TPS92612QDBVRQ1 [TI]
具有 150mA 输出和短路检测功能的汽车类单通道 LED 驱动器 | DBV | 5 | -40 to 125;
| 型号： | TPS92612QDBVRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 150mA 输出和短路检测功能的汽车类单通道 LED 驱动器 | DBV | 5 | -40 to 125 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总23页 (文件大小：1755K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS92612-Q1
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
TPS92612-Q1 汽车单通道 LED 驱动器
1 特性
3 说明
1
•
符合面向汽车应用的 AEC-Q100 标准
随着 LED 在汽车 应用中广泛使用，简单的 LED 驱动
器越来越受欢迎。与分立式解决方案相比，低成本单片
解决方案可降低系统级组件数量，并显著提高电流精度
和可靠性。
–
器件温度等级 1：
–40°C 至 125°C，TA
•
•
提供功能安全
可帮助创建功能安全系统设计的文档
–
TPS92612-Q1 器件是一款简单的单通道高侧 LED 驱
动器，由汽车蓄电池供电。这是一种简单而巧妙的解决
方案，能够为单个 LED 灯串提供恒定电流。
具有 PWM 调光功能的单通道恒定电流 LED 驱动
器
•
•
•
•
•
•
宽输入电压范围：4.5V - 40V
恒定输出电流，可通过感应电阻器进行调节
高精度电流调节，容差 ±4.6%
最大电流：150mA
器件信息(1)
器件型号
封装
SOT-23 (5)
封装尺寸（标称值）
TPS92612-Q1
2.9mm × 1.6mm
与外部电阻器实现热共享
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
低压降电压（包含电流检测压降）
–
–
–
最大压降：10mA 时为 150mV
最大压降：70mA 时为 400mV
最大压降：150mA 时为 700mV
典型应用图
4.5 œ 40V
•
•
低待机电流（每个器件小于 250µA）
R(SNS)
TPS92612 œ Q1
保护：
IN
SUPPLY
PWM
–
–
LED 短路保护，具有自动恢复功能
C1
C2
过热保护
PWM
•
工作结温范围：–40°C 至 150°C
OUT
GND
2 应用
Copyright © 2017, Texas Instruments Incorporated
•
•
•
汽车便利照明：座舱顶灯、车门把手、阅读灯和其
他灯具
汽车尾灯、中央高位刹车灯、侧面标志灯、盲点监
测指示灯、充电口指示灯
通用 LED 驱动器 应用
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLDS237
TPS92612-Q1
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 10
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application .................................................. 11
Power Supply Recommendations...................... 14
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Timing Requirements................................................ 5
6.7 Typical Characteristics.............................................. 6
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
8
9
10 Layout................................................................... 14
10.1 Layout Guidelines ................................................. 14
10.2 Layout Example .................................................... 15
11 器件和文档支持 ..................................................... 16
11.1 文档支持 ............................................................... 16
11.2 接收文档更新通知 ................................................. 16
11.3 社区资源................................................................ 16
11.4 商标....................................................................... 16
11.5 静电放电警告......................................................... 16
11.6 Glossary................................................................ 16
12 机械、封装和可订购信息....................................... 16
7
4 修订历史记录
Changes from Revision A (July 2018) to Revision B
Page
•
向特性 部分添加了提供功能安全的链接.................................................................................................................................. 1
Changes from Original (January 2018) to Revision A
Page
•
Changed "ambient temperature" to "junction temperature" in the condition statements of the Absolute Maximum
Ratings and Recommended Operating Conditions tables ..................................................................................................... 3
Added ESD classification levels for HBM and CDM to the ESD Ratings table...................................................................... 3
Changed rising and falling thresholds ................................................................................................................................... 4
Added capacitors C1 and C2................................................................................................................................................. 11
Added capacitors C1 and C2................................................................................................................................................. 12
Added capacitors C1 and C2................................................................................................................................................. 15
•
•
•
•
•
2
Copyright © 2018–2020, Texas Instruments Incorporated
TPS92612-Q1
www.ti.com.cn
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
5 Pin Configuration and Functions
TPS92612-Q1 DBV Package
5-Pin SOT-23
Top View
GND
PWM
1
2
3
5
OUT
SUPPLY
4
IN
Not to scale
Pin Functions
PIN
NO.
I/O
DESCRIPTION
NAME
GND
TPS92612-Q1
1
4
5
2
3
—
I
Ground
IN
Current input
OUT
O
I
Constant-current output
PWM input
PWM
SUPPLY
I
Device supply voltage
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–40
MAX
45
UNIT
V
High-voltage input
IN, PWM, SUPPLY
OUT
High-voltage output
IN to OUT
45
V
V(IN) – V(OUT)
V(SUPPLY) – V(IN)
45
V
SUPPLY to IN
1
V
Operating junction temperature, TJ
Storage temperature, Tstg
150
150
°C
°C
–40
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per AEC
Q100-002(1)
HBM ESD Classification Level 2
All pins
All pins
Charged-device model (CDM), per AEC
Q100-011
V(ESD)
Electrostatic discharge
V
CDM ESD Classification Level C3B [There
isn't a C3B classification, unless there is a
mistake in STDZ017I on page 84.]
Corner pins (3, 4, and 5)
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
Copyright © 2018–2020, Texas Instruments Incorporated
3
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ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
www.ti.com.cn
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
MIN
4.5
4.4
0
NOM
MAX
40
UNIT
V
SUPPLY
IN
Device supply voltage
Sense voltage
40
V
PWM
OUT
TA
PWM inputs
40
V
Driver output
0
40
V
Operating ambient temperature
–40
125
°C
6.4 Thermal Information
TPS92612-Q1
DBV (SOT23)
5 PINS
200.7
THERMAL METRIC(1)
UNIT
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
104.4
45.6
Junction-to-top characterization parameter
Junction-to-board characterization parameter
17.5
ψJB
45.2
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
6.5 Electrical Characteristics
V(SUPPLY) = 5 V to 40 V, TJ = –40°C to 150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
BIAS
Supply voltage POR rising
threshold
V(POR_rising)
3.2
4
V
Supply voltage POR falling
threshold
V(POR_falling)
I(Quiescent)
2.2
0.1
3
V
Device standby current
PWM = LOW
0.2
0.25
mA
LOGIC INPUTS (PWM)
VIL(PWM) Input logic-low voltage, PWM
VIH(PWM) Input logic-high voltage, PWM
CONSTANT-CURRENT DRIVER
1.045
1.14
1.1
1.2
1.155
1.26
V
V
I(OUT)
Device output-current range
100% duty cycle
4
150
102
mA
mV
Ω
TA = 25°C, V(SUPPLY) = 4.5 V to 18 V
94
98
98
V(CS_REG)
R(CS_REG)
Sense-resistor regulation voltage
Sense-resistor value
TA = –40°C to 125°C, V(SUPPLY)
4.5 V to 18 V
=
93.5
102.5
24.5
150
V(CS_REG) voltage included, current
setting = 10 mA
120
250
430
Voltage dropout from SUPPLY to
OUT
V(CS_REG) voltage included, current
setting = 70 mA
V(DROPOUT)
400
700
mV
V(CS_REG) voltage included, current
setting = 150 mA
DIAGNOSTICS
Channel output V(OUT) short-to-
ground falling threshold
V(SG_th_falling)
1.14
0.82
0.64
1.2
0.865
1.08
1.26
0.91
V
V
Channel output V(OUT) short-to-
ground rising threshold
V(SG_th_rising)
I(Retry)
Channel output V(OUT) short-to-
ground retry current
V(OUT)= 0 V
1.528
mA
4
Copyright © 2018–2020, Texas Instruments Incorporated
TPS92612-Q1
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ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
Electrical Characteristics (continued)
V(SUPPLY) = 5 V to 40 V, TJ = –40°C to 150°C unless otherwise noted
PARAMETER
THERMAL PROTECTION
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Thermal shutdown junction
temperature threshold
T(TSD)
172
15
°C
°C
Thermal shutdown junction
temperature hysteresis
T(TSD_HYS)
6.6 Timing Requirements
MIN
NOM
MAX
UNIT
PWM rising edge delay, 50% PWM voltage to 10% of output current,
t2 – t1 as shown in 图 1
t(PWM_delay_rising)
t(PWM_delay_falling)
17
µs
PWM falling edge delay, 50% PWM voltage to 90% of output current,
t5 – t4 as shown in 图 1
21
µs
t(TSD_deg)
t(SG_deg)
Thermal overtemperature deglitch time
Channel-output short-to-ground detection deglitch time
Recovery deglitch time
60
125
16
µs
µs
µs
80
175
t(Recover_deg)
Input duty-cycle
PWM
90%
90%
Channel
Current
IOUT
Output duty-cycle
10%
10%
t6
t1
t2
t3
t4
t5
Copyright © 2017, Texas Instruments Incorporated
图 1. Output Timing Diagram
版权 © 2018–2020, Texas Instruments Incorporated
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6.7 Typical Characteristics
250
500
I(OUT) setting = 10 mA
I(OUT) setting = 70 mA
I(OUT) setting = 150 mA
300
200
200
150
100
50
100
70
50
30
20
10
7
5
3
2
0
4
0
4
10
16
22
Supply Voltage (V)
28
34
40
0.2 0.3 0.5 0.7
1
2
3
4 5 6 78 10
20 30 50
R(SNS) (W)
D001
D001
图 2. Output Current vs Supply Voltage
图 3. Output Current vs Current-Sense Resistor
240
200
160
120
80
180
150
120
90
I(OUT) setting = 10 mA
I(OUT) setting = 70 mA
I(OUT) setting = 150 mA
60
-40èC
25èC
125èC
40
30
0
0
0.5
1
Dropout Voltage (V)
1.5
2
0
0.5
1
Dropout Voltage (V)
1.5
2
D002
D003
TA = 25 °C
I(OUT) setting = 150 mA
图 4. Output Current vs Dropout Voltage
图 5. Output Current vs Temperature
250
100
100%
-40èC, I(Quiescent)
25èC, I(Quiescent)
125èC, I(Quiescent)
10%
10
1%
2
0.5%
10
16 22
Supply Voltage (V)
28
34
40
1%
10%
PWM Duty Cycle
100%
D004
D005
图 6. Quiescent Current vs Input Voltage
图 7. PWM Output Duty Cycle vs Input Duty Cycle
6
版权 © 2018–2020, Texas Instruments Incorporated
TPS92612-Q1
www.ti.com.cn
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
Typical Characteristics (接下页)
Ch. 1 = V(SUPPLY)
Ch. 4 = V(OUT)
Ch. 2 = V(PWM)
ƒ(PWM) = 200 Hz
Ch. 3 = I(OUT)
Ch. 1 = V(SUPPLY)
f(PWM) = 200 Hz
Ch. 3 = V(OUT)
Ch. 4 = I(OUT)
Duty-cycle = 50%
Duty-cycle = 10%
SUPPLY dimming between 2.5 V and 12 V
图 8. PWM Dimming via External Input
图 9. PWM Dimming via Power Supply
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
图 10. Transient Undervoltage
图 11. Transient Overvoltage
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
图 12. Jump Start
图 13. Superimposed Alternating Voltage, 15 Hz
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TPS92612-Q1
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Typical Characteristics (接下页)
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
图 15. Slow Decrease, Quick Increase of Supply Voltage
图 14. Superimposed Alternating Voltage, 1kHz
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
图 16. Slow Decrease and Slow Increase of Supply Voltage
图 17. LED Open-Circuit and Recovery
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 4 = I(OUT)
图 18. LED Short-Circuit Protection and Recovery
8
版权 © 2018–2020, Texas Instruments Incorporated
TPS92612-Q1
www.ti.com.cn
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
7 Detailed Description
7.1 Overview
The TPS92612-Q1 device is the one of a family of single-channel linear LED drivers. The device provides a
simple current source with protection for automotive LED applications.
The output current can be set by an external R(SNS) resistor. Current flows from the supply through the R(SNS)
resistor into the internal current source and to the LEDs.
7.2 Functional Block Diagram
R(SNS)
TPS92612-Q1
SUPPLY
IN
Supply &
Control
PWM
OUT
Output Driver
GND
Copyright ©2017, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Device Bias
7.3.1.1 Power-On Reset (POR)
The TPS92612-Q1 device has an internal power-on-reset (POR) function. When power is applied to SUPPLY,
the internal POR holds the device in the reset condition until V(SUPPLY) reaches V(POR_rising)
.
7.3.2 Constant-Current Driver
The TPS92612-Q1 device has a high-side constant-current integrated driver. The device senses channel current
with an external high-side current-sense resistor, R(SNS). A current regulation loop drives an internal transistor
and regulates the current-sense voltage at the current-sense resistor to V(CS_REG). When the output driver is in
regulation, the output current can be set by the current-sense resistor using the following equation.
V
(CS _REG)
I(OUT)
=
R(SNS)
(1)
9
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TPS92612-Q1
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
www.ti.com.cn
Feature Description (接下页)
7.3.3 PWM Dimming
The TPS92612-Q1 device supports PWM dimming via PWM input dimming and supply dimming.
The PWM input functions as an enable for the output current.
Supply dimming applies PWM dimming on the power input. For an accurate PWM threshold, TI recommends
using a resistor divider on the PWM input stage to set the PWM threshold higher than V(POR_rising)
.
7.3.4 Protection
7.3.4.1 Short-to-GND Protection
The TPS92612-Q1 device has LED short-to-GND protection. Short-to-GND detection monitors the output voltage
when the channel is in the ON state. Once a short-to-GND LED failure is detected, the device turns off the output
channel and retries automatically, ignoring the PWM input. If the retry mechanism detects removal of the LED
short-to-GND fault, the device resumes normal operation.
The device monitors the V(OUT) voltage and compares it with the internal reference voltage to detect a short-to-
GND failure. If V(OUT) falls below V(SG_th_rising) longer than the deglitch time of t(SG_deg), the device asserts the
short-to-GND fault. During the deglitching time period, if V(OUT) rises above V(SG_th_falling), the timer is reset.
Once the device has detected a short-to-GND fault, the device turns off the output channel and retries
automatically with a small current. When retrying, the device sources a small current I(retry) from IN to OUT to pull
up the LED loads continuously. Once auto retry detects output voltage rising above V(SG_th_falling), the device
clears the short-to-GND fault and resumes normal operation.
7.3.4.2 Overtemperature Protection
The TPS92612-Q1 device monitors device junction temperature. When the junction temperature reaches thermal
shutdown threshold T(TSD), the output shuts down. Once the junction temperature falls below T(TSD) – T(TSD_HYS)
the device resumes normal operation.
,
7.4 Device Functional Modes
7.4.1 Undervoltage Lockout, V(SUPPLY)< V(POR_rising)
When the device is in undervoltage lockout mode, the TPS92612-Q1 device disables all functions until the supply
rises above the POR-rising threshold.
7.4.2 Normal Operation, V(SUPPLY) ≥ 4.5 V
The device drives an LED string in normal operation. With enough voltage drop across SUPPLY and OUT, the
device is able to drive the output in constant-current mode.
10
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TPS92612-Q1
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ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
In automotive lighting applications, thermal performance is always a design challenge for linear LED drivers.
To increase current-driving capability, the TPS92612-Q1 device supports heat sharing using an external parallel
resistor as shown in 图 21. This technique provides the low-cost solution of using external resistors to dissipate
heat due to high input voltage, and still keeps high accuracy of the total current output.
8.2 Typical Application
8.2.1 Single-Channel LED Driver
The TPS92612-Q1 device can be a good fit for many automotive lighting applications.
4.5 œ 40V
R(SNS)
TPS92612 œ Q1
IN
SUPPLY
PWM
C1
C2
PWM
OUT
GND
Copyright © 2017, Texas Instruments Incorporated
图 19. Typical Application Diagram
8.2.1.1 Design Requirements
Input voltage range is 9 V to 16 V, LED maximum forward voltage Vfmax = 2.5 V, minimum forward voltage Vfmin
1.9 V, current I(LED) = 50 mA.
=
8.2.1.2 Detailed Design Procedure
Current setting by the sense resistor is as described in 公式 1.
V
(CS _REG)
R(SNS)
=
= 1.96W
I(LED)
(2)
(3)
LED-string maximum forward voltage = 3 × 2.5 V = 7.5 V.
Total device power consumption at worst case is with 16-V input and LEDs at minimal forward voltage.
P
= (V
- V
- V(OUT) )´I(LED) + V(SUPPLY) ´I(Quiescent)
(Max)
(SUPPLY)
(CS _REG)
= (16 - 3´1.9 - 0.098)´0.05 +16 ´0.00025 = 0.5141 W
TI recommends to add capacitors C1 and C2 at SUPPLY and OUT. TI recommends C1 of 1 μF and 100 nF close
to the SUPPLY pin, and C2 of 10 nF close to the OUT pin. A larger capacitor for C1 or C2 is helpful for EMC and
ESD; however, it takes a longer time to charge up the capacitor and could affect PWM dimming performance.
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Typical Application (接下页)
8.2.1.3 Application Curve
Ch. 1 = V(OUT)
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
图 20. Output Current With PWM Input
8.2.2 Single-Channel LED Driver With Heat Sharing
Using parallel resistors, thermal performance can be improved by balancing current between the TPS92612-Q1
device and the external resistors as follows. As the current-sense resistor controls the total LED string current,
the LED string current I(LED) is set by V(CS_REG) / R(SNS), while the TPS92612-Q1 current I(DRIVE) and parallel
resistor current I(P) combine to the total current.
4.5 œ 40V
R(SNS)
ILED
TPS92612 œ Q1
IDRIVE
IN
SUPPLY
PWM
C1
C2
PWM
IP
R(P)
OUT
GND
图 21. Heat Sharing With a Parallel Resistor
8.2.2.1 Design Requirements
The input voltage range is 9 V to 16 V, LED maximum forward voltage Vfmax = 2.5 V, minimum forward voltage
Vfmin = 1.9 V, current I(LED) = 100 mA.
8.2.2.2 Detailed Design Procedure
In linear LED driver applications, the input voltage variation contributes to most of the thermal concerns. The
resistor current, as indicated by Ohm’s law, depends on the voltage across the external resistors. The
TPS92612-Q1 device controls the driver current I(DRIVE) to attain the desired total current. If I(P) increases, the
TPS92612-Q1 device decreases I(DRIVE) to compensate, and vice versa.
While in low-dropout mode, the voltage across the R(P) resistor may be close to zero, so that almost no current
can flow through the external resistor R(P)
.
12
版权 © 2018–2020, Texas Instruments Incorporated
TPS92612-Q1
www.ti.com.cn
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
Typical Application (接下页)
When the input voltage is high, parallel-resistor current I(P) is proportional to the voltage across the parallel
resistor, R(P). The parallel resistor, R(P), takes the majority of the total string current, generating maximum heat.
The device must prevent current from draining out to ensure current regulation capability.
In this case, the parallel resistor value must be carefully calculated to ensure that 1) enough output current is
achieved in low-dropout mode, 2) thermal dissipation for both the TPS92612-Q1 device and the resistor is within
their thermal dissipation limits, and 3) device current in the high-voltage mode is above the minimal output-
current requirement.
TI recommends to add capacitors C1 and C2 at SUPPLY and OUT. TI recommends C1 of 1 μF and 100 nF close
to the SUPPLY pin, and C2 of 10 nF close to the OUT pin. A larger capacitor for C1 or C2 is helpful for EMC and
ESD; however, it takes a longer time to charge up the capacitor and could affect PWM dimming performance.
Current setting by the sense resistor is as described in 公式 1.
V
(CS _REG)
R(SNS)
=
= 0.98W
I(LED)
(4)
(5)
LED-string maximum forward voltage = 3 × 2.5 V = 7.5 V.
Parallel resistor R(P) is recommended to consume 1/2 of the total current at maximum supply voltage.
V
(SUPPLY) - V(CS_REG) - V
16 - 0.098 - 3ì1.9
0.5ì0.1
(OUT)
R(P)
=
=
ö 200W
0.5ìI(LED)
Total device power consumption is maximum with 16-V input and LEDs at minimal forward voltage.
≈
’
÷
V SUPPLY - V CS _REG - V OUT
(
)
(
)
(
)
∆
PDEV _MAX = V
- V CS _REG - V OUT ì I
-
LED
+ V SUPPLY ìI(Quiescent
( )
(
)
SUPPLY
(
)
(
)
(
)
(
)
(
)
)
∆
÷
◊
R(P
)
«
16 - 0.098 - 3ì1.9
200
≈
’
= 16 - 0.098 - 3ì1.9 ì 0.1-
+16ì0.00025 = 0.504W
(
)
∆
÷
◊
«
(6)
Resistor R(P) maximum power consumption is at 16-V input.
2
2
V
- V CS _REG - V OUT
)
(
SUPPLY
16 - 0.098 - 3 ì1.9
(
)
(
)
(
)
(
)
PRP _MAX
=
=
= 0.52W
(
)
R(P
200
)
(7)
版权 © 2018–2020, Texas Instruments Incorporated
13
TPS92612-Q1
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
www.ti.com.cn
Typical Application (接下页)
8.2.2.3 Application Curve
Ch. 1 = V(SUPPLY)
Ch. 4 = I(LED)
Ch. 2 = V(OUT)
Ch. 3 = I(P)
Supply voltage increases from 9 V to 16 V
图 22. Constant Output Current With Increasing Supply Voltage
9 Power Supply Recommendations
The TPS92612-Q1 device is qualified for automotive applications. The normal power supply connection is
therefore to an automobile electrical system that provides a voltage within the range specified in the
Recommended Operating Conditions.
10 Layout
10.1 Layout Guidelines
Thermal dissipation is the primary consideration for TPS92612-Q1 layout. TI recommends good thermal
dissipation area beneath the device for better thermal performance.
14
版权 © 2018–2020, Texas Instruments Incorporated
TPS92612-Q1
www.ti.com.cn
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
10.2 Layout Example
GND
TPS92612 œ Q1
OUT
C2
GND
PWM
SUPPLY
IN
SUPPLY
C1
图 23. TPS92612-Q1 Example Layout Diagram
版权 © 2018–2020, Texas Instruments Incorporated
15
TPS92612-Q1
ZHCSHC1B –JANUARY 2018–REVISED JANUARY 2020
www.ti.com.cn
11 器件和文档支持
11.1 文档支持
11.1.1 相关文档
如需相关文档，请参阅：
•
•
•
•
•
•
《TPS92610-Q1 汽车单通道线性 LED 驱动器》
《TPS92611-Q1 汽车单通道线性 LED 驱动器》
《TPS92610-Q1 EVM 用户指南》
《如何在汽车外部照明应用中计算 TPS92630-Q1 最大输出 电流》
《适用于中央高位刹车灯 (CHMSL) 的汽车线性 LED 驱动器参考设计》
《适用于中央高位刹车灯 (CHMSL) 的汽车线性 LED 驱动器参考设计》
11.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.3 社区资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是适用于指定器件的最新数据。数据如有变更，恕不另行通知，
且不会对此文档进行修订。如需获取此数据表的浏览器版本，请查看左侧的导航面板。
16
版权 © 2018–2020, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92612QDBVRQ1
ACTIVE
SOT-23
DBV
5
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
1J6F
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jan-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92612QDBVRQ1
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jan-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBV
SPQ
Length (mm) Width (mm) Height (mm)
210.0 185.0 35.0
TPS92612QDBVRQ1
5
3000
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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