TPS92612DBVR [TI]
150mA 单通道 LED 线性驱动器 | DBV | 5 | -40 to 125;型号: | TPS92612DBVR |
厂家: | TEXAS INSTRUMENTS |
描述: | 150mA 单通道 LED 线性驱动器 | DBV | 5 | -40 to 125 驱动 驱动器 |
文件: | 总23页 (文件大小:1543K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS92612
ZHCSL42 –APRIL 2020
具有保护功能的 TPS92612 40V、150mA 单通道线性 LED 驱动器(恒流
源)
1 特性
3 说明
1
•
单通道高精度电流源:
随着 LED 光源的广泛应用,简单的 LED 驱动器越来
越受欢迎。与分立式解决方案相比,低成本单片解决方
案可降低系统级组件数量,并显著提高电流精度和可靠
性。
–
–
–
在 –40°C 至 +125°C 范围内电流精度为 ±4.6%
可通过外部感应电阻器调节电流
最大电流高达 150mA
•
•
•
宽输入电压范围:4.5V 至 40V
TPS92612 器件是一款单通道高侧线性 LED 驱动器,
具有宽电源电压范围。这是一种简单而巧妙的解决方
案,能够为单个 LED 灯串提供恒定电流。它支持通过
长电缆连接非板载 LED。TPS92612 器件也可在其他
应用中用作一般恒流源或限流器。
通过输入 PWM 占空比进行亮度控制
低压降电压(包含电流感应压降)
–
–
–
最大压降:10mA 时为 150mV
最大压降:70mA 时为 400mV
最大压降:150mA 时为 700mV
器件信息(1)
•
•
低静态电流:典型值 200µA
器件号
TPS92612
封装
SOT-23 (5)
封装尺寸(标称值)
保护:
2.9mm × 1.6mm
–
–
LED 短路保护,具有自动恢复功能
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
热关断
•
•
与外部电阻器实现热共享
典型应用图
工作结温范围:–40°C 至 +150°C
4.5 œ 40V
2 应用
•
LED 驱动器、恒流源或限流器,可用于:
R(SNS)
TPS92612
–
–
–
–
–
–
洗衣机和烘干机
冰箱和冷冻柜
气体检测仪
IN
SUPPLY
PWM
C(SUPPLY)
PWM
C(OUT)
工厂自动化和控制
楼宇自动化
OUT
GND
医疗
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSFG3
TPS92612
ZHCSL42 –APRIL 2020
www.ti.com.cn
目录
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 9
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
Power Supply Recommendations...................... 14
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Timing Requirements................................................ 4
6.7 Typical Characteristics.............................................. 5
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
8
9
10 Layout................................................................... 15
10.1 Layout Guidelines ................................................. 15
10.2 Layout Example .................................................... 15
11 器件和文档支持 ..................................................... 16
11.1 接收文档更新通知 ................................................. 16
11.2 支持资源................................................................ 16
11.3 商标....................................................................... 16
11.4 静电放电警告......................................................... 16
11.5 Glossary................................................................ 16
12 机械、封装和可订购信息....................................... 16
7
4 修订历史记录
日期
修订版本
说明
2020 年 4 月
*
初始发行版。
2
Copyright © 2020, Texas Instruments Incorporated
TPS92612
www.ti.com.cn
ZHCSL42 –APRIL 2020
5 Pin Configuration and Functions
TPS92612 DBV Package
5-Pin SOT-23
Top View
GND
PWM
1
2
3
5
OUT
SUPPLY
4
IN
Not to scale
Pin Functions
PIN
NO.
I/O
DESCRIPTION
NAME
GND
TPS92612
1
4
5
2
3
—
I
Ground
IN
Current input
OUT
O
I
Constant-current output
PWM input
PWM
SUPPLY
I
Device supply voltage
6 Specifications
6.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–40
MAX
45
UNIT
V
High-voltage input
IN, PWM, SUPPLY
OUT
High-voltage output
IN to OUT
45
V
V(IN) – V(OUT)
V(SUPPLY) – V(IN)
45
V
SUPPLY to IN
1
V
Operating junction temperature, TJ
Storage temperature, Tstg
150
150
°C
°C
–40
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC
JS-001(1)
All pins
±2000
V(ESD)
Electrostatic discharge
V
All pins
±500
±750
Charged-device model (CDM), per JEDEC
specification JESD22-C101(2)
Corner pins (3, 4, and 5)
(1) JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.
Copyright © 2020, Texas Instruments Incorporated
3
TPS92612
ZHCSL42 –APRIL 2020
www.ti.com.cn
6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
4.5
4.4
0
NOM
MAX
40
UNIT
V
SUPPLY
IN
Device supply voltage
Sense voltage
PWM inputs
40
V
PWM
OUT
40
V
Driver output
0
40
V
Operating ambient temperature, TA
–40
125
°C
6.4 Thermal Information
TPS92612
THERMAL METRIC
DBV (SOT23)
5 PINS
200.7
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
104.4
Junction-to-board thermal resistance
45.6
Junction-to-top characterization parameter
Junction-to-board characterization parameter
17.5
ψJB
45.2
6.5 Electrical Characteristics
V(SUPPLY) = 5 V to 40 V, TJ = –40°C to +150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
BIAS
V(POR_rising)
V(POR_falling)
I(Quiescent)
Supply voltage POR rising threshold
Supply voltage POR falling threshold
Device standby current
3.2
4
V
V
2.2
0.1
3
PWM = HIGH
0.2
0.25
mA
LOGIC INPUTS (PWM)
VIL(PWM) Input logic-low voltage, PWM
VIH(PWM) Input logic-high voltage, PWM
CONSTANT-CURRENT DRIVER
1.045
1.16
1.1
1.2
1.155
1.24
V
V
I(OUT)
Device output-current range
100% duty cycle
4
94
150
102
mA
mV
Ω
TA = 25°C, V(SUPPLY) = 4.5 V to 18 V
98
98
V(CS_REG)
R(CS_REG)
Sense-resistor regulation voltage
Sense-resistor value
TA = –40°C to +125°C, V(SUPPLY) = 4.5 V to 18 V
93.5
0.66
102.5
24.5
150
V(CS_REG) voltage included, current setting of 10 mA
V(CS_REG) voltage included, current setting of 70 mA
120
250
400
V(DROPOUT)
Voltage dropout from SUPPLY to OUT
mV
V(CS_REG) voltage included, current setting of 150
mA
430
700
DIAGNOSTICS
Channel output V(OUT) short-to-ground
rising threshold
V(SG_th_rising)
1.14
0.82
0.64
1.2
0.865
1.08
1.26
0.91
V
V
Channel output V(OUT) short-to-ground
falling threshold
V(SG_th_falling)
I(Retry)
Channel output V(OUT) short-to-ground
retry current
1.528
mA
THERMAL PROTECTION
Thermal shutdown junction temperature
threshold
T(TSD)
157
172
15
187
°C
°C
Thermal shutdown junction temperature
hysteresis
T(TSD_HYS)
6.6 Timing Requirements
MIN NOM MAX UNIT
10 17 25 µs
PWM rising edge delay, 50% PWM voltage to 10% of output current closed loop, t2 - t1 as shown
in Figure 1
t(PWM_delay_rising)
4
Copyright © 2020, Texas Instruments Incorporated
TPS92612
www.ti.com.cn
ZHCSL42 –APRIL 2020
Timing Requirements (continued)
MIN NOM MAX UNIT
PWM falling edge delay, 50% PWM voltage to 90% of output current open loop, t5 - t4 as shown
in Figure 1
t(PWM_delay_falling)
t(DEVICE_STARTUP)
15
21
30
µs
µs
SUPPLY rising edge to 10% output current at 50-mA set current, t8 - t7 as shown
in Figure 1
100
150
175
t(SG_deg)
Output short-to-ground detection deglitch time
Thermal over temperature deglitch timer
Fault recovery deglitch timer
80
125
50
µs
µs
µs
t(TSD_deg)
t(Recover_deg)
8.5
16
25
SUPPLY
PWM
IOUT
Input duty-cycle
90%
90%
Output duty-cycle
10%
t1
10%
t6
10%
t8
t7
t2
t3
t4
t5
图 1. Output Timing Diagram
6.7 Typical Characteristics
250
200
I(OUT) setting = 10 mA
I(OUT) setting = 70 mA
I(OUT) setting = 150 mA
100
70
200
150
100
50
50
30
20
10
7
5
3
2
0
4
10
16
22
Supply Voltage (V)
28
34
40
0.6
1
2
3
4
5
6 7 8 10
20
30
R(SNS) (W)
D001
TA = 25 °C
图 2. Output Current vs Supply Voltage
图 3. Output Current vs Current-Sense Resistor
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5
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ZHCSL42 –APRIL 2020
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Typical Characteristics (接下页)
240
180
150
120
90
I(OUT) setting = 10 mA
I(OUT) setting = 70 mA
I(OUT) setting = 150 mA
200
160
120
80
60
-40èC
25èC
125èC
40
30
0
0
0
0.5
1
Dropout Voltage (V)
1.5
2
0
0.5
1
Dropout Voltage (V)
1.5
2
D002
D003
TA = 25 °C
图 4. Output Current vs Dropout Voltage
I(OUT) setting = 150 mA
图 5. Output Current vs Dropout Voltage
250
200
150
100
50
100%
10%
1%
0.5%
-40
-20
0
20
40
60
80
100 120 140
1%
10%
PWM Duty Cycle
100%
Temperature (oC)
D005
I(OUT) setting = 150 mA
V(SUPPLY)-V(OUT) = 2 V
f(PWM) = 200 Hz
图 7. PWM Output Duty Cycle vs Input Duty Cycle
图 6. Output Current vs Temperature
Ch. 1 = SUPPLY
f(PWM) = 200 Hz
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
Ch. 1 = SUPPLY
f(PWM) = 2 kHz
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
Duty-cycle = 50%
Duty-cycle = 50%
图 8. PWM Dimming at 200 Hz
图 9. PWM Dimming at 2 kHz
6
版权 © 2020, Texas Instruments Incorporated
TPS92612
www.ti.com.cn
ZHCSL42 –APRIL 2020
Typical Characteristics (接下页)
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
图 10. LED Open-Circuit and Recovery
图 11. LED Short-Circuit Protection and Recovery
版权 © 2020, Texas Instruments Incorporated
7
TPS92612
ZHCSL42 –APRIL 2020
www.ti.com.cn
7 Detailed Description
7.1 Overview
The TPS92612 device is a single-channel linear LED driver providing a simple current source with protection.
The output current at OUT pin can be set by an external R(SNS) resistor. Current flows from the supply through
the R(SNS) resistor into the integrated current regulation circuit and to the output through OUT pin. Brightness can
be controlled by PWM pin.
7.2 Functional Block Diagram
4.5 œ 40V
TPS92612
R(SNS)
IN
SUPPLY
Supply
and
Control
PWM
Output Driver
OUT
GND
7.3 Feature Description
7.3.1 Device Bias
7.3.1.1 Power-On Reset (POR)
The TPS92612 device has an internal power-on-reset (POR) function. When power is applied to the SUPPLY
pin, the internal POR holds the device in the reset condition until V(SUPPLY) reaches V(POR_rising)
.
7.3.2 Constant-Current Driver
The TPS92612 device is a high-side constant-current driver. The device controls the output current through
regulating the voltage drop on an external high-side current-sense resistor, R(SNS). An integrated error amplifier
drives an internal power transistor to maintain the voltage drop on the current-sense resistor R(SNS) to V(CS_REG)
and therefore regulates the current output to target value. When the output current is in regulation, the current
value can be calculated by using 公式 1.
V
(CS _REG)
I(OUT)
=
R(SNS)
where
•
V(CS_REG) = 98 mV (typical)
(1)
8
版权 © 2020, Texas Instruments Incorporated
TPS92612
www.ti.com.cn
ZHCSL42 –APRIL 2020
Feature Description (接下页)
When the SUPPLY-to-OUT voltage difference is below the required dropout voltage, V(DROPOUT), at a given
output current, the TPS92612 is not able to deliver enough current output as set by the value of R(SNS), and the
voltage across the current-sense resistor R(SNS) is less than V(CS_REG)
.
7.3.3 PWM Control
The pulse width modulation (PWM) input of the TPS92612 functions as enable for the output current. When the
voltage applied on the PWM pin is higher than VIH(PWM), the output current is enabled. When the voltage applied
on PWM pin is lower than VIL(PWM), the output current is disabled. Besides output current enable and disable
function, the PWM input of TPS92612 also supports adjustment of the average current for LED brightness
control. TI recommends a 200 Hz – 2 kHz PWM signal for brightness control, which is out of visible frequency
range of human eyes.
7.3.4 Protection
7.3.4.1 Short-to-GND Protection
The TPS92612 device has OUT short-to-GND protection. The device monitors the V(OUT) voltage when the
output current is enabled and compares it with the internal reference voltage to detect a short-to-GND failure. If
V(OUT) falls below V(SG_th_falling) longer than the deglitch time of t(SG_deg), the device asserts the short-to-GND fault.
During the deglitching time period, if V(OUT) rises above V(SG_th_rising), the timer is reset.
Once the device has detected a short-to-GND fault, the device turns off the output channel and retries
automatically by sourcing a small current I(retry) from IN to OUT to pull up the loads continuously, regardless of
the state of the PWM input. Once auto retry detects output voltage rising above V(SG_th_rising), the device clears
the short-to-GND fault and resumes normal operation.
7.3.4.2 Over Temperature Protection
The TPS92612 device monitors device junction temperature. When the junction temperature reaches thermal
shutdown threshold T(TSD), the output shuts down. Once the junction temperature falls below T(TSD) – T(TSD_HYS)
the device recovers to normal operation.
,
7.4 Device Functional Modes
7.4.1 Undervoltage Lockout, V(SUPPLY)< V(POR_rising)
When the TPS92612 device is in undervoltage lockout mode, the device disables all functions until the supply
rises above the V(POR_rising) threshold.
7.4.2 Normal State, V(SUPPLY) ≥ 4.5 V
The device regulates output current in normal state. With enough voltage drop across SUPPLY and OUT, the
device is able to drive the output in constant-current mode.
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9
TPS92612
ZHCSL42 –APRIL 2020
www.ti.com.cn
8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS92612 device is a constant-current regulator which can be used as a LED driver, general constant-
current source or current limiter in industrial applications.
Thermal performance is one of the design challenges for linear devices. To increase current-driving capability,
the device supports heat sharing using an external parallel resistor, as shown in 图 15. This technique provides
the low-cost solution of using external resistors to minimize thermal accumulation on the device itself, and still
keeps high accuracy of the total current output.
8.2 Typical Application
8.2.1 Single LED Driver
The TPS92612 offers a cost-effective and easy-to-use solution for LED driver applications. PWM input can be
adopted for LED brightness adjust and LED ON/OFF control. The device also supports off-board LED connection
with long cables.
5 V
R(SNS)
TPS92612
IN
SUPPLY
PWM
C(SUPPLY)
PWM
Long wire impedence
C(OUT)
OUT
GND
图 12. Typical Application Diagram
8.2.1.1 Design Requirements
The input voltage is 5 V ± 5%. LED maximum forward voltage VF_MAX = 2.5 V, minimum forward voltage VF_MIN
1.9 V, current I(LED) = 150 mA. LED is connected to device OUT pin through a 1-m long wire.
=
8.2.1.2 Detailed Design Procedure
STEP 1: Determine the current setting resistor, R(SNS) value by using 公式 2.
V
(CS _REG)
R(SNS)
=
= 0.653W
I(LED)
where
•
•
V(CS_REG) = 98 mV (typical)
I(LED) = 150 mA
(2)
STEP 2: Power consumption analysis for the worst application conditions.
10
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TPS92612
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ZHCSL42 –APRIL 2020
Typical Application (接下页)
Normally the thermal analysis is necessary for linear LED-driver applications to ensure that the operation junction
temperature of TPS92612 is well managed. The total power consumption on the TPS92612 itself is one
important factor determining operation junction temperature, and it can be calculated by using 公式 3. Based on
the worst-case analysis for maximum power consumption on device, consider either optimizing PCB layout for
better power dissipation as Layout describes or adding an extra heat-sharing resistor as described in Single-
Channel LED Driver With Heat Sharing.
PDEV = V
- V CS _REG - V OUT ìI
) + V(SUPPLY ìI(Quiescent
) )
(
)
SUPPLY
LED
(
)
(
)
(
)
(
)
(
PDEV _MAX = 5.25 - 0.098 -1.9 ì0.15 + 5.25ì0.00025 = 0.489W
(
)
where
•
•
V(CS_REG) = 98 mV (typical)
I(Quiescent) = 250 µA (maximum)
(3)
In this application, the calculated result for maximum power consumption on the TPS92612 is 0.489 W at
V(SUPPLY) = 5.25 V and I(LED) = 150 mA conditions.
TI recommends to add capacitors C(SUPPLY) at SUPPLY and C(OUT) at OUT. TI recommends one 1-μF capacitor
plus one 100-nF decoupling ceramic capacitor close to the SUPPLY pin for C(SUPPLY) and a 10-nF ceramic
capacitor close to the OUT pin for C(OUT). The larger capacitor for C(SUPPLY) or C(OUT) is helpful for EMI and ESD
immunity; however, large C(OUT) takes a longer time to charge up the capacitor and may affect PWM dimming
performance.
8.2.1.3 Application Curve
A 1-μH inductor is connected between OUT and the LED to simulate the 1-m long cable.
Ch. 1 = V(SUPPLY)
Ch. 3 = V(OUT)
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
Ch. 1 = V(SUPPLY)
Ch. 3 = V(OUT)
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
图 14. Output Current With PWM Input
图 13. Output Current With PWM Input
8.2.2 Single-Channel LED Driver With Heat Sharing
Using parallel resistors, thermal performance can be improved by balancing current between the TPS92612
device and the external resistors as follows. As the current-sense resistor controls the total LED string current,
the LED string current I(LED) is set by V(CS_REG) / R(SNS), while the TPS92612 current I(DRIVE) and parallel resistor
current I(P) combine to the total current.
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TPS92612
ZHCSL42 –APRIL 2020
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Typical Application (接下页)
12 V
R(SNS)
I(DRIVE)
I(LED)
TPS92612
SUPPLY
IN
C(SUPPLY)
C(OUT)
I(P)
R(P)
PWM
GND
OUT
图 15. Heat Sharing With a Parallel Resistor
8.2.2.1 Design Requirements
The input voltage range is 12 V ± 10%, LED maximum forward voltage VF_MAX = 2.5 V, minimum forward voltage
VF_MIN = 1.9 V, current I(LED) = 150 mA.
8.2.2.2 Detailed Design Procedure
In linear LED driver applications, the input and output voltage variation generates the most of the thermal
concerns. The resistor current I(P), as indicated by Ohm's law, depends on the voltage across the external
resistors. The TPS92612 controls the driver current I(DRIVE) to attain the desired total current. If I(P) increases, the
TPS92612 device decreases I(DRIVE) to compensate, and vice versa. The parallel-resistor takes highest current
and generates maximum heat at maximum supply voltage and minimum LED-string forward voltage.
The parallel resistor value must be carefully calculated to ensure that 1) thermal dissipation for both the
TPS92612 device and the resistor is within their thermal dissipation limits, and 2) device current at high voltage
drop condition is above the minimal output-current requirement.
STEP 1: Determine the current setting resistor, R(SNS) value by using 公式 4.
V
(CS _REG)
R(SNS)
=
= 0.653W
I(LED)
where
•
•
V(CS_REG) = 98 mV (typical)
I(LED) = 150 mA
(4)
The calculated result for R(SNS) is 0.653 Ω.
STEP 2: Calculate the parallel resistor, R(P) value by using 公式 5.
The parallel resistor R(P) is recommended to consume 50% of the total current at maximum supply voltage and
minimum LED-string forward voltage.
V
(SUPPLY) - V(CS _ REG) - V
13.2 - 0.098 - 3 ì1.9
0.5 ì0.15
(OUT)
R(P)
=
=
ö 100W
0.5 ìI(LED)
where
•
•
V(CS_REG) = 98 mV (typical)
I(LED) = 150 mA
(5)
The calculated result for R(P) is about 100 Ω at V(SUPPLY) = 13.2 V.
STEP 3: Power consumption analysis for the worst application conditions.
The total device power consumption can be calculated by 公式 6.
12
版权 © 2020, Texas Instruments Incorporated
TPS92612
www.ti.com.cn
ZHCSL42 –APRIL 2020
Typical Application (接下页)
≈
∆
’
÷
V(SUPPLY - V(CS _ REG - V(OUT
)
)
)
PDEV = V
- V CS _ REG - V OUT ì I
-
LED
+ V(SUPPLY ìI(Quiescent
(
)
SUPPLY
(
)
(
)
(
)
(
)
(
)
)
)
∆
R(P
÷
)
«
◊
13.2 - 0.098 - 3 ì1.9
100
≈
’
PDEV _ MAX = 13.2 - 0.098 - 3 ì1.9 ì 0.15 -
+13.2ì0.00025 = 0.566W
(
)
∆
÷
◊
(
)
«
where
•
•
V(CS_REG) = 98 mV (typical)
I(Quiescent) = 250 µA (maximum)
(6)
The calculated maximum power consumption on the TPS92612 device is 0.566 W at V(SUPPLY) = 13.2 V, V(OUT)
3 × 1.9 V = 5.7 V and I(LED) = 150 mA.
=
The power consumption on resistor R(P) can be calculated through 公式 7.
2
V
- V(CS _ REG - V(OUT
) )
(
)
SUPPLY
(
)
PRP
=
(
)
R(P
)
2
13.2 - 0.098 - 3 ì1.9
(
)
PRP _ MAX
=
= 0.548W
(
)
100
where
•
V(CS_REG) = 98 mV (typical)
(7)
The calculated maximum power consumption on the 100 Ω, R(P) parallel resistor is 0.548 W at V(SUPPLY) = 13.2 V
and V(OUT) = 3 × 1.9 V = 5.7 V.
TI recommends adding capacitors C(SUPPLY) at SUPPLY and C(OUT) at OUT. One 1-μF capacitor plus one 100-nF
decoupling ceramic capacitor close to the SUPPLY pin is recommended for C(SUPPLY), and a 10-nF ceramic
capacitor close to the OUT pin is recommended for C(OUT). The larger capacitor for C(SUPPLY) or C(OUT) is helpful
for EMI and ESD immunity, however large C(OUT) takes a longer time to charge up the capacitor and could affect
PWM dimming performance.
Note that the parallel resistor path cannot be shut down by PWM or fault protection. If PWM control is required,
TI recommends an application circuit as shown in 图 16. A NPN bipolar transistor with a base current-limiting
resistor, R1, can modulate the output current together with the device PWM function. The resistor value of R1
needs to be calculated based on the applied PWM voltage and β value of selected NPN transistor.
12 V
R(SNS)
I(LED)
TPS92612
SUPPLY
I(DRIVE)
IN
C(SUPPLY)
PWM
I(P)
R(P)
PWM
GND
OUT
C(OUT)
R1
PWM
图 16. PWM Control With Heat Sharing Resistor
版权 © 2020, Texas Instruments Incorporated
13
TPS92612
ZHCSL42 –APRIL 2020
www.ti.com.cn
Typical Application (接下页)
8.2.2.3 Application Curve
Ch. 1 = V(SUPPLY) Ch. 2 = V(OUT)
Ch. 3 = I(P) Ch. 4 = I(LED)
图 17. Constant Output Current With Heat Sharing Resistor
9 Power Supply Recommendations
The TPS92612 is designed to operate from a power system within the range specified in the Recommended
Operating Conditions. The SUPPLY input must be protected from reverse voltage and overvoltage over 40 V.
The impedance of the input supply rail must be low enough that the input current transient does not cause drop
below LED string required forward voltage. If the input supply is connected with long wires, additional bulk
capacitance may be required in addition to normal input capacitor.
14
版权 © 2020, Texas Instruments Incorporated
TPS92612
www.ti.com.cn
ZHCSL42 –APRIL 2020
10 Layout
10.1 Layout Guidelines
Thermal dissipation is the primary consideration for TPS92612 layout. TI recommends good thermal dissipation
area beneath the device for better thermal performance.
10.2 Layout Example
GND
TPS92612
OUT
GND
PWM
SUPPLY
IN
SUPPLY
图 18. TPS92612 Example Layout Diagram
版权 © 2020, Texas Instruments Incorporated
15
TPS92612
ZHCSL42 –APRIL 2020
www.ti.com.cn
11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知,请导航至 ti.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.2 支持资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
16
版权 © 2020, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92612DBVR
ACTIVE
SOT-23
DBV
5
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
22SF
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-May-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92612DBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-May-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBV
SPQ
Length (mm) Width (mm) Height (mm)
210.0 185.0 35.0
TPS92612DBVR
5
3000
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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