the TPS92612

device and the external resistors as follows. As the current-sense resistor controls the total LED string current,

the LED string current I_(LED)is set by V_{(CS_REG)}/ R_(SNS), while the TPS92612 current I_(DRIVE)and parallel resistor

current I_(P)combine to the total current.

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Typical Application (接下页)

12 V

R_(SNS)

I_(DRIVE)

I_(LED)

TPS92612

SUPPLY

C_(SUPPLY)

C_(OUT)

I_(P)

R_(P)

PWM

GND

OUT

图 15. Heat Sharing With a Parallel Resistor

8.2.2.1 Design Requirements

The input voltage range is 12 V ± 10%, LED maximum forward voltage V_{F_MAX}= 2.5 V, minimum forward voltage

V_{F_MIN}= 1.9 V, current I_(LED)= 150 mA.

8.2.2.2 Detailed Design Procedure

In linear LED driver applications, the input and output voltage variation generates the most of the thermal

concerns. The resistor current I_(P), as indicated by Ohm's law, depends on the voltage across the external

resistors. The TPS92612 controls the driver current I_(DRIVE)to attain the desired total current. If I_(P)increases, the

TPS92612 device decreases I_(DRIVE)to compensate, and vice versa. The parallel-resistor takes highest current

and generates maximum heat at maximum supply voltage and minimum LED-string forward voltage.

The parallel resistor value must be carefully calculated to ensure that 1) thermal dissipation for both the

TPS92612 device and the resistor is within their thermal dissipation limits, and 2) device current at high voltage

drop condition is above the minimal output-current requirement.

STEP 1: Determine the current setting resistor, R_(SNS)value by using 公式 4.

(CS _REG)

R_(SNS)

= 0.653W

I_(LED)

where

•

V_{(CS_REG)}= 98 mV (typical)

I_(LED)= 150 mA

(4)

The calculated result for R_(SNS)is 0.653 Ω.

STEP 2: Calculate the parallel resistor, R_(P)value by using 公式 5.

The parallel resistor R_(P)is recommended to consume 50% of the total current at maximum supply voltage and

minimum LED-string forward voltage.

_(SUPPLY)- V_{(CS _ REG)}- V

13.2 - 0.098 - 3 ì1.9

0.5 ì0.15

(OUT)

R_(P)

ö 100W

0.5 ìI_(LED)

where

•

V_{(CS_REG)}= 98 mV (typical)

I_(LED)= 150 mA

(5)

The calculated result for R_(P)is about 100 Ω at V_(SUPPLY)= 13.2 V.

STEP 3: Power consumption analysis for the worst application conditions.

The total device power consumption can be calculated by 公式 6.

TPS92612

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ZHCSL42 –APRIL 2020

Typical Application (接下页)

≈

∆

’

V₍_SUPPLY- V₍_{CS _ REG}- V₍_OUT

)

P_DEV= V

- V _{CS _ REG}- V _OUTì I

LED

+ V₍_SUPPLYìI₍_Quiescent

(

)

SUPPLY

(

)

(

)

(

)

(

)

(

)

∆

R₍_P

)

◊

13.2 - 0.098 - 3 ì1.9

100

≈

’

P_{DEV _ MAX}= 13.2 - 0.098 - 3 ì1.9 ì 0.15 -

+13.2ì0.00025 = 0.566W

(

)

∆

◊

(

)

where

•

V_{(CS_REG)}= 98 mV (typical)

I_(Quiescent)= 250 µA (maximum)

(6)

The calculated maximum power consumption on the TPS92612 device is 0.566 W at V_(SUPPLY)= 13.2 V, V_(OUT)

3 × 1.9 V = 5.7 V and I_(LED)= 150 mA.

The power consumption on resistor R_(P)can be calculated through 公式 7.

- V₍_{CS _ REG}- V₍_OUT

) )

(

)

SUPPLY

(

)

P_RP

(

)

R₍_P

)

13.2 - 0.098 - 3 ì1.9

(

)

P_{RP _ MAX}

= 0.548W

(

)

100

where

•

V_{(CS_REG)}= 98 mV (typical)

(7)

The calculated maximum power consumption on the 100 Ω, R_(P)parallel resistor is 0.548 W at V_(SUPPLY)= 13.2 V

and V_(OUT)= 3 × 1.9 V = 5.7 V.

TI recommends adding capacitors C_(SUPPLY)at SUPPLY and C_(OUT)at OUT. One 1-μF capacitor plus one 100-nF

decoupling ceramic capacitor close to the SUPPLY pin is recommended for C_(SUPPLY), and a 10-nF ceramic

capacitor close to the OUT pin is recommended for C_(OUT). The larger capacitor for C_(SUPPLY)or C_(OUT)is helpful

for EMI and ESD immunity, however large C_(OUT)takes a longer time to charge up the capacitor and could affect

PWM dimming performance.

Note that the parallel resistor path cannot be shut down by PWM or fault protection. If PWM control is required,

TI recommends an application circuit as shown in 图 16. A NPN bipolar transistor with a base current-limiting

resistor, R₁, can modulate the output current together with the device PWM function. The resistor value of R₁

needs to be calculated based on the applied PWM voltage and β value of selected NPN transistor.

12 V

R_(SNS)

I_(LED)

TPS92612

SUPPLY

I_(DRIVE)

C_(SUPPLY)

PWM

I_(P)

R_(P)

PWM

GND

OUT

C_(OUT)

R₁

PWM

图 16. PWM Control With Heat Sharing Resistor

TPS92612

ZHCSL42 –APRIL 2020

www.ti.com.cn

Typical Application (接下页)

8.2.2.3 Application Curve

Ch. 1 = V_(SUPPLY)Ch. 2 = V_(OUT)

Ch. 3 = I_(P)Ch. 4 = I_(LED)

图 17. Constant Output Current With Heat Sharing Resistor

9 Power Supply Recommendations

The TPS92612 is designed to operate from a power system within the range specified in the Recommended

Operating Conditions. The SUPPLY input must be protected from reverse voltage and overvoltage over 40 V.

The impedance of the input supply rail must be low enough that the input current transient does not cause drop

below LED string required forward voltage. If the input supply is connected with long wires, additional bulk

capacitance may be required in addition to normal input capacitor.

TPS92612

www.ti.com.cn

ZHCSL42 –APRIL 2020

10 Layout

10.1 Layout Guidelines

Thermal dissipation is the primary consideration for TPS92612 layout. TI recommends good thermal dissipation

area beneath the device for better thermal performance.

10.2 Layout Example

GND

TPS92612

OUT

GND

PWM

SUPPLY

图 18. TPS92612 Example Layout Diagram

TPS92612

ZHCSL42 –APRIL 2020

www.ti.com.cn

11 器件和文档支持

11.1 接收文档更新通知

要接收文档更新通知，请导航至 ti.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产

品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

11.2 支持资源

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 静电放电警告

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可

能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可

能会导致器件与其发布的规格不相符。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 机械、封装和可订购信息

以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且

不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS92612DBVR

ACTIVE

SOT-23

DBV

3000 RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-40 to 125

22SF

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

22-May-2020

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS92612DBVR

SOT-23

DBV

3000

180.0

8.4

3.2

1.4

4.0

8.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

22-May-2020

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SOT-23 DBV

SPQ

Length (mm) Width (mm) Height (mm)

210.0 185.0 35.0

TPS92612DBVR

3000

Pack Materials-Page 2

PACKAGE OUTLINE

DBV0005A

SOT-23 - 1.45 mm max height

SMALL OUTLINE TRANSISTOR

3.0

2.6

0.1 C

1.75

1.45

0.90

PIN 1

INDEX AREA

(0.1)

2X 0.95

1.9

3.05

2.75

1.9

(0.15)

0.5

0.3

0.15

0.00

(1.1)

TYP

0.2

C A B

NOTE 5

0.25

GAGE PLANE

0.22

0.08

TYP

0.6

0.3

TYP

SEATING PLANE

4214839/G 03/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.25 mm per side.

5. Support pin may differ or may not be present.

www.ti.com

EXAMPLE BOARD LAYOUT

DBV0005A

SOT-23 - 1.45 mm max height

SMALL OUTLINE TRANSISTOR

PKG

5X (1.1)

5X (0.6)

SYMM

(1.9)

2X (0.95)

(R0.05) TYP

(2.6)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

METAL

EXPOSED METAL

0.07 MIN

ARROUND

0.07 MAX

ARROUND

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4214839/G 03/2023

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

EXAMPLE STENCIL DESIGN

DBV0005A

SOT-23 - 1.45 mm max height

SMALL OUTLINE TRANSISTOR

PKG

5X (1.1)

5X (0.6)

SYMM

(1.9)

2X(0.95)

(R0.05) TYP

(2.6)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

4214839/G 03/2023

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

www.ti.com

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TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TPS92612 [TI]

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